Board card test system
By designing a board test system and utilizing components such as tooling chassis and test cabinets, the problems of insufficient and inefficient verification and testing of domestic chips have been solved, fast and reliable chip verification has been achieved, and verification efficiency and result reliability have been improved.
Patent Information
- Application Number
- CN202422776204.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-09-12
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The verification and testing of domestic chips is insufficient and inefficient, affecting the stability and reliability of chip performance.
A board test system is designed, including a tooling chassis and a test cabinet. Utilizing components such as a PXIe industrial chassis, a programmable power supply, a test interface panel, an electronic load, and a data acquisition module, rapid automated test and verification of the chip is achieved.
It has achieved fast, automated and reliable verification testing of domestic chips, with high versatility and high verification efficiency, and the test results are highly reliable and practical.
Smart Images
Figure CN223333122U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of board testing, and more specifically, to a board testing system. Background Art
[0002] Under current circumstances, thanks to the active promotion of the government and businesses, domestic chip research and development has made significant progress. However, the Chinese chip industry still faces significant challenges. For example, chip reliability and stability have not undergone rigorous, long-term verification, and there is still a significant gap between China and leading foreign companies in high-end manufacturing technology.
[0003] Chip development is a complex and lengthy process, and verification of domestically produced chips is a crucial step. To ensure the functionality and performance of the chip during the design phase, allowing for smooth operation in subsequent manufacturing and mass production, the device verification process for domestically produced chips requires rigorous testing and repetition to ensure the stability and reliability of chip performance. The device verification test system can quickly, conveniently, stably, and reliably verify and test domestically produced chips, ensuring smooth manufacturing and mass production. Utility Model Content
[0004] In response to the defects of the existing technology, the purpose of this application is to provide a board test system, which aims to solve the problems of insufficient verification and testing of existing domestic chips and low verification and testing efficiency.
[0005] To achieve the above-mentioned purpose, the present application provides a board test system, comprising: a tooling chassis and a test cabinet;
[0006] The tooling chassis is provided with a tooling motherboard and N card slots for carrying boards to be tested; the tooling motherboard is connected to the N card slots; N is an integer greater than 0;
[0007] The tooling chassis is also provided with N input power interfaces of the boards to be tested, N output power interfaces of the boards to be tested, and N output signal interfaces of the boards to be tested;
[0008] The test cabinet is provided with a PXIe industrial chassis, a programmable power supply, a test interface panel, an electronic load and a data acquisition module; the tooling motherboard is interconnected with the PXIe industrial chassis via a serial port and a network port; the programmable power supply is connected to the PXIe industrial chassis, and is connected to the input power interfaces of N boards to be tested via the test interface panel; the electronic load is connected to the PXIe industrial chassis, and is connected to the output power interfaces of N boards to be tested via the test interface panel; the data acquisition module is connected to the PXIe industrial chassis, and is connected to the output signal interfaces of N boards to be tested via the test interface panel.
[0009] In an optional example, the test interface panel is disposed at the front of the test cabinet.
[0010] In an optional example, the PXIe industrial chassis is provided with a measurement module, a power matrix module, a radio frequency matrix module, and a serial communication module;
[0011] The measuring module is connected to the input power interface and output power interface of N boards to be tested via the test interface panel on the test cabinet;
[0012] The power matrix module is connected to the power network analyzer through an internal cable and is connected to the input power interface and output power interface of N boards to be tested through a test interface panel;
[0013] The RF matrix module is connected to the measurement module through an internal cable, and is connected to the input power interface and output power interface of N boards to be tested through a test interface panel;
[0014] The serial communication module is connected to the tooling chassis via a test interface panel.
[0015] In an optional example, the tooling chassis is further provided with a power module;
[0016] The power module is connected to the tooling motherboard.
[0017] In an optional example, the tooling chassis is provided with 4 to 8 board slots.
[0018] In an optional example, a drawer tray is provided on the test cabinet.
[0019] In an optional example, a switch panel is provided on the test cabinet.
[0020] In an optional example, the tooling chassis is provided with a serial port, an indicator light and a switch; the serial port, the indicator light and the switch are connected to the tooling motherboard.
[0021] In an optional example, the at least one board slot is arranged flatly on the tooling chassis.
[0022] In an optional example, the board to be tested is a voltage regulator.
[0023] In general, the above technical solutions conceived by this application have at least the following beneficial effects compared with the prior art:
[0024] The present application provides a board test system, which designs the board to be tested into a standard module to be verified according to requirements, installs all the modules to be verified in a tooling chassis, connects the cables between the tooling chassis and the test cabinet, and sets the relevant parameters. It can realize rapid automated test and verification of the chip to be verified, and can present the test results on the host computer. It has the characteristics of good versatility, high result reliability, high verification efficiency, and strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 A diagram showing the internal structure of a tooling chassis in a board test system provided in an embodiment of the present application;
[0026] Figure 2 A diagram showing the internal structure of a test cabinet in a board test system provided in an embodiment of the present application;
[0027] Figure 3 This is a wiring diagram inside a tooling chassis in a board test system provided in an embodiment of the present application;
[0028] Figure 4 This is a wiring diagram inside a tooling cabinet in a board test system provided in an embodiment of the present application;
[0029] Figure 5 An operational flow chart of a board test provided in an embodiment of the present application. DETAILED DESCRIPTION
[0030] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.
[0031] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.
[0032] In order to solve the current problems of insufficient verification and testing of domestic chips and low verification and testing efficiency, the present application designs a universal standardized testing system based on board-level verification of the functional performance of voltage regulator devices. The voltage regulator type chips to be verified are designed into standard modules to be verified according to requirements, all modules to be verified are installed in a tooling chassis, the cables between the tooling chassis and the test cabinet are connected, and the relevant parameters are set. This can realize rapid and automated testing and verification of the chips to be verified, and the test results can be presented on the host computer. It has the characteristics of good versatility, high result reliability, high verification efficiency, and strong practicality.
[0033] The implementation method of the present application is as follows: The present application provides a test system design based on the functional performance device verification of a voltage regulator device, including a tooling chassis and a test cabinet.
[0034] The tooling chassis consists of a standard 2U chassis to be tested, a board to be tested, a status monitoring tooling motherboard and a power module. The designed chassis has a power supply system. The specific composition is shown in the figure below. Figure 1 As shown in the figure, similar boards under test are stacked flat within the tooling chassis, allowing input and output signals to be connected to the test cabinet from the back. A corresponding condition monitoring tooling motherboard is designed based on the voltage regulator component type. The condition monitoring tooling motherboard collects and uploads status information such as temperature, current, and voltage from the boards under test. The condition monitoring tooling motherboard manages health status and communicates data with the test cabinet, connecting to the test cabinet's PXIe industrial chassis via serial and network ports. The power module converts AC to DC and provides power to the condition monitoring motherboard.
[0035] The test cabinet is composed of a standard 19-inch industrial rack, a PXIe industrial chassis, a programmable power supply, an electronic load, a data acquisition module and other instruments and equipment. The specific composition is shown in the figure below. Figure 2 shown.
[0036] The PXIe chassis is equipped with high-precision measurement modules, power matrix modules, RF matrix modules, serial communication modules, etc., which are the main functional components of the test system.
[0037] The test interface panel is located at the front of the cabinet for easy operation. It is the electrical interconnection interface between the test system and the device under test.
[0038] Set the test parameters of the chip to be verified through the host computer software.
[0039] The programmable power supply is connected to the PXIe industrial chassis in the test cabinet via USB, and is connected to the input power interfaces of all boards under test through the test interface panel. The output voltage range, output current range and other parameters of the programmable power supply are set through the host computer software based on the performance parameters of the components to be verified in the boards under test.
[0040] The electronic load is connected to the PXIe industrial chassis in the test cabinet via USB and to the output power interfaces of all boards under test via power cables. The output current mode, output current range, and other parameters of the electronic load are set through the host computer software based on the performance parameters of the components to be verified in the boards under test.
[0041] The data acquisition module is connected to the test cabinet PXIe industrial chassis via USB, and is connected to the output signal of the board under test through the test interface panel. Then, the output signal of the board under test is collected with the help of an isolation probe to measure indicators such as ripple.
[0042] The high-precision measurement module is integrated into the PXIe industrial chassis of the test cabinet. It is interconnected with the input and output power supplies of all boards under test through the test interface panel to measure the input and output voltages of the device under test.
[0043] The power matrix module is integrated into the PXIe industrial chassis of the test cabinet. It is interconnected with the input and output power supplies of all boards under test through the test interface panel and with the high-precision measurement module through internal cables, realizing high-current power path switching between voltage regulator devices and instruments.
[0044] Among them, an aviation plug is installed on the above-mentioned test interface panel.
[0045] The entire product set can test LDO regulators, DC / DC controllers and other types of voltage regulators. It has automated testing capabilities and realizes functions such as test process control, automatic analysis and storage of test data, test fault warning and automatic generation of test reports. Through data processing, the human-computer interaction interface displays, records and generates test data reports for various devices.
[0046] in, Figure 2 The injector and power network analyzer are used to test the power supply rejection ratio (PSRR) performance of the board. The injector superimposes the AC ripple output from the power network analyzer and the DC signal from the programmable power supply, then injects the result into the test board's input. The power network analyzer measures the ripple at the input and output terminals, and then calculates the power supply rejection ratio (PSRR).
[0047] The present embodiment provides a universal test system for board-level verification of voltage regulator functionality and performance, including a test fixture and a test cabinet. The specific connection method is as follows:
[0048] like Figure 3 This shows the internal interconnection of a standard 2U tooling chassis, which can test six standard boards under test simultaneously. The status monitoring tooling motherboard in the chassis is interconnected with the PXIe industrial chassis in the test cabinet via the serial port. The indicators on the front panel of the chassis are controlled by the status monitoring tooling motherboard. The standard boards under test are interconnected with the test interface panel in the test cabinet via the RF port and aviation socket.
[0049] like Figure 4It is a standard 19-inch test cabinet with a standard 6U position reserved for placing a programmable power supply. According to the functional performance parameters of the device to be verified in the board to be tested, the output voltage range, output current range and other parameters of the programmable power supply can be set through the host computer software; 2 standard 2U positions are reserved for placing PXIe industrial chassis, which can simultaneously test 6 standard boards to be tested; a standard rack-mounted 2U data acquisition module is used to collect the output signal of the board to be tested and measure indicators such as ripple. A standard 6U position is reserved for placing an electronic load. According to the performance parameters of the device to be verified in the board to be tested, the output voltage range, output current range and other parameters of the programmable power supply can be set through the host computer software; 2 standard 2U positions are reserved for placing a PXIe industrial chassis, which can simultaneously test 6 standard boards to be tested; a standard rack-mounted 2U data acquisition module is used to collect the output signal of the board to be tested and measure indicators such as ripple. Energy parameters, and the output current mode, output current range and other parameters of the electronic load are set through the host computer software; the PXIe chassis is equipped with a high-precision measurement module, power matrix module, RF matrix module, serial communication module, etc. to control the entire cabinet, and communicate with the data acquisition module, high-precision measurement module, RF matrix and other modules through the embedded zero-slot controller. The programmable power supply, electronic load and other instruments are controlled through the network port or USB. The host computer software sends instructions to the module to perform operations such as parameter setting, matrix signal switching and automated testing.
[0050] It should be noted that the above Figure 2 and Figure 4 The U, or "unit," is the unit used to measure the space occupied by equipment in a rack. A rack is a frame structure used to mount servers, network equipment, and other electronic equipment. Typically, 1U represents a vertical height of 1.75 inches, or 44.45 mm, occupied by the equipment in the rack.
[0051] The embodiment of the present application provides a general test method based on board-level verification of voltage regulator function performance. In this embodiment, a voltage regulator device DC / DC controller is selected for testing. The specific steps are as follows: Figure 5 The embodiments described here are only some of the embodiments of this application, not all of them. When this general test method is applied to other types of voltage regulator devices, such as functional performance testing of LDO regulators, as well as functional performance testing in other environments, such as high and low test, vibration and shock test, etc., they all fall within the scope of protection of this application.
[0052] Connect the corresponding cables of the tooling chassis to be tested to the corresponding interfaces on the test interface panel of the test cabinet, and then follow the Figure 5 Conduct testing.
[0053] a) The test system completes the hardware connection (power cable, signal cable, RF cable, serial port cable, etc. are connected to the instrument equipment) according to the port definition and completes the self-test first;
[0054] b) After the self-test passes, the computer host software selects the board to be tested, then selects the functional performance parameters that need to be verified, and executes the test;
[0055] c) If the test results do not meet expectations, analyze the causes, make relevant corrections, and then return to the beginning of the test;
[0056] d) If there are no obvious problems in the test results, other boards to be tested can be tested until all boards to be tested in the tooling chassis are tested;
[0057] e) After all the functional performance tests of the cards to be tested are completed, the data will be sorted and the results will be output. The report supports three file formats: Excel, Word, and *.txt.
[0058] It should be understood that expressions such as "include" and "may include" used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as "include" and / or "have" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components, or combinations thereof, but may not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.
[0059] In addition, in this application, the expression "and / or" includes any and all combinations of the associated listed words. For example, the expression "A and / or B" may include A, may include B, or may include both A and B.
[0060] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship after the connection remains unchanged. "Rotational connection" means that the two are connected to each other and can rotate relative to each other after the connection. "Sliding connection" means that the two are connected to each other and can slide relative to each other after the connection. The directional terms mentioned in the embodiments of the present application, such as "top", "bottom", "inside", "outside", "left", "right", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.
[0061] In addition, in the embodiments of the present application, the mathematical concepts mentioned include symmetry, equality, parallelism, and perpendicularity. These limitations are all for the current state of the art, rather than being absolutely strict definitions in a mathematical sense. A small amount of deviation is allowed, and it is possible to be approximately symmetric, approximately equal, approximately parallel, or approximately perpendicular. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.
[0062] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.
Claims
1. A board test system, characterized in that: include: Tooling chassis and test cabinets; The tooling chassis is provided with a tooling motherboard and N card slots for carrying the boards to be tested; The tooling motherboard is connected to N board slots; N is an integer greater than 0; The tooling chassis is also provided with N input power interfaces of the boards to be tested, N output power interfaces of the boards to be tested, and N output signal interfaces of the boards to be tested; The test cabinet is provided with a PXIe industrial chassis, a programmable power supply, a test interface panel, an electronic load and a data acquisition module; the tooling motherboard is interconnected with the PXIe industrial chassis via a serial port and a network port; the programmable power supply is connected to the PXIe industrial chassis, and is connected to the input power interfaces of N boards to be tested via the test interface panel; the electronic load is connected to the PXIe industrial chassis, and is connected to the output power interfaces of N boards to be tested via the test interface panel; the data acquisition module is connected to the PXIe industrial chassis, and is connected to the output signal interfaces of N boards to be tested via the test interface panel.
2. The system according to claim 1, wherein: The test interface panel is arranged right in front of the test cabinet.
3. The system according to claim 1, wherein: The PXIe industrial chassis is provided with a measurement module, a power matrix module, a radio frequency matrix module and a serial communication module; The measuring module is connected to the input power interface and output power interface of N boards to be tested via the test interface panel on the test cabinet; The power matrix module is connected to the power network analyzer through an internal cable and is connected to the input power interface and output power interface of N boards to be tested through a test interface panel; The RF matrix module is connected to the measurement module through an internal cable, and is connected to the input power interface and output power interface of N boards to be tested through a test interface panel; The serial communication module is connected to the tooling chassis via a test interface panel.
4. The system according to claim 1, wherein: The tooling chassis is also provided with a power supply module; The power module is connected to the tooling motherboard.
5. The system according to claim 1, wherein: The tooling chassis is provided with 4 to 8 board slots.
6. The system according to claim 1, wherein: The test cabinet is provided with a drawer tray.
7. The system according to claim 1, wherein: The test cabinet is provided with a switch panel.
8. The system according to claim 1, wherein: The tooling chassis is provided with a serial port, an indicator light and a switch; the serial port, the indicator light and the switch are connected to the tooling motherboard.
9. The system according to claim 1 or 5, characterized in that The N board slots are arranged flatly on the tooling chassis.
10. The system according to any one of claims 1 to 8, characterized in that The board to be tested is a voltage regulator.