Packaging structure and electronic equipment

Abstract

The utility model discloses a packaging structure and electronic equipment, and relates to the technical field of optical modules, and the packaging structure comprises a substrate which is provided with a first side surface; the heat dissipation structure comprises a heat dissipation main body, supporting bodies and reinforcing ribs, the multiple supporting bodies are arranged in the circumferential direction of the heat dissipation main body at intervals in a protruding mode, one end of each supporting body makes contact with the heat dissipation main body, and the other end of each supporting body makes contact with the first side face; the heat dissipation main body is arranged on the substrate, so that a mounting gap is formed between the substrate and the heat dissipation main body, the reinforcing rib is arranged in the mounting gap, one end of the reinforcing rib is in contact with the first side surface, and the other end of the reinforcing rib is in contact with the heat dissipation main body; and the optical module is arranged in the installation gap, the optical module is fixed to the substrate and abuts against the heat dissipation body, and the heat dissipation structure and the optical module are arranged on the same side of the first side face. According to the technical scheme, warping of the packaging structure can be optimized.

Description

Technical Field

[0001] The present application relates to the technical field of optical modules, and in particular to a packaging structure and an electronic device. Background Art

[0002] With the rapid development of technologies such as artificial intelligence (AI) and high-performance computing (HPC), data centers are facing increasingly heavy data processing workloads, placing higher demands on high bandwidth, low power consumption, and low-latency service quality. Currently, CPO (Co-Packaged Optics) optical / optical co-packaging structures are rapidly developing and being adopted, gradually replacing traditional pluggable optical modules. While these structures can reduce power consumption in data centers, they are prone to warping during packaging and use. Utility Model Content

[0003] The main purpose of this application is to provide a packaging structure and an electronic device, aiming to reduce the warping degree of the existing packaging structure.

[0004] To achieve the above objectives, the present invention provides a packaging structure, which includes:

[0005] a substrate having a first side;

[0006] a heat dissipation structure comprising a heat dissipation body, a support body, and a reinforcing rib, wherein the support body is provided with a plurality of protrusions at intervals along the circumference of the heat dissipation body, one end of the support body contacts the heat dissipation body, and the other end of the support body contacts the first side surface, so that a mounting gap is formed between the substrate and the heat dissipation body, and the reinforcing rib is provided in the mounting gap, one end of the reinforcing rib contacts the first side surface, and the other end of the reinforcing rib contacts the heat dissipation body; and

[0007] An optical module is arranged in the installation gap, fixed to the substrate and abutting against the heat dissipation body, and the heat dissipation structure and the optical module are arranged on the same side of the first side surface.

[0008] To achieve the above objectives, an embodiment of the present application provides an electronic device, which includes the packaging structure described above.

[0009] The technical solution of the present application forms an installation gap between the heat dissipation body and the substrate by providing a support body, which can facilitate the installation of the optical module on the substrate. At the same time, a reinforcing rib is provided in the installation gap, that is, the reinforcing rib is provided below the heat dissipation body and connects the substrate and the heat dissipation body, which can provide support for the heat dissipation body and can apply pressure to the substrate to reduce the degree of warping of the heat dissipation body or the substrate due to heat. Moreover, compared with the reinforcing rib running through the heat dissipation body, the space occupied is reduced, the installation space of the chip on the substrate is increased, and the chip size can be made larger. In addition, the width of the support body is greater than the width of the reinforcing rib, which can provide more installation space for the optical module on the basis of improving and optimizing the warping effect of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0011] Figure 1 This is a structural diagram of an embodiment of the packaging structure of the present application;

[0012] Figure 2 for Figure 1 A top view of

[0013] Figure 3 This is a schematic structural diagram of another embodiment of the packaging structure of the present application;

[0014] Figure 4 for Figure 3 A top view of

[0015] Figure 5 This is a structural diagram of another embodiment of the packaging structure of the present application;

[0016] Figure 6 This is a side view of an embodiment of the packaging structure of the present application.

[0017] Description of Figure Numbers:

[0018] 100. Heat dissipation structure; 110. Heat dissipation body; 111. Ring-shaped heat sink; 112. Heat dissipation cover; 120. Support body; 130. Reinforcement rib; 140. Installation gap; 200. Optical module; 300. Substrate; 400. Chip; 500. Heat conduction layer; 600. First blocking portion; 700. Circuit board.

[0019] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the embodiments of this application.

[0021] It should be noted that all directional indications in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0022] In addition, in the embodiments of the present application, descriptions such as "first" and "second" are only for descriptive purposes and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the embodiments of the present application, the meaning of "plurality" is at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0023] In the embodiments of the present application, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean a fixed connection, a detachable connection, or an integral connection; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal connection between two elements or the interaction between two elements, unless otherwise specified. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0024] In addition, the technical solutions between the various embodiments of the present application can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the embodiments of the present application.

[0025] With the rapid development of AI, HPC, and other technologies, data centers are facing increasing pressure. When switch bandwidth increases to 51.2T, the power consumption of optical modules increases by approximately 26 times, and the power consumption of switch chips increases by approximately 8 times. Consequently, data centers are increasingly demanding high bandwidth, low power consumption, and low latency. Co-Packaged Optics (CPO) can effectively reduce data center power consumption.

[0026] Currently, optoelectronic co-packaging typically involves directly interconnecting the optical module and integrated chip on a substrate, which is then soldered to a PCB. The inventors discovered that traditional heat dissipation structures require hollowing out the area where the optical module resides, reducing the contact area between the heat dissipation structure and the substrate, and making the overall structure susceptible to significant warping.

[0027] In light of this, the present invention provides a packaging structure with reinforcing ribs within the mounting gap. Specifically, the ribs are positioned below the heat sink and connect the substrate to the heat sink. This provides support for the heat sink and applies pressure to the substrate, reducing the degree of warping of the heat sink or substrate. Furthermore, compared to reinforcing ribs extending through the heat sink, this reduces space usage and increases chip mounting space on the substrate, allowing for larger chips.

[0028] In order to better understand the above technical solution, the above technical solution is described in detail below with reference to the accompanying drawings.

[0029] like Figures 1 to 4 As shown, the embodiment of the present application proposes a packaging structure, which includes:

[0030] The substrate 300 has a first side surface, which is used to mount electronic components such as the chip 400 and the optical module 200, thereby interconnecting the different electronic components. Specifically, the substrate 300 is a thick organic substrate 300, which can reduce losses during signal transmission. Of course, in other embodiments, the substrate 300 can also be other types of substrates, which is not limited here;

[0031] The heat dissipation structure 100 includes a heat dissipation body 110, a support body 120, and reinforcement ribs 130. The support body 120 is provided with multiple spaced-apart ribs along the circumference of the heat dissipation body 110. One end of the support body 120 contacts the heat dissipation body 110, while the other end of the support body 120 contacts the first side surface. This creates an installation gap 140 between the substrate 300 and the heat dissipation body 110. The installation gap 140 provides installation space for the optical module 200. In one embodiment, the heat dissipation body 110 may be rectangular, square, or other irregularly shaped, with at least two corners. The support bodies 120 are positioned at the corners to better support the heat dissipation body 110 while avoiding the installation position of the optical module 200. Of course, in other embodiments, the heat dissipation body 110 may also be annular, and may be a solid single, double, or multiple metal ring, or a hollow single, double, or multiple metal ring, without limitation herein. The reinforcing rib 130 is provided in the installation gap 140, with one end of the reinforcing rib 130 in contact with the first side surface, and the other end of the reinforcing rib 130 in contact with the heat dissipation body 110. Optionally, the heat dissipation body 110 is made of an alloy material such as stainless steel. In one embodiment, the width of the support body 120 is greater than the width of the reinforcing rib 130, so that more installation space can be provided for other components while ensuring the effect of reducing the warping of the substrate 300; and

[0032] The optical module 200 is disposed in the installation gap 140 , fixed to the substrate 300 and abutting the heat dissipation body 110 , and the heat dissipation structure 100 and the optical module 200 are disposed on the same side of the first side. Optionally, the optical module 200 is soldered to the substrate 300 .

[0033] In the technical solution adopted in this embodiment, the support body 120 creates an installation gap 140 between the heat sink 110 and the substrate 300, facilitating the installation of the optical module 200 on the substrate 300. Furthermore, the support body 120 physically connects the substrate 300 and the heat sink 110, exerting force on the substrate 300 and reducing warping. Furthermore, reinforcing ribs 130 are provided within the installation gap 140. Specifically, the reinforcing ribs 130 are positioned below the heat sink 110 and physically connect the substrate 300 and the heat sink 110, providing support for the heat sink 110 and applying pressure to the substrate 300, further reducing the degree of warping of the heat sink 110 or the substrate 300 due to heat. Furthermore, compared to reinforcing ribs 130 extending through the heat sink 110, this reduces space usage, increases chip installation space on the substrate, and allows for larger chip sizes. In addition, the width of the support body 120 is greater than the width of the reinforcing rib 130 , which can improve the effect of optimizing the warping of the substrate; the small width of the reinforcing rib 130 can provide more installation space for the optical module 200 .

[0034] In the examples of this application, refer to Figure 1 and Figure 3 Multiple reinforcing ribs 130 are spaced between two adjacent support bodies 120, and at least one optical module 200 is positioned between two adjacent reinforcing ribs 130. This allows support to be provided simultaneously at multiple locations, further increasing the contact area between the substrate 300 and the heat sink 110 and effectively preventing warping. Furthermore, at least one optical module 200 is positioned between two adjacent reinforcing ribs 130, providing support on both sides of the optical module 200 and further reducing the degree of warping near the optical module 200 due to heat.

[0035] In the examples of this application, refer to Figure 5 The heat sink body 110 includes an annular heat sink 111. A reinforcing rib 130 is provided on the side of the annular heat sink 111 facing the first side surface. One end of the reinforcing rib 130 contacts the annular heat sink 111, and the other end of the reinforcing rib 130 contacts the first side surface. One end of the support body 120 contacts the annular heat sink 111, and the other end of the support body 120 contacts the first side surface. The annular heat sink 111 may optionally be a circular ring, a square ring, or the like, without limitation herein.

[0036] In the examples of this application, refer to Figure 5 The heat sink body 110 further includes a heat sink cover 112, which is located on the side of the annular heat sink 111 facing away from the first side surface and covers the central cavity of the annular heat sink 111. This allows heat from the heating element (chip 400 in this embodiment) mounted on the substrate 300 to be transferred to the heat sink cover 112 and the annular heat sink 111 via the thermal interface material. Together, the heat sink cover 112 and the annular heat sink 111 form a heat dissipation surface, increasing the heat exchange area with the external radiator and effectively improving heat dissipation efficiency.

[0037] In the examples of this application, refer to Figure 6 , the packaging structure also includes a heat-conducting layer 500, and the optical module 200 is in contact with the heat dissipation body 110 through the heat-conducting layer 500. In this way, the heat transfer efficiency between the optical module 200 and the heat dissipation body 110 can be improved, so that the heat of the optical module 200 can be better transferred to the heat dissipation body 110 for heat dissipation, thereby improving the heat dissipation effect of the optical module 200. Optionally, the material of the heat-conducting layer 500 is a thermal interface material, including a silicone layer, a metal indium layer or a graphene layer, or other types of thermal interface materials, which are not limited here. It is understandable that the heat-conducting layer 500 can be a silicone layer, a metal indium layer, a graphene layer, a superposition of any two, or a superposition of three, which are not limited here.

[0038] In the embodiment of the present application, a glue layer is provided at the connection between the optical module 200 and the substrate 300. After the optical module 200 is soldered to the substrate 300 via bumps, glue is applied at the bumps to form a glue layer, which can improve the connection reliability between the optical module 200 and the substrate 300. Alternatively, glue can be applied to each optical module 200 individually, or to two or more optical modules 200 simultaneously, without limitation.

[0039] Reference Figure 6 A first blocking portion 600 is protruded on the substrate 300, and the first blocking portion 600 is arranged close to the optical module 200 and located at the edge of the substrate 300, so that the glue of the BUMP bump can be prevented from overflowing during glue dispensing; and / or, the packaging structure also includes a second blocking portion, which is protruded on the substrate 300 and located between the optical module 200 and the reinforcement rib 130, so that the glue of the BUMP bump can be prevented from overflowing to the reinforcement rib 130 during glue dispensing.

[0040] In the examples of this application, refer to Figures 1 to 4 as well as Figure 6 The packaging structure also includes a chip 400, and the heat dissipation body 110 is arranged around the chip 400. The chip 400 and the heat dissipation cover 112 are in contact through a thermal interface material. It can be understood that the chip 400 transfers heat to the heat dissipation cover 112, and then further dissipates heat through an external radiator. Optionally, the chip 400 is soldered to the substrate 300 and can be interconnected with the optical module 200. Specifically, the chip 400 is arranged in the middle of the substrate 300. In one embodiment, the chip 400 is a bare chip. Of course, in other embodiments, the chip 400 can also be a chip structure of other forms, which is not limited here.

[0041] In the embodiment of the present application, the support body 120, the heat dissipation body 110 and the reinforcing ribs 130 are integrally formed, which can save the use of parts, simplify the process flow, and make the structural strength more stable and reliable. Optionally, they can be processed by stamping or milling.

[0042] In an embodiment of the present application, the reinforcing rib 130 is fixed to the heat dissipation body 110 or the substrate 300 by a bonding structure. In this way, the fixation of the reinforcing rib 130 can be conveniently achieved. Optionally, the bonding structure can be a glue structure, a double-sided tape structure, etc. In one embodiment, one end of the reinforcing rib 130 is bonded to the heat dissipation body 110, and the other end of the reinforcing rib 130 is abutted against the substrate 300; or, one end of the reinforcing rib 130 is abutted against the heat dissipation body 110, and the other end of the reinforcing rib 130 is bonded to the substrate 300; or, one end of the reinforcing rib 130 is bonded to the heat dissipation body 110, and the other end of the reinforcing rib 130 is bonded to the substrate 300.

[0043] In the embodiment of the present application, one end of the optical module 200 extends to the outside of the substrate 300. It can be understood that one end of the optical module 200 is suspended outside the substrate 300, which can facilitate the optical fiber of the optical module 200 to output light.

[0044] The present application also provides an electronic device comprising the above-described packaging structure. Specifically, the specific structure of the packaging structure is similar to that of the above-described embodiment. Since the electronic device utilizes all of the technical solutions of the above-described embodiment, it at least has all of the beneficial effects brought about by the technical solutions of the above-described embodiment, and thus will not be further elaborated here. Optionally, the electronic device may be a data exchange device.

[0045] In the embodiment of the present application, the electronic device further includes a circuit board 700. Figure 6 The substrate 300 has a second side surface opposite to the first side surface, and the circuit board 700 is disposed on the second side surface of the substrate 300. It is understood that the substrate 300 is connected to the circuit board 700 through solder balls, so that signal interconnection between the circuit board 700 and the substrate 300 can be achieved.

[0046] The above description is merely an exemplary embodiment of the present application and does not limit the patent scope of the embodiments of the present application. Any equivalent structural transformations made using the description and drawings of the embodiments of the present application under the technical concept of the embodiments of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the embodiments of the present application.

Claims

1. A packaging structure, characterized in that: The packaging structure includes: a substrate having a first side; a heat dissipation structure comprising a heat dissipation body, a support body, and a reinforcing rib, wherein the support body is provided with a plurality of protrusions at intervals along the circumference of the heat dissipation body, one end of the support body contacts the heat dissipation body, and the other end of the support body contacts the first side surface, so that a mounting gap is formed between the substrate and the heat dissipation body, and the reinforcing rib is provided in the mounting gap, one end of the reinforcing rib contacts the first side surface, and the other end of the reinforcing rib contacts the heat dissipation body; and An optical module is arranged in the installation gap, fixed to the substrate and abutting against the heat dissipation body, and the heat dissipation structure and the optical module are arranged on the same side of the first side surface.

2. The packaging structure according to claim 1, wherein: A plurality of reinforcing ribs are arranged between two adjacent supporting bodies, and at least one optical module is arranged between two adjacent reinforcing ribs.

3. The packaging structure according to claim 1, wherein: The heat dissipation body includes an annular heat sink, the reinforcing rib is arranged on the side of the annular heat sink facing the first side surface, one end of the reinforcing rib contacts the annular heat sink, and the other end of the reinforcing rib contacts the first side surface, one end of the support body contacts the annular heat sink, and the other end of the support body contacts the first side surface.

4. The packaging structure according to claim 3, wherein: The heat dissipation body further includes a heat dissipation cover, which is arranged on a side of the annular heat dissipation fin away from the first side surface and covers a central cavity of the annular heat dissipation fin.

5. The packaging structure according to claim 1, wherein: The packaging structure further includes a heat-conducting layer, and the optical module abuts against the heat dissipation body through the heat-conducting layer.

6. The packaging structure according to claim 5, wherein: The material of the heat-conducting layer is thermal interface material.

7. The packaging structure according to claim 1, wherein: A glue layer is provided at the connection between the optical module and the substrate; A first blocking portion is protruded from the substrate, the first blocking portion is arranged close to the optical module and located at the edge of the substrate; and / or the packaging structure further includes a second blocking portion, the second blocking portion is protruded from the substrate and located between the optical module and the reinforcing rib.

8. The packaging structure according to claim 1, wherein: The packaging structure further includes a chip, which is arranged on the substrate, and the heat dissipation body is arranged around the chip.

9. The packaging structure according to claim 8, wherein: The chip is arranged in the middle of the substrate.

10. The packaging structure according to claim 1, wherein: The support body, the heat dissipation body and the reinforcing rib are integrally formed; or, the reinforcing rib is fixed to the heat dissipation body or the substrate through a bonding structure.

11. The packaging structure according to claim 1, wherein: One end of the optical module extends to the outside of the substrate.

12. An electronic device, characterized in that: The electronic device comprises the packaging structure according to any one of claims 1 to 11.

13. The electronic device according to claim 12, wherein: The electronic device further includes a circuit board. The substrate has a second side surface opposite to the first side surface. The circuit board is disposed on the second side surface of the substrate.

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