Leading-out type piezoelectric actuator and piezoelectric actuator array structure

Abstract

The utility model relates to the technical field of piezoelectric driving, and provides a leading-out type piezoelectric actuator and a piezoelectric actuator array structure, and the leading-out type piezoelectric actuator comprises a piezoelectric actuator stack which comprises a plurality of piezoelectric driving units which are stacked in a first direction; the conductive layer is located on the side face of one side of the piezoelectric driver stack in the direction perpendicular to the first direction, the conductive layer comprises a plurality of conductive sections arranged in the first direction, and the plurality of conductive sections are arranged corresponding to the plurality of piezoelectric driving units respectively; the electrode plate comprises a main body section and a leading-out section, the main body section is connected with at least one conductive section, and the leading-out section protrudes out of the piezoelectric actuator stack in the first direction. As the leading-out sections of the electrode plates protrude out of the piezoelectric actuator stack, the space between two adjacent leading-out piezoelectric actuators cannot be occupied by connecting external devices through the leading-out sections, the distance between the leading-out piezoelectric actuators can be reduced, and higher-density array arrangement of the leading-out piezoelectric actuators in the same space is achieved.

Description

Technical Field

[0001] The present application relates to the field of piezoelectric drive technology, and in particular to an extraction-type piezoelectric driver and a piezoelectric driver array structure. Background Art

[0002] Piezoelectric actuators are high-precision components capable of micro-drive and micro-control. Assembled into arrays, these piezoelectric actuators can be fabricated into deformable mirrors for applications in adaptive optics, enabling precision imaging and focusing in fields such as laser communications. The increasing sophistication and miniaturization of deformable mirrors often necessitates the assembly of higher-density piezoelectric actuator arrays per unit area. Therefore, the overall structural dimensions of the piezoelectric actuators are crucial for the subsequent fabrication of piezoelectric actuator arrays and deformable mirrors.

[0003] In the prior art, the leads of the piezoelectric driver are led out from the side of the piezoelectric driver, which occupies the space between two adjacent piezoelectric drivers, resulting in that the two adjacent piezoelectric drivers cannot be arranged closely, thereby reducing space utilization. Utility Model Content

[0004] In view of this, an embodiment of the present application provides a lead-out piezoelectric driver and a piezoelectric driver array structure to solve the problem of low space utilization.

[0005] The first aspect of the present application provides an extraction-type piezoelectric driver, comprising:

[0006] A piezoelectric driver stack comprising a plurality of piezoelectric driver units stacked along a first direction;

[0007] a conductive layer, located on a side surface of the piezoelectric driver stack in a direction perpendicular to the first direction, the conductive layer comprising a plurality of conductive segments arranged along the first direction, the plurality of conductive segments being respectively arranged corresponding to the plurality of piezoelectric driver units;

[0008] An electrode sheet extends along the first direction, the electrode sheet includes a main section and a lead section, the main section is connected to at least one of the conductive sections, and the lead section protrudes from the piezoelectric driver stack in the first direction.

[0009] The beneficial effects of the lead-out piezoelectric driver provided in the embodiment of the present application are as follows: since the lead-out section of the electrode sheet protrudes from the piezoelectric driver stack and is connected to external devices (such as leads, circuit boards, etc.) through the lead-out section, the welding point between the lead-out section and the external device is not between two adjacent lead-out piezoelectric drivers, and the electrode sheet itself is a sheet-like structure with a small thickness. Therefore, the distance between two adjacent lead-out piezoelectric drivers can be reduced to improve space utilization, thereby achieving a higher-density array arrangement of the lead-out piezoelectric drivers in the same space.

[0010] In some embodiments, the main body segment connects all of the conductive segments arranged along the first direction.

[0011] The beneficial effect of adopting this technical solution is that even if the conductive layer between two adjacent piezoelectric drive units cracks, the two adjacent piezoelectric drive units can still be connected through the main body segment, thus avoiding open circuits, ensuring the normal use of the lead-out piezoelectric driver and extending the service life of the lead-out piezoelectric driver. At the same time, the main body segment also increases the overall structural strength of the lead-out piezoelectric driver.

[0012] In some embodiments, a connection hole is provided on the lead-out section.

[0013] The beneficial effect of adopting the above technical solution is that when connecting the lead wire, the lead wire can be passed through the connection hole and welded to the lead-out section, thereby ensuring the stability of the lead wire connection to the lead-out section.

[0014] In some embodiments, a plurality of connection holes are provided on each lead-out segment.

[0015] The beneficial effect of adopting the above technical solution is that the same lead-out section can be connected to multiple leads through multiple connection holes to lead to different external devices.

[0016] In some embodiments, the lead-out section is further provided with a first arc-shaped hole arranged around the connecting hole.

[0017] The beneficial effect of adopting the above technical solution is that the lead wire can be connected in the connecting hole or the first arc-shaped hole as needed.

[0018] In some embodiments, the lead-out piezoelectric driver further includes a lead wire connected in the connection hole.

[0019] The beneficial effect of adopting the above technical solution is that the lead-out piezoelectric driver can be easily connected to an external device through the lead wire.

[0020] In some embodiments, the main body segment includes a welding portion welded to the conductive segment, the welding portion has a central hole and a second arc-shaped hole, and the second arc-shaped hole is arranged around the central hole.

[0021] The beneficial effects of adopting the above technical solution are: the central hole and the second arc hole can be used for welding, which increases the welding area, and the welding area is distributed more evenly, which is beneficial to improving the stability of welding between the welding part and the conductive segment.

[0022] In some embodiments, the conductive layer is provided with two layers, namely a positive conductive layer and a negative conductive layer, the positive conductive layer includes a plurality of positive conductive segments arranged along the first direction, and the negative conductive layer includes a plurality of negative conductive segments arranged along the first direction;

[0023] There are two electrode sheets, namely a first electrode sheet and a second electrode sheet, the first electrode sheet includes a first main section and a first lead section, the first main section is connected to at least one positive conductive section, and the first lead section protrudes from the piezoelectric driver stack in the first direction; the second electrode sheet includes a second main section and a second lead section, the second main section is connected to at least one negative conductive section, and the second lead section protrudes from the piezoelectric driver stack in the first direction.

[0024] The beneficial effect of adopting the above technical solution is that the first electrode sheet and the second electrode sheet are both led out from one end of the lead-out piezoelectric driver in the first direction, and when the lead-out piezoelectric drivers are arranged in an array, the space occupied is further reduced.

[0025] In some embodiments, the conductive layer is a silver layer.

[0026] The beneficial effects of adopting the above technical solution are as follows: the conductive layer made of silver material has excellent conductivity, which can effectively improve the current transmission efficiency and stability between each piezoelectric drive unit.

[0027] The second aspect of the present application proposes a piezoelectric driver array structure, which includes the extraction-type piezoelectric driver as described in the first aspect, wherein a plurality of the extraction-type piezoelectric drivers are provided and arranged in an array.

[0028] The piezoelectric driver array structure adopts any one or more embodiments of the above-mentioned lead-out piezoelectric driver, and thus has the beneficial effects of the above-mentioned embodiments, which will not be described in detail here.

[0029] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or conventional technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0031] Figure 1 is a schematic structural diagram of an extraction-type piezoelectric actuator provided in some embodiments of the present application;

[0032] Figure 2 yes Figure 1A schematic structural diagram of the lead-out piezoelectric actuator from another perspective;

[0033] Figure 3 is a schematic structural diagram of an electrode sheet provided in some embodiments of the present application;

[0034] Figure 4 is a schematic structural diagram of electrode sheets provided in other embodiments of the present application;

[0035] Figure 5 is a schematic structural diagram of electrode sheets provided in some other embodiments of the present application;

[0036] Figure 6 is a schematic structural diagram of an electrode sheet provided in some further embodiments of the present application;

[0037] Figure 7 is a schematic structural diagram of a piezoelectric driver array structure provided in some embodiments of the present application;

[0038] Figure 8 yes Figure 7 Schematic diagram of the structure of the middle base;

[0039] Figure 9 yes Figure 8 Enlarged view of point A in the middle;

[0040] Figure 10 is a schematic structural diagram of a piezoelectric driver array structure provided in other embodiments of the present application;

[0041] Figure 11 yes Figure 10 Schematic diagram of the structure of the middle-lead piezoelectric actuator;

[0042] Figure 12 is a schematic structural diagram of a piezoelectric driver array structure provided in some other embodiments of the present application;

[0043] Figure 13 yes Figure 12 Schematic diagram of the structure of the middle-lead piezoelectric actuator.

[0044] The meanings of the marks in the figure are:

[0045] 100. Piezoelectric actuator array structure;

[0046] 10. Lead-out piezoelectric driver;

[0047] 11. Piezoelectric driver stack; 111. Piezoelectric driver unit; 112. Insulator;

[0048] 12, conductive layer; 12a, positive conductive layer; 12b, negative conductive layer; 121, conductive segment; 121a, positive conductive segment; 121b, negative conductive segment;

[0049] 13. Electrode sheet; 13a. First electrode sheet; 13b. Second electrode sheet; 131. Main body section; 131a. First main body section; 131b. Second main body section; 1311. Welding portion; 13111. Center hole; 13112. Second arc-shaped hole; 132. Lead section; 132a. First lead section; 132b. Second lead section; 1321. Connecting hole; 1322. First arc-shaped hole;

[0050] 14. Leads; 14a. Positive lead; 14b. Negative lead;

[0051] 20. Base; 21. First jack; 22. Insulation sleeve;

[0052] 30. Circuit board; 31. Second socket; 32. Circuit. DETAILED DESCRIPTION

[0053] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0055] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0056] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0057] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0058] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0059] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the embodiments of the present application.

[0060] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0061] The embodiment of the first aspect of the present application proposes a lead-out piezoelectric driver. Figure 1 and Figure 2 The lead-out piezoelectric driver 10 includes a piezoelectric driver stack 11, a conductive layer 12, and an electrode sheet 13. The piezoelectric driver stack 11 includes a plurality of piezoelectric driver units 111 stacked along a first direction X. The conductive layer 12 is located on one side of the piezoelectric driver stack 11 in a direction perpendicular to the first direction X. The conductive layer 12 includes a plurality of conductive segments 121 arranged along the first direction X. The plurality of conductive segments 121 are respectively arranged corresponding to the plurality of piezoelectric driver units 111. The electrode sheet 13 extends along the first direction X and includes a main segment 131 and a lead-out segment 132. The main segment 131 is connected to at least one conductive segment 121, and the lead-out segment 132 protrudes from the piezoelectric driver stack 11 in the first direction X.

[0062] According to the deformation requirement of the piezoelectric driver stack 11 , two, three, four, or more piezoelectric driver units 111 may be stacked along the first direction X. For example, eight piezoelectric driver units 111 may be stacked along the first direction X.

[0063] The shape of the piezoelectric driving unit 111 is not limited in this application. For example, the piezoelectric driving unit 111 can be a rectangular block structure, a circular block structure, etc.

[0064] Two conductive layers 12 are provided, namely a positive conductive layer 12a and a negative conductive layer 12b, and both the positive conductive layer 12a and the negative conductive layer 12b extend along the first direction X. It will be understood that, in a direction perpendicular to the first direction X, the positive conductive layer 12a and the negative conductive layer 12b can be on opposite sides of the piezoelectric actuator stack 11; alternatively, the positive conductive layer 12a and the negative conductive layer 12b can be on adjacent sides of the piezoelectric actuator stack 11; or alternatively, the positive conductive layer 12a and the negative conductive layer 12b can be on the same side of the piezoelectric actuator stack 11.

[0065] Among them, the positive conductive layer 12a includes a plurality of positive conductive segments 121a arranged along the first direction X, and the plurality of positive conductive segments 121a are respectively arranged corresponding to the plurality of piezoelectric drive units 111; the negative conductive layer 12b includes a plurality of negative conductive segments 121b arranged along the first direction X, and the plurality of negative conductive segments 121b are respectively arranged corresponding to the plurality of piezoelectric drive units 111.

[0066] It should be noted that each piezoelectric drive unit 111 is provided with a positive electrode layer and a negative electrode layer on both sides of the first direction X. Optionally, multiple positive electrode layers and multiple negative electrode layers of the piezoelectric driver stack 11 are alternately arranged in the first direction X, wherein all the positive electrode layers are connected to the positive conductive layer 12a, and all the negative electrode layers are connected to the negative conductive layer 12b.

[0067] Among them, two electrode sheets 13 are provided, namely a first electrode sheet 13a and a second electrode sheet 13b. The first electrode sheet 13a and the positive conductive layer 12a are on the same side of the piezoelectric driver stack 11, and the second electrode sheet 13b and the negative conductive layer 12b are on the same side of the piezoelectric driver stack 11.

[0068] Optionally, the first electrode sheet 13a is welded on the positive conductive layer 12a, and the second electrode sheet 13b is welded on the negative conductive layer 12b.

[0069] It can be understood that the first electrode sheet 13a includes a first main segment 131a and a first lead segment 132a. The first main segment 131a is connected to at least one positive conductive segment 121a. The first lead segment 132a protrudes from the piezoelectric driver stack 11 in the first direction X and is connected to an external device. The second electrode sheet 13b includes a second main segment 131b and a second lead segment 132b. The second main segment 131b is connected to at least one negative conductive segment 121b. The second lead segment 132b protrudes from the piezoelectric driver stack 11 in the first direction X and is connected to an external device. Alternatively, the first electrode sheet 13a includes a first main segment 131a and a first lead segment 132a. The first main segment 131a is connected to at least one positive conductive segment 121a. The first lead segment 132a protrudes from the piezoelectric driver stack 11 in the first direction X. The second electrode sheet 13b includes a second main segment 131b but does not include a second lead segment 132b. The second main segment 131b is connected to an external device. Alternatively, the second electrode sheet 13b includes a second main segment 131b and a second lead segment 132b, the second main segment 131b is connected to at least one negative conductive segment 121b, and the second lead segment 132b protrudes from the piezoelectric driver stack 11 in the first direction X; the first electrode sheet 13a only includes the first main segment 131a, but does not include the first lead segment 132a, and the first main segment 131a is connected to an external device.

[0070] The beneficial effects of the lead-out piezoelectric driver 10 provided in the embodiment of the present application are as follows: since the lead-out section 132 of the electrode sheet 13 protrudes from the piezoelectric driver stack 11, the external device (such as a lead, a circuit board, etc.) is connected through the lead-out section 132, so that the welding point between the lead-out section 132 and the external device is not between two adjacent lead-out piezoelectric drivers 10, and the electrode sheet 13 itself is a sheet-like structure with a small thickness. Therefore, the distance between two adjacent lead-out piezoelectric drivers 10 can be reduced to improve space utilization, thereby realizing a higher-density array arrangement of the lead-out piezoelectric drivers 10 in the same space.

[0071] In some embodiments, the lead-out piezoelectric driver 10 further includes two insulating members 112, which are located at both ends of the lead-out piezoelectric driver 10 in the first direction X. That is, the plurality of piezoelectric drive units 111 are located between the two insulating members 112. The insulating member 112 may be an insulating plate or an insulating block.

[0072] Please also refer to Figure 1 and Figure 2 In some embodiments, the main body segment 131 connects all the conductive segments 121 arranged along the first direction X.

[0073] Optionally, the first main segment 131 a connects all the positive conductive segments 121 a arranged along the first direction X; and the second main segment 131 b connects all the negative conductive segments 121 b arranged along the first direction X.

[0074] Typically, using the above technical solution, even if the conductive layer 12 between two adjacent piezoelectric drive units 111 cracks, the two adjacent piezoelectric drive units 111 can still be connected through the main body section 131, thereby avoiding an open circuit, ensuring the normal use of the lead-out piezoelectric driver 10, and improving the service life of the lead-out piezoelectric driver 10. At the same time, the main body section 131 can also increase the overall structural strength of the lead-out piezoelectric driver 10.

[0075] In other embodiments, the main body segment 131 may be connected to a portion of the conductive segments 121 arranged along the first direction X. For example, the main body segment 131 is only connected to Figure 1 One or more conductive segments 121 at the middle and lower ends.

[0076] Please also refer to Figure 1 、 Figure 3 and Figure 10 In some embodiments, a connection hole 1321 is provided on the lead-out section 132 .

[0077] In the present application, the shape of the connection hole 1321 is not limited. For example, the shape of the connection hole 1321 can be a circular hole, an elliptical hole, a rectangular hole, a triangular hole, etc.

[0078] When connecting the lead wire 14 , the lead wire 14 can be passed through the connection hole 1321 and welded to the lead section 132 to ensure the stability of the lead wire 14 connected to the lead section 132 .

[0079] In other embodiments, please refer to Figure 4 , the connection hole 1321 may not be provided on the lead-out section 132.

[0080] Please refer to Figure 5 In some embodiments, a plurality of connection holes 1321 are provided on each lead-out section 132 .

[0081] It can be understood that two, three or more connecting holes 1321 can be provided on the same lead-out section 132 .

[0082] Among them, multiple connection holes 1321 on the same lead-out section 132 can be arranged along the first direction X; or, multiple connection holes 1321 on the same lead-out section 132 are arranged in a direction perpendicular to the first direction X; or, when there are three connection holes 1321 on the same lead-out section 132, the three connection holes 1321 are arranged in a herringbone shape.

[0083] By adopting the above technical solution, the same lead section 132 can be connected to multiple leads 14 through multiple connection holes 1321 to lead to different external devices.

[0084] Please refer to Figure 6 In some embodiments, the lead-out section 132 is further provided with a first arc-shaped hole 1322 arranged around the connecting hole 1321 , that is, the extending direction of the first arc-shaped hole 1322 is the circumferential direction of the connecting hole 1321 .

[0085] It is understood that one or more first arc-shaped holes 1322 may be provided. When there are multiple first arc-shaped holes 1322 , the multiple first arc-shaped holes 1322 are spaced apart along the circumference of the connecting hole 1321 .

[0086] By adopting the above technical solution, the lead wire 14 can be connected to the connecting hole 1321 or the first arc-shaped hole 1322 as needed; moreover, the structure on the lead-out section 132 is the same as that on the main section 131, which is more beautiful.

[0087] Please also refer to Figure 1 、 Figure 2 and Figure 11 In some embodiments, the lead-out piezoelectric driver 10 further includes a lead 14 connected within the connection hole 1321 .

[0088] Optionally, there are two leads 14, namely a positive lead 14a and a negative lead 14b. The positive lead 14a is connected to the connection hole 1321 of the first lead section 132a, and the negative lead 14b is connected to the connection hole 1321 of the second lead section 132b.

[0089] It is understood that a single lead 14 may be provided. For example, lead 14 may be a positive lead 14a, connected to the connection hole 1321 of the first lead section 132a, and the second lead section 132b may be directly welded to an external device through the connection hole 1321. Alternatively, lead 14 may be a negative lead 14b, connected to the connection hole 1321 of the second lead section 132b, and the first lead section 132a may be directly welded to an external device through the connection hole 1321.

[0090] By adopting the above technical solution, the lead wire 14 is used to facilitate the connection of the lead-out piezoelectric driver 10 with an external device.

[0091] In other embodiments, the lead wire 14 may not be provided, and the first lead section 132 a and the second lead section 132 b may be directly welded to external devices through the connection holes 1321 .

[0092] Please refer to Figure 3In some embodiments, the main body segment 131 includes a welding portion 1311 welded to the conductive segment 121 , the welding portion 1311 has a central hole 13111 and second arc-shaped holes 13112 , and the second arc-shaped holes 13112 are arranged around the central hole 13111 .

[0093] Optionally, a plurality of welding portions 1311 are provided along the first direction X, that is, all welding portions 1311 are on the same straight line, and all welding portions 1311 have the same shape, so as to improve the aesthetics of the lead-out piezoelectric driver 10 .

[0094] It is understood that one or more second arc-shaped holes 13112 can be provided. When there are multiple second arc-shaped holes 13112, the multiple second arc-shaped holes 13112 are arranged at intervals along the circumference of the central hole 13111.

[0095] By adopting the above technical solution, the central hole 13111 and the second arc hole 13112 can be used for welding to increase the welding area. At the same time, the welding area is more evenly distributed, which is beneficial to improving the stability of the welding between the welding portion 1311 and the conductive segment 121.

[0096] In other embodiments, the welding portion 1311 may be provided with a central hole 13111 without providing the second arc-shaped hole 13112 ; or, the welding portion 1311 may be provided with only the second arc-shaped hole 13112 without providing the central hole 13111 .

[0097] In some embodiments, the conductive layer 12 is a silver layer.

[0098] By adopting the above technical solution, the conductive layer 12 made of silver material has excellent conductivity, which can effectively improve the current transmission efficiency and stability between the piezoelectric driving units 111.

[0099] In other embodiments, the conductive layer 12 may be made of other conductive materials, such as copper, aluminum, etc.

[0100] The manufacturing method of the lead-out piezoelectric actuator 10 provided in some embodiments of the present application includes the following steps:

[0101] Slurry casting: Select piezoelectric ceramic powder and perform slurry casting according to certain formula and process conditions to obtain a green ceramic tape of a certain thickness, for example, a thickness of about 30um.

[0102] Printing and lamination molding: Use a printing machine to print the inner electrode on the green porcelain tape after casting and punching according to the set pattern, for example, an interdigitated inner electrode; after the green porcelain tape is laminated to a certain thickness in a laminating machine according to the set lamination program, an isostatic pressing process is used to form a green block, for example, with a thickness of about 2.6 mm.

[0103] Cutting: Cut the green block into individual green blocks along the surface cutting lines. For example, the green block size is about 6.35*6.35*2.6 mm.

[0104] Debinding and sintering: The green body is debinded in a debinding furnace and then placed in a sintering furnace. The inner electrode and the piezoelectric ceramic are matched and co-fired at high temperature to form a ceramic block. For example, the thickness of the sintered product is about 2.1 to 2.2 mm.

[0105] Grinding: The sintered ceramic block is ground to a specified shape and size, for example, 5*5*2 mm, to obtain the piezoelectric driving unit 111 .

[0106] Bonding and alignment: bonding the multiple ground piezoelectric drive units 111 together with glue to form a piezoelectric drive stack 11 . For example, there are eight piezoelectric drive units 111 .

[0107] Silver coating and silver firing: Silver is coated on the side of the piezoelectric actuator stack 11 and the silver is fired at a certain temperature to form a conductive layer 12.

[0108] Welding: welding the electrode sheet 13 on the conductive layer 12 on the side of the piezoelectric actuator stack 11;

[0109] Polarization: The lead-out piezoelectric actuator 10 after welding the electrode sheet 13 is placed in silicone oil for polarization.

[0110] Please refer to Figures 7 to 9 The second aspect of this application proposes a piezoelectric actuator array structure 100, which can be used in precision optical components requiring high capacity density, such as deformable mirrors and adaptive optics, and is primarily used in fields such as laser communications and laser weapons. The piezoelectric actuator array structure 100 includes the extraction-type piezoelectric actuator 10 of the first aspect, wherein a plurality of extraction-type piezoelectric actuators 10 are provided and arranged in an array.

[0111] The piezoelectric driver array structure 100 adopts any one or more embodiments of the above-mentioned lead-out piezoelectric driver 10, and thus has the beneficial effects of the above-mentioned embodiments, which will not be described in detail here.

[0112] Optionally, the piezoelectric actuator array structure 100 further includes a base 20 for supporting the arrayed plurality of lead-out piezoelectric actuators 10. The base 20 is provided with a plurality of first insertion holes 21, each of which is a strip-shaped hole having a length greater than or equal to the maximum width of the lead-out section 132. The lead-out piezoelectric actuator 10 includes an electrode sheet 13, the lead-out section 132 of which passes through the first insertion holes 21 for connection to an external device.

[0113] It can be understood that the base 20 can be an insulating base or a metal base; when the base 20 is a metal base, an insulating sleeve 22 needs to be set in the first socket 21, and both ends of the insulating sleeve 22 have flanges. The insulating sleeve 22 is used to isolate the base 20 and the lead-out section 132.

[0114] The shape of the base 20 is not limited in the present application. For example, the shape of the base 20 can be circular, rectangular, elliptical, etc.

[0115] Please refer to Figure 10 and Figure 11 In some embodiments, the lead 14 can be connected to the connection hole 1321 of the lead section 132. It is understood that among the multiple lead-out piezoelectric actuators 10 in the same array structure, some or all of the lead-out piezoelectric actuators 10 can be connected to the lead 14; that is, the lead-out piezoelectric actuators 10 can be connected to external devices via the lead 14.

[0116] Please refer to Figure 12 and Figure 13 In some embodiments, the piezoelectric driver array structure 100 further includes a circuit board 30 , which is located on a side of the base 20 facing away from the lead-out piezoelectric driver 10 .

[0117] Optionally, the shape of the circuit board 30 is the same as that of the base 20 . For example, when the shape of the base 20 is circular, the shape of the circuit board 30 is also circular.

[0118] Among them, the circuit board 30 has multiple second jacks 31 and circuits 32. The multiple second jacks 31 are arranged corresponding to the multiple first jacks 21 respectively. The lead section 132 of the electrode sheet 13 passes through the first jack 21 and the second jack 31, then is bent and welded on the circuit board 30 to connect with the circuit 32. The overall parallel connection is achieved through the design of the circuit 32.

[0119] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A lead-out piezoelectric driver, characterized in that: include: A piezoelectric driver stack comprising a plurality of piezoelectric driver units stacked along a first direction; a conductive layer, located on a side surface of the piezoelectric driver stack in a direction perpendicular to the first direction, the conductive layer comprising a plurality of conductive segments arranged along the first direction, the plurality of conductive segments being respectively arranged corresponding to the plurality of piezoelectric driver units; An electrode sheet extends along the first direction, the electrode sheet includes a main section and a lead section, the main section is connected to at least one of the conductive sections, and the lead section protrudes from the piezoelectric driver stack in the first direction.

2. The extraction type piezoelectric driver according to claim 1, wherein: The main body segment connects all the conductive segments arranged along the first direction.

3. The extraction type piezoelectric driver according to claim 1, wherein: The lead-out section is provided with a connecting hole.

4. The extraction type piezoelectric driver according to claim 3, wherein: There are multiple connection holes on each lead-out section.

5. The extraction type piezoelectric driver according to claim 3, wherein: The lead-out section is further provided with a first arc-shaped hole arranged around the connecting hole.

6. The extraction type piezoelectric driver according to claim 3, wherein: The lead-out piezoelectric driver further includes a lead wire connected in the connection hole.

7. The extraction type piezoelectric driver according to any one of claims 1 to 6, characterized in that: The main body segment includes a welding portion welded to the conductive segment, the welding portion has a central hole and a second arc-shaped hole, and the second arc-shaped hole is arranged around the central hole.

8. The extraction type piezoelectric driver according to any one of claims 1 to 6, characterized in that: There are two conductive layers, namely a positive conductive layer and a negative conductive layer, the positive conductive layer includes a plurality of positive conductive segments arranged along the first direction, and the negative conductive layer includes a plurality of negative conductive segments arranged along the first direction; There are two electrode sheets, namely a first electrode sheet and a second electrode sheet, the first electrode sheet includes a first main section and a first lead section, the first main section is connected to at least one positive conductive section, and the first lead section protrudes from the piezoelectric driver stack in the first direction; the second electrode sheet includes a second main section and a second lead section, the second main section is connected to at least one negative conductive section, and the second lead section protrudes from the piezoelectric driver stack in the first direction.

9. The extraction type piezoelectric driver according to any one of claims 1 to 6, characterized in that: The conductive layer is a silver layer.

10. A piezoelectric driver array structure, characterized in that: The invention comprises the extraction-type piezoelectric driver according to any one of claims 1 to 9, wherein a plurality of the extraction-type piezoelectric drivers are provided and arranged in an array.

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