High-performance resin cooling device

Abstract

The utility model discloses a high-performance resin cooling device which comprises a lower cabinet body and an upper cabinet body, and cooling mechanisms used for cooling high-performance resin are installed in the upper cabinet body and the lower cabinet body. The cooling mechanism comprises a lower template, the lower template is installed in the upper cabinet body through bolts, the top of the lower template is connected with an upper mold cover in a matched mode, a plurality of water channels are evenly distributed in the middle of the upper mold cover and the middle of the lower template respectively, the two ends of each water channel are connected with water pipe connectors in a screwed mode respectively, and the water pipe connectors are communicated with the other water pipe connector in a staggered mode through hoses. The cooling mechanism is arranged, a plurality of water channels are formed in the middle of the lower mold plate and the middle of the upper mold cover, staggered connection is achieved through water pipe connectors and hoses, the cooling efficiency of the lower mold plate and the upper mold cover is improved, the lower mold plate and the upper mold cover are connected in series through a third water pipe, cooling liquid circulates in the cooling mechanism, and heat emitted by the high-performance resin mold is taken away; and the cooling efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling devices, in particular to a high-performance resin cooling device. Background Art

[0002] Epoxy resin, also known as artificial resin, is a type of organic polymer containing two or more epoxy groups in its molecular structure, a thermosetting plastic; they can undergo cross-linking reactions with various types of curing agents to form insoluble, infusible polymers with a three-dimensional network structure. They have excellent insulation properties, mechanical properties and chemical stability, and are widely used in adhesives, coatings and other fields.

[0003] The existing patent document with announcement number CN216860514U discloses a cooling device for high-performance epoxy resin production molding, including a water tank and a stirring structure, characterized in that: cooling water towers are fixedly installed on the left and right sides of the top of the water tank, and the bottoms of the left and right sides of the water tank are fixedly connected with water outlet pipes, the other end of the water outlet pipe is fixedly connected to the water pump, and the other end of the water pump is fixedly connected to the mold temperature controller through a pipeline, the feed port of the mold temperature controller is fixedly connected to the stirring structure through a pipeline, the upper end of the right side of the stirring structure is fixedly connected to the heat transfer oil outlet, the left side of the bottom of the stirring structure is fixedly connected to the heat transfer oil inlet, and the bottom of the stirring structure is fixedly connected to a discharge pipe.

[0004] Although the above-mentioned cooling device for high-performance epoxy resin production molding can solve the corresponding technical problems, it is relatively cumbersome to use and is not easy to quickly cool down the high-performance resin mold, and there is still room for improvement.

[0005] To this end, a high-performance resin cooling device is proposed. Utility Model Content

[0006] The purpose of the utility model is to provide a high-performance resin cooling device for solving the problems raised by the above background technology.

[0007] In order to achieve the above-mentioned purpose, the main technical solutions adopted by this utility model include:

[0008] A high-performance resin cooling device, comprising:

[0009] A lower cabinet and an upper cabinet, wherein cooling mechanisms for high-performance resin cooling are installed inside the upper cabinet and the lower cabinet, and a cabinet door is installed at one end of the lower cabinet;

[0010] The cooling mechanism includes a lower template, which is installed in the upper cabinet by bolts. The top of the lower template is connected with an upper mold cover. The upper mold cover and the middle of the lower template are respectively provided with a plurality of water channels. The two ends of the water channels are respectively screwed with water pipe joints. The water pipe joint is staggered and connected to another water pipe joint through a hose. A lifting mechanism is also installed on the top of the upper mold cover.

[0011] Among them, one end of the lower template and the upper mold cover are respectively connected to a heat dissipation component through water pipe 1 and water pipe 2, and the heat dissipation component is installed in the lower cabinet.

[0012] As a preferred technical solution, the upper mold cover and the lower mold plate are three-way connected through water pipes.

[0013] As a preferred technical solution, the water pipe three is configured as a retractable hose.

[0014] As an optimal technical solution, the heat dissipation component includes a water tank, which is fixedly connected to the lower cabinet. A refrigerator and a water pump are respectively installed on the top of the water tank. The water outlet of the water pump is connected to the water pipe 2, and the water inlet of the water pump extends into the water tank through a pipe.

[0015] As a preferred technical solution, the water inlet of the refrigerator is connected to the water pipe, and the water outlet of the refrigerator is connected to the water tank through a pipeline.

[0016] As an optimal technical solution, the lifting mechanism includes a screw, which is threaded onto the top of the upper cabinet, one end of the screw is fixedly connected to the inner ring of the bearing, the outer ring of the bearing is fixedly connected to the top of the upper mold cover, and a handwheel is installed at one end of the screw.

[0017] As a preferred technical solution, the top of the upper mold cover is symmetrically fixedly connected with a guide rod, and the guide rod slides on the top of the upper cabinet.

[0018] The utility model has at least the following beneficial effects:

[0019] The beneficial effect of the utility model of the present application is that by setting a cooling mechanism, a plurality of water channels are opened in the middle of the lower template and the upper mold cover, and staggered connection is made using water pipe joints and hoses to increase the cooling efficiency of the lower template and the upper mold cover, and three water pipes are used to connect them in series so that the coolant circulates inside them to take away the heat emitted by the high-performance resin mold, thereby quickly cooling the high-performance resin mold placed between the lower template and the upper mold cover, greatly improving its cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1This is a three-dimensional schematic diagram of a high-performance resin cooling device of the present utility model;

[0021] Figure 2 This is a schematic diagram of the cooling mechanism components of the high-performance resin cooling device of the present invention;

[0022] Figure 3 This is a schematic diagram of the dissection of the high-performance resin cooling device of the present invention;

[0023] Figure 4 This is a schematic diagram of the back of the high-performance resin cooling device of the present utility model;

[0024] Figure 5 This is a schematic diagram of the exploded components of the high-performance resin cooling device of the present invention.

[0025] In the figure: 1. Lower cabinet body; 2. Upper cabinet body; 3. Cabinet door; 4. Cooling mechanism; 401. Upper mold cover; 402. Screw; 403. Bearing; 404. Guide rod; 405. Handwheel; 406. Hose; 407. Water pipe joint; 408. Bolt; 409. Water channel; 410. Lower mold plate; 501. Water tank; 502. Refrigerator; 503. Water pump; 504. Water pipe 1; 505. Water pipe 2; 506. Water pipe 3. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] See also Figure 1-Figure 5 This embodiment provides a high-performance resin cooling device, comprising: a lower cabinet 1 and an upper cabinet 2, wherein a cooling mechanism 4 for cooling high-performance resin is installed inside the upper cabinet 2 and the lower cabinet 1, and a cabinet door 3 is installed at one end of the lower cabinet 1;

[0028] The cooling mechanism 4 includes a lower template 410, which is mounted in the upper cabinet 2 via bolts 408. The top of the lower template 410 is fitted with an upper mold cover 401. A plurality of water channels 409 are evenly distributed in the middle of the upper mold cover 401 and the lower template 410. Water pipe connectors 407 are screwed to both ends of the water channel 409. The water pipe connector 407 is staggeredly connected to another water pipe connector 407 via a hose 406. A lifting mechanism is also installed on the top of the upper mold cover 401.

[0029] Among them, one end of the lower template 410 and the upper mold cover 401 are connected to the heat dissipation component through water pipe 1 504 and water pipe 2 505 respectively, and the heat dissipation component is installed in the lower cabinet 1.

[0030] The upper mold cover 401 and the lower mold plate 410 are connected via a third water pipe 506. The third water pipe 506 allows the water channel 409 of the upper mold cover 401 to communicate with the water channel 409 of the lower mold plate 410, thereby allowing the coolant to circulate within the lower mold plate 410 and the lower mold plate 410, thereby increasing the heat conduction capacity of the lower mold plate 410 and the upper mold cover 401, thereby rapidly cooling the high-performance mold placed between the upper mold cover 401 and the lower mold plate 410.

[0031] The water pipe 3 506 is configured as a retractable hose. By configuring the water pipe 3 506 as a retractable hose, it can be extended as the upper mold cover 401 rises, so that the upper mold cover 401 and the lower mold plate 410 always remain in a connected state.

[0032] The heat dissipation assembly includes a water tank 501, which is fixedly connected to the lower cabinet 1. A cooler 502 and a water pump 503 are respectively installed on the top of the water tank 501. The water outlet of the water pump 503 is connected to the second water pipe 505, and the water inlet of the water pump 503 extends into the water tank 501 through a pipe. By setting up the heat dissipation assembly, the water pump 503 is used to pump the coolant in the water tank 501 into the second water pipe 505. The second water pipe 505 is connected to the water channel 409 in the lower mold plate 410. The coolant circulates in the lower mold plate 410 and the upper mold cover 401, removing a large amount of heat from the upper mold cover 401 and the lower mold plate 410, thereby quickly cooling the high-performance resin mold between the lower mold plate 410 and the upper mold cover 401.

[0033] The water inlet of the cooler 502 is connected to the water pipe 1 504, and the water outlet of the cooler 502 is connected to the water tank 501 via a pipe. The cooler 502 can cool the coolant circulating in the lower mold plate 410 and the upper mold cover 401, and then drain it into the water tank 501 after cooling. This greatly improves the thermal conductivity of the lower mold plate 410 and the upper mold cover 401, and quickly cools the high-performance resin mold inside them.

[0034] The refrigerator 502 is a known technical knowledge and will not be described in detail here.

[0035] The lifting mechanism includes a screw 402, which is threaded onto the top of the upper cabinet 2. One end of the screw 402 is fixedly connected to the inner ring of the bearing 403, the outer ring of the bearing 403 is fixedly connected to the top of the upper mold cover 401, and a handwheel 405 is mounted on one end of the screw 402. By providing the screw 402 and mounting the handwheel 405 on the top of the screw 402, the handwheel 405 is rotated to drive the screw 402 to rotate, thereby driving the upper mold cover 401 to move up and down, thereby separating the upper mold cover 401 from the lower mold plate 410, which facilitates the removal of the high-performance resin mold.

[0036] Among them, the top of the upper mold cover 401 is symmetrically fixedly connected with a guide rod 404, and the guide rod 404 slides on the top of the upper cabinet 2. By providing the guide rod 404, the upper mold cover 401 can be stably moved vertically, thereby fitting and connecting with the lower template 410.

[0037] The working principle of the present invention is as follows: when in use, the hand wheel 405 is turned to drive the screw 402 to rotate, thereby driving the upper mold cover 401 to move upward, so that the upper mold cover 401 and the lower mold plate 410 are opened, and the high-performance resin mold to be cooled is placed on the lower mold plate 410, and the hand wheel 405 is turned to fit the upper mold cover 401 and the lower mold plate 410 into connection, and the refrigerator 502 and the water pump 503 are started. The water pump 503 pumps the coolant in the water tank 501 through the water pipe 2 505 to the lower mold plate 410 and the upper mold cover 401, and the coolant flows in the water channel 409 and the hose 406, thereby taking out the heat on the upper mold cover 401 and the lower mold plate 410 and discharging it to the refrigerator 502. The refrigerator 502 cools the coolant and then discharges it into the water tank 501, and the cycle is repeated, so that the high-performance resin mold in the upper mold cover 401 and the lower mold plate 410 can be quickly cooled, thereby greatly improving its cooling efficiency.

[0038] Any portion not described in the present invention is the same as the prior art or can be implemented using the prior art. Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high performance resin cooling device, characterized in that: include: A lower cabinet (1) and an upper cabinet (2), wherein a cooling mechanism (4) for cooling high-performance resin is installed inside the upper cabinet (2) and the lower cabinet (1), and a cabinet door (3) is installed at one end of the lower cabinet (1); The cooling mechanism (4) comprises a lower template (410), the lower template (410) is installed in the upper cabinet (2) by means of bolts (408), the top of the lower template (410) is connected to the upper mold cover (401), a plurality of water channels (409) are evenly distributed in the middle of the upper mold cover (401) and the lower template (410), the two ends of the water channel (409) are respectively screwed with water pipe joints (407), the water pipe joint (407) is staggeredly connected to another water pipe joint (407) through a hose (406), and a lifting mechanism is also installed on the top of the upper mold cover (401); One end of the lower mold plate (410) and the upper mold cover (401) are connected to a heat dissipation assembly via a water pipe 1 (504) and a water pipe 2 (505), respectively, and the heat dissipation assembly is installed in the lower cabinet (1).

2. A high-performance resin cooling device according to claim 1, characterized in that: The upper mold cover (401) and the lower mold plate (410) are connected via a water pipe three (506).

3. A high-performance resin cooling device according to claim 2, characterized in that: The water pipe three (506) is configured as a retractable hose.

4. The high-performance resin cooling device according to claim 1, characterized in that: The heat dissipation component includes a water tank (501), which is fixedly connected to the lower cabinet (1). A refrigerator (502) and a water pump (503) are respectively installed on the top of the water tank (501). The water outlet of the water pump (503) is connected to the second water pipe (505), and the water inlet of the water pump (503) extends into the water tank (501) through a pipeline.

5. A high-performance resin cooling device according to claim 4, characterized in that: The water inlet of the refrigerator (502) is connected to the water pipe 1 (504), and the water outlet of the refrigerator (502) is connected to the water tank (501) through a pipeline.

6. The high-performance resin cooling device according to claim 1, characterized in that: The lifting mechanism includes a screw (402), the screw (402) is screwed to the top of the upper cabinet (2), one end of the screw (402) is fixedly connected to the inner ring of the bearing (403), the outer ring of the bearing (403) is fixedly connected to the top of the upper mold cover (401), and one end of the screw (402) is installed with a handwheel (405).

7. A high-performance resin cooling device according to claim 6, characterized in that: The top of the upper mold cover (401) is symmetrically fixedly connected with a guide rod (404), and the guide rod (404) slides on the top of the upper cabinet (2).

Images