Packaging equipment for semiconductor lead frame processing
By designing packaging equipment for semiconductor lead frame processing, the problems of lead frames being easily damaged and poorly sealed during transportation are solved by using a placement plate and a closed structure, thereby achieving convenient operation and efficient sealing, and improving the working efficiency of the packaging equipment.
Patent Information
- Application Number
- CN202422665870.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-01
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-11-01
AI Technical Summary
Existing lead frame packaging equipment is easily damaged by collision during placement and transportation, and poor sealing affects the packaging quality, resulting in low work efficiency.
A packaging device for semiconductor lead frame processing is designed. It adopts structures such as placement plates, fixing bars, limit frames, pull rings, sliders, and slide grooves to achieve the separation and organization of lead frames and convenient operation. The sealing of the equipment is improved through components such as dust covers, limit bars, limit grooves, and pressure strips.
The lead frame can be placed and removed conveniently, thus avoiding damage caused by collision and air ingress affecting the packaging quality, and improving work efficiency and sealing.
Smart Images
Figure CN223328112U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor lead frames, in particular to packaging equipment for processing semiconductor lead frames. Background Art
[0002] As end-use products continue to become thinner and lighter, the corresponding semiconductor packaging requirements are also becoming increasingly demanding. Existing semiconductor packaging structures generally include a leadframe, chip, bonding wires, and a plastic package. The leadframe includes a base island and pins. The chip is mounted on the base island, with bonding wires connecting the chip and pins. The plastic package is formed on the chip and covers the base island and pins, with the bonding wires distributed within the plastic package. The overall height of this semiconductor packaging structure is the sum of the leadframe thickness, the chip thickness, the bonding wire height, and a safety distance, where the safety distance is the distance from the top of the bonding wire to the top of the plastic package. As a result, products using this semiconductor packaging structure are relatively tall. Furthermore, because the portion of the base island that connects to the chip is flat, the bonding strength between the leadframe and the plastic package is relatively low. As the chip carrier of integrated circuits, the lead frame is a key structural component that uses composite materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead ends of the chip and the external leads to form an electrical circuit. It acts as a bridge connecting to external wires. Lead frames are required in most semiconductor integrated blocks; lead frames are required in semiconductor integrated blocks. They are a bridge connecting to external wires. Semiconductor lead frames are mostly in the form of thin sheets. If they are not packaged and protected, they can easily be damaged by collision during transportation.
[0003] The existing lead frame packaging equipment is time-consuming and labor-intensive to place the lead frame when packaging the lead frame, and the stacking of multiple lead frames can easily affect the packaging process. In addition, the poor sealing of the packaging equipment during operation can easily affect the internal packaging quality of the equipment. In response to this technical problem, the present application proposes a packaging equipment for semiconductor lead frame processing. Utility Model Content
[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a packaging device for processing a semiconductor lead frame.
[0005] To achieve the above objectives, the present invention provides the following technical solutions:
[0006] A packaging device for processing semiconductor lead frames includes a packaging machine body, wherein the front and rear ends of the right side of the packaging machine body are fixedly connected to a rotating shaft, the outer wall of the rotating shaft is rotatably connected to a connecting strip, a dust cover is provided on the top side of the packaging machine body, the front and rear ends of the right side of the dust cover are fixedly connected to a fixing column, the top ends of the two connecting strips are provided with a groove, the inside of the groove is slidably connected to the right end of the outer wall of the fixing column, the front and rear sides of the packaging machine body are provided with heat dissipation holes, and the top end of the bottom side of the dust cover is fixedly connected to a limit strip.
[0007] Furthermore, a limiting groove 1 is provided at the left end of the top side of the packaging machine body, and a limiting groove 2 is provided at both the front and rear ends of the top side of the packaging machine body. The inner wall of the limiting groove 1 is slidably connected to the outer wall of the limiting strip 1, and the inner wall of the limiting groove 2 is slidably connected to the outer wall of the limiting strip 2.
[0008] Furthermore, both left and right ends of the bottom side of the dust cover are fixedly connected to limit strips 2, and a plurality of pressure strips are fixedly connected to the adjacent sides of the two limit strips 2.
[0009] Furthermore, slide grooves are provided on both sides of the left and right sides of the packaging machine body, and two placement plates are provided inside the packaging machine body. Multiple sliders are fixedly connected to the left and right ends of the placement plates, and the two sliders are slidably connected to the inside of the slide groove at one end away from each other.
[0010] Furthermore, the adjacent sides of the two placement plates are fixedly connected with fixing bars, and the adjacent sides of the two fixing bars are provided with a plurality of limiting frames.
[0011] Furthermore, the lead frame body is slidably connected to the adjacent side of the two limiting frames, and the top ends of the two placement plates are fixedly connected to pull rings.
[0012] Furthermore, two hinges are provided at the top left side of the packaging machine body, and the right sides of the two hinges are provided on the top side of the dust cover. The packaging machine body is connected to the dust cover through the hinges. A handle is fixedly connected to the middle end of the top side of the dust cover, and a plurality of universal wheels are provided on the bottom side of the packaging machine body.
[0013] The utility model has the following beneficial effects:
[0014] 1. In the present invention, the placement plate, fixing strip, limiting frame, pull ring, slider, and slide groove cooperate with each other to achieve separation and arrangement of the lead frame body, thereby preventing the lead frame bodies from sticking to each other, which would affect the packaging of the lead frame body and reduce work efficiency; and realize convenient operation of placing and removing the lead frame body, thereby avoiding time-consuming and labor-intensive manual removal that would affect the packaging process.
[0015] 2. In the present invention, the dust cover, the first limiting strip, the second limiting strip, the first limiting groove, the second limiting groove, and the pressure strip cooperate with each other to achieve sealing of the interior of the packaging machine body, thereby improving the sealing efficiency of the interior of the packaging machine body, preventing air from entering and affecting the interior of the packaging machine body, and preventing the lead frame from shaking during the packaging process and affecting the working process. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the overall structure of a packaging device for semiconductor lead frame processing proposed by the present invention;
[0017] Figure 2 This is a schematic diagram of the internal structure of a packaging device for semiconductor lead frame processing proposed by the present invention;
[0018] Figure 3 This is a schematic diagram of the sorting and classification mechanism of a packaging device for semiconductor lead frame processing proposed by the present invention;
[0019] Figure 4 The present invention is a partial structural diagram of a packaging device for semiconductor lead frame processing.
[0020] Legend:
[0021] 1. Packaging machine body; 2. Dust cover; 3. Heat dissipation hole; 4. Rotating axis; 5. Connecting bar; 6. Fixing column; 7. Limiting bar 1; 8. Limiting bar 2; 9. Pressing bar; 10. Limiting slot 1; 11. Limiting slot 2; 12. Slide; 13. Placement plate; 14. Fixing bar; 15. Limiting frame; 16. Pull ring; 17. Lead frame body; 18. Slider; 19. Hinge; 20. Handle; 21. Universal wheel. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0023] Reference Figure 1 and Figure 2The present invention provides an embodiment of a packaging device for semiconductor lead frame processing, comprising a packaging machine body 1. A rotating shaft 4 is fixedly connected to both the front and rear ends of the right side of the packaging machine body 1. A connecting bar 5 is rotatably connected to the outer wall of the rotating shaft 4. A dust cover 2 is provided on the top side of the packaging machine body 1. A fixing post 6 is fixedly connected to both the front and rear ends of the right side of the dust cover 2. The top ends of the two connecting bars 5 are each provided with a groove. The grooves are slidably connected to the right ends of the outer walls of the fixing posts 6. Heat dissipation holes 3 are provided on both the front and rear sides of the packaging machine body 1. A limiting bar 7 is fixedly connected to the top end of the bottom side of the dust cover 2. The connecting bar 5, rotating shaft 4, and fixing post 6 provided on the right side of the packaging machine body 1 securely limit the dust cover 2 when it is closed, preventing the dust cover 2 from being loosely closed, thereby affecting the sealing of the packaging machine body 1 and allowing air to enter, thereby affecting the operation process.
[0024] Reference Figure 3 and Figure 4 A limiting groove 10 is provided at the left end of the top side of the packaging machine body 1, and a limiting groove 2 11 is provided at both the front and rear ends of the top side of the packaging machine body 1. The inner wall of the limiting groove 10 is slidably connected to the outer wall of the limiting strip 17, and the inner wall of the limiting groove 2 11 is slidably connected to the outer wall of the limiting strip 2 8. The limiting strip 17 is slidably connected to the limiting groove 10, and the limiting strip 2 8 is slidably connected to the limiting groove 2 11, thereby enhancing the sealing performance of the packaging machine body 1. The left and right ends of the bottom side of the dust cover 2 are fixedly connected to the limiting strip 2 8, and a plurality of pressure strips 9 are fixedly connected to the side close to the two limiting strips 2 8. This prevents the lead frame body 17 from moving during the packaging process and affecting the packaging process. Slide grooves 12 are provided on both the left and right sides of the interior of the packaging machine body 1, and two placement plates 13 are provided inside the packaging machine body 1. A plurality of sliders 18 are fixedly connected to the left and right ends of the placement plates 13, and the two sliders 18 are slidably connected to the interior of the slide groove 12 at the separated ends. The slider 18 is slidably connected inside the slide 12, limiting the movement direction of the placement plate 13 and facilitating the installation and removal of the placement plate 13. A fixing bar 14 is fixedly connected to the adjacent side of the two placement plates 13, and a plurality of limiting frames 15 are provided on the adjacent side of the two fixing bars 14. This limits the position of the lead frame body 17. The lead frame body 17 is slidably connected to the adjacent side of the two limiting frames 15, and a pull ring 16 is fixedly connected to the top of the two placement plates 13. The pull ring 16 provides assistance for taking the placement plates 13. Two hinges 19 are provided at the top left of the packaging machine body 1. The right sides of the two hinges 19 are both provided on the top side of the dust cover 2. The packaging machine body 1 and the dust cover 2 are connected by the hinge 19. A handle 20 is fixedly connected to the middle end of the top side of the dust cover 2, and a plurality of universal wheels 21 are provided on the bottom side of the packaging machine body 1. The dust cover 2 is conveniently opened and closed, making the packaging machine body 1 easy to move.
[0025] Working Principle: The dust cover 2 is opened using the handle 20 provided on the top side. The lead frame body 17 is placed inside the packaging machine body 1 via the limiting bracket 15 connected to the placement plate 13. The lead frame body 17 is simultaneously limited in position. The placement plate 13 and the lead frame body 17 are placed and removed using the pull ring 16. After placement, the limiting bar 1 7 is first slidably connected to the limiting groove 1 10, and the limiting bar 2 8 is slidably connected to the limiting groove 2 11 to enhance the sealing of the packaging machine body 1. The connecting bar 5, rotating shaft 4, and fixed column 6 provided on the right side of the packaging machine body 1 then securely limit the dust cover 2 when it is closed, preventing it from being loosely closed. Under the action of the pressure bar 9, the pressure bar 9 is pressed down with the dust cover 2, fitting against the lead frame body 17 and preventing the lead frame body 17 from moving during the packaging process. After packaging is completed, the lead frame is taken out and the dust cover 2 is covered to prevent dust and impurities in the air from entering the device. The device body is moved to the storage position by the universal wheels 21 provided on the bottom side of the packaging machine body 1.
[0026] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A packaging device for semiconductor lead frame processing, comprising a packaging machine body (1), characterized in that: The front and rear ends of the right side of the packaging machine body (1) are fixedly connected to a rotating shaft (4), and the outer wall of the rotating shaft (4) is rotatably connected to a connecting strip (5). A dust cover (2) is provided on the top side of the packaging machine body (1), and the front and rear ends of the right side of the dust cover (2) are fixedly connected to a fixing column (6). The top ends of the two connecting strips (5) are each provided with a groove, and the inside of the groove is slidably connected to the right end of the outer wall of the fixing column (6). The front and rear sides of the packaging machine body (1) are both provided with heat dissipation holes (3), and the top end of the bottom side of the dust cover (2) is fixedly connected to a limiting strip (7).
2. The semiconductor lead frame processing packaging equipment according to claim 1, characterized in that: The packaging machine body (1) is provided with a limiting groove 1 (10) at the left end of the top side, and limiting grooves 2 (11) are provided at both the front and rear ends of the top side of the packaging machine body (1). The inner wall of the limiting groove 1 (10) is slidably connected to the outer wall of the limiting strip 1 (7), and the inner wall of the limiting groove 2 (11) is slidably connected to the outer wall of the limiting strip 2 (8).
3. The semiconductor lead frame processing packaging equipment according to claim 1, characterized in that: The left and right ends of the bottom side of the dust cover (2) are fixedly connected to the second limiting strip (8), and a plurality of pressure strips (9) are fixedly connected to the adjacent sides of the two second limiting strips (8).
4. The semiconductor lead frame processing and packaging equipment according to claim 3, characterized in that: Slide grooves (12) are provided on both left and right sides of the packaging machine body (1). Two placement plates (13) are provided inside the packaging machine body (1). A plurality of sliders (18) are fixedly connected to both left and right ends of the placement plates (13). The two sliders (18) are slidably connected to the inside of the slide groove (12) at one end away from each other.
5. The semiconductor lead frame processing and packaging equipment according to claim 4, characterized in that: The adjacent sides of the two placement plates (13) are both fixedly connected with fixing bars (14), and the adjacent sides of the two fixing bars (14) are both provided with a plurality of limiting frames (15).
6. The semiconductor lead frame processing and packaging equipment according to claim 5, characterized in that: The lead frame body (17) is slidably connected to the adjacent side of the two limiting frames (15), and the top ends of the two placement plates (13) are fixedly connected to pull rings (16).
7. The semiconductor lead frame processing and packaging equipment according to claim 1, characterized in that: Two hinges (19) are provided at the top left side of the packaging machine body (1), and the right sides of the two hinges (19) are both provided on the top side of the dust cover (2). The packaging machine body (1) and the dust cover (2) are connected via the hinges (19). A handle (20) is fixedly connected to the middle end of the top side of the dust cover (2), and a plurality of universal wheels (21) are provided on the bottom side of the packaging machine body (1).