LED circuit board heat dissipation structure

Abstract

The utility model discloses a heat dissipation structure of an LED circuit board, and in the heat dissipation structure of the LED circuit board, an LED circuit board main body can generate heat in a working process. According to the utility model, an efficient heat dissipation mechanism combining heat conduction and forced convection is adopted. Firstly, heat generated by the LED circuit board main body is quickly transferred to the heat dissipation mainboard which is in close contact with the LED circuit board main body; the heat dissipation main board is made of a high-quality heat conduction material and can efficiently absorb heat. And then, the heat dissipation mainboard transfers heat to the heat dissipation fin group located below through the heat conduction pipe embedded into the heat dissipation mainboard through the lower surface of the heat dissipation mainboard. The heat conduction pipes are filled with phase change materials, heat can be rapidly conducted to the heat dissipation fins from a heat source according to the phase change heat transfer principle, and therefore the heat conduction efficiency is remarkably improved, and meanwhile a heat dissipation fan is installed on the heat dissipation support below the heat dissipation substrate. And the cooling fan is started to form forced convection, so that the air flow around the cooling fin group is accelerated, and the cooling effect is further enhanced.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED lighting, and particularly relates to a heat dissipation structure of an LED circuit board. Background Art

[0002] With the rapid development of LED lighting technology, LED lamps are widely used in various lighting applications due to their advantages such as high brightness, low power consumption, and long life. However, LEDs generate a large amount of heat during operation. If heat cannot be dissipated effectively and promptly, the temperature of the LED chip will rise sharply, affecting the LED's luminous efficiency, color temperature, and service life, and even causing safety accidents. Therefore, it is particularly important to design an efficient and reliable heat dissipation structure for LED circuit boards. Utility Model Content

[0003] The purpose of the utility model is to provide a heat dissipation structure of an LED circuit board to solve the existing problems.

[0004] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0005] The utility model is a heat dissipation structure for an LED circuit board, comprising an LED circuit board main body, characterized in that a heat dissipation substrate is fixedly engaged on the lower surface of the LED circuit board main body, a heat dissipation bracket is fixedly fixed to the lower surface of the heat dissipation substrate with bolts, a plurality of heat dissipation fans are fixedly connected to one side of the heat dissipation bracket, a heat pipe is fixedly connected to the lower surface of the heat dissipation substrate, one end of the heat pipe is fixedly connected to a heat dissipation fin group, and both sides of the heat dissipation fin group are fixedly connected to the heat dissipation bracket.

[0006] It needs to be further explained that in the present invention, the main body of the LED circuit board generates heat during operation. In order to effectively dissipate heat and maintain a good working condition, the present invention adopts a heat dissipation mechanism that combines efficient heat conduction and forced convection. First, the heat generated by the main body of the LED circuit board is quickly transferred to the heat dissipation mainboard with which it is in close contact. The heat dissipation mainboard is made of high-quality thermally conductive material and can absorb heat efficiently. Subsequently, the heat dissipation mainboard transfers heat to the heat dissipation fin group located below through the heat conduction pipes embedded in the interior of its lower surface. These heat conduction pipes are filled with phase change material, and using the principle of phase change heat transfer, heat can be quickly transferred from the heat source to the heat dissipation fins, thereby significantly improving the heat conduction efficiency. At the same time, a heat dissipation fan is installed on the heat dissipation bracket located below the heat dissipation substrate. When the heat dissipation fan is started, forced convection is formed, which accelerates the air flow around the heat dissipation fin group, further enhancing the heat dissipation effect.

[0007] Furthermore, a plurality of positioning blocks are fixedly connected to the upper surface of the heat dissipation substrate, a fastening hole is opened on one side of the heat dissipation substrate, a fastening tension spring is fixedly connected to the inner wall of the fastening hole, and a fastening limit block is fixedly connected to one end of the fastening tension spring. The fastening limit block can ensure close contact between the LED circuit board body and the heat dissipation substrate, reduce thermal resistance, improve heat conduction efficiency, and reduce failures of the LED circuit board body caused by looseness or poor contact, thereby improving the overall stability and reliability of the system, and at the same time making the installation and disassembly of the LED circuit board body more convenient, simplifying the assembly process, and improving production efficiency.

[0008] Furthermore, the cross-section of the fastening limit block is "L"-shaped, and the size and shape of the fastening limit block cooperate with the heat dissipation substrate. The heat dissipation substrate can ensure that heat is evenly distributed over the entire heat dissipation structure, avoiding local overheating, thereby protecting the LED components from damage. At the same time, the heat dissipation substrate provides stable support for the main body of the LED circuit board, helps to maintain the structural integrity of the entire system, and reduces damage caused by vibration or external force.

[0009] Furthermore, a plurality of air inlets are provided on one side of the heat dissipation bracket, and the inner wall of the air inlet is fixedly connected to the heat dissipation fan. The size and shape of the air inlet cooperate with the heat dissipation fan, and the heat dissipation bracket provides stable support for the heat dissipation component, ensuring the structural strength and stability of the entire system. At the same time, the cooperation between the heat dissipation bracket and the heat dissipation fan enables the forced convection of the heat dissipation fan to further accelerate the air flow around the heat dissipation fin group, thereby improving the heat dissipation efficiency.

[0010] Furthermore, an air outlet is provided on one side of the heat dissipation bracket, and a heat dissipation dust-proof net is fixedly connected to the inner wall of the air outlet. The heat dissipation dust-proof net can prevent external dust from entering the heat dissipation structure of the LED circuit board, reducing the decrease in heat dissipation efficiency caused by dust blockage. By reducing dust accumulation, the heat dissipation dust-proof net helps to keep the heat dissipation structure clean and extend the maintenance cycle. The size and shape of the air outlet cooperate with the heat dissipation fin group, and the design of the heat dissipation bracket takes into account the principles of aerodynamics, which helps to improve the air flow around the heat dissipation fin group, thereby enhancing the heat dissipation effect.

[0011] Furthermore, the blades in the heat dissipation fin group are arranged at an angle, and the inclined blades can better guide the air flow, help to form a smooth airflow path, improve the heat dissipation efficiency, and also increase the surface area in contact with the air, thereby improving the heat exchange efficiency. Compared with the vertically arranged blades, the inclined setting can reduce the resistance encountered during air flow, which helps to increase the air flow rate. The size and shape of the heat dissipation fin group cooperate with the heat dissipation bracket.

[0012] It should be further explained that the cooling fan has its own driving device, the cooling fan is electrically connected to the LED circuit board body, and the LED circuit board body is connected to an external power supply.

[0013] The utility model has the following beneficial effects:

[0014] In the present invention, the main body of the LED circuit board generates heat during operation. In order to effectively dissipate heat and maintain a good working condition, the present invention adopts a heat dissipation mechanism that combines efficient heat conduction and forced convection. First, the heat generated by the main body of the LED circuit board is quickly transferred to the heat dissipation mainboard with which it is in close contact. The heat dissipation mainboard is made of high-quality thermally conductive material and can absorb heat efficiently. Subsequently, the heat dissipation mainboard transfers heat to the heat dissipation fin group located below through the heat conduction pipes embedded in the interior of its lower surface. These heat conduction pipes are filled with phase change material, and using the principle of phase change heat transfer, heat can be quickly transferred from the heat source to the heat dissipation fins, thereby significantly improving the heat conduction efficiency. At the same time, a heat dissipation fan is installed on the heat dissipation bracket located below the heat dissipation substrate. When the heat dissipation fan is started, forced convection is formed, which accelerates the air flow around the heat dissipation fin group, further enhancing the heat dissipation effect.

[0015] The utility model cooperates with the LED board body through the heat dissipation substrate, so that the heat dissipation substrate can ensure that heat is evenly distributed throughout the entire heat dissipation structure, avoiding local overheating, thereby protecting the LED components from damage. At the same time, the heat dissipation substrate provides stable support for the LED circuit board body, helping to maintain the structural integrity of the entire system and reduce damage caused by vibration or external force.

[0016] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is a schematic diagram of the heat dissipation structure of an LED circuit board;

[0019] Figure 2 A top view of a heat dissipation structure of an LED circuit board;

[0020] Figure 3 for Figure 2 Cross-section of the middle AA;

[0021] Figure 4 for Figure 3 A partial enlarged view of a.

[0022] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0023] 1. LED circuit board body; 2. Heat dissipation substrate; 201. Positioning block; 202. Fastening hole; 203. Fastening tension spring; 204. Fastening limit block; 3. Heat dissipation bracket; 301. Air inlet; 302. Air outlet; 303. Heat dissipation dustproof net; 4. Cooling fan; 5. Heat pipe; 6. Heat dissipation fin assembly. DETAILED DESCRIPTION

[0024] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] In the description of the present invention, it should be understood that the terms "upper", "middle", "outer", "inner" and the like indicating directions or positional relationships are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0026] See also Figures 1-4 As shown, the utility model is a heat dissipation structure of an LED circuit board, including an LED circuit board main body 1, characterized in that: a heat dissipation substrate 2 is fixedly engaged on the lower surface of the LED circuit board main body 1, a heat dissipation bracket 3 is fixedly fixed to the lower surface of the heat dissipation substrate 2 with bolts, a plurality of heat dissipation fans 4 are fixedly connected to one side of the heat dissipation bracket 3, a heat pipe 5 is fixedly connected to the lower surface of the heat dissipation substrate 2, one end of the heat pipe 5 is fixedly connected to a heat dissipation fin group 6, and both sides of the heat dissipation fin group 6 are fixedly connected to the heat dissipation bracket 3.

[0027] It needs to be further explained that in the present invention, the LED circuit board main body 1 generates heat during operation. In order to effectively dissipate heat and maintain a good working condition, the present invention adopts a heat dissipation mechanism that combines efficient heat conduction and forced convection. First, the heat generated by the LED circuit board main body 1 is quickly transferred to the heat dissipation main board with which it is in close contact. The heat dissipation main board is made of high-quality thermally conductive material and can absorb heat efficiently. Subsequently, the heat dissipation main board transfers the heat to the heat dissipation fin group 6 located below through the heat pipe 5 nested inside its lower surface. These heat pipes 5 are filled with phase change material, and using the principle of phase change heat transfer, heat can be quickly transferred from the heat source to the heat dissipation fins, thereby significantly improving the heat conduction efficiency. At the same time, a heat dissipation fan 4 is installed on the heat dissipation bracket 3 located below the heat dissipation substrate 2. The heat dissipation fan 4 is started to form forced convection, which accelerates the air flow around the heat dissipation fin group 6 and further enhances the heat dissipation effect.

[0028] Among them, a number of positioning blocks 201 are fixedly connected to the upper surface of the heat dissipation substrate 2, a fastening hole 202 is opened on one side of the heat dissipation substrate 2, a fastening spring 203 is fixedly connected to the inner wall of the fastening hole 202, and a fastening limit block 204 is fixedly connected to one end of the fastening spring 203. The fastening limit block 204 can ensure close contact between the LED circuit board body and the heat dissipation substrate 2, reduce thermal resistance, improve heat conduction efficiency, and also reduce failures of the LED circuit board body caused by looseness or poor contact, thereby improving the overall stability and reliability of the system, and at the same time making the installation and disassembly of the LED circuit board body more convenient, simplifying the assembly process, and improving production efficiency.

[0029] Among them, the cross-section of the fastening limit block 204 is "L"-shaped, and the size and shape of the fastening limit block 204 cooperate with the heat dissipation substrate 2. The heat dissipation substrate 2 can ensure that heat is evenly distributed on the entire heat dissipation structure to avoid local overheating, thereby protecting the LED components from damage. At the same time, the heat dissipation substrate 2 provides stable support for the main body of the LED circuit board, which helps to maintain the structural integrity of the entire system and reduce damage caused by vibration or external force.

[0030] Among them, a plurality of air inlets 301 are opened on one side of the heat dissipation bracket 3, and the inner wall of the air inlet 301 is fixedly connected to the heat dissipation fan 4. The size and shape of the air inlet 301 cooperate with the heat dissipation fan 4, and the heat dissipation bracket 3 provides stable support for the heat dissipation component, ensuring the structural strength and stability of the entire system. At the same time, the cooperation between the heat dissipation bracket 3 and the heat dissipation fan 4 enables the forced convection effect of the heat dissipation fan 4 to further accelerate the air flow around the heat dissipation fin group 6 and improve the heat dissipation efficiency.

[0031] Among them, an air outlet 302 is opened on one side of the heat dissipation bracket 3, and a heat dissipation dustproof net 303 is fixedly connected to the inner wall of the air outlet 302. The heat dissipation dustproof net 303 can prevent external dust from entering the heat dissipation structure of the LED circuit board, reducing the decline in heat dissipation efficiency caused by dust blockage. By reducing dust accumulation, the heat dissipation dustproof net 303 helps to keep the heat dissipation structure clean and extend the maintenance cycle. The size and shape of the air outlet 302 cooperate with the heat dissipation fin group 6, and the design of the heat dissipation bracket 3 takes into account the principles of aerodynamics, which helps to improve the air flow around the heat dissipation fin group 6, thereby enhancing the heat dissipation effect.

[0032] Among them, the blades in the heat dissipation fin group 6 are set at an angle, and the inclined blades can better guide the air flow, help to form a smooth airflow path, improve the heat dissipation efficiency, and also increase the surface area in contact with the air, thereby improving the heat exchange efficiency. Compared with the vertically set blades, the inclined setting can reduce the resistance encountered during air flow, which helps to increase the air flow rate. The size and shape of the heat dissipation fin group 6 cooperate with the heat dissipation bracket 3.

[0033] It should be further explained that the cooling fan 4 has its own driving device, the cooling fan 4 is electrically fused to the LED circuit board body 1, and the LED circuit board body 1 is connected to an external power supply.

[0034] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0035] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments do not describe all details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A heat dissipation structure for an LED circuit board, comprising an LED circuit board body (1), characterized in that: A heat dissipation substrate (2) is fixedly engaged on the lower surface of the LED circuit board body (1); a heat dissipation bracket (3) is fixedly bolted to the lower surface of the heat dissipation substrate (2); a plurality of heat dissipation fans (4) are fixedly connected to one side of the heat dissipation bracket (3); a heat conduction pipe (5) is fixedly connected to the lower surface of the heat dissipation substrate (2); one end of the heat conduction pipe (5) is fixedly connected to a heat dissipation fin group (6); and both sides of the heat dissipation fin group (6) are fixedly connected to the heat dissipation bracket (3).

2. The LED circuit board heat dissipation structure according to claim 1, characterized in that: A plurality of positioning blocks (201) are fixedly connected to the upper surface of the heat dissipation substrate (2); a fastening hole (202) is provided on one side of the heat dissipation substrate (2); a fastening tension spring (203) is fixedly connected to the inner wall of the fastening hole (202); and a fastening limit block (204) is fixedly connected to one end of the fastening tension spring (203).

3. The LED circuit board heat dissipation structure according to claim 2, characterized in that: The cross section of the fastening limit block (204) is L-shaped, and the size and shape of the fastening limit block (204) match those of the heat dissipation substrate (2).

4. The LED circuit board heat dissipation structure according to claim 1, characterized in that: A plurality of air inlets (301) are provided on one side of the heat dissipation bracket (3); the inner wall of the air inlet (301) is fixedly connected to the heat dissipation fan (4); and the size and shape of the air inlet (301) match those of the heat dissipation fan (4).

5. The LED circuit board heat dissipation structure according to claim 1, characterized in that: An air outlet (302) is provided on one side of the heat dissipation bracket (3), and a heat dissipation dustproof net (303) is fixedly connected to the inner wall of the air outlet (302). The size and shape of the air outlet (302) match those of the heat dissipation fin group (6).

6. The LED circuit board heat dissipation structure according to claim 1, characterized in that: The blades in the heat dissipation fin group (6) are arranged obliquely, and the size and shape of the heat dissipation fin group (6) match those of the heat dissipation bracket (3).

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