Lamp bead with inverted support structure
Through the design of lamp beads with an inverted bracket structure, the second bracket glue is used to form a accommodating groove and set up solder paste connection, which solves the problem of inconsistent glue amount, improves the process yield and luminous effect, and realizes efficient production without the need for white glue.
Patent Information
- Application Number
- CN202423070446.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-12-12
AI Technical Summary
The existing lamp bead structure has the problem of inconsistent glue amount in the processes such as white glue dispensing and baking, which affects the consistency of the packaging glue and leads to poor color concentration of the finished lamp beads.
A flip-chip bracket structure is adopted, and a second bracket glue is used to form a accommodating groove. The first solder paste and the second solder paste are set in the opening at the bottom of the groove to electrically connect the lamp bead chip to the metal sheet without the need for white glue. The process yield is improved through the automatic homing feature, and rounded corners are set on the groove wall and bottom to increase the reflectivity and enhance the brightness.
It solves the problem of solid deviation and skew of lamp bead chips, improves the process yield, saves the white glue and baking steps, and at the same time ensures the color area concentration and luminous effect of the finished lamp beads.
Smart Images
Figure CN223322373U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of lamp bead packaging, in particular to a lamp bead with an inverted bracket structure. Background Art
[0002] The purpose of applying white glue around the chip is to prevent oxidation and sulfurization caused by contact between the chip and the metal sheet, and to prevent dust and moisture from accumulating between the chip and the metal sheet and causing damage to the chip. The white glue applied around the chip has good sealing and water resistance. Figure 1 As shown, the structure of most existing lamp beads is usually to glue the flip-chip lamp bead chip to the metal sheet by using solder paste conductive glue, then apply white glue around the flip chip and bake it to a semi-dry state, separate the flip chip from the metal chip, and finally fill the bracket cavity with packaging glue.
[0003] However, the lamp beads produced using this bracket structure still require processes such as white glue application and baking. The consistency of the white glue is poor, which in turn affects the consistency of the encapsulation adhesive and ultimately leads to poor color concentration in the finished lamp beads. Therefore, removing the white glue application process while also preventing chip sulfuration, dust accumulation, and moisture damage remains a current technical challenge. Utility Model Content
[0004] Based on this, it is necessary to provide a lamp bead with an inverted bracket structure.
[0005] The utility model provides a technical solution to the above-mentioned technical problems as follows: A lamp bead with a flip-chip bracket structure comprises: a positive metal sheet, a negative metal sheet, a first bracket adhesive, a second bracket adhesive, a first solder paste, a second solder paste, a lamp bead chip and a packaging adhesive; the positive metal sheet and the negative metal sheet are arranged at intervals, and the positive metal sheet and the negative metal sheet are connected by the first bracket adhesive, the second bracket adhesive is arranged around the positive metal sheet and the negative metal sheet to form a receiving groove, and the second bracket adhesive serves as the groove wall and groove bottom of the receiving groove, and the groove bottom has an opening; the first solder paste and the second solder paste are both located in the opening, the thickness of the first solder paste and the thickness of the second solder paste are both equal to the thickness of the side wall of the opening, the first solder paste is connected to the positive metal sheet, and the second solder paste is connected to the negative metal sheet; the positive terminal of the lamp bead chip is connected to the first solder paste, and the negative terminal of the lamp bead chip is connected to the second solder paste; the packaging adhesive is arranged to fill the receiving groove, and the packaging adhesive covers the lamp bead chip.
[0006] In one embodiment, the corner between the groove wall and the groove bottom of the accommodating groove is configured as a rounded corner.
[0007] In one embodiment, the rounded corners have a size ranging from 0.01 to 0.6 mm.
[0008] In one embodiment, the sidewall thickness of the opening is 0.04 mm.
[0009] In one embodiment, the cross-sectional shape of the opening is rectangular.
[0010] In one embodiment, the length and width of the opening are both in the range of 0.1-5 mm.
[0011] In one embodiment, the shape of the opening is matched with the shape of the connection terminal of the lamp bead chip.
[0012] In one embodiment, a surface of the packaging adhesive away from the lamp bead chip is flush with the notch of the accommodating groove.
[0013] In one embodiment, the positive electrode metal sheet and the negative electrode metal sheet are symmetrical with respect to the first bracket rubber material.
[0014] In one embodiment, the packaging glue is fluorescent glue.
[0015] The beneficial effects of the present invention are as follows: the present invention provides a lamp bead with an inverted support structure, wherein the bottom of the receiving groove formed by the second support glue is also filled with the second support glue, and an opening is provided on the second support glue at the bottom of the groove, and then a first solder paste and a second solder paste are respectively provided on the positive metal sheet and the negative metal sheet in the opening, so that the two ends of the lamp bead chip can be electrically connected to the positive metal sheet and the negative metal sheet respectively through the first solder paste and the second solder paste. The filling setting of the first solder paste and the second solder paste is the same as the side wall thickness of the opening, so that when the lamp bead chip is fixedly set in the receiving groove, a part of the bottom of the lamp bead chip will be tightly abutted against the second support glue at the bottom of the receiving groove, and when the entire lamp bead is reflow soldered, the lamp bead chip and the first solder paste and the second solder paste have the characteristic of automatically returning to their original position during the soldering process, which can better solve the problems of the lamp bead chip being fixedly biased or distorted, thereby improving the process yield. Through the above setting, the second bracket glue can be used to separate the lamp bead chip from the positive metal sheet and the negative metal sheet. Therefore, there is no need to apply white glue around the lamp bead chip. It can also prevent the lamp bead chip from vulcanization, dust accumulation, water vapor and other damage to the lamp bead chip. At the same time, it can save the processes of applying white glue and baking, and can also ensure that the color zone concentration of the final finished lamp bead is good, which can ensure that the finished lamp bead has a better luminous effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.
[0017] Figure 1 It is a schematic diagram of the cross-sectional structure of an existing lamp bead;
[0018] Figure 2 Schematic diagram of the cross-sectional structure of a lamp bead with a flip-chip bracket structure in one embodiment;
[0019] Figure 3 This is a schematic diagram of the planar structure of a lamp bead with an inverted bracket structure in one direction in one embodiment;
[0020] Figure 4 A schematic diagram of the internal planar structure of a lamp bead with a flip-chip bracket structure in one embodiment;
[0021] Figure 5 Schematic diagram of the cross-sectional structure of a lamp bead with a flip-chip support structure in one embodiment when the fillet is 0.01 mm;
[0022] Figure 6 Schematic diagram of the cross-sectional structure of a lamp bead with a flip-chip support structure when the fillet is 0.6 mm in one embodiment.
[0023] In the accompanying drawings, 10 is a lamp bead with an inverted bracket structure; 100 is a positive metal sheet; 200 is a negative metal sheet; 300 is a first bracket adhesive; 400 is a second bracket adhesive; 410 is a receiving groove; 411 is a groove wall; 412 is a groove bottom; 413 is an opening; 414 is a rounded corner; 500 is a first solder paste; 600 is a second solder paste; 700 is a lamp bead chip; 800 is a packaging adhesive. DETAILED DESCRIPTION
[0024] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The following will further describe the technical solution of the present invention in conjunction with the drawings of the embodiments of the present invention, and the present invention is not limited to the following specific implementation methods.
[0025] It should be understood that the same or similar reference numerals in the drawings of the embodiments correspond to the same or similar components. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom", etc. indicating an orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to the specific circumstances.
[0026] In one embodiment, Figure 2 、 Figure 3 and Figure 4 As shown, a lamp bead 10 with a flip-chip support structure includes: a positive metal sheet 100, a negative metal sheet 200, a first support adhesive 300, a second support adhesive 400, a first solder paste 500, a second solder paste 600, a lamp bead chip 700 and a packaging adhesive 800; the positive metal sheet 100 and the negative metal sheet 200 are arranged at intervals, and the positive metal sheet 100 and the negative metal sheet 200 are connected by the first support adhesive 300, the second support adhesive 400 is arranged around the positive metal sheet 100 and the negative metal sheet 200 to form a receiving groove 410, and the second support adhesive 400 serves as the groove wall 411 and the groove bottom 412 of the receiving groove 410 , the bottom of the groove 412 opens an opening 413; the first solder paste 500 and the second solder paste 600 are both located in the opening 413, and the thickness of the first solder paste 500 and the thickness of the second solder paste 600 are both equal to the side wall thickness of the opening 413, the first solder paste 500 is connected to the positive metal sheet 100, and the second solder paste 600 is connected to the negative metal sheet 200; the positive terminal of the lamp bead chip 700 is connected to the first solder paste 500, and the negative terminal of the lamp bead chip 700 is connected to the second solder paste 600; the packaging glue 800 is arranged to fill the accommodating groove 410, and the packaging glue 800 covers the lamp bead chip 700.
[0027] Specifically, the second bracket glue 400 is also filled in the bottom 412 of the accommodating groove 410 formed by the second bracket glue 400, and an opening 413 is opened on the second bracket glue 400 at the bottom 412 of the groove, and then the first solder paste 500 and the second solder paste 600 are respectively set on the positive metal sheet 100 and the negative metal sheet 200 in the opening 413. Through the first solder paste 500 and the second solder paste 600, the two ends of the lamp bead chip 700 can be electrically connected to the positive metal sheet 100 and the negative metal sheet 200 respectively. The filling setting of the first solder paste 500 and the second solder paste 600 is the same as the side wall thickness of the opening 413. In this way, when the lamp bead chip 700 is fixedly set in the accommodating groove 410, a part of the bottom of the lamp bead chip 700 will be tightly abutted against the second bracket glue 400 at the bottom 412 of the accommodating groove 410. When the entire lamp bead is reflowed, the lamp bead chip 700 and the first solder paste 500 and the second solder paste 600 have the characteristic of automatic return to position during the welding process, which can better solve the problems of the lamp bead chip 700 such as fixed deviation and crookedness, and improve the process yield. Through the above-mentioned setting, the second bracket glue 400 can be used to separate the lamp bead chip 700 from the positive metal sheet 100 and the negative metal sheet 200. Therefore, there is no need to apply white glue around the lamp bead chip 700. It can also prevent the lamp bead chip 700 from vulcanization, dust accumulation, water vapor, etc. from damaging the lamp bead chip 700. At the same time, it can save the processes of applying white glue and baking, and can also ensure that the color zone concentration of the final finished lamp bead is good, that is, it can ensure that the finished lamp bead has a better luminous effect.
[0028] In order to make the brightness of the lamp bead 10 with the flip-chip support structure higher, in one embodiment, Figure 5 and Figure 6 As shown, the corner between the groove wall 411 and the groove bottom 412 of the accommodating groove 410 is set to a rounded corner 414. Specifically, by setting the corner of the groove bottom 412 of the accommodating groove 410 to be rounded 414, that is, adjusting the reflection angle of the groove wall 411 and the groove bottom 412 of the accommodating groove 410, the reflectivity of the groove wall 411 and the groove bottom 412 of the accommodating groove 410 can be improved, that is, the reflectivity of the second bracket glue 400 can be improved, thereby improving the brightness of the lamp bead 10 with the flip-chip bracket structure.
[0029] In order to make the second bracket adhesive 400 have a suitable reflectivity, in one embodiment, as Figure 5 and Figure 6As shown, the size range of the fillet 414 is 0.01-0.6mm. Specifically, the size of the fillet 414 is 0.01mm, which means that one end of the arc of the fillet 414 is tangent to the position of 0.01mm from the groove wall 411 to the groove bottom 412 of the accommodating groove 410, and the other end of the arc of the fillet 414 is tangent to the position of 0.01mm from the groove bottom 412 to the groove wall 411 of the accommodating groove 410. Similarly, the sizes of other fillets 414 are calculated in the same way, so the larger the size of the fillet 414, the larger the arc of the fillet 414. In this embodiment, according to the size of different lamp bead chips 700 and the different luminous angles of the lamp bead chips 700, a fillet 414 in the range of 0.01-0.6mm can be selected to make the second bracket glue 400 have a suitable reflectivity, thereby making the lamp bead 10 with a flip-chip bracket structure have higher brightness and better luminous effect.
[0030] In order to match the thickness of the first solder paste 500 and the second solder paste 600, in one embodiment, as shown in FIG. Figure 2 As shown, the sidewall thickness of the opening 413 is 0.04 mm. Specifically, the thickness of the first solder paste 500 and the second solder paste 600 is equal to the thickness of the sidewall of the opening 413. Therefore, the thickness of the first solder paste 500 and the thickness of the second solder paste 600 are also 0.04 mm. The first solder paste 500 and the second solder paste 600 with a thickness of 0.04 mm can firmly adhere the lamp bead chip 700 to the positive metal sheet 100 and the negative metal sheet 200, while also saving the amount of the first solder paste 500 and the second solder paste 600.
[0031] In order to match the shape of the lamp bead chip 700, in one embodiment, Figure 4 As shown, the cross-sectional shape of the opening 413 is rectangular. Specifically, by forming the cross-sectional shape of the opening 413 into a rectangle, and since the cross-sectional shape of the lamp bead chip 700 is generally rectangular, the rectangular opening 413 can match the shape of the lamp bead chip 700, so that the terminal of the lamp bead chip 700 can be fitted in the opening 413 and connected to the first solder paste 500 and the second solder paste 600.
[0032] In order to match lamp bead chips 700 of different sizes, in one embodiment, the length and width of the opening 413 are both within the range of 0.1-5 mm. Specifically, by setting the length and width of the opening 413 within the range of 0.1-5 mm, the lamp bead chips 700 of a size of 0.1-5 mm can be matched.
[0033] In order to better install the lamp bead chip 700 on the positive metal sheet 100 and the negative metal sheet 200, in one embodiment, the shape of the opening 413 is matched with the shape of the terminal of the lamp bead chip 700. Specifically, the positive and negative terminals of the lamp bead chip 700 are connected to the positive metal sheet 100 and the negative metal sheet 200 through the opening 413, respectively. Through the above-mentioned arrangement, when the lamp bead 10 with a flip-chip bracket structure is reflow soldered, since the lamp bead chip 700 and the first solder paste 500 and the second solder paste 600 have the characteristic of automatically returning to their original position during the welding process, it can better solve the problems of the lamp bead chip 700 being fixed, distorted, etc., and improve the process yield.
[0034] In order to make the lamp bead 10 with the flip-chip support structure have a better lighting effect, in one embodiment, Figure 2 As shown, the side of the packaging glue 800 away from the lamp bead chip 700 is flush with the notch of the accommodating groove 410. Specifically, through the above arrangement, light can be better emitted from the packaging glue 800, so that the lamp bead 10 with a flip-chip support structure has a better lighting effect.
[0035] In one embodiment, Figure 4 As shown, the positive metal sheet 100 and the negative metal sheet 200 are symmetrical about the first bracket rubber material 300. Specifically, through the above arrangement, it is possible to ensure that the lamp bead chip 700 is installed in the center of the accommodating groove 410, so that the light emitted by the lamp bead 10 with the flip-chip bracket structure is more uniform.
[0036] To produce light of varying hues, in one embodiment, the encapsulant 800 is a fluorescent adhesive. Specifically, the fluorescent adhesive is made of a colored silicone rubber and nitride phosphor. The colored silicone rubber is a translucent, addition-type liquid silicone rubber. By evenly coating the colored silicone with nitride phosphor, the LED chip 700 emits light of varying hues when light passes through it.
[0037] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. A person skilled in the art will be able to make other variations or modifications based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.
Claims
1. A lamp bead with an inverted bracket structure, characterized in that: include: Positive metal sheet, negative metal sheet, first bracket rubber material, second bracket rubber material, first solder paste, second solder paste, lamp bead chip and packaging glue; The positive metal sheet and the negative metal sheet are spaced apart and connected to each other via the first support rubber material. The second support rubber material is disposed around the positive metal sheet and the negative metal sheet to form a receiving groove, and the second support rubber material serves as the groove wall and groove bottom of the receiving groove, and the groove bottom has an opening. The first solder paste and the second solder paste are both located in the opening, the thickness of the first solder paste and the thickness of the second solder paste are both equal to the thickness of the side wall of the opening, the first solder paste is connected to the positive electrode metal sheet, and the second solder paste is connected to the negative electrode metal sheet; The positive terminal of the lamp bead chip is connected to the first solder paste, and the negative terminal of the lamp bead chip is connected to the second solder paste; The packaging glue is filled in the accommodating groove, and the packaging glue covers the lamp bead chip.
2. The lamp bead with a flip-chip support structure according to claim 1, characterized in that: The corner between the groove wall and the groove bottom of the accommodating groove is set to be rounded.
3. The lamp bead with a flip-chip support structure according to claim 2, characterized in that: The size of the rounded corners ranges from 0.01 to 0.6 mm.
4. The lamp bead with a flip-chip support structure according to claim 1, characterized in that: The side wall thickness of the opening is 0.04 mm.
5. The lamp bead with a flip-chip support structure according to claim 1, characterized in that: The cross-sectional shape of the opening is rectangular.
6. The lamp bead with a flip-chip support structure according to claim 1, characterized in that: The length and width of the opening are both in the range of 0.1-5 mm.
7. The lamp bead with a flip-chip support structure according to claim 1, characterized in that: The shape of the opening is matched with the shape of the connection terminal of the lamp bead chip.
8. The lamp bead with a flip-chip support structure according to claim 1, characterized in that: A side of the packaging glue away from the lamp bead chip is flush with the notch of the accommodating groove.
9. The lamp bead with a flip-chip support structure according to claim 1, characterized in that: The positive electrode metal sheet and the negative electrode metal sheet are symmetrical with respect to the first bracket rubber material.
10. The lamp bead with a flip-chip support structure according to any one of claims 1 to 9, characterized in that: The packaging glue is fluorescent glue.