Core plate structure for preventing lamination copper wrinkles
By setting a buffer area and a buffer channel outside the core board gold finger area, the problem of the bottom copper layer sinking during the core board pressing process is solved, and copper wrinkles are prevented and the pressing efficiency is improved.
Patent Information
- Application Number
- CN202421707079.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-18
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-07-18
AI Technical Summary
During the core board pressing process, the bottom copper layer in the gold finger area is easily sunken due to the influx of molten prepreg, resulting in copper wrinkling, which affects subsequent processes and precise product assembly.
A buffer area is set outside the gold finger area of the core board. The buffer area is provided with a buffer pattern and a buffer channel. The buffer pattern is flush with or slightly higher than the bottom copper layer. The buffer channel is 10 mil wide and is designed with a curved shape to buffer the flow of the molten prepreg and avoid direct impact on the bottom copper layer.
It effectively avoids the generation of copper wrinkles, ensures the smooth progress of the pressing process, improves the assembly accuracy and efficiency of the product, and provides an exhaust channel function.
Smart Images
Figure CN223322215U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of core plate structure design, in particular to a core plate structure capable of preventing pressed copper wrinkles. Background Art
[0002] The core board includes a graphic area at the center of the core board, a gold finger area outside the graphic area, and a board edge area outside the gold finger area. The gold finger area is provided with a bottom copper layer, and the bottom copper layer corresponds to the position of the gold finger; the upper surface of the board edge area is smooth and flush with the upper surface of the bottom copper layer.
[0003] Before the gold finger is horizontally copper-plated, the core boards need to be pressed together. The following problems are likely to occur during the pressing process: Since the area outside the bottom copper layer in the gold finger area is lower than the bottom copper layer, the semi-cured sheet covering the core board will flow to the copper-free area around the bottom copper layer after melting. A large amount of molten semi-cured sheet flows along the edge of the board to the copper-free area, forming a pool effect, that is, the molten semi-cured sheet first flows into the copper-free area in large quantities, and then bounces back on the bottom copper layer, forming an impact on the bottom copper layer, causing the bottom copper layer to sink and become uneven, that is, copper wrinkles are generated. The generation of copper wrinkles causes the core board to deform in subsequent processes, making it impossible to achieve precise assembly of the final product. Utility Model Content
[0004] In view of this, the present application aims to solve the problems in the related art to at least a certain extent. One of the purposes of the present application is to provide a core board structure that prevents pressed copper wrinkles, and to form a buffer for the copper-free area on the side of the gold finger through a buffer channel, thereby effectively avoiding the copper wrinkle phenomenon.
[0005] In order to achieve the above-mentioned purpose, the present application adopts the following technical solution: a core board structure for preventing pressed copper wrinkles, comprising a graphic area located at the center of the core board, a gold finger area located outside the graphic area, and a buffer area located outside the gold finger area, wherein the gold finger area is provided with a bottom copper layer, and the bottom copper layer corresponds to the position of the gold finger; a buffer graphic is provided in the buffer area, and a buffer channel is provided between the buffer graphics.
[0006] Furthermore, the width of the buffer channel is 10 mil.
[0007] Furthermore, the buffer area is formed by splicing hexagonal buffer patterns, and buffer channels are formed between adjacent buffer patterns.
[0008] Furthermore, the buffer patterns in adjacent rows or columns are staggered to form a curved buffer channel.
[0009] Furthermore, the hexagonal buffer pattern is symmetrical about its length axis, and the length of the length axis is 190 mil.
[0010] Furthermore, the height of the hexagonal buffer pattern is 120 mil, where the height refers to the dimension perpendicular to the length axis.
[0011] Furthermore, the dimensions of the four sides of the hexagonal buffer pattern adjacent to the length axis are 80 mils.
[0012] Furthermore, the buffer area is formed by splicing rectangular buffer patterns, and curved buffer channels are formed between adjacent buffer patterns.
[0013] Furthermore, the buffer area is formed by splicing triangular buffer patterns, and curved buffer channels are formed between adjacent buffer patterns.
[0014] Furthermore, the thickness of the bottom copper layer is 15-36 microns.
[0015] The above-mentioned technical solution provided by the embodiment of the present application has the following advantages compared with the prior art: the present application provides a core board structure for preventing copper wrinkles during pressing, comprising a graphic area located at the center of the core board, a gold finger area located outside the graphic area, and a buffer area located outside the gold finger area, wherein the gold finger area is provided with a bottom copper layer, and the bottom copper layer corresponds to the position of the gold finger; a buffer graphic is provided in the buffer area, and a buffer channel is provided between the buffer graphics. In the present application, the upper surface of the buffer graphic is flush with the upper surface of the bottom copper layer, and the buffer channel is basically flush with the copper-free area in the gold finger area, or slightly higher than the copper-free area. In this way, during the pressing process, after the semi-cured sheet is cured, it will flow into the copper-free area along the buffer channel, avoiding the problem of large influx caused by the same height of the buffer area in the prior art. The buffer channel plays a buffering role in the flow of molten semi-cured glue, avoiding impact on the bottom copper layer, and thus avoiding the generation of copper wrinkles. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.
[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0018] In the attached figure:
[0019] Figure 1 A top view of the core board structure in this application;
[0020] Figure 2 This is a schematic diagram of the structure of the buffer graphic in Example 2;
[0021] Figure 3 This is a schematic diagram of the size of the buffer graphic in Example 2;
[0022] Figure 4 This is a schematic diagram of the structure of the buffer graphic in Example 3;
[0023] Figure 5 This is a schematic diagram of the structure of the buffer graphic in Example 4.
[0024] Reference numerals:
[0025] 11. Graphic area; 12. Gold finger; 13. Buffer area; 131. Buffer graphics; 132. Buffer channel. DETAILED DESCRIPTION
[0026] In order to have a clearer understanding of the technical features, purposes and effects of the present application, the specific embodiments of the present application are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings and are constructed and operated in specific directions. They are only for the convenience of describing the technical solution and do not indicate that the mechanisms or components referred to must have specific directions. Therefore, they should not be understood as limitations on the present application.
[0027] It should also be noted that, unless otherwise clearly specified and limited, terms such as "installed", "connected", "connected", "fixed", and "set" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intervening elements. The terms "first", "second", and "third" are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" can explicitly or implicitly include one or more of the features. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0028] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.
[0029] Example 1
[0030] like Figure 1-Figure 5 As shown, the present application proposes a core board structure for preventing pressed copper wrinkles, including a graphic area 11 located at the center of the core board, a gold finger area located outside the graphic area 11, and a buffer area 13 located outside the gold finger area. The gold finger area is provided with a bottom copper layer, and the bottom copper layer corresponds to the position of the gold finger 12; a buffer graphic 131 is provided in the buffer area 13, and a buffer channel 132 is provided between the buffer graphics 131.
[0031] In the present application, the upper surface of the buffer pattern 131 is flush with the upper surface of the bottom copper layer, and the buffer channel 132 is basically flush with the copper-free area in the gold finger area, or slightly higher than the copper-free area. In this way, during the pressing process, after the prepreg is cured, it will flow into the copper-free area along the buffer channel 132, avoiding the problem of large influx caused by the same height of the buffer area 13 in the prior art. The buffer channel 132 buffers the flow of the molten prepreg, avoiding impact on the bottom copper layer, and thus preventing the formation of copper wrinkles.
[0032] In this application, the upper surface of the buffer pattern 131 needs to be flush with the upper surface of the bottom copper layer, which is the portion of the bottom copper layer before copper plating, that is, it corresponds one-to-one with the position of the gold fingers 12. There is a copper-free area between adjacent gold fingers 12. The copper-free area is lower than the height of the gold fingers 12 on the core board surface, that is, the copper-free area is in a low-lying area in the core board.
[0033] In this application, the buffer channels 132 can be understood as the gaps between the buffer patterns 131. The buffer region 13 includes a plurality of buffer patterns 131. Gaps are formed between adjacent buffer patterns 131. These gaps form multiple channels connected to the copper-free area, namely, the buffer channels 132 in this application. The buffer channels 132 can be flush with the bottom copper layer or slightly higher than the bottom copper layer.
[0034] In the present application, the top surface of the buffer pattern 131 can be flush with the top surface of the bottom copper layer, or slightly lower than the top surface of the bottom copper layer. When the top surface of the buffer pattern 131 is flush with the bottom copper layer, the melted prepreg will flow into the copper-free area along the buffer channel 132 during the lamination process. When the top surface of the buffer pattern 131 is slightly lower than the bottom copper layer, during the lamination process, part of the melted prepreg will remain above the buffer pattern 131, while the rest will flow into the copper-free area along the buffer channel 132.
[0035] Example 2
[0036] like Figure 1-Figure 5 As shown, the present application proposes a core board structure for preventing pressed copper wrinkles, including a graphic area 11 located at the center of the core board, a gold finger area located outside the graphic area 11, and a buffer area 13 located outside the gold finger area. The gold finger area is provided with a bottom copper layer, and the bottom copper layer corresponds to the position of the gold finger 12; a buffer graphic 131 is provided in the buffer area 13, and a buffer channel 132 is provided between the buffer graphics 131.
[0037] In this application, the width of the buffer channel 132 is 10 mils, which refers to the dimension perpendicular to the direction of flow of the molten prepreg within the buffer channel 132. This width ensures a consistent flow of molten prepreg into the bottom copper layer from all directions, preventing copper wrinkles caused by a large influx of molten prepreg. It also ensures an appropriate flow rate of prepreg, preventing lamination time and affecting lamination efficiency.
[0038] like Figure 2 and Figure 3 As shown, in the embodiment of the present application, the buffer area 13 is composed of hexagonal buffer patterns 131, and a buffer channel 132 is formed between adjacent buffer patterns 131. Specifically, the hexagonal buffer pattern 131 in the present application is a symmetrical pattern, and the hexagon is defined as symmetrical about its length axis, and the length axis refers to Figure 3 The hexagon's mid-horizontal axis, on either side of the length axis, forms a trapezoidal structure without a base. This trapezoidal structure is an isosceles trapezoid. The direction perpendicular to the length axis is defined as the hexagon's height. Because the hexagon is symmetrical about the length axis, the height is the same at all locations on the top and bottom. The four sides of the hexagon, excluding the top and base, are all the same length.
[0039] In the buffer area 13, the buffer patterns 131 in adjacent rows or columns are staggered to form a curved buffer channel 132, such as Figure 2 As shown, the staggered hexagonal buffer patterns 131 can ensure that the gap between two adjacent buffer patterns 131 is 10 mil, thus forming a curved and equal-width buffer channel 132.
[0040] Specifically, such as Figure 3 As shown, the length axis dimension of the hexagonal buffer pattern 131 in the present application is 190 mil, and the two sides of the length axis are located at the corners of two adjacent sides. The height of the hexagonal buffer pattern 131 is 120 mil. The size of the four sides adjacent to the length axis in the hexagonal buffer pattern 131 is 80 mil. The gap between the buffer channel 132 of two adjacent hexagons is 10 mil. The buffer channel 132 in the direction from the buffer area 13 to the gold finger area is curved, that is, the molten semi-cured sheet flows into the copper-free area along the curved buffer channel 132, and does not flow into the copper-free area in a straight line. The curved inflow route can maximize the buffering effect of the buffer channel 132 and avoid impact on the bottom copper layer.
[0041] The thickness of the bottom copper layer in this application, i.e., its height in the core board, is 15-36 microns. On this basis, the length axis dimension of the hexagonal buffer pattern 131 is set to 190 mils, with both sides of the length axis located at the corners of two adjacent sides. The height of the hexagonal buffer pattern 131 is 120 mils. The four sides of the hexagonal buffer pattern 131 adjacent to the length axis are 80 mils. The gap between the buffer channels 132 of two adjacent hexagons is 10 mils; this can minimize the formation of copper wrinkles.
[0042] This application utilizes the existing all-copper board edge area as a buffer region 13. This buffer region 13 includes a buffer pattern 131 and buffer channels 132 between these patterns 131. This ensures that the copper-free area is buffered during glue filling, preventing the simultaneous influx of large amounts of directly melted prepregs, which creates a pooling effect and significantly impacts the underlying copper layer, forming copper wrinkles. Furthermore, the buffer channels 132 in this application also serve as exhaust channels during the lamination process, facilitating the removal of residual gas between the core boards during the lamination process.
[0043] Example 3
[0044] The present application proposes a core board structure for preventing pressed copper wrinkles, including a graphic area 11 located at the center of the core board, a gold finger area located outside the graphic area 11, and a buffer area 13 located outside the gold finger area. The gold finger area is provided with a bottom copper layer, and the bottom copper layer corresponds to the position of the gold finger 12; the buffer area 13 is provided with a buffer graphic 131, and a buffer channel 132 is provided between the buffer graphics 131.
[0045] The thickness of the bottom copper layer, i.e., its height within the core board, is 15-36 microns. In this application, the width of the buffer channel 132 is 10 mils, which refers to the dimension perpendicular to the direction of flow of the molten prepreg within the buffer channel 132. This width ensures a consistent flow of molten prepreg from all directions into the bottom copper layer, preventing copper wrinkles caused by excessive influx. It also ensures a suitable flow rate for the prepreg, preventing excessive lamination time and impacting lamination efficiency.
[0046] like Figure 4 As shown, the buffer area 13 is composed of rectangular buffer patterns 131, and a curved buffer channel 132 is formed between adjacent buffer patterns 131. Specifically, rectangles in adjacent rows or columns are staggered to ensure that the formed buffer channel 132 is a curved buffer channel 132.
[0047] In the present application, the buffer channel 132 from the buffer area 13 to the gold finger area is curved, that is, the molten semi-cured sheet flows into the copper-free area along the curved buffer channel 132, rather than flowing into the copper-free area in a straight line. The curved flow route can maximize the buffering effect of the buffer channel 132 and avoid impact on the bottom copper layer.
[0048] This application utilizes the existing all-copper board edge area as a buffer region 13. This buffer region 13 includes a buffer pattern 131 and buffer channels 132 between these patterns 131. This ensures that the copper-free area is buffered during glue filling, preventing the simultaneous influx of large amounts of directly melted prepregs, which creates a pooling effect and significantly impacts the underlying copper layer, forming copper wrinkles. Furthermore, the buffer channels 132 in this application also serve as exhaust channels during the lamination process, facilitating the removal of residual gas between the core boards during the lamination process.
[0049] Example 4
[0050] The present application proposes a core board structure for preventing pressed copper wrinkles, including a graphic area 11 located at the center of the core board, a gold finger area located outside the graphic area 11, and a buffer area 13 located outside the gold finger area. The gold finger area is provided with a bottom copper layer, and the bottom copper layer corresponds to the position of the gold finger 12; the buffer area 13 is provided with a buffer graphic 131, and a buffer channel 132 is provided between the buffer graphics 131.
[0051] The thickness of the bottom copper layer, i.e., its height within the core board, is 15-36 microns. In this application, the width of the buffer channel 132 is 10 mils, which refers to the dimension perpendicular to the direction of flow of the molten prepreg within the buffer channel 132. This width ensures a consistent flow of molten prepreg from all directions into the bottom copper layer, preventing copper wrinkles caused by excessive influx. It also ensures a suitable flow rate for the prepreg, preventing excessive lamination time and impacting lamination efficiency.
[0052] like Figure 5 As shown, the buffer area 13 is composed of triangular buffer patterns 131, and a curved buffer channel 132 is formed between adjacent buffer patterns 131. Specifically, the triangles in adjacent rows or columns are staggered to ensure that the formed buffer channel 132 is a curved buffer channel 132.
[0053] In the present application, the buffer channel 132 from the buffer area 13 to the gold finger area is curved, that is, the molten semi-cured sheet flows into the copper-free area along the curved buffer channel 132, rather than flowing into the copper-free area in a straight line. The curved flow route can maximize the buffering effect of the buffer channel 132 and avoid impact on the bottom copper layer.
[0054] This application utilizes the existing all-copper board edge area as a buffer region 13. This buffer region 13 includes a buffer pattern 131 and buffer channels 132 between these patterns 131. This ensures that the copper-free area is buffered during glue filling, preventing the simultaneous influx of large amounts of directly melted prepregs, which creates a pooling effect and significantly impacts the underlying copper layer, forming copper wrinkles. Furthermore, the buffer channels 132 in this application also serve as exhaust channels during the lamination process, facilitating the removal of residual gas between the core boards during the lamination process.
[0055] It can be understood that the above embodiments only express the preferred implementation methods of the present application, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present application. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, the above technical features can be freely combined, and several deformations and improvements can be made, which all fall within the scope of protection of the present application. Therefore, all equivalent changes and modifications made to the scope of the claims of the present application should fall within the scope of coverage of the claims of the present application.
Claims
1. A core board structure for preventing pressed copper wrinkles, characterized in that: It includes a graphic area located at the center of the core board, a gold finger area located outside the graphic area, and a buffer area located outside the gold finger area. The gold finger area is provided with a bottom copper layer, and the bottom copper layer corresponds to the position of the gold finger; a buffer graphic is provided in the buffer area, and a buffer channel is provided between the buffer graphics.
2. A core board structure for preventing pressed copper wrinkles according to claim 1, characterized in that: The width of the buffer channel is 10 mil.
3. A core plate structure for preventing pressed copper wrinkles according to claim 1, characterized in that: The buffer area is formed by splicing hexagonal buffer patterns, and buffer channels are formed between adjacent buffer patterns.
4. A core board structure for preventing pressed copper wrinkles according to claim 3, characterized in that: The buffer patterns in adjacent rows or columns are staggered to form a curved buffer channel.
5. The core plate structure for preventing pressed copper wrinkles according to claim 3, characterized in that: The hexagonal buffer pattern is symmetrical about its length axis, and the length of the length axis is 190 mil.
6. A core board structure for preventing pressed copper wrinkles according to claim 5, characterized in that: The height of the hexagonal buffer pattern is 120 mil, where the height refers to the dimension perpendicular to the length axis.
7. A core board structure for preventing pressed copper wrinkles according to claim 6, characterized in that: The size of the four sides of the hexagonal buffer pattern adjacent to the length axis is 80 mil.
8. The core plate structure for preventing pressed copper wrinkles according to claim 1, characterized in that: The buffer area is formed by splicing rectangular buffer patterns, and a curved buffer channel is formed between adjacent buffer patterns.
9. The core board structure for preventing pressed copper wrinkles according to claim 1, characterized in that: The buffer area is formed by splicing triangular buffer patterns, and a curved buffer channel is formed between adjacent buffer patterns.
10. The core board structure for preventing pressed copper wrinkles according to claim 1, characterized in that: The thickness of the bottom copper layer is 15-36 microns.