Flexible LED lamp strip convenient to produce
By setting up independent IC chip pad groups and light-emitting lamp bead pad groups on the FPC substrate, the problems of complex and high cost production of existing flexible LED light strips are solved, and the production effect of easy production and low cost is achieved.
Patent Information
- Application Number
- CN202422831742.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-11-19
AI Technical Summary
Existing flexible LED light strips have complex production processes and high production costs, making them difficult to manufacture.
An IC chip pad group and a light-emitting lamp bead pad group are set on the FPC substrate. The IC chip and the LED lamp beads are set independently, and signal transmission is achieved through electrical connection, which simplifies the production process.
The production process is simplified, the production cost is reduced, and the production and processing are convenient.
Smart Images

Figure CN223331619U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of flexible LED light strips, in particular to a flexible LED light strip that is easy to produce. Background Art
[0002] LED lights are common lighting devices in daily life. LED lights with flexible circuit boards, also known as light strips, are made by soldering LED lights onto copper wire or a flexible circuit board using a special process. These lights are then connected to a power source to produce light. They are named for their strip-like shape when illuminated and can be used for both decorative and lighting purposes.
[0003] A search revealed a Chinese utility model patent application numbered CN202222104715.4, which discloses a flexible LED light strip comprising a flexible circuit board, several integrated packaged components, several current-limiting resistors, and several filter capacitors. The flexible circuit board is long and includes a functional area, which is located at the center of the flexible circuit board and arranged in a straight line along the length of the flexible circuit board. The integrated packaged components include an LED light-emitting chipset and an IC chip, which are integrated into a single device through an integrated packaging process. The integrated packaged components are soldered to the functional area. Signal transmission between the several integrated packaged components is connected in series and parallel. In this utility model, the signal transmission between the integrated packaged components is connected in series and parallel, transforming the signal transmission from single-channel to multi-channel, reducing the impact of a signal transmission failure in the previous integrated packaged component on the signal transmission of subsequent light strips.
[0004] Although the existing flexible LED light strips can meet basic usage requirements, they need to integrate the LED light-emitting chip group and IC chip into one device through integrated packaging during the production process to form an integrated packaged device. The production process is relatively complicated, inconvenient to produce, and has high production costs. Utility Model Content
[0005] The technical problem to be solved by the present invention is to provide a flexible LED light strip that is easy to produce in view of the above-mentioned defects of the prior art, so as to solve the problems of the existing flexible LED light strips that are inconvenient to produce and have high production costs.
[0006] In order to solve the above technical problems, the technical solution of the utility model is:
[0007] A flexible LED light strip that is easy to produce includes an FPC substrate. The FPC substrate is provided with a plurality of IC chip pad groups and a plurality of light-emitting lamp pad groups. The IC chip pad groups are electrically connected to the light-emitting lamp pad groups. An IC chip and a constant voltage resistor are welded to the IC chip pad groups. LED lamp beads are welded to the light-emitting lamp pad groups. The IC chip pad groups are equidistantly distributed between the light-emitting lamp pad groups.
[0008] Preferably, the IC chip pad group includes a first IC chip pad, a second IC chip pad, a third IC chip pad and a fourth IC chip pad, and the first IC chip pad, the second IC chip pad, the third IC chip pad and the fourth IC chip pad are distributed in sequence as vertices of a rectangle.
[0009] Preferably, one of the IC chip and the constant voltage resistor is soldered to each of the first IC chip pad, the second IC chip pad, the third IC chip pad and the fourth IC chip pad.
[0010] Preferably, the light-emitting lamp bead pad group includes a first light-emitting lamp bead pad, a second light-emitting lamp bead pad, a third light-emitting lamp bead pad and a fourth light-emitting lamp bead pad, and the first light-emitting lamp bead pad, the second light-emitting lamp bead pad, the third light-emitting lamp bead pad and the fourth light-emitting lamp bead pad are all distributed on the FPC substrate from left to right in sequence.
[0011] Preferably, two of the LED lamp beads are correspondingly welded on the first light-emitting lamp bead welding pad, the second light-emitting lamp bead welding pad, the third light-emitting lamp bead welding pad and the fourth light-emitting lamp bead welding pad.
[0012] Preferably, the first light-emitting lamp bead soldering pad and the fourth light-emitting lamp bead soldering pad are both arranged obliquely, and the second light-emitting lamp bead soldering pad and the third light-emitting lamp bead soldering pad are both arranged horizontally.
[0013] By adopting the above technical solution, the utility model provides a flexible LED light strip that is easy to produce and has the following beneficial effects: a plurality of IC chip pad groups and a plurality of light-emitting lamp bead pad groups are provided on the FPC substrate in the flexible LED light strip, the IC chip pad group is electrically connected to the light-emitting lamp bead pad group, an IC chip and a constant voltage resistor are welded on the IC chip pad group, LED lamp beads are welded on the light-emitting lamp bead pad group, the IC chip pad groups are equidistantly distributed between the light-emitting lamp bead pad groups, and the IC chip and LED lamp beads are welded respectively by arranging the IC chip pad group and the light-emitting lamp bead pad group, so that the IC chip and the LED lamp beads are independently provided, and there is no need to integrate them into a device through an integrated packaging operation, which can simplify the production process, the production process is relatively simple, easy to produce and process, and the production cost is low. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is an exploded view of the utility model;
[0015] Figure 2 It is a structural diagram of the utility model;
[0016] In the figure, 1-FPC substrate, 2-IC chip, 3-constant voltage resistor, 4-LED lamp bead, 5-first IC chip pad, 6-second IC chip pad, 7-third IC chip pad, 8-fourth IC chip pad, 9-first light-emitting lamp bead pad, 10-second light-emitting lamp bead pad, 11-third light-emitting lamp bead pad, 12-fourth light-emitting lamp bead pad. DETAILED DESCRIPTION
[0017] The following further describes specific embodiments of the present invention in conjunction with the accompanying drawings. It should be noted that the descriptions of these embodiments are intended to aid understanding of the present invention and do not constitute limitations on the present invention. Furthermore, the technical features involved in the various embodiments of the present invention described below may be combined with one another as long as they do not conflict with one another.
[0018] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.
[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0020] like Figure 1-2As shown, this flexible LED light strip, which is easy to produce, includes an FPC substrate 1, on which are disposed several IC chip pad groups and several LED pad groups. The IC chip pad groups are electrically connected to the LED pad groups. An IC chip 2 and a constant voltage resistor 3 are soldered to the IC chip pad groups, and LED beads 4 are soldered to the LED pad groups. The IC chip pad groups are equidistantly distributed between the LED pad groups. It is understood that the FPC substrate 1 can be a general-purpose FPC circuit board, the IC chip 2 can be a general-purpose IC chip, and the LED beads 4 can be general-purpose LED beads.
[0021] Specifically, the IC chip pad group includes a first IC chip pad 5, a second IC chip pad, a third IC chip pad 7 and a fourth IC chip pad 8, and the first IC chip pad 5, the second IC chip pad 6, the third IC chip pad 7 and the fourth IC chip pad 8 are distributed in sequence at the vertices of a rectangle; the first IC chip pad 5, the second IC chip pad 6, the third IC chip pad 7 and the fourth IC chip pad 8 are correspondingly welded with an IC chip 2 and a constant voltage resistor 3; the light-emitting lamp pad group includes a first light-emitting lamp pad 9, a second light-emitting lamp pad 10, the third IC chip pad 7 and the fourth IC chip pad 8. Three light-emitting lamp bead pads 11 and a fourth light-emitting lamp bead pad 12, the first light-emitting lamp bead pad 9, the second light-emitting lamp bead pad 10, the third light-emitting lamp bead pad 11 and the fourth light-emitting lamp bead pad 12 are all distributed on the FPC substrate 1 from left to right; two LED lamp beads 4 are correspondingly welded on the first light-emitting lamp bead pad 9, the second light-emitting lamp bead pad 10, the third light-emitting lamp bead pad 11 and the fourth light-emitting lamp bead pad 12; the first light-emitting lamp bead pad 9 and the fourth light-emitting lamp bead pad 12 are both obliquely arranged, and the second light-emitting lamp bead pad 10 and the third light-emitting lamp bead pad 11 are both horizontally arranged.
[0022] It can be understood that the utility model has a reasonable design and a unique structure. By setting an IC chip pad group and a light-emitting lamp bead pad group to respectively weld the IC chip 2 and the LED lamp bead 4, the IC chip 2 and the LED lamp bead 4 are independently set. The overall structure is relatively simple. During the production process, there is no need to integrate them into a device through an integrated packaging operation, which can simplify the production process. The production process is relatively simple, easy to produce and process, and the production cost is low.
[0023] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It is apparent to those skilled in the art that various changes, modifications, substitutions, and variations to these embodiments may be made without departing from the principles and spirit of the present invention, and these changes and modifications still fall within the scope of protection of the present invention.
Claims
1. A flexible LED light strip that is easy to produce, including an FPC substrate, characterized by: The FPC substrate is provided with several IC chip pad groups and several light-emitting lamp pad groups. The IC chip pad group is electrically connected to the light-emitting lamp pad group. The IC chip and the constant voltage resistor are welded on the IC chip pad group. The LED lamp beads are welded on the light-emitting lamp pad group. The IC chip pad groups are equidistantly distributed between the light-emitting lamp pad groups.
2. The flexible LED light strip that is easy to produce according to claim 1 is characterized in that: The IC chip pad group includes a first IC chip pad, a second IC chip pad, a third IC chip pad and a fourth IC chip pad, and the first IC chip pad, the second IC chip pad, the third IC chip pad and the fourth IC chip pad are arranged in sequence at the vertices of a rectangle.
3. The flexible LED light strip that is easy to produce according to claim 2 is characterized in that: An IC chip and a constant voltage resistor are correspondingly welded on the first IC chip pad, the second IC chip pad, the third IC chip pad and the fourth IC chip pad.
4. The flexible LED light strip that is easy to produce according to claim 1 is characterized in that: The light-emitting lamp bead pad group includes a first light-emitting lamp bead pad, a second light-emitting lamp bead pad, a third light-emitting lamp bead pad and a fourth light-emitting lamp bead pad. The first light-emitting lamp bead pad, the second light-emitting lamp bead pad, the third light-emitting lamp bead pad and the fourth light-emitting lamp bead pad are all distributed on the FPC substrate from left to right in sequence.
5. The flexible LED light strip that is easy to produce according to claim 4 is characterized in that: Two LED lamp beads are correspondingly welded on the first light-emitting lamp bead welding pad, the second light-emitting lamp bead welding pad, the third light-emitting lamp bead welding pad and the fourth light-emitting lamp bead welding pad.
6. The flexible LED light strip that is easy to produce according to claim 4 is characterized in that: The first light-emitting lamp bead soldering pad and the fourth light-emitting lamp bead soldering pad are both arranged obliquely, and the second light-emitting lamp bead soldering pad and the third light-emitting lamp bead soldering pad are both arranged horizontally.
Citation Information
Patent Citations
LED flexible lamp strip
CN218001229U