Temperature-controllable shock absorber

Abstract

The utility model discloses a temperature-controllable shock absorber which comprises a liquid storage cylinder barrel, a piston rod, a piston valve and a guider. The guider is fixedly arranged at the top of the liquid storage cylinder barrel; the piston valve is fixedly mounted at the lower end of the piston rod to form a piston assembly; when the shock absorber is a double-barrel shock absorber, the piston valve is in sliding fit with the inner wall of a working cylinder arranged on the inner side of the liquid storage cylinder barrel. When the shock absorber is a single-barrel shock absorber, the piston valve is in sliding fit with the inner wall of the liquid storage cylinder barrel; the piston rod is in sliding fit with the guider; semiconductor refrigeration plates are arranged on the outer wall of the liquid storage cylinder barrel, on the outer side of the guider and / or the outer side of the stroke area of the piston valve in the circumferential direction in groups; and the cold end of the semiconductor refrigeration plate is in contact with the outer wall of the liquid storage cylinder barrel. Semiconductor refrigeration plates are arranged on the outer wall of a liquid storage cylinder barrel of the shock absorber, the outer side of a guider and / or the outer side of a stroke area of a piston valve in the circumferential direction in a grouped mode, so that active cooling can be achieved, and the problems of oil leakage, oil seepage and the like caused by overheating of a product are solved.

Description

Technical Field

[0001] The utility model relates to a vibration damper, in particular to a temperature-controllable vibration damper. Background Art

[0002] Shock absorbers are used to dampen the oscillations caused by spring rebound after absorbing vibrations, as well as impacts from the road. Shock absorbers in vehicles accelerate the attenuation of frame and body vibrations, improving ride smoothness. While the absorbing springs filter out road vibrations when driving over uneven surfaces, the springs themselves still experience reciprocating motion, and shock absorbers are designed to dampen this spring bounce.

[0003] When the shock absorber is working, it drives the piston rod to move up and down, changing the volume of the front and rear cavities of the piston. The pressure difference is used to make the oil flow through the front and rear cavities of the piston, and the throttling holes on the piston are used to convert kinetic energy into heat energy, thereby achieving vibration reduction.

[0004] During operation, shock absorbers inevitably generate heat. Oil leakage, a common failure mode for shock absorbers, is often caused by heat. Furthermore, common oil seepage is also generally due to shock absorber heat. Therefore, it is necessary to develop a shock absorber product that can actively control temperature. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention provides a temperature-controllable vibration damper. Semiconductor cooling plates are arranged in groups along the circumference of the outer wall of the reservoir cylinder, outside the guide and / or outside the piston valve travel area. These plates actively reduce the temperature and prevent oil leakage and seepage caused by overheating.

[0006] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0007] A temperature-controllable shock absorber comprises a liquid storage cylinder, a piston rod, a piston valve and a guide; the guide is fixedly arranged at the top of the liquid storage cylinder; the piston valve is fixedly installed at the lower end of the piston rod to form a piston assembly; when the shock absorber is a double-tube shock absorber, the piston valve slides in cooperation with the inner wall of the working cylinder arranged on the inner side of the liquid storage cylinder; when the shock absorber is a single-tube shock absorber, the piston valve slides in cooperation with the inner wall of the liquid storage cylinder; the piston rod slides in cooperation with the guide; on the outer wall of the liquid storage cylinder, on the outside of the guide and / or on the outside of the piston valve stroke area, semiconductor refrigeration plates are grouped in the circumferential direction.

[0008] Compared with the prior art, the present invention arranges semiconductor refrigeration plates in groups along the circumferential direction on the outer wall of the liquid storage cylinder. The cold ends of the semiconductor refrigeration plates are in contact with the outer wall of the liquid storage cylinder, so that the semiconductor refrigeration plates can be connected to a power source, so that the cold ends thereof absorb heat from the shock absorber and the hot ends thereof dissipate heat into the atmosphere, thereby cooling the shock absorber and avoiding problems such as oil leakage and oil seepage due to overheating. When in use, the shock absorber can be actively temperature-controlled in combination with the temperature sensor, the driving ECU and the low-voltage power supply, so that the temperature of the shock absorber is maintained within a set range. In addition, the semiconductor refrigeration plates are specifically arranged in groups on the outside of the guide and / or the outside of the piston valve stroke area, which is rationally designed and has a good use effect.

[0009] As an optimization, in the aforementioned temperature-controlled shock absorber, a cooling element protective shell is sheathed on the outer wall of the liquid storage cylinder; a set of cooling plate mounting slots are defined within the inner periphery of the cooling element protective shell, into which the semiconductor cooling plate is mounted; the cooling element protective shell and the semiconductor cooling plate mounted therein form a cooling module. The cooling element protective shell protects the semiconductor cooling plate, thereby enhancing its reliability and reducing the risk of failure. During production, the semiconductor cooling plate and cooling element protective shell can be assembled into a cooling module before being assembled into the shock absorber's liquid storage cylinder, facilitating easy large-scale production.

[0010] As an optimization, in the aforementioned temperature-controlled damper, the semiconductor refrigeration plate is a long strip structure with a square cross section. Designing the semiconductor refrigeration plate into a long strip structure with a square cross section is not only easy to purchase, but also conducive to industrialization.

[0011] As an optimization, in the aforementioned temperature-controllable vibration damper, the gap between the semiconductor refrigeration plate and the outer wall of the liquid storage cylinder is filled with thermal grease. The provision of thermal grease can improve heat exchange efficiency, thereby improving the use effect of the semiconductor refrigeration plate.

[0012] As an optimization, in the aforementioned temperature-controlled vibration damper, the cooling element protective shell is made of aluminum alloy. This is not only lightweight, meeting lightweight requirements, but also offers the advantage of strong heat conduction. Furthermore, the use of aluminum alloy also offers the advantage of easy molding.

[0013] As an optimization, in the aforementioned temperature-controlled damper, a temperature sensor is mounted on the cooling element protective housing. The probe of the temperature sensor abuts the surface of the cooling element protective housing or passes through a clearance hole in the housing to abut the outer wall of the liquid storage cylinder. Installing the temperature sensor on the cooling element protective housing eliminates the need for OEMs to install a dedicated temperature sensor, making it more attractive to OEMs and easier to market.

[0014] As an optimization, in the aforementioned temperature-controllable vibration damper, the refrigeration element protection shell is composed of a straight cylindrical body and covers provided at both ends of the straight cylindrical body. This structural design has the advantage of being easy to implement.

[0015] As an optimization, in the aforementioned temperature-controllable vibration damper, the straight cylindrical body is provided with heat dissipation ribs, thereby further improving the heat exchange capacity of the refrigeration element protective shell and thus improving the active temperature control capability of the vibration damper. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 1 is a schematic structural diagram of a temperature-controllable vibration damper according to Example 1 of the present invention;

[0017] Figure 2 is a cross-sectional view of a temperature-controllable vibration damper according to Example 1 of the present utility model;

[0018] Figure 3 This is a schematic diagram (cross section) of the structure of the refrigeration element protection shell in Example 1 of the present invention.

[0019] Figure 4 Schematic diagram of the structure of the temperature-controllable vibration damper of Example 2 of the present utility model;

[0020] Figure 5 This is a schematic diagram (cross section) of the structure of the refrigeration element protection shell in Example 2 of the present invention.

[0021] Figure 6 1 is a schematic structural diagram of a temperature-controllable vibration damper according to Example 3 of the present utility model;

[0022] Figure 7 Schematic diagram of the structure of the temperature-controllable vibration damper of Example 4 of the present utility model;

[0023] Figure 8 1 is a schematic structural diagram of a temperature-controllable vibration damper according to Example 5 of the present utility model;

[0024] Figure 9 It is a structural schematic diagram of the temperature-controllable vibration damper of Example 6 of the present utility model.

[0025] Markings in the accompanying drawings: 1-liquid storage cylinder; 2-piston rod; 3-piston valve; 4-guide; 5-working cylinder; 6-semiconductor refrigeration plate; 7-refrigeration element protective shell, 701-refrigeration plate mounting groove, 702-straight cylindrical body, 703-cover, 704-heat dissipation rib; 8-thermal grease; 9-temperature sensor; 10-floating piston. DETAILED DESCRIPTION

[0026] The present invention is further described below with reference to the accompanying drawings and embodiments, but is not intended to be construed as a basis for the present invention. The following contents not described in detail are common technical knowledge or commonly used technical means in this field.

[0027] Example 1 (see Figure 1-3 ):

[0028] In Example 1, the temperature-controllable shock absorber of the present invention comprises a liquid reservoir cylinder 1, a piston rod 2, a piston valve 3, and a guide 4. The guide 4 is fixedly mounted on the top of the liquid reservoir cylinder 1; the piston valve 3 is fixedly mounted on the lower end of the piston rod 2, forming a piston assembly. The shock absorber is a double-tube shock absorber, in which the piston valve 3 slides with the inner wall of a working cylinder 5 located inside the liquid reservoir cylinder 1. The piston rod 2 slides with the guide 4. Semiconductor cooling plates 6 are arranged in groups along the circumference of the outer wall of the liquid reservoir cylinder 1, outside the travel range of the piston valve 3. The cold ends of the semiconductor cooling plates 6 contact the outer wall of the liquid reservoir cylinder 1. During operation, when the shock absorber passes through the orifice in the piston, the damping force generates work, converting kinetic energy into heat. Therefore, the travel range of the piston valve 3 is a direct heat-generating area. Placing the semiconductor cooling plates 6 outside the travel range of the piston valve 3 reduces heat transfer to the guide 4, effectively preventing failure of the guide 4 due to overheating.

[0029] In Example 1, a cooling element protective housing 7 is sheathed on the outer wall of the liquid storage cylinder 1. Six evenly distributed cooling plate mounting slots 701 are defined within the inner circumference of the cooling element protective housing 7, within which the semiconductor cooling plates 6 are mounted. The cooling element protective housing 7 and the semiconductor cooling plates 6 therein form a cooling module. Specifically, six evenly distributed semiconductor cooling plates 6 are disposed circumferentially on the outer wall of the liquid storage cylinder 1, outside the travel range of the piston valve 3.

[0030] In Example 1, for the convenience of implementation, the semiconductor refrigeration plate 6 is a long strip structure with a square cross section.

[0031] In Example 1, in order to improve the heat conduction capability, the gap between the semiconductor refrigeration plate 6 and the outer wall of the liquid storage cylinder 1 is filled with thermal grease 8 .

[0032] Example 2 (see Figure 4-5 ):

[0033] In Example 2, based on Example 1, an optimized design is made for the refrigeration element protection shell 7 .

[0034] In Example 2, from the perspectives of manufacturing, heat dissipation capacity, and lightweight, the refrigeration element protection shell 7 is made of aluminum alloy.

[0035] In Example 2, a temperature sensor 9 is mounted on the cooling element protective housing 7, with the probe of the temperature sensor 9 contacting the surface of the cooling element protective housing 7. In Example 1, the shock absorber is equipped with the temperature sensor 9, eliminating the need for the OEM to subsequently install a dedicated temperature sensor 9, thus simplifying its use. Of course, the temperature sensor 9 is not mandatory. For example, some shock absorber products already have a temperature monitoring module, eliminating the need for a separate temperature sensor 9.

[0036] In Example 2, for ease of implementation, the refrigeration element protection shell 7 is composed of a straight cylindrical body 702 and sealing covers 703 provided at both ends of the straight cylindrical body 702 .

[0037] In Example 2, in order to improve the heat exchange capacity, heat dissipation ribs 704 are provided on the straight cylindrical body 702 .

[0038] Example 3 (see Figure 6 ):

[0039] Unlike Example 1, in Example 2, the semiconductor cooling plate 6 is located outside the guide 4, rather than outside the piston travel area. Overheating of the shock absorber can easily cause the seal of the guide 4 to fail, leading to oil leakage and seepage. Therefore, placing the semiconductor cooling plate 6 outside the guide 4 to cool it effectively prevents seal failure caused by overheating.

[0040] Example 4 (see Figure 7 ):

[0041] Unlike Examples 1 and 2, Example 3 incorporates semiconductor cooling plates 6 on the outside of the guide 4 and the piston travel area. While the damper of Example 3 incurs a slight increase in manufacturing cost compared to Examples 1 and 2, its cooling capacity is significantly improved, providing the damper with stronger active temperature control capabilities and making it more suitable for use in hot climates.

[0042] Example 5 (see Figure 8 ):

[0043] Unlike Example 1, Example 4 utilizes a monotube shock absorber without a working cylinder 5. Instead, a floating piston 10 is located within the liquid reservoir 1. The upper side of the floating piston 10 is filled with oil, while the lower side is filled with air. The piston valve 3 is located within the oil-filled cavity and slides against the inner wall of the liquid reservoir 1. As in Example 1, a semiconductor cooling plate 6 is located outside the travel range of the piston valve 3 to reduce heat transfer to the guide 4, effectively preventing failure of the guide 4 due to overheating.

[0044] Example 6 (see Figure 9 ):

[0045] Unlike Example 5, in Example 6, the semiconductor cooling plate 6 is located outside the guide 4 rather than outside the piston travel area. In Example 5, the semiconductor cooling plate 6 is positioned in the same manner as in Example 2. Being located outside the guide 4 provides cooling, effectively preventing seal failure of the guide 4 due to overheating.

[0046] The above are only some of the embodiments of the present invention and do not represent all forms of the temperature-controlled vibration damper of the present invention. The present invention provides a temperature-controlled vibration damper, wherein the outer wall of the liquid storage cylinder 1 is provided with a semiconductor cooling plate 6. During use, the positive lead of the semiconductor cooling plate 6 is connected to the positive terminal of a DC power supply, and the negative lead is connected to the negative terminal of the DC power supply. An intelligent switch is also provided in the circuit. When the vibration damper overheats (the temperature exceeds a set value, such as 80°C), the ECU controls the intelligent switch to conduct, and the cold end of the semiconductor cooling plate 6 absorbs heat from the vibration damper, while the hot end of the semiconductor cooling plate 6 dissipates heat to the atmosphere, thereby achieving active temperature control. Furthermore, based on the operating characteristics of the semiconductor cooling panel 6, the OEM can also configure a reverse circuit for the semiconductor cooling panel 6. Specifically, the positive lead of the semiconductor cooling panel 6 is connected to the negative terminal of the DC power supply, and the negative lead is connected to the positive terminal of the DC power supply. When the shock absorber temperature is too low (for example, below -30°C), the ECU controls the corresponding intelligent switch to connect the circuit. The hot end of the semiconductor cooling panel 6 absorbs heat, and the cold end dissipates heat to the shock absorber. In this case, the semiconductor cooling panel 6 heats the shock absorber. However, in extremely cold conditions, the heating capacity of the semiconductor cooling panel 6 is very limited, so it is best to configure an additional electric heating tube for heating.

[0047] The above general description of the utility model and the description of its specific embodiments involved in this application should not be construed as limiting the technical solutions of the utility model. Based on the disclosure of this application, those skilled in the art may, without violating the constituent elements of the utility model involved, add to, subtract from, or combine the disclosed technical features in the above general description and / or specific embodiments (including examples) to form other technical solutions within the scope of protection of this application.

Claims

1. A temperature-controllable vibration damper, characterized in that: The invention comprises a liquid storage cylinder (1), a piston rod (2), a piston valve (3) and a guide (4); the guide (4) is fixedly arranged on the top of the liquid storage cylinder (1); the piston valve (3) is fixedly installed on the lower end of the piston rod (2) to form a piston assembly; when the shock absorber is a double-tube shock absorber, the piston valve (3) is slidably matched with the inner wall of the working cylinder (5) arranged on the inner side of the liquid storage cylinder (1); when the shock absorber is a single-tube shock absorber, the piston valve (3) is slidably matched with the inner wall of the liquid storage cylinder (1); the piston rod (2) is slidably matched with the guide (4); on the outer wall of the liquid storage cylinder (1), on the outer side of the guide (4) and / or on the outer side of the stroke area of ​​the piston valve (3), semiconductor refrigeration plates (6) are circumferentially arranged in groups; the cold end of the semiconductor refrigeration plate (6) contacts the outer wall of the liquid storage cylinder (1).

2. The temperature-controllable vibration damper according to claim 1, characterized in that: A refrigeration element protection shell (7) is sleeved on the outer wall of the liquid storage cylinder (1); a group of refrigeration plate installation grooves (701) are provided on the inner periphery of the refrigeration element protection shell (7), and the semiconductor refrigeration plate (6) is arranged in the refrigeration plate installation grooves (701); the refrigeration element protection shell (7) and the semiconductor refrigeration plate (6) arranged therein form a refrigeration module.

3. The temperature-controllable vibration damper according to claim 2, characterized in that: The semiconductor refrigeration plate (6) is a long strip structure with a square cross-section.

4. The temperature-controllable vibration damper according to claim 3, characterized in that: The gap between the semiconductor refrigeration plate (6) and the outer wall of the liquid storage cylinder (1) is filled with thermal grease (8).

5. The temperature-controllable vibration damper according to claim 2, 3 or 4, characterized in that: The refrigeration element protective shell (7) is made of aluminum alloy.

6. The temperature-controllable vibration damper according to claim 5, characterized in that: A temperature sensor (9) is installed on the refrigeration element protection shell (7), and a probe of the temperature sensor (9) abuts against the surface of the refrigeration element protection shell (7) or passes through a clearance hole on the surface of the refrigeration element protection shell (7) and directly abuts against the outer wall of the liquid storage cylinder (1).

7. The temperature-controllable vibration damper according to claim 5, characterized in that: The refrigeration element protection shell (7) consists of a straight cylindrical main body (702) and sealing covers (703) provided at both ends of the straight cylindrical main body (702).

8. The temperature-controllable vibration damper according to claim 7, characterized in that: The straight cylindrical body (702) is provided with heat dissipation ribs (704).

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