Deflection angle measuring assembly, inclination measuring mechanism and semiconductor detection equipment

Abstract

The utility model discloses a deflection angle measuring assembly, an inclination measuring mechanism and semiconductor detection equipment, the deflection angle measuring assembly is used for obtaining a score deflection angle of a to-be-measured surface of a sample table relative to a reference surface, the deflection angle measuring assembly comprises a light source, a light reflection module and a detector, and the light source is used for exciting an incident light beam perpendicular to the reference surface; the light reflecting module is used for being connected with a sample table and is provided with a first reflecting surface and a second reflecting surface, so that an incident light beam is allowed to form an emergent light beam after being reflected twice by the first reflecting surface and the second reflecting surface; the detector is used for receiving the outgoing light beam, so that the outgoing light beam forms a test light spot on the detector. Wherein a reference light spot is pre-formed on the detector, so that the deflection angle of the to-be-measured surface relative to the reference surface can be determined by measuring the offset of the test light spot relative to the reference light spot.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular relates to a deflection angle measurement component, an inclination measurement mechanism, and a semiconductor detection device. Background Art

[0002] Semiconductor inspection equipment often relies on optical imaging systems to perform high-precision defect detection and dimensional measurement. The position of the sample stage in an optical imaging system directly affects the imaging results and inspection accuracy. Therefore, the zero-position calibration of the optical imaging system requires high precision.

[0003] In related technologies, the calibration parameters for the sample stage position include the vertical distance between the machine stage and the sample stage and the horizontal posture of the sample stage. The horizontal posture of the sample stage is obtained by obtaining the vertical distance between different points on the machine stage and the sample stage to obtain a fitting plane.

[0004] However, this horizontal posture detection method has the disadvantages of high cost and occupying space for other mechanisms in the imaging system, which needs to be improved. Utility Model Content

[0005] The embodiments of the present application provide a deflection angle measurement component, an inclination measurement mechanism, and a semiconductor detection device. The deflection angle measurement component can obtain the deflection angle of the sample stage relative to the reference plane, and then use the deflection angle to determine the horizontal posture of the sample stage.

[0006] In a first aspect, an embodiment of the present application provides a deflection angle measurement component for obtaining the deflection angle of a sample stage relative to a reference plane. The deflection angle measurement component includes a light source, a reflective module and a detector. The light source is used to excite an incident light beam perpendicular to a reference plane; the reflective module is used to connect to the sample stage, and has a first reflective surface and a second reflective surface to allow the incident light beam to be reflected by the first reflective surface and the second reflective surface in sequence to form an outgoing light beam; the detector is used to receive the outgoing light beam, so that the outgoing light beam forms a test spot on the detector; wherein the detector is pre-formed with a reference spot, so that the deflection angle of the surface to be measured relative to the reference plane can be determined by measuring the offset of the test spot relative to the reference spot.

[0007] In some embodiments, the first reflective surface is perpendicular to the second reflective surface.

[0008] In some embodiments, the first reflective surface is arranged at an angle of 45° to the surface to be measured.

[0009] In some embodiments, the reflective module is a right-angle prism having two perpendicular right-angled surfaces and an inclined surface connecting the two right-angled surfaces, wherein the inclined surface is arranged parallel to the surface to be measured, wherein the right-angled surface close to the light source forms a first reflective surface, and the right-angled surface close to the detector forms a second reflective surface, and the incident light beam enters the right-angled prism through the inclined surface.

[0010] In some embodiments, the reflective module includes an incident reflector and a detection reflector, the incident reflector and the detection reflector are arranged opposite to each other, the incident reflector has a first reflective surface, and the detection reflector has a second reflective surface.

[0011] In some embodiments, the incident reflector and the detection reflector are spaced apart from each other along the reference plane.

[0012] In a second aspect, an embodiment of the present application provides an inclination measurement mechanism, which includes two deflection angle measurement components provided by any one of the aforementioned embodiments, wherein the two reflective modules are connected to the sample stage, and the plane where the incident light beam and the outgoing light beam are located in one of the deflection angle measurement components is arranged to intersect with the plane where the incident light beam and the outgoing light beam are located in the other deflection angle measurement component.

[0013] In some embodiments, the plane where the incident light beam and the outgoing light beam are located in one deflection angle measurement component is arranged perpendicular to the plane where the incident light beam and the outgoing light beam are located in another deflection angle measurement component.

[0014] In some embodiments, the shortest distances between the light sources and the detectors in the two deflection angle measurement assemblies are equal.

[0015] In a third aspect, an embodiment of the present application provides a semiconductor detection device, which includes a machine, a sample stage and the inclination measurement mechanism provided by any of the aforementioned embodiments, the inclination measurement mechanism including two deflection angle measurement components; wherein the reflective module is connected to the sample stage; and the light source and the detector are both connected to the machine.

[0016] In the deflection angle measurement component of the embodiment of the present application, a light source excites an incident light beam perpendicular to the reference plane. The incident light beam is reflected by the first reflecting surface and the second reflecting surface in the reflective module in sequence to obtain an outgoing light beam and form a test light spot on the detector. The detector is pre-formed with a reference light spot. The displacement of the test light spot relative to the reference light spot is obtained through the deflection angle measurement component to provide for the subsequent deflection angle of the surface to be measured relative to the reference plane, thereby assisting in obtaining the horizontal posture of the sample stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0018] Figure 1 This is a schematic structural diagram of a deflection angle measurement assembly in some embodiments of the present application;

[0019] Figure 2 This is a schematic structural diagram of the inclination measurement mechanism of some embodiments of the present application.

[0020] The accompanying drawings in the specific implementation manner are as follows:

[0021] 100, light source; 200, detector; 300, reflective module; 310, incident reflector; 320, detection reflector; 400, sample stage; 401, reference surface; 500, machine platform. DETAILED DESCRIPTION

[0022] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0024] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0025] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0026] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0027] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0028] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0029] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0030] In the semiconductor industry and even in the optical inspection field, imaging systems, as core components of inspection equipment, often have high requirements for the vertical distance and horizontal position of the sample being tested. For example, mature small optical microscopes and high-resolution scanning electron microscopes often only control the vertical distance to the sample being tested due to their depth of field. If the equipment is subjected to internal or external influences such as stress release, shock and vibration, or temperature and humidity fluctuations, the horizontal position of the sample stage may change, significantly affecting the equipment's inspection performance.

[0031] In related technologies, optical imaging systems often utilize multiple sets of detection elements based on vertical distance detection technology. The sample stage is calibrated by measuring the vertical distances of multiple acquisition points on the sample stage or the sample to be measured to obtain a fitting plane. This plane is then compared with a reference plane to achieve the desired calibration. However, this calibration method is expensive and takes up space on other components within the optical imaging system. Furthermore, for detection equipment using a single-axis motion system, closed-loop control of vertical distance detection is often required, resulting in significant discrepancies between the fitting plane and the actual sample stage, hindering calibration effectiveness.

[0032] To address the problems of the prior art, embodiments of the present application provide a deflection angle measurement assembly, an inclination measurement mechanism, and semiconductor inspection equipment. It should be understood that the semiconductor inspection equipment provided herein includes both inspection equipment for inspecting semiconductor quality, such as defect detection equipment such as electron beam imaging equipment, and measurement equipment for obtaining semiconductor parameters, as well as other equipment for inspecting and measuring semiconductor products using optical imaging systems. The following first introduces the deflection angle measurement assembly provided in embodiments of the present application.

[0033] First, see Figure 1 An embodiment of the present application provides a deflection angle measurement component for obtaining the deflection angle of a surface to be measured of a sample stage 400 relative to a reference plane 401. The deflection angle measurement component includes a light source 100, a reflective module 300, and a detector 200. The light source 100 is used to excite an incident light beam perpendicular to a reference plane 401. The reflective module 300 is used to connect to the sample stage 400. The reflective module 300 has a first reflective surface 310 and a second reflective surface 320. The detector 200 and the light source 100 are parallel to the reference plane 401 and are arranged at intervals. The detector 200 is used to receive the outgoing light beam.

[0034] The incident light beam emitted by the light source 100 enters the reflective module 300 , is reflected by the first reflective surface 310 and the second reflective surface 320 , and exits the reflective module 300 to obtain an outgoing light beam. The outgoing light beam forms a test light spot on the detector 200 .

[0035] The intersection of the first reflective surface 310 and the second reflective surface 320 is positioned perpendicular to the incident light beam emitted by the light source 100. For example, the incident light beam extends vertically, while the intersection of the first reflective surface 310 and the second reflective surface 320 extends horizontally. Furthermore, the detector is positioned in the direction of light emission from the second reflective surface 320 to ensure that the detector 200 can receive the outgoing light beam and form a test spot regardless of whether the surface to be measured is deflected.

[0036] Before the measurement begins, the reflective module 300 is first placed in the reference plane 401 and the light source 100 is turned on and calibrated so that the detector 200 can receive the outgoing light beam and form a test light spot.

[0037] The light spot formed on the detector 200 by the outgoing light beam when the reflective module 300 is located on the reference plane 401 is defined as a reference light spot. The detector 200 is pre-formed with a reference light spot.

[0038] In some embodiments, the reference light spot is obtained through actual measurement. For example, after the optical imaging system is calibrated, the deflection angle measurement component is turned on to pre-form a reference light spot and record it for comparison as a reference in subsequent calibration work. In other embodiments, the reference light spot is obtained through simulation calculation. The acquisition of the reference light spot does not depend on the actual existence of the reference surface 401, so it can be obtained in advance before the measurement starts or during the measurement process.

[0039] Therefore, the test light spot is obtained based on the deflection angle measurement component, and compared with the reference light spot to obtain the light spot offset, and then the deflection angle of the sample stage 400 relative to the reference surface 401 is determined by the light spot offset.

[0040] The deflection angle measurement assembly provided in the embodiment of the present application has a simple structure, helps to control costs, does not excessively occupy the internal space of the optical imaging system, and is highly adaptable to semiconductor detection equipment.

[0041] Optionally, the light source 100 is a monochromatic light source. Exemplarily, the detection light beam emitted by the monochromatic light source is any one of a red light beam, an orange light beam, a yellow light beam, a green light beam, a blue light beam, an indigo light beam, and a violet light beam.

[0042] Optionally, the detector 200 is a photodetector. For example, the detector 200 is a position sensitive device (PSD). PSD has the advantages of high sensitivity, high resolution, fast response speed, and simple circuit configuration, and can quickly respond to the light spot and obtain corresponding position information.

[0043] According to some embodiments of the present application, the first reflective surface 310 is disposed perpendicular to the second reflective surface 320 , that is, a normal line of the first reflective surface 310 is perpendicular to a normal line of the second reflective surface 320 .

[0044] See also Figure 1 Even if the sample stage 400 is deflected, the incident light beam entering the reflective module 300 and the outgoing light beam exiting the reflective module 300 remain parallel to each other, and the spot shape formed by the test light beam on the detector 200 does not change with the tilt of the sample stage 400.

[0045] As a result, the outgoing light beam is only offset but not deflected relative to the incident light beam, which reduces the displacement of the test spot relative to the reference spot, improves the accuracy of the photoelectric conversion of the detector 200, makes it easy to expand the optical path design, and reduces the space occupied by the deflection angle measurement component in the optical imaging system.

[0046] According to certain embodiments of the present application, a first angle is formed between the first reflective surface 310 and the surface to be measured. The first angle is an acute angle so that the incident light beam can be reflected by the first reflective surface 310 to the second reflective surface 320 after entering the reflective module, and smoothly exit the reflective module under the reflection of the second reflective surface 320 to obtain an outgoing light beam.

[0047] Optionally, the first angle is at least one of 15°, 30°, 45°, 60°, and 75°.

[0048] For example, see Figure 1 The first reflective surface 310 is positioned at a 45° angle to the surface to be measured. When the reflective module 300 is located on the reference plane 401, the incident light beam can be directed vertically toward the first reflective surface 310 without being refracted and reflected toward the second reflective surface 320. The path of the light beam between the first reflective surface 310 and the second reflective surface 320 is equal to the distance between the light source 100 and the detector 200, facilitating the subsequent calculation of the deflection angle of the surface to be measured based on the light spot offset.

[0049] According to some embodiments of the present application, please refer to Figure 1 The reflective module 300 is a right-angle prism having two perpendicular right-angled faces connected by an inclined plane parallel to the surface to be measured. It can be understood that the incident light beam enters the right-angle prism through the inclined plane, and the outgoing light beam exits the right-angle prism through the inclined plane.

[0050] The right-angled surface close to the light source 100 forms a first reflecting surface 310 to reflect the incident light beam to obtain an intermediate light beam, and the right-angled surface close to the detector 200 forms a second reflecting surface 320 to reflect the intermediate light beam to obtain an outgoing light beam.

[0051] For details, please refer to Figure 1 , the measurement principle of the deflection angle measurement assembly is introduced by taking the reflective module 300 as a right-angle prism as an example, wherein the dotted line represents the surface to be measured and the reflective module 300 after deflection, and the solid line represents the reference plane 401.

[0052] Define the refractive index of the right-angle prism as n, the deflection angle of the surface to be measured as θ, and the refraction angle γ of the incident light beam entering the right-angle prism according to the following formula ① or ②:

[0053]

[0054] That is,

[0055]

[0056] Please continue reading Figure 1 From the reflection of light, it can be seen that the incident light beam is deflected by γ when entering the right-angle prism. When the workpiece stage is deflected, the incident light beam is deflected by (θ+γ) when it is emitted to the first reflecting surface 310. The light beam emitted from the first reflecting surface 310 to the second reflecting surface 320 is deflected by (2θ+2γ). The angle between the light beam emitted from the second reflecting surface 320 and the normal of the right-angle prism exit surface is θ.

[0057] Here, the distance between the light source 100 and the detector 200 is defined as a, the light spot offset obtained by the detector 200 is defined as b, and the offset between the test beam and the reference beam on the second reflective surface 320 in the direction of the incident beam is introduced and defined as c. The following equations ③ and ④ can be further obtained from the definition of trigonometric functions:

[0058]

[0059] For the convenience of derivation, (θ+γ) is assigned a value of α here. Combining the above equations ③ and ④, we can get equation ⑤:

[0060]

[0061] Further derive formula ⑥:

[0062]

[0063] Combining formula ⑥ with formula ② above, we can derive formula ⑦:

[0064]

[0065] Thus, the quantitative relationship between the spot offset b of the detector 200 and the deflection angle θ of the surface to be measured is obtained. The deflection angle of the surface to be measured is obtained through the light source 100, the reflective module 300 and the detector 200 to assist in the measurement of the horizontal posture of the optical imaging system.

[0066] According to some embodiments of the present application, please refer to Figure 2 The reflective module 300 includes an incident reflector and a detection reflector. The incident reflector and the detection reflector are arranged opposite to each other. The incident reflector has a first reflection surface 310 , and the detection reflector has a second reflection surface 320 perpendicular to the first reflection surface 310 .

[0067] At this time, the refractive index n in formula ⑦ is converted to 1, and formula ⑧ is obtained:

[0068]

[0069] Furthermore, the incident reflector and the detection reflector are arranged along the reference plane, thereby extending the optical path of the light beam within the reflective module 300. As can be easily understood from Equation 7 or Equation 8, lengthening the optical path a of the reflective module 300 can make the offset b detected by the detector 200 more pronounced, thereby improving the measurement accuracy of the deflection angle.

[0070] Therefore, the refraction factor when the light beam enters the first reflective surface 310 and exits from the second reflective surface 320 is eliminated, the calculation method of the deflection angle is simplified, and the stability and measurement accuracy of the deflection angle measurement component are improved.

[0071] Second, see Figure 2 An embodiment of the present application provides an inclination measurement mechanism, comprising two deflection angle measurement components provided by any of the aforementioned embodiments, wherein a plane where the incident light beam and the outgoing light beam are located in one deflection angle measurement component and a plane where the incident light beam and the outgoing light beam are located in the other deflection angle measurement component are arranged to intersect, wherein both reflective modules 300 are connected to a sample stage 400.

[0072] Therefore, the inclination measurement mechanism can obtain the inclination angle of the surface to be measured of the sample stage 400 relative to the reference plane 401 in two non-parallel planes, that is, obtain two intersecting vectors, and then determine the unique fitting plane through these two intersecting vectors to realize the determination of the horizontal posture of the sample stage 400.

[0073] Optionally, a second angle is defined between a plane containing the incident and outgoing beams in one deflection angle measurement assembly and a plane containing the incident and outgoing beams in the other deflection angle measurement assembly, where the second angle is greater than 0 and less than or equal to 90°. Exemplarily, the second angle is any one of 15°, 30°, 45°, 60°, and 75°.

[0074] According to certain embodiments of the present application, the plane where the incident light beam and the outgoing light beam are located in one deflection angle measurement component is perpendicular to the plane where the incident light beam and the outgoing light beam are located in another deflection angle measurement component. In other words, the second angle is 90°.

[0075] Optionally, the shortest distances between the light source and the detector in the two deflection angle measurement assemblies are set to be equal, that is, the optical path of the reflective module 300 in the two deflection angle measurement assemblies is the same, so that the measurement accuracy of the two deflection angle measurement assemblies remains consistent, which helps to obtain more reliable inclination measurement results. For example, see Figure 2 In the two deflection angle measurement components, the reflective modules 300 both adopt a design of an incident reflector and a detection reflector, and the distance between the incident reflector and the detection reflector in one reflective module 300 is equal to the distance between the incident reflector and the detection reflector in the other reflective module 300.

[0076] This reduces the amount of calculation required by manpower or computers for plane fitting. At the same time, since the second angle is 90°, the two deflection angles of the sample stage 400 relative to the reference plane 401 do not affect each other, and the measurement accuracy of the inclination measurement mechanism is further improved.

[0077] On the third aspect, an embodiment of the present application provides a semiconductor detection device, which includes a machine 500, a sample stage 400 and a tilt measurement mechanism provided by any of the aforementioned embodiments, wherein the light source 100 and the detector 200 are relatively fixed to the machine 500, and the reflective module 300 is relatively fixed to the sample stage 400 to achieve horizontal posture determination of the sample stage 400 relative to the reference plane 401 of the machine 500, so as to provide the machine 500 with the opportunity to calibrate the sample stage 400.

[0078] Semiconductor inspection equipment refers to equipment that uses an optical imaging system to perform dimension measurement or defect detection on semiconductor products, wherein the reference plane 401 refers to a virtual plane perpendicular to the emission direction of the optical imaging system.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A deflection angle measurement assembly for obtaining the deflection angle of a surface to be measured of a sample stage relative to a reference surface, characterized in that: The deflection angle measurement component includes: a light source for exciting an incident light beam perpendicular to a reference plane; a reflective module connected to the sample stage, having a first reflective surface and a second reflective surface, so as to allow the incident light beam to be reflected by the first reflective surface and the second reflective surface in sequence to form an outgoing light beam; a detector, configured to receive the outgoing light beam so that the outgoing light beam forms a test light spot on the detector; The detector is pre-formed with a reference light spot, so as to determine the deflection angle of the surface to be measured relative to the reference plane by measuring the offset of the test light spot relative to the reference light spot.

2. The deflection angle measurement assembly according to claim 1, characterized in that: The first reflecting surface is perpendicular to the second reflecting surface.

3. The deflection angle measurement assembly according to claim 2, characterized in that: The first reflecting surface is arranged at an angle of 45° to the surface to be measured.

4. The deflection angle measurement assembly according to claim 3, characterized in that: The reflective module is a right-angle prism, which has two perpendicular right-angled surfaces and an inclined surface connecting the two right-angled surfaces. The inclined surface is arranged parallel to the surface to be measured, wherein the right-angled surface close to the light source forms the first reflecting surface, and the right-angled surface close to the detector forms the second reflecting surface. The incident light beam enters the right-angled prism through the inclined surface.

5. The deflection angle measurement assembly according to claim 3, characterized in that: The reflective module includes an incident reflective mirror and a detection reflective mirror. The incident reflective mirror and the detection reflective mirror are arranged opposite to each other. The incident reflective mirror has the first reflection surface, and the detection reflective mirror has the second reflection surface.

6. The deflection angle measurement assembly according to claim 5, characterized in that: The incident reflector and the detection reflector are arranged at intervals along the reference plane.

7. An inclination measuring mechanism, characterized in that: It comprises two deflection angle measurement assemblies as described in any one of claims 1 to 6, both of the reflective modules are connected to the sample stage, and the plane where the incident light beam and the outgoing light beam in one of the deflection angle measurement assemblies are located intersects with the plane where the incident light beam and the outgoing light beam in the other deflection angle measurement assembly are located.

8. The inclination measuring mechanism according to claim 7, characterized in that: The plane where the incident light beam and the outgoing light beam are located in one of the deflection angle measurement components is arranged perpendicular to the plane where the incident light beam and the outgoing light beam are located in the other deflection angle measurement component.

9. The inclination measuring mechanism according to claim 7, characterized in that: In the two deflection angle measurement assemblies, the shortest distances between the light sources and the detectors are equal.

10. A semiconductor testing device, characterized in that: include: The inclination measuring mechanism according to any one of claims 7 to 9, comprising two deflection angle measuring components; A sample stage, to which the reflective module in the deflection angle measurement assembly is connected; The light source and the detector in the deflection angle measurement component are connected to the machine platform.

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