Display device

Abstract

A display device is provided. The display device includes: a display panel including a first surface and a second surface, the display panel including a base layer and a display layer on the base layer; a driving circuit part disposed on a second surface of the display panel, the driving circuit part including a ground line and a driving circuit; a conductive resin member disposed on the second surface of the display panel, the conductive resin member electrically connected to the ground line, the conductive resin member including conductive particles and a resin; and a setting bracket covering at least a portion of the second surface of the display panel, the setting bracket forming an electrical contact surface with the conductive resin member.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0094809, filed on July 20, 2023, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device. Background Art

[0004] Recently, as interest in information display increases, research and development of display devices are progressing.

[0005] A display device may include a plurality of conductive structures. Therefore, in the event that an electrostatic discharge (ESD) phenomenon occurs adjacent to a conductive structure, the conductive structure may be damaged and reliability of an electrical signal may be reduced.

[0006] ESD can be eliminated by a predetermined ground path. Therefore, schemes for thoroughly designing the ground path have been studied.

[0007] It is to be understood that this background technology section is intended, in part, to provide a useful background for understanding the technology. However, this background technology section may also include ideas, concepts, or understandings that were not known or understood by those skilled in the relevant art before the corresponding effective filing date of the subject matter disclosed herein. Utility Model Content

[0008] Embodiments provide a display device in which a ground path having improved grounding performance is defined, so that risks due to ESD can be reduced.

[0009] Embodiments also provide a display device in which structural stability can be ensured.

[0010] According to one aspect of the present disclosure, a display device is provided, which may include: a display panel, the display panel including: a first surface, a second surface, a base layer, and a display layer, the display layer being arranged on the base layer; a driving circuit component, the driving circuit component being arranged on the second surface of the display panel and including: a ground line, and a driving circuit; a conductive resin component, the conductive resin component being arranged on the second surface of the display panel and electrically connected to the ground line, the conductive resin component including: conductive particles, and a resin; and a positioning bracket, the positioning bracket covering at least a portion of the second surface of the display panel and forming an electrical contact surface with the conductive resin component.

[0011] The conductive particles may include at least one of aluminum (Al), gold (Au), copper (Cu), graphene, and zinc (Zn). The resin may include an acrylic material.

[0012] The conductive resin member may be at least one of a thermosetting conductive resin member and a photocurable conductive resin member.

[0013] The display device may further include a lower layer disposed on the second surface of the display panel and electrically connected to the conductive resin member, wherein the lower layer includes a material having conductivity.

[0014] The lower layer, the ground line, the conductive resin member, and the placement bracket may form a ground path that eliminates at least a portion of electrostatic discharge (ESD).

[0015] The display device may further include a folding area in which at least a portion of the display panel is bent and a non-folding area in which the display panel is not bent, wherein at least a portion of the conductive resin part is arranged in the folding area.

[0016] The conductive resin member in the folding area may couple the display panel and the positioning bracket to each other.

[0017] The display device may further include a cover layer disposed on the display panel and including a cover glass, wherein the conductive resin member in the folding area couples the cover layer and the positioning bracket to each other.

[0018] At least a portion of the conductive resin member may extend in a first direction in plan view, and at least another portion of the conductive resin member may extend in a second direction different from the first direction in plan view.

[0019] The driving circuit part may include a cover part disposed adjacent to one side of the display panel, the cover part including a ground line.

[0020] The display device may further include a lower layer disposed on the second surface of the display panel and comprising a conductive material. The lower layer may form a heat dissipation structure. In plan view, at least a portion of the lower layer may extend in a first direction, and in plan view, at least another portion of the lower layer may extend in a second direction different from the first direction.

[0021] The lower layer may include a first lower layer and a second lower layer, the first lower layer and the second lower layer being spaced apart from each other with a filling layer interposed therebetween.The conductive resin member may be directly adjacent to the first lower layer and the second lower layer.

[0022] The display device may further include a battery component that stores electricity. The battery component may be separated from the conductive resin component by a partition wall connected to the positioning bracket, with the partition wall interposed between the battery component and the conductive resin component.

[0023] The display panel may include at least one of an organic light emitting diode, an inorganic light emitting element, and a liquid crystal display.

[0024] According to another aspect of the present disclosure, a display device is provided that may include a ground path for eliminating at least a portion of electrostatic discharge (ESD). The display device may include: a display panel including: a pixel circuit, and a light-emitting element electrically connected to the pixel circuit; a drive circuit component electrically connected to the pixel circuit and including a ground line; a positioning bracket overlapping at least a portion of the display device in a plan view; and a conductive resin component having at least a portion arranged between the positioning bracket and the drive circuit component, wherein the ground path includes an electrical path, and current flows through the electrical path along the ground line, the conductive resin component, and the positioning bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic plan view illustrating a display device according to an embodiment of the present disclosure.

[0026] Figure 2 is a schematic cross-sectional view illustrating a display device according to an embodiment of the present disclosure.

[0027] Figure 3 is a schematic plan view illustrating a display device according to an embodiment of the present disclosure.

[0028] Figure 4 is a schematic block diagram illustrating a ground path according to an embodiment of the present disclosure.

[0029] Figure 5 is a schematic diagram illustrating a conductive resin member according to an embodiment of the present disclosure.

[0030] Figures 6 to 9 is a schematic cross-sectional view illustrating a display device according to an embodiment of the present disclosure.

[0031] Figure 10 : is a view schematically illustrating a positional relationship of a conductive resin member in a region adjacent to a folding region according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0032] Example embodiments will now be described more fully hereinafter with reference to the accompanying drawings; however, these embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the example embodiments to those skilled in the art.

[0033] In the accompanying drawings, dimensions may be exaggerated for clarity of illustration. It will be understood that when an element is referred to as being "between two elements," it can be the only element between the two elements, or one or more intervening elements may also be present. Throughout the specification, like reference numerals refer to like elements.

[0034] It will be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. Thus, the "first" element discussed below may also be referred to as the "second" element without departing from the teachings of the present disclosure. As used herein, the singular is intended to include the plural unless the context clearly indicates otherwise.

[0035] It will be further understood that the terms “comprise,” “comprising,” “have,” “having,” “has,” “include,” and “including,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence and / or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0036] In the specification and claims, for the purposes of its meaning and interpretation, the term "and / or" is intended to include any combination of the terms "and" and "or." For example, "A and / or B" may be understood to mean any combination of "A, B, or A and B." The terms "and" and "or" may be used in conjunction or disjunctive conjunction sense and may be understood to be equivalent to "and / or."

[0037] For the purpose of this disclosure, the phrase “at least one of A and B” may be interpreted as only A, only B, or any combination of A and B. In addition, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z.

[0038] Furthermore, expressions that an element such as a layer, region, substrate, or plate is placed “on” or “over” another element indicate not only a case where the element is “placed directly on” or “placed just over” another element, but also a case where another element is interposed between the element and the other element. Expressions that an element such as a layer, region, substrate, or plate is placed “under” or “below” another element indicate not only a case where the element is “placed directly under” or “placed just under” another element, but also a case where another element is interposed between the element and the other element.

[0039] The term "overlap" or "overlapping" means that a first object can be above, below, or to one side of a second object, and vice versa. Additionally, the term "overlap" may include layer, stack, facing, or facing, extending over, covering, or partially covering, or any other suitable term as would be appreciated and understood by one of ordinary skill in the art.

[0040] When an element is described as "not overlapping" or "non-overlapping" another element, this may include the elements being spaced apart from each other, offset from each other, disposed beside each other, or any other suitable terminology as would be appreciated and understood by one of ordinary skill in the art.

[0041] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will also be understood that, unless expressly defined as such herein, terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense.

[0042] Figure 1 is a schematic plan view illustrating a display device according to an embodiment of the present disclosure.

[0043] refer to Figure 1 The display device DD may include a base layer BSL and pixels PXL disposed on the base layer BSL. Although not shown in the drawings, the display device DD may further include a driving circuit component PCB for driving the pixels PXL (see FIG. Figure 4 ) (e.g., scan drivers and data drivers), lines, and pads.

[0044] The display device DD (or base layer BSL) may include a display area DA and a non-display area NDA. The non-display area NDA may mean an area other than the display area DA. The non-display area NDA may surround at least a portion of the display area DA.

[0045] The base layer BSL may form a base surface of the display device DD. The base layer BSL may be a rigid substrate including glass and / or a flexible substrate (or film) including plastic or metal materials and at least one insulating layer. However, the present disclosure is not limited to specific examples.

[0046] In some embodiments, the base layer BSL may include a layer made of a flexible material (for example, a structure in which polyimide layers and barrier layers are alternately arranged therein), and at least a portion of the base layer BSL may be bent. The bent portion of the base layer BSL may be arranged under a portion of another base layer BSL and form a substrate in which the driving circuit part PCB (see FIG. 1 ) is arranged. Figure 4 ) etc. Therefore, the area of ​​the non-display area NDA (for example, dead zone) can be reduced.

[0047] The display area DA may mean an area in which pixels PXL are arranged. The non-display area NDA may mean an area in which pixels PXL are not arranged. Lines and pads connected to the pixels PXL of the display area DA may be arranged in the non-display area NDA.

[0048] According to the embodiment, the structure, PENTILE TM The pixel PXL (or sub-pixel SPX) is provided with a configuration structure, etc. However, the present disclosure is not limited thereto, and various embodiments may be applied to the present disclosure.

[0049] According to an embodiment, a pixel PXL (or subpixel SPX) may include a first subpixel SPXL1, a second subpixel SPXL2, and a third subpixel SPXL3. Each of the first subpixel SPXL1, the second subpixel SPXL2, and the third subpixel SPXL3 may be a subpixel SPX. At least one first subpixel SPXL1, at least one second subpixel SPXL2, and at least one third subpixel SPXL3 may constitute a pixel unit configured to emit light of various colors.

[0050] For example, each of the first sub-pixel SPXL1, the second sub-pixel SPXL2, and the third sub-pixel SPXL3 can emit light of one color. For example, the first sub-pixel SPXL1 can be a red pixel that emits red (e.g., the first color) light, the second sub-pixel SPXL2 can be a green pixel that emits green (e.g., the second color) light, and the third sub-pixel SPXL3 can be a blue pixel that emits blue (e.g., the third color) light. According to an embodiment, the number of second sub-pixels SPXL2 can be greater than the number of first sub-pixels SPXL1 and the number of third sub-pixels SPXL3. However, the colors, types, and / or numbers of the first sub-pixels SPXL1, the second sub-pixels SPXL2, and the third sub-pixels SPXL3 that constitute each pixel unit are not limited to specific examples.

[0051] Figure 2 is a schematic cross-sectional view illustrating a display device according to an embodiment of the present disclosure.

[0052] refer to Figure 2 , the display device DD may include a display panel DP, a cover layer CG and a lower layer HGL.

[0053] The display panel DP may include a pixel circuit layer PCL (eg, a backplane layer) including a base layer BSL and a display layer DL disposed on the pixel circuit layer PLC.

[0054] The display panel DP may include a first surface SF1 and a second surface SF2. The first surface SF1 may be a front surface, and the second surface SF2 may be a rear surface. The first surface SF1 may be adjacent to the display layer DL. The second surface SF2 may be adjacent to the pixel circuit layer PCL.

[0055] The pixel circuit layer PCL may be a layer including a pixel circuit for driving the pixel PXL formed by the display layer DL (or a light emitting element included in the display layer DL). The pixel circuit layer PCL may include a base layer BSL, a conductive layer for forming the pixel circuit, and an insulating layer arranged on the conductive layer.

[0056] The display layer DL may be arranged on the pixel circuit layer PCL. In some embodiments, the display layer DL may include a light-emitting element. In some embodiments, the light-emitting element may include an organic light-emitting diode (OLED). In other embodiments, the light-emitting element may include an inorganic light-emitting element including an inorganic material. In other embodiments, the display layer DL may include a liquid crystal display (LCD). However, the present disclosure is not limited thereto.

[0057] In some embodiments, the display layer DL may further include a polarization layer POL disposed adjacent to the cover layer CG (see FIG. Figure 9). The polarization layer POL may allow light provided from the display layer DL to be transmitted therethrough and reflect light introduced from the outside. In some embodiments, the polarization layer POL may include a polarizer that polarizes light applied along a polarization axis.

[0058] The cover layer CG may be disposed on the first surface SF1 of the display panel DP. The cover layer CG may be disposed substantially at the outside with respect to the display direction (eg, the third direction DR3). In some embodiments, the cover layer CG may include a cover glass.

[0059] In some embodiments, the cover layer CG may cover the front surface of the display panel DP. In some embodiments, the cover layer CG may protect the display panel DP and include a glass material (eg, ultra-thin glass). However, the present disclosure is not limited thereto.

[0060] The lower layer HGL may be disposed on the second surface SF2 of the display panel DP. The lower layer HGL may cover the rear surface of the display panel DP.

[0061] In some embodiments, the lower HGL layer may include a heat dissipation layer and form a heat dissipation structure. For example, the lower HGL layer may include a material with relatively high thermal conductivity. In some embodiments, the lower HGL layer may form part of a ground path. For example, the lower HGL layer may include a material with electrical conductivity. In some embodiments, the lower HGL layer may include copper (Cu). However, the present disclosure is not limited thereto.

[0062] The structure of the display device DD including the conductive resin member CRS is described as a structure in which a ground path for reducing electrostatic discharge (ESD) risk is formed. For convenience of description, descriptions of portions overlapping with those described above will be simplified or will not be repeated.

[0063] Figure 3 is a schematic plan view illustrating a display device according to an embodiment of the present disclosure. Figure 3 Schematically illustrates a planar structure in which the display device DD is viewed from the bottom. For example, Figure 3 Components disposed under the display panel DP (eg, the base layer BSL) may be schematically illustrated.

[0064] Figure 4 is a schematic block diagram illustrating a ground path according to an embodiment of the present disclosure. For example, Figure 4 The figure schematically illustrates the connection relationship between conductive components forming a ground path according to an embodiment of the present disclosure.

[0065] Figure 5 is a schematic diagram illustrating a conductive resin member according to an embodiment of the present disclosure. Figure 5Materials forming the conductive resin member CRS according to an embodiment of the present disclosure are schematically illustrated.

[0066] refer to Figures 3 to 5 , the display device DD may further include a driving circuit part PCB, a battery part BAT, and a conductive resin part CRS arranged on the rear surface of the base layer BSL (eg, the second surface SF2 of the display panel DP).

[0067] In some embodiments, the lower HGL may be completely disposed on the rear surface of the base layer BSL. For example, the lower HGL may extend onto a plane defined by the first direction DR1 and the second direction DR2. In some embodiments, the lower HGL may overlap the drive circuit component PCB, the battery component BAT, and the conductive resin component CRS in a plan view. In some embodiments, the lower HGL may cover a wider area of ​​the display panel DP in a plan view than the drive circuit component PCB.

[0068] In some embodiments, the driving circuit part PCB may be arranged to overlap the conductive resin part CRS and the lower layer HGL on the rear surface of the base layer BSL. In some embodiments, the driving circuit part PCB may not overlap the battery part BAT in a plan view.

[0069] In some embodiments, the driving circuit component PCB may include a circuit board and a driver chip. The circuit board and the driver chip may be electrically connected to each other. The circuit board may include a driving circuit. The driver chip may include a scan driver capable of supplying scan signals for driving the pixels PXL and a data driver capable of supplying data signals for driving the pixels PXL. In some embodiments, the circuit board may be a flexible circuit board. In some embodiments, the driving circuit component PCB may be electrically connected to the pixel circuit.

[0070] In some embodiments, the driving circuit component PCB may include a cover component C-IC. The cover component C-IC may be arranged adjacent to one side of the display panel DP. For example, the cover component C-IC may be part of the driving circuit component PCB and may be arranged on a side adjacent to the folding area FA of the display panel DP. The folding area FA may refer to an area in which a portion of the display panel DP is bent. The folding area FA may be adjacent to one side of a non-folding area NFA, which is an area in which the display panel DP is not bent. In some embodiments, the cover component C-IC may include a structure in which a conductive structure is patterned on a film.

[0071] In some embodiments, the driving circuit component PCB (eg, the cover component C-IC) may include a ground line GL. For example, the ground line GL may form a ground source as at least a portion of a conductive structure formed in the cover component C-IC.

[0072] The battery component BAT may be disposed on the rear surface of the base layer BSL. In some embodiments, the battery component BAT may be disposed so as not to overlap with the drive circuit component PCB in a plan view. In some embodiments, the battery component BAT may store and supply power required for the operation of the display device DD.

[0073] In some embodiments, the battery component BAT may not overlap with the conductive resin component CRS in plan view. For example, the conductive resin component CRS may be selectively arranged in a portion of the rear surface of the base layer BSL that is not directly adjacent to the battery component BAT. This facilitates replacement and repair of the battery component BAT.

[0074] The conductive resin component CRS may be completely arranged on the rear surface of the base layer BSL. For example, the conductive resin component CRS may extend onto a plane defined by the first direction DR1 and the second direction DR2. The conductive resin component CRS may overlap with the drive circuit component PCB (e.g., the cover component C-IC) and the lower layer HGL in a plan view.

[0075] refer to Figure 4 , the conductive resin member CRS may form a portion of a ground path for eliminating at least a portion of ESD. The display device DD according to an embodiment of the present disclosure may include a ground path capable of eliminating at least a portion of ESD.

[0076] ESD formed at the inside or outside of the display device DD may be discharged to the outside along a ground path of the display device DD, and thus, risks due to ESD in the display device DD can be reduced.

[0077] The ground path may include a ground line GL, a conductive resin member CRS, and a set standoff SET.

[0078] In some embodiments, the conductive resin component CRS may have conductive properties. Figure 5 , the conductive resin member CRS may include conductive particles MT and resin MO.

[0079] The conductive particles MT may be made of a conductive material. For example, the conductive particles MT may be made of a metal. The conductive particles MT may include one or more metal materials having low resistance. For example, the conductive particles MT may include at least one selected from the group consisting of aluminum (Al), gold (Au), copper (Cu), graphene, and zinc (Zn). However, the present disclosure is not limited thereto.

[0080] The resin MO may include various materials. For example, the resin MO may include an acrylic material. However, the present disclosure is not limited thereto.

[0081] In some embodiments, the conductive resin component CRS may be a member of a base resin cured to include conductive particles MT that is thermally cured or photocured (e.g., ultraviolet (UV) cured). For example, the base resin may include a material for forming the resin MO (e.g., an acrylic monomer). The base resin may also include a photoinitiator or a thermal initiator. Thus, the resin MO provided by curing may also include a photoinitiator or a thermal initiator. However, the present disclosure is not limited thereto.

[0082] In some embodiments, the conductive resin member CRS may be electrically connected to the ground line GL. For example, the conductive resin member CRS may form an electrical contact surface with the ground line GL. In some embodiments, at least a portion of the ground line GL and the conductive resin member CRS may be in contact with each other.

[0083] In some embodiments, the conductive resin member CRS may be electrically connected to the setting support SET. For example, the conductive resin member CRS may form an electrical contact surface with the setting support SET. In some embodiments, at least a portion of the setting support SET and the conductive resin member CRS may be in contact with each other.

[0084] Therefore, ESD can be discharged to the outside through the ground path.

[0085] According to an embodiment, the conductive resin member CRS distributed in a relatively wide area under the display panel DP may form a ground path. The conductive resin member CRS may relatively widely define a contact surface with other components.

[0086] Experimentally, it can be difficult to ensure reliable grounding performance when the component forming the ground path covers a narrow area. For example, when a conductive pin or the like is used to form the ground path, an oxide layer may form in the area between the conductive pin and another component electrically contacting the conductive pin, making it difficult to properly define the ground path.

[0087] However, according to the embodiment of the present disclosure, the conductive resin member CRS covering a relatively wide area, rather than the conductive pin defined in a narrow area, can form a ground path, and therefore, a ground path with high reliability can be formed.

[0088] Will combine Figures 6 to 10 A cross-sectional structure of a display device DD including the conductive resin member CRS is described.

[0089] Figures 6 to 9 is a schematic cross-sectional view illustrating a display device according to an embodiment of the present disclosure. For example, Figure 6 It is along Figure 3 Schematic cut-away cross-sectional view taken along line AA′ shown in FIG. Figure 7 It is along Figure 3 Schematic cut-sectional view taken along line BB' shown in FIG. Figure 8 It is along Figure 3 Schematic cut-sectional view taken along line CC' shown in FIG. Figure 9 It is along Figure 3 Schematic cut-sectional view taken along line DD' shown in FIG.

[0090] Figure 10 : is a view schematically illustrating a positional relationship of a conductive resin member in a region adjacent to a folding region according to an embodiment of the present disclosure. Figure 10 The structure in which the conductive resin member CRS is arranged in the space defined by the folded display panel DP can be schematically illustrated.

[0091] The display device DD according to an embodiment of the present disclosure may further include a shield can SCA, a gasket GAS, a middle frame MFR, and an adhesive part GLU.

[0092] refer to Figures 6 to 10 , the shield can SCA, the gasket GAS, and the middle frame MFR may be disposed under the display panel DP (eg, the base layer BSL) and between the lower layer HGL and the set support SET.

[0093] The shielding can SCA may be disposed on the drive circuit component PCB. The shielding can SCA may be disposed below the display panel DP (e.g., the base layer BSL) and between the gasket GAS and the drive circuit component PCB. The shielding can SCA may protect other components from electromagnetic interference. The shielding can SCA may include a metal material. However, the present disclosure is not limited thereto.

[0094] The gasket GAS may be disposed on the driving circuit component PCB. The gasket GAS may be disposed between the lower layer HGL and the shielding can SCA. The gasket GAS may protect components of the display device DD from external influences (dust, electromagnetic waves, etc.).

[0095] The middle frame MFR may be disposed below the lower layer HGL (e.g., the base layer BSL) and between the setting bracket SET and the display panel DP. The middle frame MFR may include a material having relatively high rigidity. In some embodiments, at least a portion of the middle frame MFR may be covered with a conductive resin member CRS and coupled to the setting bracket SET via an adhesive member GLU including various adhesive materials.

[0096] The positioning bracket SET may form a lower member of the display device DD. The positioning bracket SET may form a housing of the display device DD. The positioning bracket SET may be disposed under the display panel DP.

[0097] The positioning bracket SET may cover the conductive resin member CRS. For example, the positioning bracket SET may form a contact surface with the conductive resin member CRS and be electrically connected to the conductive resin member CRS. The positioning bracket SET may be coupled to the cover layer CG. The positioning bracket SET may be connected to the intermediate frame MFR via an adhesive member GLU.

[0098] As described above, the setting bracket SET can form a ground path.

[0099] The positioning bracket SET may include a rigid material and be conductive. The conductive material included in the positioning bracket SET is not particularly limited. The positioning bracket SET may fix the display panel DP. The positioning bracket SET may stably hold the components of the display device DD.

[0100] In some embodiments, the display device DD may include a folding area FA in which a portion of the display panel DP is bent and a non-folding area NFA in which the display panel DP is not bent.

[0101] In some embodiments, the polarization layer POL may be disposed in the non-folding area NFA and may not be disposed in the folding area FA. The lower layer HGL may be disposed in the non-folding area NFA and may not be disposed in the folding area FA.

[0102] In some embodiments, the cover layer CG may be disposed in the entire non-folding area NFA from the folding area FA. In some embodiments, the conductive resin member CRS may be disposed in the entire non-folding area NFA from the folding area FA.

[0103] In some embodiments, the conductive resin member CRS can fill at least a portion of the space within the folding area FA. For example, the conductive resin member CRS can be arranged in the inner region formed when the display panel DP is bent, and can be arranged in the outer region formed when the display panel DP is bent. Therefore, the conductive resin member CRS in the folding area FA can couple the display panel DP, the cover layer CG, and the set support SET to each other. Therefore, the conductive resin member CRS can protect the components in the folding area FA and ensure the stability of the entire display device DD.

[0104] According to the embodiment ( Figure 10 ), the lower layer HGL may include a first lower layer HGL1 and a second lower layer HGL2, and the display device DD may further include a filling layer FIL disposed between the first lower layer HGL1 and the second lower layer HGL2. In some embodiments, the first lower layer HGL1 may be adjacent to a portion of the display panel DP formed at the front surface, and the second lower layer HGL2 may be adjacent to a portion of the display panel DP formed at the rear surface. Depending on the embodiment, the conductive resin member CRS may be directly adjacent to the filling layer FIL, the first lower layer HGL1, and the second lower layer HGL2 in the folding area FA.

[0105] In some embodiments, the display device DD may further include a protective layer BPL for protecting the display panel DP in the folding area FA. The protective layer BPL may be arranged from the folding area FA throughout the non-folding area NFA. The protective layer BPL may be formed using the same process as at least one of the multiple insulating layers used to form the display panel DP. In some embodiments, the protective layer BPL may be arranged on another portion of the display panel DP, which is arranged below the display panel DP that forms the front surface when at least a portion of the protective layer BPL is bent. The protective layer BPL may include an inorganic material. However, the present disclosure is not limited to specific examples.

[0106] The battery component BAT may be disposed on the setting support SET. The battery component BAT may be disposed between the lower layer HGL and the setting support SET.

[0107] In some embodiments, the display device DD may include a partition wall PAR. The partition wall PAR may be adjacent to the battery assembly BAT. In some embodiments, the battery assembly BAT and the conductive resin assembly CRS may be separated from each other. In some embodiments, the partition wall PAR may include a rigid material. In some embodiments, the partition wall PAR may be integrally formed with the setting support SET.

[0108] In some embodiments, the partition wall PAR may be adjacent to the battery component BAT. In the case where a base resin is supplied downward from the display panel DP to form the conductive resin component CRS, the risk of the base resin being directly adjacent to the battery component BAT can be prevented. The base resin can be provided as a cured conductive resin component CRS when the curing process is performed. In the case where the cured conductive resin component CRS is directly adjacent to the battery component BAT, the battery component BAT may be coupled to the conductive resin component CRS arranged in the upper half below the display panel DP. This may be disadvantageous in terms of repair, replacement, etc. of the battery component BAT. However, the partition wall PAR is formed so that the above-mentioned risk can be prevented.

[0109] The conductive resin member CRS may be disposed under the display panel DP to be adjacent to one or more components.

[0110] The conductive resin member CRS may be disposed between the driving circuit member PCB and the setting bracket SET. The conductive resin member CRS may be disposed between the middle frame MFR and the lower layer HGL. The conductive resin member CRS may be directly adjacent to the middle frame MFR.

[0111] Therefore, the conductive resin member CRS may fill the area under the display panel DP. The conductive resin member CRS may support components of the display device DD while serving as a ground path for eliminating ESD.

[0112] For example, the conductive resin member CRS may be prepared by injecting a base resin including the resin MO and the conductive particles MT into a portion under the display panel DP during a manufacturing process of the display device DD and curing the base resin.

[0113] When the base resin is supplied to the portion below the display panel DP, the base resin can fill the area below the display panel DP due to its relatively flexible nature. Thereafter, the base resin can be thermally cured or photocured (eg, ultraviolet (UV) cured).

[0114] When the manufacturing process of the display device DD is performed, the process of supplying the base resin to the portion under the display panel DP and the curing process can be performed without adding additional process facilities or excessive changes in the process procedure.

[0115] The conductive resin member CRS can be formed using a base resin that does not have excessive rigidity, and thus damage to the display panel DP and components thereunder can be prevented.

[0116] As described above, the conductive resin member CRS can be electrically connected to the setting support SET over a wide area, and can also be electrically connected to the underlying HGL over a wide area. For example, compared to relatively sharp electrical connection members (e.g., conductive pins), the conductive resin member CRS can be electrically connected to another component over a wide area (e.g., an area extending on a plane).

[0117] For example, in an edge region of the display panel DP corresponding to a side at which the cover part C-IC is not arranged (see Figures 6 to 8 ), the conductive resin part CRS may be electrically connected to a ground line GL included in the driving circuit part PCB and contact the setting support SET.

[0118] For example, in an edge region of the display panel DP corresponding to a side at which the cover part C-IC is arranged (see Figure 9 ), the conductive resin part CRS may be electrically connected to a ground line GL included in the driving circuit part PCB and contact the setting support SET.

[0119] Therefore, according to the embodiment of the present disclosure, the process is optimized and the grounding performance is enhanced. Therefore, the reliability of the electrical characteristics applied to the entire display device DD can be improved, and the stability of the display device DD can be ensured.

[0120] According to the present disclosure, it is possible to provide a display device in which a ground path having improved grounding performance is defined, so that risks due to ESD can be reduced.

[0121] According to the present disclosure, it is possible to provide a display device in which structural stability can be ensured.

[0122] Example embodiments have been disclosed herein, and although specific terms are employed, they are used and to be interpreted in a generic and descriptive sense only and not for purposes of limitation. In some cases, as will be apparent to one of ordinary skill in the art at the time of filing this application, features, characteristics, and / or elements described in connection with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in connection with other embodiments, unless expressly stated otherwise. Accordingly, those skilled in the art will understand that various changes in form and details may be made without departing from the spirit and scope of the present disclosure.

Claims

1. A display device, characterized in that: include: Display panel, including: The first surface, The second surface, basal layer, and a display layer disposed on the base layer; a driving circuit component disposed on the second surface of the display panel and comprising: ground wire, and Drive circuit; a conductive resin member disposed on the second surface of the display panel and electrically connected to the ground line, the conductive resin member comprising: conductive particles, and Resins; and A positioning bracket covers at least a portion of the second surface of the display panel and forms an electrical contact surface with the conductive resin member.

2. The display device according to claim 1, wherein The conductive resin member is electrically connected to the positioning bracket over a wide area.

3. The display device according to claim 1, wherein The drive circuit component is arranged to overlap with the conductive resin component on the rear surface of the base layer.

4. The display device according to claim 1, wherein Also includes: A lower layer is arranged on the second surface of the display panel and is electrically connected to the conductive resin member.

5. The display device according to claim 4, wherein: The lower layer, the ground line, the conductive resin member, and the positioning bracket form a ground path that eliminates at least a portion of electrostatic discharge.

6. The display device according to claim 1, wherein Also includes: a folding region in which at least a portion of the display panel is bent; as well as a non-folding area, in which the display panel is not bent, Here, at least a portion of the conductive resin member is arranged in the folding region.

7. The display device according to claim 6, wherein: The conductive resin member in the folding area couples the display panel and the positioning bracket to each other.

8. The display device according to claim 6, wherein: Also includes: a cover layer disposed on the display panel and comprising a cover glass, The conductive resin member in the folding region couples the cover layer and the positioning bracket to each other.

9. The display device according to claim 1, wherein At least a portion of the conductive resin member extends in a first direction, and At least another portion of the conductive resin member extends in a second direction different from the first direction.

10. The display device according to claim 1, wherein The driving circuit part includes a covering part disposed adjacent to one side of the display panel, the covering part including the ground line.

11. The display device according to claim 1, wherein Also includes: a lower layer disposed on the second surface of the display panel and having conductivity, Wherein, the lower layer forms a heat dissipation structure, At least a portion of the lower layer extends in a first direction, and At least another portion of the lower layer extends in a second direction different from the first direction.

12. The display device according to claim 11, wherein The lower layer includes a first lower layer and a second lower layer, the first lower layer and the second lower layer are spaced apart from each other with a filling layer interposed therebetween, and The conductive resin member is directly adjacent to the first lower layer and the second lower layer.

13. The display device according to claim 1, wherein Also includes: a battery component that stores electricity, The battery component is separated from the conductive resin component by a partition wall connected to the positioning bracket, and the partition wall is interposed between the battery component and the conductive resin component.

14. The display device according to claim 1, wherein The display panel includes at least one of an organic light emitting diode, an inorganic light emitting element, and a liquid crystal display.

15. A display device comprising a ground path for eliminating at least a portion of electrostatic discharge, characterized in that: The display device further includes: Display panel, including: pixel circuits, and a light-emitting element electrically connected to the pixel circuit; a driving circuit component electrically connected to the pixel circuit and including a ground line; a positioning bracket, the positioning bracket overlapping at least a portion of the display device; and a conductive resin member having at least a portion disposed between the positioning bracket and the drive circuit member, The grounding path includes an electrical path, and current flows through the electrical path along the grounding wire, the conductive resin component, and the positioning bracket.

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