Light emitting device

Abstract

The utility model relates to a light emitting device which is integrated on a heat sink. The light emitting device comprises a target laser, a collimating lens, an isolator, a converging lens and a photonic integrated chip, the laser power of the target laser is larger than or equal to 50 milliwatts, and the photonic integrated chip comprises a first optical splitter and a Mach-Zehnder modulator which are sequentially connected through a silicon waveguide; wherein a collimating lens, an isolator and a converging lens are sequentially arranged on a light path of the target laser, and the converging lens converges laser passing through the isolator to the first optical splitter, so that compared with an existing light emitting device, a light source of the target laser always works under relatively high power, and the temperature fluctuation of the light source is relatively small; therefore, no additional compensation is needed to stabilize the optical power.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communications, in particular to a light emitting device. Background Art

[0002] At present, the existing light emitting devices can be integrated with semiconductor optical amplifiers (Semiconductor Optical Amplifier, SOA) and electro-absorption modulated lasers (Electro-absorption Modulated Laser, EML), etc. For details, please refer to Figure 1 .

[0003] However, since the SOA has a disadvantage of high noise figure, it requires a complex circuit to stabilize its gain. Utility Model Content

[0004] (1) Technical issues to be solved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a light emitting device, which solves the technical problem in the prior art that a complex circuit is required to stabilize its gain.

[0006] (2) Technical solution

[0007] In order to achieve the above-mentioned purpose, the main technical solutions adopted by this utility model include:

[0008] The present invention provides a light emitting device integrated on a heat sink. The light emitting device includes: a target laser, a collimating lens, an isolator, a converging lens, and a photon integrated chip. The target laser is a laser with a laser power greater than or equal to 50 milliwatts. The photon integrated chip includes a first optical splitter and a Mach-Zehnder modulator connected in sequence via a silicon waveguide.

[0009] Wherein, a collimating lens, an isolator and a converging lens are sequentially arranged on the optical path of the target laser, and the converging lens converges the laser light passing through the isolator to the first beam splitter.

[0010] In one possible embodiment, the photonic integrated chip further includes an MPD_in interface, a second optical splitter, an MPD_out interface and a wavelength division multiplexer. The first optical splitter is also connected to the MPD_in interface through a silicon waveguide, the Mach-Zehnder modulator is also connected to the second optical splitter through a silicon waveguide, and the second optical splitter is also connected to the MPD_out interface and the first wavelength division interface of the wavelength division multiplexer through silicon waveguides.

[0011] In one possible embodiment, the photonic integrated chip further includes a fiber array V-groove and a photodetector, the fiber array V-groove is connected to the wavelength combining interface of the wavelength division multiplexer, and the photodetector is connected to the second wavelength demultiplexing interface of the wavelength division multiplexer; wherein the fiber array V-groove is obtained by encapsulating the Tx_out interface and Rx_in interface of the photonic integrated chip.

[0012] In a possible embodiment, the optical emitting device further includes an optical interface assembly with a pigtail, and the pigtail is horizontally placed in the V-groove of the optical fiber array.

[0013] In a possible embodiment, the optical interface component is an LC socket or an SC socket.

[0014] (3) Beneficial effects

[0015] The beneficial effects of the utility model are:

[0016] An embodiment of the present application provides a light emitting device, in which a collimating lens, an isolator, and a converging lens are sequentially arranged on the optical path of a target laser, and the converging lens converges the laser light passing through the isolator to a first beam splitter, and the first beam splitter is also connected to a Mach-Zehnder modulator, and the target laser is a laser with a laser power greater than or equal to 50 milliwatts. Compared with existing light emitting devices, the light source of the target laser always operates at a relatively high power and its temperature fluctuation is relatively small, so no additional compensation is required to stabilize the optical power.

[0017] In order to make the above-mentioned objectives, features and advantages to be achieved by the embodiments of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A schematic structural diagram of a light emitting device in the prior art is shown;

[0020] Figure 2 A schematic structural diagram of a light emitting device provided in an embodiment of the present application is shown;

[0021] Figure 3A A side view of a V Groove provided by an embodiment of the present application is shown;

[0022] Figure 3B A front view of a V Groove provided by an embodiment of the present application is shown;

[0023] Figure 4A A schematic diagram of a structure of a PIC bonded to a Driver / TIA provided in an embodiment of the present application is shown;

[0024] Figure 4B A schematic structural diagram of a PIC bonded to a PCB according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0025] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below through specific implementation methods in conjunction with the accompanying drawings.

[0026] With the widespread adoption and continued speed increases of broadband, the gigabit broadband era has arrived. At the same time, emerging services such as 8K video, Cloud VR, and holographic interaction are constantly emerging, placing higher demands on network bandwidth. PON networks evolve approximately every 8-10 years, and currently, gigabit broadband based on 10G PON fiber access technology has become mainstream. Compared to 10G PON, 50G PON will deliver a fivefold increase in bandwidth, featuring low latency, low jitter, and high reliability. By trading bandwidth for latency and computing power, it can provide an ultimate service experience, spurring the emergence of numerous new applications and services, and better meet the typical application needs of digital home life, industry digital transformation, and urban digital infrastructure in the 10G era.

[0027] In 2018, the International Telecommunication Union's Telecommunication Standardization Sector, ITU-T, initiated the development of 50G PON standards. Its converged development path, compatible with existing 10G PON networks, was widely recognized by the industry, and the 50G PON standard was officially released in September 2021, defining it as the next-generation PON after 10G PON. In September 2022, ITU-T approved the first revision of the standard, supporting 50Gbps downstream and 12.5Gbps, 25Gbps, or 50Gbps upstream. The China Communications Standards Association (CCSA), also closely aligned with international standards, initiated the development of China's 50G PON standard.

[0028] As well as Figure 1 As shown in the figure, existing 50G PON OLT optical transmitter devices can integrate an SOA and EML, with the SOA being placed between two optical devices (i.e., lens 1 and lens 2). Furthermore, while the SOA amplifier has the advantages of high gain and wide bandwidth, its disadvantage is a high noise figure, requiring complex circuitry to stabilize its gain.

[0029] That is to say, as the temperature rises, the optical power will decrease and the optical amplification capability will also change. Therefore, the control of the optical power of existing optical emitting devices requires relatively complex circuits to perform temperature compensation in order to meet relevant standards.

[0030] Based on this, an embodiment of the present application provides a light emitting device, in which a collimating lens, an isolator and a converging lens are sequentially arranged on the optical path of a target laser, and the converging lens converges the laser passing through the isolator to a first spectrometer, and the first spectrometer is also connected to a Mach-Zehnder modulator, and the target laser is a laser with a laser power greater than or equal to 50 milliwatts. Compared with existing light emitting devices, the light source of the target laser always operates at a relatively high power and its temperature fluctuation is relatively small, so no additional compensation is required to stabilize the optical power.

[0031] It should be understood that the light emitting device may also be called a light engine, etc.

[0032] To better understand the above technical solution, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a clearer and more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0033] See Figure 2 , Figure 2 FIG. 1 shows a schematic structural diagram of a light emitting device provided in an embodiment of the present application. Figure 2 As shown, the light emitting device includes a heat sink (1) integrated thereon; the light emitting device includes a target laser (2), a collimating lens (3), an isolator (4), a converging lens (5), a photon integrated chip PIC (6) and an optical interface group (7) with a pigtail, the target laser is a laser with a laser power greater than or equal to 50 milliwatts, the photon integrated chip includes a first optical splitter (61), a second optical splitter (62), an MPD_in interface (63), an MPD_out interface (64), a Mach-Zehnder modulator MZM (65), a wavelength division multiplexer WDM (66), a photodetector PD (67) and an optical fiber array V-groove V Groove (68);

[0034] Wherein, a collimating lens (3), an isolator (4) and a converging lens (5) are sequentially arranged on the optical path of the target laser (2), and the converging lens (5) converges the laser light passing through the isolator (4) into the first optical splitter (61), and the first optical splitter (61) is further connected to the MPD_in interface (63) and the Mach-Zehnder modulator (65) respectively through a silicon waveguide, and the Mach-Zehnder modulator (65) is further connected to the second optical splitter (62) through a silicon waveguide, and the second optical splitter (62) is further connected to the MPD_out interface (64) and the first demultiplexing interface (661) of the wavelength division multiplexer (66) respectively through a silicon waveguide, and the optical fiber array V-groove (68) is connected to the combining interface (663) of the wavelength division multiplexer (66) through a silicon waveguide, and the photodetector PD (67) is connected to the second demultiplexing interface (662) of the wavelength division multiplexer (66) through a silicon waveguide;

[0035] In addition, the pigtails of the optical interface group (7) with pigtails are placed horizontally in the V-grooves (68) of the optical fiber array.

[0036] It should be understood that the specific structure of each device in the light emitting device can be set according to actual needs, and the embodiments of the present application are not limited thereto.

[0037] Alternatively, see Figure 3A and Figure 3B The COM ports of Tx_out and Rx_in on the photonic integrated chip (6) can be made into a fiber array V-groove (68), and the pigtails of the optical interface group (7) are coupled under a microscope through a multi-dimensional adjustment frame. The bare fiber is placed horizontally in the V Groove, with the end face 10 to 20 μm away from the PIC optical port end face, to complete the passive coupling. Then, UV glue is applied in the V Groove and cured with a UV lamp to complete the passive coupling.

[0038] That is, when the optical fiber is placed horizontally into the V-groove and contacts it, the fiber core is naturally aligned with the center of the waveguide on the PIC, and the gap in the V-groove is filled with UV glue to fix the optical fiber, completing the coupling.

[0039] Optionally, the optical interface component is an LC socket or an SC socket.

[0040] In addition, the connection between the optical emitting device and the DRIVER and TIA on the printed circuit board PCBA can reserve a position for gold wire bonding, which can be bonded from the PIC to the PCB and then connected to the DRIVER and TIA, or the PIC can be directly connected to the DRIVER and TIA through gold wire bonding.

[0041] For example, see Figure 4AFor the PIC bonding to Driver / TIA, Driver / TIA needs to be mounted on the PCBA, and then the PIC-Driver / TIA-PCBA are bonded separately.

[0042] For another example, see Figure 4B For the method of bonding PIC to PCB, the Driver / TIA uses flip-chip packaging and can be SMTed together with other components during PCB-Assembly. The disadvantage is that the path is a bit long (PIC-PCB-Driver / TIA), and the RF performance will be worse.

[0043] To facilitate understanding of the light emitting device, the specific structure of the light emitting device is described below.

[0044] Specifically, the target laser (2), the photonic integrated chip PIC (6) and the isolator (4) can be mounted on a heat sink with conductive silver glue, and the divergent light can be converted into quasi-parallel light through coupling with a collimating lens (3), and the quasi-parallel light passes through the isolator, and the isolator can block the reflected light from returning to the laser, reducing noise, and the laser passing through the isolator (4) can also be coupled into the first spectrometer (61) using a converging lens (5).

[0045] Furthermore, the light coupled into the silicon waveguide by the first optical splitter (61) is divided into two parts: one part of the light enters the MPD_in interface (63), thereby detecting the optical power coupled into the waveguide, that is, the coupling efficiency can be monitored through the MPD_in interface (63); the other part of the light is input into the Mach-Zehnder modulator (65) for modulation, and the modulation signal is input through the RFO interface and the RFOB interface to realize the change of the optical power, and the Mach-Zehnder modulator (65) can output a laser light wave with a signal, but modulation is not required in the optical engine manufacturing process.

[0046] Furthermore, after the laser passes through the modulation waveguide of the Mach-Zehnder modulator (65), it is split again into two parts by the second optical splitter (62): one part enters the MPD_out interface (64), so that the output optical power can be monitored; the other part is output from the optical port and input into the wavelength division multiplexer WDM (66).

[0047] Furthermore, the wavelength division multiplexer WDM (66) can input the input light into the optical interface group (7) through the V Groove (68), and then the optical interface group (7) can input the light into the wavelength division multiplexer WDM (66) through the V Groove (68), and the wavelength division multiplexer WDM (66) divides the input light into two parts, one part of which is input into the photodetector PD (67) and the other part is input into the second optical splitter (62), but this part is invalid and can be left unprocessed.

[0048] Therefore, the light source of the target laser in the present application always operates at a relatively high power and its temperature fluctuation is relatively small, so no additional compensation is required to stabilize the optical power.

[0049] In addition, Tx / Rx are integrated on a photonic integrated chip, the chip size is more compact, and the extra space is conducive to module PCBA wiring.

[0050] In addition, the Tx_out / Rx_in coupling adopts the V Groove structure passive coupling on the photonic integrated circuit chip. It only needs to use a multi-dimensional adjustment frame under a microscope to control the horizontal placement of the optical fiber into the V Groove. The coupling is completed when the fiber end face is within 10-20μm from the PIC end face.

[0051] In addition, since the target laser is external and coupled through a pair of lenses, it can be distanced from the photonic integrated chip, thereby improving heat dissipation efficiency.

[0052] It should be understood that the above-mentioned light emitting device is only exemplary, and those skilled in the art can make various modifications based on the above-mentioned method, and the modified solutions also fall within the scope of protection of this application.

[0053] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Thus, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0054] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions.

[0055] It should be noted that in the claims, any reference signs placed between brackets should not be understood as limiting the claims. The word "comprising" does not exclude the presence of components or steps not listed in the claims. The word "a" or "an" preceding a component does not exclude the presence of a plurality of such components. The present invention can be implemented by means of hardware comprising several different components and by means of a suitably programmed computer. In claims that list several means, several of these means may be embodied by the same hardware. The use of the words first, second, third, etc. is for convenience of expression only and does not indicate any order. These words may be understood as part of the component name.

[0056] In addition, it should be noted that, in the description of this specification, the description of the terms "one embodiment", "some embodiments", "embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0057] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments after learning the basic creative concept. Therefore, the claims should be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0058] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention shall also include such modifications and variations.

Claims

1. A light emitting device, characterized in that: The light emitting device is integrated on a heat sink; the light emitting device includes: a target laser, a collimating lens, an isolator, a converging lens and a photon integrated chip, the target laser is a laser with a laser power greater than or equal to 50 milliwatts, and the photon integrated chip includes a first optical splitter and a Mach-Zehnder modulator connected in sequence through a silicon waveguide; The collimating lens, the isolator and the converging lens are sequentially arranged on the optical path of the target laser, and the converging lens converges the laser light passing through the isolator to the first beam splitter.

2. The light emitting device according to claim 1, wherein The photonic integrated chip further includes an MPD_in interface, a second optical splitter, an MPD_out interface and a wavelength division multiplexer. The first optical splitter is also connected to the MPD_in interface through the silicon waveguide, the Mach-Zehnder modulator is also connected to the second optical splitter through the silicon waveguide, and the second optical splitter is also connected to the MPD_out interface and the first wavelength division multiplexer interface respectively through the silicon waveguide.

3. The light emitting device according to claim 2, wherein: The photonic integrated chip further includes a fiber array V-groove and a photodetector, wherein the fiber array V-groove is connected to the wavelength combining interface of the wavelength division multiplexer, and the photodetector is connected to the second wavelength demultiplexing interface of the wavelength division multiplexer; wherein the fiber array V-groove is obtained by encapsulating the Tx_out interface and Rx_in interface of the photonic integrated chip.

4. The light emitting device according to claim 3, wherein The optical emitting device further includes an optical interface assembly with a pigtail, and the pigtail is horizontally placed in the V-groove of the optical fiber array.

5. The light emitting device according to claim 4, wherein: The optical interface component is an LC socket or an SC socket.

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