Slide block anti-sticking mold

Abstract

The utility model discloses a sliding block anti-sticking mold, and belongs to the technical field of injection molds. The die mainly comprises a lower die and an upper die, a pair of sliding block mechanisms are installed on the lower die, a cooling mechanism is installed on one side of the lower die, a pair of wedge blocks and a pair of inclined guide columns are installed at the bottom of the upper die, the lower die and the upper die are combined to form a forming cavity, and a cooling groove is formed in the lower die. The cooling mechanism comprises a cooling box and a cooling pipe, the two ends of the cooling pipe communicate with the cooling box, the cooling pipe is spirally arranged in the cooling groove, and a semiconductor chilling plate is installed on the cooling box. According to the anti-sticking mold for the sliding block, after a product is formed, cooling water in the cooling box can circularly flow in the cooling pipe by starting a water pump in the cooling mechanism, so that the contact part of the product and the ejector pin is fully cooled, and the hardness and stability of the product are improved; and extrusion and deformation of the ejector pin on the surface of a workpiece during demolding can be avoided, so that marks are reduced.

Description

Technical Field

[0001] The present application relates to the technical field of injection molds, and in particular to an anti-sticking mold for a slider. Background Art

[0002] In mold injection molding, products need to be demolded and removed after injection molding. When removing, ejectors, ejector blocks, sliders, etc. are generally used to demold the product. This method is suitable for products whose molding direction is the same as the direction of mold opening and closing of the injection molding machine. However, for products whose molding direction is different from the mold opening and closing direction, such as products molded from the side of the mold, these products cannot be directly demolded and ejected by components such as ejectors or sliders. When demolding such products, a laterally movable movable core is used after the mold is formed to first pull out the lateral slider before ejecting the product from the mold.

[0003] Currently, an ejector pin structure is usually added to the slider to assist in smooth demolding of the product and solve the mold sticking phenomenon that often occurs during product demolding. However, the ejector pin contacts the product surface. If the contact part between the product and the ejector pin is not completely cooled, the ejector pin will leave a mark on the product surface, causing defects on the product surface and thus damaging the surface finish and integrity of the product.

[0004] Therefore, it is necessary to provide a slider anti-sticking mold to solve the above problems.

[0005] It should be noted that the above information disclosed in this Background section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute prior art. Utility Model Content

[0006] Based on the above-mentioned problems existing in the prior art, the problem to be solved by this application is: to provide a slider anti-sticking mold. After the product is formed, the water pump in the cooling mechanism can be started to circulate the cooling water in the cooling box in the cooling pipe, thereby fully cooling the contact part between the product and the ejector pin, improving the hardness and stability of the product, and helping to avoid the extrusion and deformation of the workpiece surface caused by the ejector pin during demolding, thereby reducing the generation of marks.

[0007] The technical solution adopted by the present application to solve the technical problem is: a slider anti-sticking mold, comprising a lower mold and an upper mold, wherein a pair of slider mechanisms are installed on the lower mold, and a cooling mechanism is installed on one side of the lower mold, and a pair of wedge blocks and a pair of inclined guide pillars are installed on the bottom of the upper mold respectively, the lower mold and the upper mold are combined to form a molding cavity, and a cooling groove is opened inside the lower mold;

[0008] The cooling mechanism includes a cooling box and a cooling pipe. Both ends of the cooling pipe are connected to the cooling box. The cooling pipe is arranged in a spiral shape in the cooling tank. A semiconductor refrigeration plate is installed on the cooling box, and a water pump connected to one end of the cooling pipe is also installed inside the cooling box.

[0009] Furthermore, the slider mechanism includes a slider body, and the slider body is slidably connected to the lower mold.

[0010] Furthermore, a guide hole is provided on the slider body, and the guide hole is adapted to the oblique guide column.

[0011] Furthermore, an installation groove and an ejector groove are respectively provided inside the slider body, the installation groove and the ejector groove are communicated, a connecting column is slidably connected inside the installation groove, an ejector is installed at the end of the connecting column, the ejector is slidably connected to the ejector groove, a spring is installed on the inner wall of the installation groove, the spring is sleeved on the outer wall of the ejector and the end is connected to the connecting column.

[0012] Furthermore, the end of the connecting column away from the ejector pin is arranged in a hemispherical shape, and a right-angle groove is provided on one side of the wedge block.

[0013] Furthermore, the cooling mechanism also includes an L-shaped bracket, the L-shaped bracket is installed to the outer wall of the lower mold, the cooling box is installed to the top of the L-shaped bracket, a fan is installed on one side of the L-shaped bracket, and the fan is located on one side of the semiconductor refrigeration plate.

[0014] The beneficial effect of the present application is that the present application provides a slider anti-sticking mold. After the product is formed, the water pump in the cooling mechanism can be started to circulate the cooling water in the cooling box in the cooling pipe, thereby fully cooling the contact part between the product and the ejector pin, improving the hardness and stability of the product, and helping to avoid the extrusion and deformation of the workpiece surface caused by the ejector pin during demolding, thereby reducing the generation of marks.

[0015] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail below with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings in the specification, which constitute a part of this application, are used to provide further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute improper limitations on this application.

[0017] In the attached figure:

[0018] Figure 1 Schematic diagram of the overall structure;

[0019] Figure 2 is a first cross-sectional structural schematic diagram;

[0020] Figure 3 is a second cross-sectional structural schematic diagram;

[0021] Figure 4 is a third cross-sectional structural schematic diagram;

[0022] Figure 5 is a fourth cross-sectional structural schematic diagram;

[0023] Figure 6 Schematic diagram of the cross-sectional structure of the slider mechanism;

[0024] Figure 7 It is a structural diagram of the cooling mechanism.

[0025] Among them, the reference numerals in the figures are:

[0026] 1. Lower mold; 2. Upper mold; 3. Cooling mechanism; 31. Cooling box; 32. Semiconductor cooling plate; 33. L-shaped bracket; 34. Fan; 35. Cooling pipe; 4. Slider mechanism; 41. Slider body; 42. Connecting column; 43. Ejector pin; 44. Spring; 5. Wedge block; 6. Inclined guide column; 7. Right-angle groove; 8. Molding cavity. DETAILED DESCRIPTION

[0027] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0028] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0029] like Figure 1-7 As shown, the present application provides a slider anti-sticking mold, including a lower mold 1 and an upper mold 2, a pair of slider mechanisms 4 are installed on the lower mold 1, and a cooling mechanism 3 is installed on one side of the lower mold 1, a pair of wedge blocks 5 and a pair of inclined guide pillars 6 are respectively installed at the bottom of the upper mold 2, the wedge blocks 5 and the inclined guide pillars 6 are fixed to the bottom of the upper mold 2 by bolts, the lower mold 1 and the upper mold 2 are combined to form a molding cavity 8, and a cooling groove is opened inside the lower mold 1;

[0030] The cooling mechanism 3 includes a cooling box 31 and a cooling pipe 35. Both ends of the cooling pipe 35 are connected to the cooling box 31. The cooling pipe 35 is arranged in a spiral shape in the cooling tank. A semiconductor refrigeration plate 32 is installed on the cooling box 31, and a water pump connected to one end of the cooling pipe 35 is also installed inside the cooling box 31.

[0031] In this embodiment, after the injection mold is formed, a movable core that can be moved laterally is used to first pull out the lateral slider before ejecting the product from the mold. In addition, a slider mechanism 4 with an ejector pin is used to assist in smooth demolding of the product, thereby solving the problem of mold sticking that often occurs during product demolding.

[0032] Among them, after the product is formed, the water pump in the cooling mechanism 3 can be started to circulate the cooling water in the cooling box 31 in the cooling pipe 35, so as to fully cool the contact part between the product and the ejector pin 43, thereby improving the hardness and stability of the product, and helping to avoid the extrusion and deformation of the workpiece surface caused by the ejector pin 43 during demolding, thereby reducing the generation of marks.

[0033] It should be noted that the cooling water in the cooling box 31 is circulated in the cooling pipe 35 by the provided water pump. The cooling water gradually heats up during the circulation process and eventually flows back into the cooling box 31. It is re-cooled by the semiconductor refrigeration plate 32 to prepare for the next cycle. The cooling end of the semiconductor refrigeration plate 32 is located in the cooling box 31, and the heating end of the semiconductor refrigeration plate 32 is located on one side of the cooling box 31.

[0034] like Figure 4-5 As shown, the slider mechanism 4 includes a slider body 41 , which is slidably connected to the lower mold 1 . A guide hole is provided on the slider body 41 , and the guide hole is adapted to the inclined guide column 6 .

[0035] In this embodiment, through the mutual cooperation between the inclined guide pin 6 and the guide hole, when the upper mold 2 moves downward, the inclined guide pin 6 enters the guide hole. During the movement, the slider body 41 is moved closer to the center of the lower mold 1 under the action of the inclined guide pin 6, that is, closer to the mold core in the lower mold 1 not shown in the figure, until a molding cavity 8 is formed. Conversely, when the upper mold 2 moves upward, the inclined guide pin 6 gradually disengages from the guide hole, causing the slider body 41 to move away from the center of the lower mold 1 under the action of the inclined guide pin 6.

[0036] like Figure 2-3 and Figure 6As shown, a mounting groove and an ejector groove are respectively provided inside the slider body 41, and the mounting groove and the ejector groove are connected. A connecting column 42 is slidably connected inside the mounting groove, and an ejector 43 is installed at the end of the connecting column 42. The ejector 43 is slidably connected to the ejector groove, and a spring 44 is installed on the inner wall of the mounting groove. The spring 44 is sleeved on the outer wall of the ejector 43 and the end is connected to the connecting column 42. The end of the connecting column 42 away from the ejector 43 is hemispherical, and a right-angle groove 7 is provided on one side of the wedge block 5. The cross-section of the right-angle groove 7 is a right-angled triangle.

[0037] In this embodiment, when the lower mold 1 and the upper mold 2 are closed, one end of the connecting column 42 abuts against the inner wall of the right-angle groove 7, and the spring 44 is in a compressed state. When the upper mold 2 moves upward, the slider body 41 moves away from the center of the lower mold 1. During this process, the positions of the connecting column 42 and the ejector pin 43 remain unchanged under the action of the right-angle groove 7. As the slider body 41 moves, the ejector pin 43 can exert a certain force on the product to separate the slider body 41 from the product. When the connecting column 42 is no longer in contact with the wedge block 5, the connecting column 42 and the ejector pin 43 are reset under the elastic force of the spring 44. This design can help the product to be demolded smoothly and solve the problem of mold sticking that often occurs when the product is demolded.

[0038] like Figure 7 As shown, the cooling mechanism 3 also includes an L-shaped bracket 33, which is installed to the outer wall of the lower mold 1. The L-shaped bracket 33 is fixed to the outer wall of the lower mold 1 by bolts, and the cooling box 31 is installed on the top of the L-shaped bracket 33. A fan 34 is installed on one side of the L-shaped bracket 33, and the fan 34 is located on one side of the semiconductor refrigeration plate 32.

[0039] In this embodiment, when the semiconductor refrigeration plate 32 cools the liquid in the cooling box 31, a large amount of heat is generated at its hot end. The fan 34 provided can quickly dissipate the generated heat, thereby improving the cooling effect of the semiconductor refrigeration plate 32 and thus improving the cooling effect on the product.

[0040] Working principle:

[0041] After the product is formed, the water pump in the cooling mechanism 3 can be started to circulate the cooling water in the cooling box 31 in the cooling pipe 35, so that the contact part of the product and the ejector pin 43 is fully cooled. Then, the upper mold 2 is controlled to move upward, and the slider body 41 moves away from the center of the lower mold 1. During this process, the positions of the connecting column 42 and the ejector pin 43 remain unchanged under the action of the right-angle groove 7. As the slider body 41 moves, the ejector pin 43 can exert a certain force on the product to separate the slider body 41 from the product. When the connecting column 42 is no longer in contact with the wedge block 5, the connecting column 42 and the ejector pin 43 are reset under the elastic force of the spring 44. This design can assist in smooth demoulding of the product and solve the problem of mold sticking that often occurs during product demoulding. In addition, the contact part of the product and the ejector pin 43 is fully cooled, the hardness and stability of the product are improved, and it helps to avoid the extrusion and deformation of the workpiece surface caused by the ejector pin 43 during demoulding, thereby reducing the generation of marks.

[0042] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A slider anti-sticking mold, comprising a lower mold (1) and an upper mold (2), characterized in that: A pair of slider mechanisms (4) are installed on the lower mold (1), and a cooling mechanism (3) is installed on one side of the lower mold (1); a pair of wedge blocks (5) and a pair of inclined guide pillars (6) are respectively installed on the bottom of the upper mold (2); the lower mold (1) and the upper mold (2) are combined to form a molding cavity (8); a cooling groove is opened inside the lower mold (1); The cooling mechanism (3) comprises a cooling box (31) and a cooling pipe (35), both ends of the cooling pipe (35) are connected to the cooling box (31), the cooling pipe (35) is arranged in a spiral shape in the cooling tank, a semiconductor refrigeration plate (32) is installed on the cooling box (31), and a water pump connected to one end of the cooling pipe (35) is also installed inside the cooling box (31).

2. The anti-sticking mold for a slider according to claim 1, characterized in that: The slider mechanism (4) comprises a slider body (41), and the slider body (41) is slidably connected to the lower mold (1).

3. The anti-sticking mold for a slider according to claim 2, characterized in that: The slider body (41) is provided with a guide hole, and the guide hole is adapted to the inclined guide column (6).

4. The anti-sticking mold for a slider according to claim 2, characterized in that: The slider body (41) is provided with a mounting groove and an ejector groove, respectively. The mounting groove and the ejector groove are communicated with each other. A connecting column (42) is slidably connected inside the mounting groove. An ejector (43) is installed at the end of the connecting column (42). The ejector (43) is slidably connected to the ejector groove. A spring (44) is installed on the inner wall of the mounting groove. The spring (44) is sleeved on the outer wall of the ejector (43) and the end thereof is connected to the connecting column (42).

5. The anti-sticking mold for a slider according to claim 4, characterized in that: The end of the connecting column (42) away from the ejector pin (43) is arranged in a hemispherical shape, and a right-angle groove (7) is provided on one side of the wedge block (5).

6. The anti-sticking mold for a slider according to claim 1, characterized in that: The cooling mechanism (3) further comprises an L-shaped bracket (33), wherein the L-shaped bracket (33) is mounted to the outer side wall of the lower mold (1), the cooling box (31) is mounted to the top of the L-shaped bracket (33), and a fan (34) is mounted on one side of the L-shaped bracket (33), and the fan (34) is located on one side of the semiconductor cooling plate (32).

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