Heat conduction base for plate type heat dissipation device and heat dissipation device

Abstract

The utility model discloses a heat conduction pedestal used for a plate type heat radiation device and a heat radiation device, the heat conduction pedestal is used for attaching at least one heat source, the heat conduction pedestal comprises a first cover body, a second cover body and a support assembly, the first cover body is used for installing at least one heat radiation fin; the second cover body is provided with a sunken part which extends and sinks towards the direction far away from the first cover body, and the first cover body is arranged on the second cover body and covers the sunken part; the supporting assembly is arranged in the concave part, the top and the bottom of the supporting assembly are correspondingly connected with the first cover body and the second cover body respectively, and the first cover body is supported through the supporting assembly.

Description

Technical Field

[0001] The utility model relates to a heat-conducting base, in particular to a heat-conducting base and a heat-dissipating device used for a plate-type heat-dissipating device. Background Art

[0002] With the rapid development of science and technology, the application of electronic products is becoming more and more extensive, and the requirements for the heat dissipation devices of electronic products are becoming higher and higher.

[0003] Most existing electronic products utilize plate-type heat sinks, which use a solid plate as a thermal base and heat dissipation via heat sink fins mounted on the plate. However, in practice, using a solid plate as a thermal base not only significantly increases the weight of the heat sink, but also provides less than ideal heat dissipation. Therefore, with today's thinner electronic products, reducing the weight of heat sinks while improving heat dissipation efficiency and providing sufficient structural support for the heat sink fins have become challenges researchers in this field are striving to address. Utility Model Content

[0004] The utility model provides a heat-conducting base for a plate-type heat dissipation device, wherein the heat-conducting base is used to adhere to at least one heat source, and the heat-conducting base includes:

[0005] A first cover body, on which at least one heat dissipation fin is mounted;

[0006] The second cover has a recessed portion extending in a direction away from the first cover, and the first cover is mounted on the second cover and covers the recessed portion;

[0007] A support assembly is disposed in the recessed portion, wherein the top and bottom of the support assembly are respectively connected to the first cover body and the second cover body, and the first cover body is supported by the support assembly.

[0008] The above-mentioned thermally conductive base, wherein the second cover comprises:

[0009] a bottom shell having the recessed portion;

[0010] The annular wall portion is connected to the upper portion of the bottom shell in a surrounding manner, and the first cover body is connected to the annular wall portion.

[0011] The above-mentioned thermally conductive base, wherein the bottom shell includes:

[0012] base plate;

[0013] Four side plates are connected around and to the bottom plate to form the recessed portion, and the annular wall portion is connected to the four side plates.

[0014] The above-mentioned thermally conductive base, wherein the support assembly includes:

[0015] a partition plate mounted on the bottom plate and located in the recessed portion, the partition plate having at least one opening, and separating the recessed portion from at least one supporting area through the at least one opening;

[0016] At least one supporting member is correspondingly disposed in at least one of the supporting areas. The top surface and the bottom surface of each supporting member are correspondingly connected to the first cover and the bottom plate.

[0017] In the above-mentioned heat-conducting base, at least one slot group is spaced apart on the first cover, and each of the heat dissipation fins is correspondingly mounted on each of the slot groups.

[0018] The above-mentioned thermal conductive base, wherein the first cover body is also provided with an injection port connected to the interior of the thermal conductive base, and the thermal conductive base also includes an injection pipeline installed on the injection port, and the working fluid is injected into the interior of the thermal conductive base through the injection pipeline and the injection port.

[0019] In the above-mentioned thermal conductive base, each of the supporting members is a folded fin heat sink or a buckled fin heat sink.

[0020] In the above-mentioned thermal conductive base, the folded fin heat sink includes at least one of: staggered fins, continuous fins, corrugated fins and serrated fins.

[0021] In the above-mentioned thermally conductive base, the bottom shell and / or the first cover are both formed by stamping a sheet metal part.

[0022] In the above-mentioned thermally conductive base, the first cover body and the second cover body are connected by a brazing process.

[0023] The utility model also provides a heat dissipation device, which includes:

[0024] At least one heat dissipation fin, wherein at least one of the heat dissipation fins is arranged at intervals;

[0025] In any of the above-mentioned heat-conducting bases, at least one heat dissipation fin is mounted on the heat-conducting base, the heat-conducting base is used to be attached to at least one heat source, and the heat-conducting base includes:

[0026] A first cover body, on which at least one heat dissipation fin is mounted;

[0027] The second cover has a recessed portion extending in a direction away from the first cover, and the first cover is mounted on the second cover and covers the recessed portion;

[0028] A support assembly is disposed in the recessed portion, wherein the top and the bottom of the support assembly are respectively connected to the first cover body and the second cover body, and the first cover body is supported by the support assembly.

[0029] The above-mentioned heat dissipation device includes: a flow channel inside each of the heat dissipation fins, and the flow channel is connected to the inside of the heat conductive base.

[0030] The above-mentioned heat dissipation device includes: at least one installation and positioning block installed on the bottom of the second cover.

[0031] Compared with the prior art, the utility model has the following advantages: the utility model can reduce the weight of a plate-type heat dissipation device of the same size, and can at least achieve the compressive performance of a solid plate, thereby improving the heat dissipation effect and reducing material costs.

[0032] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a three-dimensional view from one perspective of the heat dissipation device according to the present invention.

[0034] Figure 2 This is a three-dimensional diagram from another perspective of the heat dissipation device according to the present invention.

[0035] Figure 3 A three-dimensional diagram of the thermal base.

[0036] Figure 4 for Figure 3 Exploded diagram.

[0037] Figure 5 This is a schematic diagram of the bottom case installation.

[0038] Figure 6 Schematic diagram of the structure of continuous fins.

[0039] Figure 7 Schematic diagram of the structure of corrugated fins.

[0040] Figure 8 Schematic diagram of the structure of the buckled Fin heat sink.

[0041] Wherein, the reference numerals:

[0042] Heat sink fin 1

[0043] Entrance 11

[0044] Outlet 12

[0045] Runner R

[0046] Thermal base 2

[0047] First cover 21

[0048] Slot C1

[0049] Slot C2

[0050] Inlet K2

[0051] Second cover 22

[0052] Bottom S

[0053] Bottom shell 221

[0054] Base plate 2211

[0055] Side panel 2212

[0056] Ring wall portion 222

[0057] Depression RP

[0058] Support assembly 23

[0059] Partition 231

[0060] Opening K1

[0061] Support member 232

[0062] Support area P

[0063] Injection line 24

[0064] Install positioning block 3 DETAILED DESCRIPTION

[0065] See also Figure 1-Figure 2 , Figure 1 This is a perspective view of the heat dissipation device according to the present invention. Figure 2 FIG. 1 is a perspective view of the heat dissipation device according to the present invention from another perspective. Figure 1-Figure 2 As shown, in this embodiment, a heat dissipation device of the present invention includes: at least one heat dissipation fin 1 and a thermally conductive base 2, at least one of the heat dissipation fins 1 is arranged at intervals; at least one of the heat dissipation fins 1 is mounted on the thermally conductive base 2, and the thermally conductive base 2 is used to fit at least one heat source, wherein each of the heat dissipation fins 1 has a flow channel R1 inside, and the flow channel is connected to the inside of the thermally conductive base 2 to provide a channel for the working fluid inside the thermally conductive base 2 to circulate in the thermally conductive base 2 and the heat dissipation fin 1, thereby dissipating heat from the heat source.

[0066] The heat dissipation device further includes at least one mounting and positioning block 3 , which is mounted on the bottom of the heat-conducting base 2 so that the heat dissipation device can be stably mounted in the electronic product.

[0067] Please refer to Figure 3-Figure 5 , Figure 3 This is a three-dimensional diagram of the thermal base. Figure 4 for Figure 3 Exploded diagram, Figure 5 This is a schematic diagram of the installation of the bottom shell, where Figure 5 The middle support area P is provided with a support member 232, and the other support area P is not provided with a support member 232. Figure 3-Figure 5 As shown, the thermal base 2 includes: the thermal base 2 includes: a first cover body 21, a second cover body 22 and a support assembly 23, the first cover body 21 is used to install at least one heat dissipation fin 1; the second cover body 22 has a recessed portion RP extending in a direction away from the first cover body 21, the first cover body 21 is installed on the second cover body 22 and covers the recessed portion RP, at least one mounting positioning block 3 is installed on the bottom of the second cover body 22; the support assembly 23 is arranged in the recessed portion RP, the top and the bottom of the support assembly 23 are respectively connected to the first cover body 21 and the second cover body 22, and the first cover body 21 is supported by the support assembly 23.

[0068] At least one slot group is spaced apart on the first cover 21, and each heat sink fin 11 is correspondingly mounted on each slot group. In this embodiment, each slot group includes two slots C1 and a slot C2 located between the two slots C1. Each heat sink fin 11 has two inlet ends 11 and an outlet end 12 located between the two inlet ends 11. The inlet ends 11 and the outlet ends 12 are connected to the flow channel R1. The two inlet ends 11 are correspondingly inserted into the slots C1, and the outlet end 12 is inserted into the slot C2. Based on this, the flow channel R1 is connected to the interior of the thermal base 2, thereby forming a circulation channel.

[0069] Furthermore, the second cover 22 includes a bottom shell 221 and an annular wall 222 . The bottom shell 221 has the recessed portion RP. The annular wall 222 surrounds and is connected to the upper portion of the bottom shell 221 . The first cover 21 is connected to the annular wall 222 .

[0070] The bottom shell 221 includes a bottom plate 2211 and four side plates 2212 . The four side plates 2212 surround and connect to the bottom plate 2211 to form the recessed portion RP. The annular wall portion 222 is connected to the four side plates 2212 .

[0071] Furthermore, the support assembly 23 includes: a partition 231 and at least one support member 232, the partition 231 is installed on the bottom plate 2211 and is located in the recessed portion RP, the partition 231 has at least one opening K1, and the recessed portion RP is separated into at least one support area P by at least one opening K1; at least one support member 232 is correspondingly arranged in at least one support area P, and the top surface and bottom surface of each support member 232 are respectively connected to the first cover body 21 and the bottom plate 2211.

[0072] Please refer to Figure 6-Figure 8 , Figure 6 is a schematic diagram of the structure of the continuous fin. Figure 7 is a structural diagram of the corrugated fin. Figure 8 The figure is a schematic diagram of the structure of a snap-fit ​​fin heat sink. In this embodiment, each support member 232 is a folded fin heat sink or a snap-fit ​​fin heat sink. The folded fin heat sink includes at least one of: offset fins, continuous fins, corrugated fins, and serrated fins. Based on this, the support members 232 not only provide structural support for the first cover 21, but also effectively increase the heat dissipation area within the thermally conductive base, enhancing heat exchange and thus improving the heat dissipation performance of the heat sink.

[0073] Furthermore, the first cover 21 is provided with an injection port K2 connected to the interior of the thermal base 2. The thermal base 2 also includes an injection pipe 24 installed on the injection port K2, and the working fluid is injected into the interior of the thermal base 2 through the injection pipe 24 and the injection port K2.

[0074] In one embodiment of the present invention, the bottom shell 221 is formed by stamping a sheet metal part.

[0075] In one embodiment of the present invention, the first cover 21 is also formed by stamping a sheet metal part.

[0076] In one embodiment of the present invention, the first cover 21 and the second cover 22 are connected by a brazing process, and the brazing makes the bottom surface S of the second cover 22 flat, and the flatness thereof can be controlled within a threshold.

[0077] In an embodiment of the present invention, the heat dissipation fins 11 and the first cover 21 are connected by a brazing process.

[0078] Compared with traditional heat dissipation devices, the heat dissipation device according to the present invention has the following beneficial effects:

[0079] The utility model can reduce the weight of a plate-type heat dissipation device of the same size and at least achieve the compressive resistance of a solid plate, thereby improving the heat dissipation effect and reducing material costs.

[0080] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the claims appended to the present invention.

Claims

1. A heat-conducting base for a plate-type heat sink, characterized in that: For attaching to at least one heat source, the thermally conductive base comprises: A first cover body, on which at least one heat dissipation fin is mounted; The second cover has a recessed portion extending in a direction away from the first cover, and the first cover is mounted on the second cover and covers the recessed portion; A support assembly is disposed in the recessed portion, wherein the top and bottom of the support assembly are respectively connected to the first cover body and the second cover body, and the first cover body is supported by the support assembly.

2. The thermally conductive base according to claim 1, wherein: The second cover comprises: a bottom shell having the recessed portion; The annular wall portion is connected to the upper portion of the bottom shell in a surrounding manner, and the first cover body is connected to the annular wall portion.

3. The thermally conductive base according to claim 2, wherein: The bottom shell includes: base plate; Four side plates are connected around and to the bottom plate to form the recessed portion, and the annular wall portion is connected to the four side plates.

4. The thermally conductive base according to claim 3, wherein: The support assembly comprises: a partition plate mounted on the bottom plate and located in the recessed portion, the partition plate having at least one opening, and separating the recessed portion from at least one supporting area through the at least one opening; At least one supporting member is correspondingly disposed in at least one of the supporting areas. The top surface and the bottom surface of each supporting member are correspondingly connected to the first cover and the bottom plate.

5. The thermally conductive base according to claim 1, wherein: At least one slot group is spaced apart on the first cover, and each of the heat dissipation fins is correspondingly mounted on each of the slot groups.

6. The thermally conductive base according to claim 1, wherein: The first cover body is further provided with an injection port connected to the interior of the heat-conducting base. The heat-conducting base further includes an injection pipeline installed on the injection port, and the working fluid is injected into the interior of the heat-conducting base through the injection pipeline and the injection port.

7. The thermally conductive base according to claim 4, wherein: Each of the supporting members is a folded fin heat sink or a buckled fin heat sink.

8. The thermally conductive base according to claim 7, wherein: The folded fin heat sink includes at least one of a staggered fin, a continuous fin, a corrugated fin and a serrated fin.

9. The thermally conductive base according to claim 2, wherein: The bottom shell and / or the first cover are both formed by stamping a sheet metal part.

10. The thermally conductive base according to claim 1, wherein: The first cover body and the second cover body are connected by a brazing process.

11. A heat dissipation device, characterized in that: include: At least one heat dissipation fin, wherein at least one of the heat dissipation fins is arranged at intervals; The thermally conductive base according to any one of claims 1 to 10, wherein at least one heat dissipation fin is mounted on the thermally conductive base, the thermally conductive base is used to be attached to at least one heat source, and the thermally conductive base comprises: A first cover body, on which at least one heat dissipation fin is mounted; The second cover has a recessed portion extending in a direction away from the first cover, and the first cover is mounted on the second cover and covers the recessed portion; A support assembly is disposed in the recessed portion, wherein the top and the bottom of the support assembly are respectively connected to the first cover body and the second cover body, and the first cover body is supported by the support assembly.

12. The heat dissipation device according to claim 11, wherein: include: Each of the heat dissipation fins has a flow channel inside, and the flow channel is communicated with the inside of the heat conductive base.

13. The heat dissipation device according to claim 11, wherein: include: At least one installation positioning block is installed on the bottom of the second cover.

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