Blocking mechanism of semiconductor test sorting machine

Abstract

The utility model relates to the technical field of semiconductor sorting equipment, in particular to a semiconductor test sorting machine blocking mechanism which comprises a feeding machine main body, a conveying supporting plate is installed on one side of the feeding machine main body, a sorting machine main body is installed at the other end of the conveying supporting plate, an intercepting buffering mechanism is installed on the conveying supporting plate, and the sorting machine main body is installed on the conveying supporting plate. The interception buffer mechanism comprises a guide assembly and a buffer assembly, the guide assembly is used for guiding the falling direction of the semiconductor component, and the buffer assembly is used for slowing down the falling speed of the semiconductor component; the device is simple in structure and convenient to operate, a worker can conveniently and flexibly adjust the falling conveying speed of each semiconductor component, the distance between the semiconductor components during conveying is effectively controlled, blocking and separating operation can be carried out on each semiconductor component, and the working efficiency is improved. Therefore, the semiconductor components can be sequentially released according to processing requirements, and the situation that the semiconductor components collide with one another due to too high falling speed is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor sorting equipment, in particular to a blocking mechanism of a semiconductor testing and sorting machine. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. After the processing and production of semiconductor components are completed, they need to be tested to check whether they are qualified. Generally, semiconductor components are transported to the test sorting machine through a vibrating plate loader and a conveyor track for testing and sorting. In order to test and sort the semiconductor components in sequence, a blocking mechanism is usually set in the conveyor track, that is, a baffle that can move up and down is set to control the semiconductor components to enter the test sorting machine in sequence. The current blocking mechanism structure is relatively complex and the manufacturing cost is high. Therefore, we propose a semiconductor test sorting machine blocking mechanism to solve the above problems.

[0003] In order to solve the above technical problems, the Chinese patent with announcement number CN212681740U in the prior art discloses a blocking mechanism for a semiconductor test sorting machine, which includes a vibration plate loading body, a U-shaped conveying track and a test sorting body. The two ends of the U-shaped conveying track are respectively connected to the discharge port of the vibration plate loading body and the feed port of the test sorting body. A support plate is provided below one end of the U-shaped conveying track close to the test sorting body. Four connecting columns are symmetrically fixed on the top of the support plate, and the tops of the connecting columns are fixedly connected to the bottom of the U-shaped conveying track.

[0004] Although the above-mentioned existing technical solution can control the up and down movement of the baffle to perform blocking and releasing operations, its U-shaped conveying track is set at an angle, and the falling speed of multiple groups of semiconductor components cannot be controlled. There is no buffer, and they will collide with each other when falling, causing the components to be bumped and damaged. Once multiple semiconductor components are close to each other or fall together, it will be difficult for the baffle to accurately separate each semiconductor component and release them in sequence. The separation and release effect is poor, which in turn affects the subsequent work efficiency. Utility Model Content

[0005] The purpose of the present utility model is to provide a blocking mechanism for a semiconductor test sorting machine to solve the problem proposed in the above background technology that its U-shaped conveying track is tilted, the falling speed of multiple groups of semiconductor components cannot be controlled, there is no buffer, and they collide with each other when falling, causing the components to be bumped and damaged. In addition, once multiple semiconductor components are close to each other or fall together, it is difficult for the baffle to accurately separate the individual semiconductor components and release them in sequence, resulting in poor separation and release effects, which in turn affects the subsequent work efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A blocking mechanism for a semiconductor testing and sorting machine includes a loader body, a conveyor pallet is installed on one side of the loader body, a sealing cover is clamped on the top of the conveyor pallet through a positioning assembly, the sorting machine body is installed on the other end of the conveyor pallet, and an intercepting buffer mechanism is installed on the conveyor pallet. The intercepting buffer mechanism includes a guide assembly and a buffer assembly. The guide assembly is used to guide the direction of falling semiconductor components, and the buffer assembly is used to slow down the falling speed of semiconductor components.

[0008] As a preferred solution of the present invention, the guide assembly includes rotating grooves that are staggered and opened on both sides of the inner wall of the conveying pallet, wherein two groups of the rotating grooves are rotatably connected to the inner sides of the first movable rods, and the other two groups of the rotating grooves are rotatably connected to the inner sides of the second movable rods. The first movable rod and the second movable rod extend to one end of the outer side of the conveying pallet and are respectively installed with a first sprocket and a second sprocket. The two groups of the first sprockets are meshed and connected by a first chain, and the two groups of the second sprockets are meshed and connected by a second chain. The first movable rod and the second movable rod are both provided with a guide seat at one end located on the inner side of the rotating groove.

[0009] As a preferred solution of the present invention, connecting plates are installed on both sides of the bottom of the conveying pallet, and a first motor is installed at one end of the connecting plate. The output ends of two groups of the first motors are fixedly connected to one side of the first sprocket and the second sprocket respectively. A connecting rod is rotatably connected to one end of the inner wall of the conveying pallet close to the sorting machine body, and multiple groups of shift plates are arranged on the outside of the connecting rod. A second motor is installed on one side of the outer wall of the conveying pallet, and the driving end of the second motor extends to the inner side of the conveying pallet and is fixedly connected to one end of the movable rod.

[0010] As a preferred solution of the present invention, the buffer assembly includes a sliding groove opened on one side of the guide seat, an airbag is installed on one side of the inner wall of the sliding groove, a first rubber plate is installed on the other side of the airbag, and two groups of fixed blocks are arranged and installed on the other side of the first rubber plate, and spring damping shock absorbers are installed on the opposite surfaces of the two groups of fixed blocks.

[0011] As a preferred solution of the present invention, the opposite ends of the two groups of spring damping shock absorbers are installed with a first connecting plate, the opposite ends of the two groups of the first connecting plates are rotatably connected to the second connecting plate, the connection between the two groups of the second connecting plates is a rotatable connection, one side of the two groups of the second connecting plates is rotatably connected to the third connecting plate, the other end of the third connecting plate is installed with a sliding plate, the sliding plate and the sliding groove are slidably connected, the cross-section of the sliding plate is T-shaped, and a second rubber plate is installed on the other side of the sliding plate.

[0012] As a preferred solution of the present invention, the positioning assembly includes a first fixed plate installed at one end of the top of the conveying pallet, a first spring is installed at one end of one side of the first fixed plate, a second fixed plate is installed at the other end of the first spring, and a pull ring is installed at one end outside the second fixed plate.

[0013] As a preferred solution of the present invention, a positioning block is installed on the top of the conveying pallet on one side of the first fixed plate, a fixing groove is provided at one end of the bottom of the sealing cover and is slidably connected to the positioning block, a positioning hole is provided on one side of the outer wall of the sealing cover and extends to the inner side of the positioning block, a positioning column is installed on one side of the second fixed plate and is slidably connected to the positioning hole, and the positioning column is slidably connected to the first fixed plate.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] In the utility model, the guide assembly guides the direction of the falling of the semiconductor components, and the buffer assembly slows down the falling speed of the semiconductor components. The utility model has a simple structure and is easy to operate, which makes it convenient for the staff to flexibly adjust the falling and conveying speed of each semiconductor component, effectively controls the distance between each semiconductor component during transportation, and allows the blocking and separation operations to be performed on each semiconductor component, so that the semiconductor components can be released in sequence according to processing needs, and avoids the situation where the falling speed is too fast and they collide with each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the top view of the conveying support plate of the utility model;

[0018] Figure 3 This is a partial cross-sectional structural diagram of the interception and buffering mechanism of the utility model;

[0019] Figure 4 This is a schematic diagram of a partial cross-sectional side view of the conveying support plate of the utility model;

[0020] Figure 5 This is a schematic diagram of the partial three-dimensional structure of the positioning component of the utility model;

[0021] Figure 6 It is a schematic diagram of the three-dimensional structure of the connecting rod and the shift plate of the utility model.

[0022] In the figure: 1. Feeder body; 2. Conveyor tray; 3. Sealing cover; 4. Sorting machine body; 5. First movable rod; 6. Second movable rod; 7. First sprocket; 8. Second sprocket; 9. First motor; 10. Guide seat; 11. Airbag; 12. First rubber plate; 13. Fixed block; 14. Spring damping shock absorber; 15. First connecting plate; 16. Second connecting plate; 17. Third connecting plate; 18. Sliding plate; 19. Second rubber plate; 20. Paddle plate; 21. First fixed plate; 22. First spring; 23. Second fixed plate; 24. Positioning block; 25. Positioning column. DETAILED DESCRIPTION

[0023] The following will combine the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0024] Example:

[0025] See also Figures 1-6 , the utility model provides a technical solution:

[0026] A blocking mechanism for a semiconductor testing and sorting machine comprises a loader body 1, a conveying pallet 2 is installed on one side of the loader body 1, a sealing cover 3 is clamped on the top of the conveying pallet 2 through a positioning component, a sorting machine body 4 is installed on the other end of the conveying pallet 2, and an intercepting buffer mechanism is installed on the conveying pallet 2. The intercepting buffer mechanism comprises a guide component and a buffer component. The guide component is used to guide the falling direction of the semiconductor components, and the buffer component is used to slow down the falling speed of the semiconductor components. When in use, the device can guide the falling direction of the semiconductor components through the guide component, and the buffer component slows down the falling speed of the semiconductor components. The structure is simple and the operation is convenient, which is convenient for the staff to flexibly adjust the falling and conveying speed of each semiconductor component, effectively controls the distance between each semiconductor component during transportation, and allows the blocking and separation operation to be performed on each semiconductor component, so that the semiconductor components can be released in sequence according to processing needs, and avoid the situation where the falling speed is too fast and they collide with each other.

[0027] In this embodiment, if Figure 1 、 Figure 2 and Figure 3As shown, the buffer assembly includes a sliding groove opened on one side of the guide seat 10, an airbag 11 is installed on one side of the inner wall of the sliding groove, a first rubber plate 12 is installed on the other side of the airbag 11, and two groups of fixed blocks 13 are arranged on the other side of the first rubber plate 12. The opposite surfaces of the two groups of fixed blocks 13 are installed with spring damping shock absorbers 14, and the opposite ends of the two groups of spring damping shock absorbers 14 are installed with first connecting plates 15. The opposite ends of the two groups of first connecting plates 15 are rotatably connected to the second connecting plates 16. The connection point of the two groups of second connecting plates 16 is a rotatable connection. One side of the two groups of second connecting plates 16 is rotatably connected to the third connecting plate 17. The other end of the third connecting plate 17 is installed with a sliding plate 18. The sliding plate 1 8 is slidably connected to the sliding groove, the cross-section of the sliding plate 18 is T-shaped, and a second rubber plate 19 is installed on the other side of the sliding plate 18. First, after the semiconductor components are transported to the inner side of the conveying pallet 2 one by one, they slide to the surface of the second rubber plate 19 and are forced to retract the sliding plate 18. The third connecting plate 17 is compressed, forcing the two groups of second connecting plates 16 to move downward and deflect. As the second connecting plates 16 move back, the first connecting plate 15 squeezes the spring damping shock absorber 14. At the same time, the first rubber plate 12 squeezes the airbag 11 after being subjected to force, buffering the downward force and slowing down its falling speed, thereby preventing the semiconductor components from falling too fast and colliding with each other, resulting in difficulties in separate transportation and damage caused by bumps.

[0028] In this embodiment, if Figure 1 、 Figure 2 and Figure 6 As shown, the guide assembly includes rotating grooves that are staggered and opened on both sides of the inner wall of the conveying pallet 2, wherein two groups of rotating grooves are rotatably connected to the inner sides of the first movable rod 5, and the other two groups of rotating grooves are rotatably connected to the inner sides of the second movable rod 6. The first movable rod 5 and the second movable rod 6 extend to one end of the outer side of the conveying pallet 2 and are respectively installed with a first sprocket 7 and a second sprocket 8. The two groups of first sprockets 7 are meshed and connected by a first chain, and the two groups of second sprockets 8 are meshed and connected by a second chain. The first movable rod 5 and the second movable rod 6 are both provided with a guide seat 10 at one end of the inner side of the rotating groove. Then, starting the second motor can drive the multiple groups of shift plates 20 on the connecting rod to rotate. When one of the semiconductor components slides to its shift plate 20, it can be rotated and shifted to allow the semiconductor component at that location to be transported down. At the same time, the next group of shift plates 20 moves down to block the opening of the conveying pallet 2 to play a blocking effect, thereby achieving the effect of sequential conveying and release.

[0029] In this embodiment, if Figure 1 、 Figure 2 and Figure 4As shown, connecting plates are installed on both sides of the bottom of the conveyor pallet 2, and a first motor 9 is installed at one end of the connecting plate. The output ends of the two groups of first motors 9 are fixedly connected to one side of the first sprocket 7 and the second sprocket 8 respectively. The inner wall of the conveyor pallet 2 is close to the end of the sorting machine body 4 and is rotatably connected to a connecting rod. A plurality of groups of shift plates 20 are arranged on the outside of the connecting rod. A second motor is installed on one side of the outer wall of the conveyor pallet 2. The driving end of the second motor extends to the inner side of the conveyor pallet 2 and is fixedly connected to one end of the movable rod. Furthermore, starting the two groups of first motors 9 can drive the first sprocket 7 and the second sprocket 8 to rotate, and cooperate with the first chain and the second chain to drive each group of first movable rods 5 and second movable rods 6 to rotate, adjust the inclination angle of the guide seat 10, and further adjust the falling conveying speed of semiconductor components according to actual needs.

[0030] In this embodiment, if Figure 1 and Figure 5 As shown, the positioning assembly includes a first fixing plate 21 installed at one end of the top of the conveying support plate 2, one end of the first fixing plate 21 side is installed with a first spring 22, the other end of the first spring 22 is installed with a second fixing plate 23, and a pull ring is installed at one end of the outer side of the second fixing plate 23. The top of the conveying support plate 2 is located on one side of the first fixing plate 21 and a positioning block 24 is installed. The bottom end of the sealing cover 3 is provided with a fixing groove that is slidably connected to the positioning block 24, and one side of the outer wall of the sealing cover 3 is provided with a positioning hole extending to the inner side of the positioning block 24. A positioning post 25 is installed on one side of the second fixing plate 23 and is slidably connected to the positioning hole. The positioning post 25 is slidably connected to the first fixing plate 21. Further, by buckling the pull ring, the second fixing plate 23 is driven to move, and the first spring 22 is stretched so that the positioning post 25 is pulled away from the positioning hole inside the positioning block 24. At this time, the sealing cover 3 can be lifted to disengage the positioning block 24 from the fixing groove, and then the components of the interception buffer mechanism can be inspected and maintained.

[0031] The implementation principle of the blocking mechanism of a semiconductor test sorting machine in the embodiment of the present application is as follows: after the semiconductor components are transported to the inner side of the conveying pallet 2 one by one, they slide to the surface of the second rubber plate 19 and are subjected to force to drive the sliding plate 18 to retract, and the third connecting plate 17 is compressed, forcing the two groups of second connecting plates 16 to move downward and deflect. As the second connecting plate 16 moves back, the first connecting plate 15 squeezes the spring damping shock absorber 14. At the same time, the first rubber plate 12 is subjected to force and squeezes the airbag 11 to buffer the downward force and slow down its falling speed, so as to prevent the individual semiconductor components from falling too fast and colliding with each other, resulting in difficulty in separate transportation and damage due to bumps. Starting the second motor can drive the multiple groups of dial plates 20 on the connecting rod to rotate. When one of the semiconductor components slides to its dial plate 20 After that, the rotation shift can be performed to allow the semiconductor components there to be transported down. At the same time, the next set of shift plates 20 moves down to block the opening of the conveying pallet 2 to achieve a blocking effect, thereby achieving the effect of sequential conveying and release. Starting the two sets of first motors 9 can drive the first sprocket 7 and the second sprocket 8 to rotate, and cooperate with the first chain and the second chain to drive each group of first movable rods 5 and second movable rods 6 to rotate, adjust the inclination angle of the guide seat 10, and further adjust the falling and conveying speed of the semiconductor components according to actual needs. Buckle the pull ring to drive the second fixed plate 23 to move, and stretch the first spring 22 so that the positioning column 25 is pulled away from the positioning hole inside the positioning block 24. At this time, the sealing cover 3 can be lifted to disengage the positioning block 24 from the fixing groove, and then the components of the interception buffer mechanism can be inspected and maintained.

[0032] The control method of the present invention is to control through a controller. The control circuit of the controller can be implemented by simple programming by technicians in this field. The provision of power is also common knowledge in this field. Moreover, the present invention is used to protect mechanical devices, so the control method and circuit connection are no longer explained in detail in the present invention.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor test and sorting machine blocking mechanism, comprising a loader body (1), characterized in that: A conveying tray (2) is installed on one side of the feeder main body (1), a sealing cover (3) is clamped on the top of the conveying tray (2) through a positioning assembly, a sorting machine main body (4) is installed on the other end of the conveying tray (2), and an intercepting buffer mechanism is installed on the conveying tray (2), the intercepting buffer mechanism includes a guide assembly and a buffer assembly, the guide assembly is used to guide the falling direction of the semiconductor components, and the buffer assembly is used to slow down the falling speed of the semiconductor components.

2. The semiconductor test and sorting machine blocking mechanism according to claim 1, characterized in that: The guide assembly includes rotating grooves arranged in an interlaced manner on both sides of the inner wall of the conveying support plate (2), wherein two groups of the rotating grooves are rotatably connected to the inner sides of the first movable rods (5), and the other two groups of the rotating grooves are rotatably connected to the inner sides of the second movable rods (6). The first movable rods (5) and the second movable rods (6) are extended to the outer sides of the conveying support plate (2) and are respectively installed with a first sprocket (7) and a second sprocket (8). The two groups of the first sprockets (7) are meshed and connected by a first chain, and the two groups of the second sprockets (8) are meshed and connected by a second chain. The first movable rods (5) and the second movable rods (6) are both sleeved with a guide seat (10) at one end located on the inner side of the rotating groove.

3. The semiconductor test and sorting machine blocking mechanism according to claim 2, characterized in that: Connecting plates are installed on both sides of the bottom of the conveying support plate (2), and a first motor (9) is installed at one end of the connecting plate. The output ends of the two groups of the first motors (9) are fixedly connected to one side of the first sprocket (7) and the second sprocket (8), respectively. The inner wall of the conveying support plate (2) is rotatably connected to one end of the separator body (4). Multiple groups of shift plates (20) are arranged on the outer side of the connecting rod. A second motor is installed on one side of the outer wall of the conveying support plate (2), and the driving end of the second motor extends to the inner side of the conveying support plate (2) and is fixedly connected to one end of the movable rod.

4. The semiconductor test and sorting machine blocking mechanism according to claim 3, characterized in that: The buffer assembly comprises a sliding groove opened on one side of the guide seat (10), an air bag (11) is installed on one side of the inner wall of the sliding groove, a first rubber plate (12) is installed on the other side of the air bag (11), two groups of fixed blocks (13) are arranged and installed on the other side of the first rubber plate (12), and spring damping shock absorbers (14) are installed on the opposite surfaces of the two groups of fixed blocks (13).

5. The semiconductor test and sorting machine blocking mechanism according to claim 4, characterized in that: The opposite ends of the two groups of spring damping shock absorbers (14) are both installed with a first connecting plate (15), the opposite ends of the two groups of the first connecting plates (15) are both rotatably connected to the second connecting plates (16), the connection between the two groups of the second connecting plates (16) is a rotatable connection, one side of the two groups of the second connecting plates (16) is rotatably connected to the third connecting plate (17), the other end of the third connecting plate (17) is installed with a sliding plate (18), the sliding plate (18) is slidably connected to the sliding groove, the cross-section of the sliding plate (18) is T-shaped, and the other side of the sliding plate (18) is installed with a second rubber plate (19).

6. The semiconductor test and sorting machine blocking mechanism according to claim 5, characterized in that: The positioning assembly comprises a first fixing plate (21) mounted on one end of the top of the conveying support plate (2), a first spring (22) being mounted on one end of one side of the first fixing plate (21), a second fixing plate (23) being mounted on the other end of the first spring (22), and a pull ring being mounted on one end of the outer side of the second fixing plate (23).

7. The semiconductor test and sorting machine blocking mechanism according to claim 6, characterized in that: A positioning block (24) is installed on the top of the conveying support plate (2) on one side of the first fixed plate (21); a fixing groove is provided at one end of the bottom of the sealing cover (3) and is slidably connected to the positioning block (24); a positioning hole is provided on one side of the outer wall of the sealing cover (3) and extends to the inner side of the positioning block (24); a positioning column (25) is installed on one side of the second fixed plate (23) and is slidably connected to the positioning hole; and the positioning column (25) is slidably connected to the first fixed plate (21).

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