High-power LED light source

Abstract

The utility model discloses a high-power LED light source which comprises a lamp panel, a plurality of LED lamp beads arranged on the lower surface of the lamp panel, a cooling groove formed in the upper surface of the lamp panel, cooling liquid arranged in an inner cavity of the cooling groove and a heat exchange assembly arranged on the inner wall of the cooling groove. A water changing assembly communicating with an inner cavity of the cooling tank is arranged at the top of the sealing plate. The LED lamp beads are arranged below the lamp panel in an array mode, the LED lamp beads arranged in the array mode can provide light sources and energy of multiple wave bands, the energy and the density of light beams are improved, the LED lamp beads arranged in the array mode emit a large amount of heat during working, the heat is transmitted to the lamp panel through glue, and therefore the heat efficiency is improved. And then the heat is transferred to the cooling liquid through the bottom surface of the cooling groove and the heat exchange assembly for heat exchange, so that the LED lamp beads are rapidly cooled, and the situation that the working efficiency and the service life of the LED lamp beads are affected by too high heat is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, in particular to a high-power LED light source. Background Art

[0002] At present, LED light sources are packaged in substrates, and the following heat dissipation methods are usually used: 1. Encapsulate the LED lamp beads on a copper or aluminum flat substrate, and then dissipate the heat from the flat substrate through other heat dissipation methods to achieve the purpose of heat dissipation of the LED lamp beads; 2. Encapsulate the LED lamp beads on a copper or aluminum flat substrate, make a sandwich inside the flat plate, fill it with some heat-conductive heat dissipation oil or high thermal conductivity material, and then dissipate the heat from the flat substrate through heat dissipation devices; 3. Encapsulate the LED lamp beads more dispersedly, encapsulate them on a copper or aluminum flat substrate, and then use optical means to gather the scattered light. The dispersed mounting of LED lamp beads can effectively reduce the problem of heat concentration, thereby achieving the purpose of reducing the chip temperature.

[0003] The above solutions are helpful for the heat dissipation of LED chips to a certain extent, but for LED lamp beads with higher beam energy and density, they cannot meet the heat dissipation requirements of LED lamp beads, resulting in the LED lamp bead temperature being too high and the power cannot be increased. Utility Model Content

[0004] To achieve the above objectives, the present invention provides the following technical solutions:

[0005] A high-power LED light source includes: a lamp board, a plurality of LED lamp beads arranged on the lower surface of the lamp board, a cooling groove opened on the upper surface of the lamp board, a coolant arranged in the inner cavity of the cooling groove, and a heat exchange component arranged on the inner wall of the cooling groove. The top of the lamp board is connected to a sealing plate, and the top of the sealing plate is provided with a water exchange component connected to the inner cavity of the cooling groove.

[0006] As a further solution of the present invention: a plurality of the LED lamp beads are arranged in an array below the lamp board and two adjacent LED lamp beads are tightly fitted together, and the LED lamp beads are connected to the lamp board by glue.

[0007] As a further solution of the present invention: the glue includes silver glue, and the LED lamp beads are adhered to the bottom of the cooling groove by glue.

[0008] As a further solution of the present invention: the heat exchange component includes a plurality of fins arranged in a staggered manner, the fins are fixedly connected to the inner wall of the cooling tank, and the shapes of the fins include circle, triangle, and square.

[0009] As a further solution of the present invention: the water exchange assembly includes a connecting block fixedly connected to the top of the sealing plate, a first water guide hole and a second water guide hole opened at both ends of the top of the connecting block, the first water guide hole and the second water guide hole are connected to the inner cavity of the cooling tank, and the inner walls of the first water guide hole and the second water guide hole are respectively threadedly connected with a first water connecting head and a second water connecting head.

[0010] As a further solution of the present invention: an annular groove is provided on the upper surface of the lamp board at an edge position relative to the cooling groove, and a sealing ring is provided on the inner wall of the annular groove.

[0011] As a further solution of the present invention: a temperature detector for detecting the temperature of the LED lamp beads is provided on the lower surface of the lamp board, and the temperature detector includes a thermistor.

[0012] As a further solution of the present invention: the materials of the lamp board and the sealing plate include aluminum alloy, brass, copper, silver thermal conductive metal materials, and also include diamond copper, diamond aluminum, and diamond thermal conductive composite materials.

[0013] As a further solution of the present invention: the coolant includes pure water, and ethylene glycol, propylene glycol, 2-ethylacetic acid, and sodium benzoate organic solvents are provided inside the coolant.

[0014] As a further solution of the present invention: a first threaded hole is opened on the outer wall of the lamp board, a second threaded hole corresponding to the position of the first threaded hole is opened on the outer wall of the sealing plate, and the first threaded hole and the second threaded hole are connected by bolts.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: by arranging a number of LED lamp beads in an array under the lamp board, the LED lamp beads arranged in an array can provide light sources and energy of multiple bands, thereby improving the energy and density of the light beam; the LED lamp beads arranged in an array emit a large amount of heat when working, and the heat is transferred to the lamp board through glue, and then transferred to the coolant through the bottom surface of the cooling tank and the heat exchange component for heat exchange, thereby quickly dissipating the heat of the LED lamp beads, preventing excessive heat from affecting the working efficiency and service life of the LED lamp beads; by setting a water change component, the coolant in the cooling tank can be circulated and drawn out and new coolant can be injected, thereby ensuring the heat exchange efficiency of the coolant inside the cooling tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural diagram of a high-power LED light source.

[0017] Figure 2 This is a schematic diagram of the structure of the upper surface of a lamp board in a high-power LED light source.

[0018] Figure 3This is a schematic diagram of the structure of LED lamp beads in a high-power LED light source.

[0019] Figure 4 This is a schematic diagram of the structure of a temperature detector in a high-power LED light source.

[0020] In the figure: 1. lamp board; 2. sealing plate; 3. LED lamp bead; 4. temperature detector; 5. cooling groove; 6. fin; 7. annular groove; 8. sealing ring; 9. connecting block; 10. first water guide hole; 11. second water guide hole; 12. first water connection head; 13. second water connection head; 14. first threaded hole; 15. bolt; 16. second threaded hole. DETAILED DESCRIPTION

[0021] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] See also Figures 1-4 A high-power LED light source includes: a lamp board 1, a plurality of LED lamp beads 3 arranged on the lower surface of the lamp board 1, a cooling groove 5 opened on the upper surface of the lamp board 1, a coolant arranged in the inner cavity of the cooling groove 5, and a heat exchange component arranged on the inner wall of the cooling groove 5. The top of the lamp board 1 is connected to a sealing plate 2, and the top of the sealing plate 2 is provided with a water exchange component connected to the inner cavity of the cooling groove 5.

[0023] A plurality of LED lamp beads 3 are arranged in an array below the lamp board 1 , and two adjacent LED lamp beads 3 are tightly fitted together. The LED lamp beads 3 are connected to the lamp board 1 by glue.

[0024] By arranging a number of LED lamp beads 3 in an array below the lamp board 1, the array-arranged LED lamp beads 3 can provide light sources and energy in multiple bands, thereby improving the energy and density of the light beam. The array-arranged LED lamp beads 3 emit a large amount of heat when working. The heat is transferred to the lamp board 1 through glue, and then transferred to the coolant through the bottom surface of the cooling groove 5 and the heat exchange component for heat exchange, thereby quickly dissipating the heat of the LED lamp beads 3, preventing excessive heat from affecting the working efficiency and service life of the LED lamp beads 3.

[0025] By providing a water exchange component, the coolant in the cooling tank 5 can be circulated and drawn out and new coolant can be injected, thereby ensuring the heat exchange efficiency of the coolant in the cooling tank 5.

[0026] The glue includes silver glue, and the LED lamp bead 3 is adhered to the bottom of the cooling groove 5 by the glue.

[0027] By setting up silver glue, it has good thermal conductivity and can effectively transfer the heat of the LED lamp bead 3 to the coolant. The silver glue has good adhesion and high temperature resistance, ensuring the stability and reliability of the operation of the LED lamp bead 3.

[0028] The heat exchange assembly includes a plurality of fins 6 arranged in a staggered manner. The fins 6 are fixedly connected to the inner wall of the cooling tank 5. The shapes of the fins 6 include circle, triangle and square.

[0029] By adopting the staggered arrangement of fins 6, the heat from the LED lamp beads 3 is transferred to the fins 6, which increases the heat dissipation area. The coolant is in full contact with the fins 6, thereby increasing the heat dissipation capacity of the coolant. The fins 6 are manufactured using a mechanical processing process or a die-casting, injection molding or other process. According to the optimization of the processing technology, the shape of the fins 6 can also be adjusted, such as round, triangular, square, to improve the heat dissipation effect.

[0030] The water exchange assembly includes a connecting block 9 fixedly connected to the top of the sealing plate 2, a first water guide hole 10 and a second water guide hole 11 opened at both ends of the top of the connecting block 9, the first water guide hole 10 and the second water guide hole 11 are connected to the inner cavity of the cooling tank 5, and the inner walls of the first water guide hole 10 and the second water guide hole 11 are respectively threadedly connected with a first water receiving head 12 and a second water receiving head 13.

[0031] When in use, the first water connection head 12 and the second water connection head 13 are connected to the water inlet pipe and the water outlet pipe respectively, the coolant in the cooling tank 5 is circulated and drawn out and new coolant is injected to ensure the heat exchange efficiency of the coolant in the cooling tank 5.

[0032] An annular groove 7 is provided on the upper surface of the lamp board 1 at the edge of the cooling groove 5 , and a sealing ring 8 is provided on the inner wall of the annular groove 7 to improve the sealing effect between the lamp board 1 and the sealing plate 2 and prevent the coolant in the cooling groove 5 from overflowing.

[0033] A temperature detector 4 for detecting the temperature of the LED lamp beads 3 is provided on the lower surface of the lamp board 1 . The temperature detector 4 includes a thermistor.

[0034] By setting up a temperature detector 4 to detect the peripheral temperature of the LED lamp bead 3, and using a thermistor to connect to an external circuit board, the temperature of the thermistor is different and the resistance value is different. According to the resistance value, the external circuit board can convert the temperature of the corresponding LED lamp bead 3. When the set temperature exceeds the protection temperature, an alarm can be used or the LED lamp bead 3 can be directly turned off to avoid light source loss.

[0035] The materials of the lamp board 1 and the sealing plate 2 include aluminum alloy, brass, copper, silver thermal conductive metal materials, as well as diamond copper, diamond aluminum, and diamond thermal conductive composite materials. Anti-oxidation treatment can be performed on the surface according to different materials. For example, copper can be silver-plated, gold-plated, and nickel-plated, and aluminum alloy can be natural oxidation, black oxidation, silver-plated, and plated, so as to avoid the problem of oxide blockage at the internal fin 6 position of the coolant due to oxidation, which in turn leads to poor heat dissipation effect of the lamp board 1.

[0036] The coolant includes pure water, and ethylene glycol, propylene glycol, 2-ethylacetic acid, and sodium benzoate organic solvents are provided inside the coolant, thereby lowering the freezing point of the pure water, allowing the pure water to be used at minus 20 degrees, thereby enhancing the use environment of the LED lamp beads 3.

[0037] A first threaded hole 14 is formed on the outer wall of the lamp board 1 , and a second threaded hole 16 corresponding to the position of the first threaded hole 14 is formed on the outer wall of the sealing plate 2 . The first threaded hole 14 and the second threaded hole 16 are connected by a bolt 15 .

[0038] The above are only preferred specific implementation methods of the present invention, but the protection scope of the present invention is not limited to them. Any technician familiar with the technical field can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention within the technical scope disclosed by the present invention, and they should be covered by the protection scope of the present invention.

Claims

1. A high-power LED light source, characterized in that: include: A lamp board, several LED lamp beads arranged on the lower surface of the lamp board, a cooling groove opened on the upper surface of the lamp board, a coolant arranged in the inner cavity of the cooling groove, and a heat exchange component arranged on the inner wall of the cooling groove. The top of the lamp board is connected to a sealing plate, and the top of the sealing plate is provided with a water exchange component connected to the inner cavity of the cooling groove.

2. A high-power LED light source according to claim 1, characterized in that: A plurality of LED lamp beads are arranged in an array below the lamp board, and two adjacent LED lamp beads are tightly fitted together. The LED lamp beads are connected to the lamp board by glue.

3. A high-power LED light source according to claim 2, characterized in that: The glue includes silver glue, and the LED lamp beads are adhered to the bottom of the cooling groove through the glue.

4. The high-power LED light source according to claim 1, characterized in that: The heat exchange component includes a plurality of fins arranged in a staggered manner. The fins are fixedly connected to the inner wall of the cooling tank. The shapes of the fins include circle, triangle and square.

5. The high-power LED light source according to claim 1, characterized in that: The water exchange assembly includes a connecting block fixedly connected to the top of the sealing plate, a first water guide hole and a second water guide hole opened at both ends of the top of the connecting block, the first water guide hole and the second water guide hole are connected to the inner cavity of the cooling tank, and the inner walls of the first water guide hole and the second water guide hole are respectively threadedly connected with a first water receiving head and a second water receiving head.

6. The high-power LED light source according to claim 1, characterized in that: An annular groove is provided on the upper surface of the lamp board at an edge position relative to the cooling groove, and a sealing ring is provided on the inner wall of the annular groove.

7. The high-power LED light source according to claim 1, characterized in that: A temperature detector for detecting the temperature of the LED lamp beads is provided on the lower surface of the lamp board, and the temperature detector includes a thermistor.

8. The high-power LED light source according to claim 1, characterized in that: The materials of the lamp board and the sealing board include aluminum alloy, brass, copper, silver thermal conductive metal materials, and also include diamond copper, diamond aluminum, and diamond thermal conductive composite materials.

9. The high-power LED light source according to claim 1, characterized in that: The coolant comprises pure water, and ethylene glycol, propylene glycol, 2-ethylacetic acid, and sodium benzoate organic solvents are provided inside the coolant.

10. The high-power LED light source according to claim 1, characterized in that: A first threaded hole is formed on the outer wall of the lamp panel, and a second threaded hole corresponding to the position of the first threaded hole is formed on the outer wall of the sealing plate. The first threaded hole and the second threaded hole are connected by bolts.

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