Household appliance controller circuit board with multi-layer heat dissipation

Abstract

The utility model belongs to the technical field of circuit boards, and particularly discloses a multilayer heat dissipation household appliance controller circuit board which comprises a circuit board body, a protective layer is arranged in the circuit board body, a plurality of heat conduction columns are arranged at the bottom of the protective layer, a connecting plate is arranged at the bottoms of the plurality of heat conduction columns, and a plurality of heat dissipation fins are arranged at the bottom of the connecting plate. A plurality of radiating fins are arranged on the protective layer, a metal radiating plate is arranged below the radiating fins, a liquid cooling pipe is arranged below the metal radiating plate, and a plurality of heat conduction columns are evenly distributed in the horizontal direction of the protective layer. Heat generated by the circuit board of the household appliance controller is quickly and effectively dissipated, the temperature of the circuit board is reduced, the performance and stability of the circuit board are improved, the uniformly distributed heat conduction columns ensure uniform conduction of the heat and avoid local overheating, the structures of the cooling fins and the connecting plate which are connected in a welded mode are stable and can bear certain vibration impact, and the whole multi-layer heat dissipation structure is high in adaptability.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and more specifically, to a multi-layer heat dissipation circuit board for a home appliance controller. Background Art

[0002] With the continuous advancement of technology and the improvement of people's living standards, home appliances are playing an increasingly important role in daily life. As one of the core components of home appliances, the stability and reliability of the performance of home appliance controllers directly affect the overall quality and user experience of home appliances. As a key part that carries electronic components and circuits, the design and manufacturing level of home appliance controller circuit boards play a decisive role in the performance of home appliance controllers.

[0003] As electronic products evolve toward miniaturization, lightweighting, and higher performance, multilayer circuit boards are increasingly being used. However, due to their complex structure, heat dissipation issues are becoming more prominent. Multilayer circuit boards, composed of alternating conductive and insulating layers, create a complex and tortuous heat conduction path within the board. Heat must pass through different layers of material to be transferred to the external environment. However, the varying thermal conductivity of different materials complicates heat transfer, making it difficult for heat to dissipate quickly into the surrounding environment. This leads to heat accumulation and reduces the lifespan of the board. Utility Model Content

[0004] In order to solve the above problems, the present application provides a multi-layer heat dissipation circuit board for a home appliance controller.

[0005] The present application provides a multi-layer heat dissipation circuit board for home appliance controllers that adopts the following technical solutions:

[0006] A multi-layer heat dissipation circuit board for a household appliance controller includes a circuit board body, a protective layer is provided inside the circuit board body, a plurality of heat-conducting columns are provided at the bottom of the protective layer, a connecting plate is provided at the bottom of the plurality of heat-conducting columns, a plurality of heat sinks are provided at the bottom of the connecting plate, a metal heat sink is provided below the plurality of heat sinks, and a liquid cooling pipe is provided below the metal heat sink.

[0007] Through the above technical solution, the synergistic effect of the multi-layer heat dissipation structure such as thermal conductive columns, heat sinks, metal heat sinks and liquid cooling tubes can quickly and effectively dissipate the heat generated by the home appliance controller circuit board, reduce the circuit board temperature, and improve its performance and stability. The evenly distributed thermal conductive columns ensure uniform heat conduction and avoid local overheating.

[0008] Furthermore, the plurality of heat-conducting columns are evenly distributed along the horizontal direction of the protective layer, and the heat sinks are equidistantly distributed along the horizontal direction of the connecting plate.

[0009] Furthermore, the heat sink and the connecting plate are connected by welding, a conductive layer is provided under the plurality of heat sinks, and an insulating polymer layer is provided under the metal heat sink.

[0010] Through the above technical solution, the heat sink and the connecting plate connected by welding are structurally stable and can withstand certain vibration impacts, and the entire multi-layer heat dissipation structure has strong adaptability.

[0011] Furthermore, the metal heat dissipation plate is located between the conductive layer and the insulating polymer layer. Plate bodies are provided around the metal heat dissipation plate, and threaded holes are provided inside each plate body.

[0012] Furthermore, a connecting bolt is provided inside each threaded hole, the metal heat dissipation plate and the conductive layer are connected by a plurality of connecting bolts, and a gap is provided between the metal heat dissipation plate and the conductive layer.

[0013] Through the above technical solution, the connection bolts are screwed into the threaded holes to connect the metal heat sink and the conductive layer. This connection method is relatively stable and can ensure that the relative position between the metal heat sink and the conductive layer remains stable under various working conditions.

[0014] Furthermore, a top layer is provided at the bottom of the metal heat dissipation plate, and a bottom layer is provided at the bottom of the top layer.

[0015] Furthermore, the liquid cooling tube is located between the top layer and the bottom layer, and cooling liquid is provided inside the liquid cooling tube.

[0016] Furthermore, a plurality of heat dissipation slots are provided inside each bottom layer, and every two heat dissipation slots form a heat dissipation cavity.

[0017] Through the above technical solution, when heat is transferred to the bottom layer, the heat dissipation grooves and heat dissipation cavity can promote air flow and heat dissipation, and cooperate with the heat dissipation effect of the liquid cooling tube to jointly achieve heat dissipation of the circuit board.

[0018] In summary, this application includes at least one of the following beneficial technical effects:

[0019] (1) The utility model uses the synergistic effect of a multi-layer heat dissipation structure including heat-conducting columns, heat sinks, metal heat sinks and liquid cooling tubes to quickly and effectively dissipate the heat generated by the home appliance controller circuit board, thereby reducing the circuit board temperature and improving its performance and stability. The evenly distributed heat-conducting columns ensure uniform heat conduction and avoid local overheating. The heat sink and connecting plate connected by welding are structurally stable and can withstand certain vibration impacts. The entire multi-layer heat dissipation structure has strong adaptability.

[0020] (2) The present invention connects the metal heat sink and the conductive layer by screwing the connecting bolts into the threaded holes. This connection method is relatively stable and can ensure that the relative position between the metal heat sink and the conductive layer remains stable under various working conditions. In addition, since there is a gap between the metal heat sink and the conductive layer, on the one hand, the risk of short circuit caused by direct contact between the two is avoided, and on the other hand, a certain space is provided for heat conduction and air circulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the internal structure of the circuit board body of the present utility model;

[0023] Figure 3 It is a plan view of the utility model;

[0024] Figure 4 It is a schematic diagram of the connection structure of the top layer and the bottom layer of the utility model.

[0025] Explanation of the accompanying symbols: 1. Circuit board body; 2. Protective layer; 3. Thermal conductive column; 4. Connecting plate; 5. Heat sink; 6. Conductive layer; 7. Board body; 8. Connecting bolts; 9. Metal heat sink; 10. Top layer; 11. Bottom layer; 12. Heat sink; 13. Liquid cooling pipe; 14. Insulating polymer layer. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application; it is obvious that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0027] Reference Figures 1-4 A multi-layer heat dissipation circuit board for household appliance controller includes a circuit board body 1, a protective layer 2 is provided inside the circuit board body 1, a plurality of heat-conducting columns 3 are provided at the bottom of the protective layer 2, a connecting plate 4 is provided at the bottom of the plurality of heat-conducting columns 3, a plurality of heat-dissipating fins 5 are provided at the bottom of the connecting plate 4, a metal heat dissipation plate 9 is provided below the plurality of heat dissipating fins 5, and a liquid cooling pipe 13 is provided below the metal heat dissipation plate 9.

[0028] Reference Figure 2-Figure 3 Multiple heat-conducting columns 3 are evenly distributed along the horizontal direction of the protective layer 2, and the heat sinks 5 are equidistantly distributed along the horizontal direction of the connecting plate 4. The heat sinks 5 and the connecting plate 4 are welded together. A conductive layer 6 is provided under the multiple heat sinks 5, and an insulating polymer layer 14 is provided under the metal heat dissipation plate 9.

[0029] When the circuit board is working, the heat is first transferred to the circuit board body 1. The internal protective layer 2 plays a role in protecting the circuit board on the one hand, and may also assist in the transfer of heat to the heat-conducting columns 3. The multiple heat-conducting columns 3 evenly distributed at the bottom of the protective layer 2 are made of high thermal conductivity materials, and efficiently transfer heat from the protective layer 2 to the connecting plate 4. The equidistantly distributed heat sinks 5 welded on the connecting plate 4 receive heat from the heat-conducting columns 3, and heat is dissipated by exchanging heat with the surrounding air by increasing the heat dissipation area. Part of the heat is transferred from the heat sink 5 to the metal heat sink 9 below. The metal heat sink 9 is made of metal material with good thermal conductivity, which further expands the heat dissipation area and transfers heat to the lower structure. Coolant flows in the liquid cooling pipe 13 below the metal heat sink 9, and the heat transferred from the metal heat sink 9 is taken away by the coolant.

[0030] Through the synergistic effect of the multi-layer heat dissipation structure including the heat-conducting columns 3, the heat sink 5, the metal heat sink 9 and the liquid cooling tube 13, the heat generated by the home appliance controller circuit board is quickly and effectively dissipated, the temperature of the circuit board is reduced, and its performance and stability are improved. The evenly distributed heat-conducting columns 3 ensure uniform heat conduction and avoid local overheating. The heat sink 5 and the connecting plate 4 connected by welding are structurally stable and can withstand certain vibration impacts. The entire multi-layer heat dissipation structure has strong adaptability.

[0031] Reference Figure 2-Figure 3 The metal heat dissipation plate 9 is located between the conductive layer 6 and the insulating polymer layer 14. Plate bodies 7 are provided around the metal heat dissipation plate 9. A threaded hole is provided inside each plate body 7. A connecting bolt 8 is provided inside each threaded hole. The metal heat dissipation plate 9 is connected to the conductive layer 6 through multiple connecting bolts 8. A gap is provided between the metal heat dissipation plate 9 and the conductive layer 6.

[0032] The metal heat sink 9 is positioned between the conductive layer 6 and the insulating polymer layer 14, forming a unique heat dissipation hierarchy. The conductive layer 6 typically serves as a conductor, grounding device, or heat dissipation aid, while the insulating polymer layer 14 prevents short circuits between the metal heat sink 9 and other components below, ensuring a safe and stable circuit. The plate 7 surrounding the metal heat sink 9 provides mounting locations for connecting bolts 8. The threaded holes ensure that the connecting bolts 8 can securely secure the metal heat sink 9 to the conductive layer 6.

[0033] By screwing the connecting bolts 8 into the threaded holes, the metal heat sink 9 is connected to the conductive layer 6. This connection is relatively stable and can ensure that the relative position between the metal heat sink 9 and the conductive layer 6 remains stable under various working conditions.

[0034] Since there is a gap between the metal heat sink 9 and the conductive layer 6, on the one hand, the risk of short circuit caused by direct contact between the two is avoided, and on the other hand, a certain space is provided for heat conduction and air circulation.

[0035] Reference Figure 2-Figure 3 A top layer 10 is provided at the bottom of the metal heat sink 9, and a bottom layer 11 is provided at the bottom of the top layer 10. A liquid cooling tube 13 is located between the top layer 10 and the bottom layer 11. Cooling liquid is provided inside the liquid cooling tube 13. A plurality of heat dissipation grooves 12 are provided inside each bottom layer 11, and every two heat dissipation grooves 12 form a heat dissipation cavity.

[0036] The liquid cooling tube 13 is located between the top layer 10 and the bottom layer 11. When heat is transferred to this area, the coolant in the liquid cooling tube 13 absorbs the heat and removes it from the high-temperature area, or transfers it to other heat dissipation devices for cooling (not shown), thereby achieving efficient heat transfer from the circuit board. Multiple heat dissipation slots 12 within the bottom layer 11 form a heat dissipation cavity. These heat dissipation slots 12 increase the surface area of ​​the bottom layer 11, improving its contact area with the air and enhancing the natural convection heat dissipation effect.

[0037] When heat is transferred to the bottom layer 11 , the heat dissipation slots 12 and the heat dissipation cavity can promote air flow and heat dissipation, and cooperate with the heat dissipation effect of the liquid cooling tube 13 to achieve heat dissipation of the circuit board.

[0038] Working principle: When the circuit board is working, the heat is first transferred to the circuit board body 1. The internal protective layer 2 plays a role in protecting the circuit board on the one hand, and may also assist in the transfer of heat to the heat-conducting column 3. The multiple heat-conducting columns 3 evenly distributed at the bottom of the protective layer 2 are made of high thermal conductivity materials, and efficiently transfer heat from the protective layer 2 to the connecting plate 4. The equidistantly distributed heat sinks 5 welded on the connecting plate 4 receive heat from the heat-conducting columns 3, and heat is dissipated by exchanging heat with the surrounding air by increasing the heat dissipation area. Part of the heat is transferred from the heat sink 5 to the metal heat sink 9 below. The metal heat sink 9 is made of metal material with good thermal conductivity, which further expands the heat dissipation area and transfers heat to the lower structure. Coolant flows in the liquid cooling pipe 13 below the metal heat sink 9, and the heat transferred from the metal heat sink 9 is taken away by the coolant. The multiple heat dissipation grooves 12 opened inside the bottom layer 11 form a heat dissipation cavity. These heat dissipation grooves 12 increase the surface area of ​​the bottom layer 11 and improve the contact area with the air, thereby enhancing the natural convection heat dissipation effect. When heat is transferred to the bottom layer 11, the heat dissipation grooves 12 and the heat dissipation cavity can promote the flow of air and the dissipation of heat, and cooperate with the heat dissipation effect of the liquid cooling tube 13 to jointly achieve heat dissipation of the circuit board.

[0039] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A multi-layer heat dissipation circuit board for home appliance controller, characterized in that: include: A circuit board body (1) is provided with a protective layer (2) inside the circuit board body (1), a plurality of heat-conducting columns (3) are provided at the bottom of the plurality of heat-conducting columns (3), a connecting plate (4) is provided at the bottom of the plurality of heat-conducting columns (3), a plurality of heat sinks (5) are provided at the bottom of the connecting plate (4), a metal heat sink (9) is provided below the plurality of heat sinks (5), and a liquid cooling pipe (13) is provided below the metal heat sink (9).

2. The multi-layer heat dissipation circuit board for home appliance controller according to claim 1, characterized in that: The plurality of heat-conducting columns (3) are evenly distributed along the horizontal direction of the protective layer (2), and the heat sinks (5) are distributed at equal distances along the horizontal direction of the connecting plate (4).

3. The multi-layer heat dissipation circuit board for home appliance controller according to claim 1, characterized in that: The heat sink (5) and the connecting plate (4) are connected by welding, a conductive layer (6) is provided below the plurality of heat sinks (5), and an insulating polymer layer (14) is provided below the metal heat sink (9).

4. The multi-layer heat dissipation circuit board for home appliance controller according to claim 1, characterized in that: The metal heat dissipation plate (9) is located between the conductive layer (6) and the insulating polymer layer (14). Plate bodies (7) are provided around the metal heat dissipation plate (9), and threaded holes are provided inside each of the plate bodies (7).

5. The multi-layer heat dissipation circuit board for home appliance controller according to claim 4, characterized in that: A connecting bolt (8) is provided inside each threaded hole, the metal heat dissipation plate (9) and the conductive layer (6) are connected via a plurality of connecting bolts (8), and a gap is provided between the metal heat dissipation plate (9) and the conductive layer (6).

6. The multi-layer heat dissipation circuit board for home appliance controller according to claim 1, characterized in that: A top layer (10) is provided at the bottom of the metal heat dissipation plate (9), and a bottom layer (11) is provided at the bottom of the top layer (10).

7. The multi-layer heat dissipation circuit board for home appliance controller according to claim 6, characterized in that: The liquid cooling pipe (13) is located between the top layer (10) and the bottom layer (11), and a cooling liquid is provided inside the liquid cooling pipe (13).

8. The multi-layer heat dissipation circuit board for home appliance controller according to claim 6, characterized in that: A plurality of heat dissipation grooves (12) are provided inside each bottom layer (11), and every two heat dissipation grooves (12) form a heat dissipation cavity.

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