Base structure of OIS driving device

Abstract

The utility model relates to a base structure of an OIS driving device. The base structure comprises a base. A light through hole is formed in the middle of the base; a multi-chip FP-coil is arranged on the base; the FP-coil is installed on the base in a surrounding mode, and a light-transmitting hole opposite to the light-transmitting hole is formed in the middle of the FP-coil. According to the utility model, the FP-coil is arranged to be of a split structure, so that the effective usable area of the circuit board can be effectively increased, the waste of materials is reduced, and the cost is reduced; due to the split structure, the FP-coil is more regular in shape, the material utilization rate is higher during production, and waste caused by middle hollowing during production of a traditional integrated structure is avoided; through the through hole, the first bonding pad and the second bonding pad can be conveniently welded through the bottom of the base, and a visual observation area is formed by using the light through hole / extension part, so that the welding quality can be conveniently and directly observed visually.

Description

Technical Field

[0001] The utility model relates to the field of optical imaging, in particular to a base structure of an OIS driving device. Background Art

[0002] With the rapid advancement of technology, modern electronic devices have entered a new era. It's not hard to see that many everyday electronic products, such as smartphones and digital cameras, now feature powerful photography and video recording capabilities. These features are no longer limited to specialized photography equipment but are becoming increasingly ubiquitous, becoming an integral part of our lives. To meet the demands of consumers, the designs of these electronic devices are increasingly focused on convenience and thinness, striving to offer a wide range of functions while maintaining a compact design and ease of portability.

[0003] In electronic devices with camera or video capabilities, the lens drive plays a crucial role. It drives the precise movement of the lens' optical components, enabling autofocus and optical image stabilization. When we press the shutter or record button, light passes through the lens' optical components and ultimately focuses on the photosensitive element, producing a clear, stable image.

[0004] Optical Image Stabilization (OIS) typically requires an FP-coil installed on the base. Traditional OIS drive coils are integrated fine pitch coils (FP-coils). These multilayer circuit board coils are large, complex to manufacture, and have low yields, resulting in high prices. Furthermore, the integrated FP-coil requires a hollowed-out center for mounting the lens module, resulting in low area utilization. Furthermore, the integrated FP-coil's series structure can lead to its entirety being scrapped if a problem occurs, leading to high costs. Utility Model Content

[0005] In order to solve the above problems in the prior art, the utility model provides a base structure of an OIS driving device.

[0006] In order to achieve the above-mentioned purpose, the main technical solutions adopted by this utility model include:

[0007] A base structure of an OIS drive device includes a base; a light-through hole is formed in the middle of the base; a multi-piece FP-coil is provided on the base; the FP-coil is mounted on the base and forms a light-transmitting hole in the middle opposite to the light-through hole.

[0008] Furthermore, the number of the FP-coils is two, three or four.

[0009] Furthermore, a limiting groove is provided at the end of the FP-coil; and a limiting column is provided on the base to cooperate with the limiting groove.

[0010] Furthermore, a conductive circuit is embedded in the base.

[0011] Furthermore, a plurality of sensing elements are electrically connected to the conductive circuit.

[0012] Furthermore, a first pad is provided at the bottom of the FP-coil; a second pad is provided on the base and is arranged opposite to the first pad; and the FP-coil is electrically connected to the conductive circuit by welding the first pad to the second pad.

[0013] Furthermore, a hollow portion is provided on the second pad.

[0014] Furthermore, the hollow portion is connected to the light-through hole.

[0015] Furthermore, a through hole is provided on the base; the second solder pad is arranged at the through hole; and the hollow portion is located in the middle of the second solder pad.

[0016] Furthermore, an extension portion is formed on the through hole and is connected to the hollow portion and located outside the hollow portion.

[0017] The beneficial effects of the present invention are as follows: by configuring the FP-coil into a split structure, the effective use area of ​​the circuit board can be effectively increased, material waste can be reduced, and costs can be lowered; the split structure makes the shape of the FP-coil more regular, the material utilization rate during production is higher, and the waste caused by hollowing out the middle during production of the traditional integrated structure is avoided; the through hole can conveniently weld the first soldering pad and the second soldering pad through the bottom of the base, and the light hole / extension portion is used to form a visual observation area, which facilitates direct visual observation of the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is an exploded view of the structure of the utility model;

[0020] Figure 2 This utility model has a structural explosion Figure 2 ;

[0021] Figure 3It is an enlarged view of part B of the utility model;

[0022] Description of reference numerals:

[0023] 100, base; 110, limiting column; 120, light-transmitting hole; 130, through-hole; 200, conductive circuit; 210, sensing element; 220, second solder pad; 221, hollow portion; 222, extension portion; 300, FP-coil; 310, light-transmitting hole; 320, limiting groove; 330, first solder pad. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents the selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0025] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc., should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model in specific circumstances.

[0027] A base structure of an OIS drive device includes a base 100; a light hole 120 is formed in the middle of the base 100; the light hole 120 is used for light transmission and installation of a lens module; a multi-piece FP-coil 300 is provided on the base 100; the FP-coil 300 is mounted around the base 100 and forms a light-transmitting hole 310 in the middle opposite to the light hole 120; by configuring the FP-coil 300 as a split structure, the utility model can effectively increase the effective use area of ​​the circuit board, reduce material waste, and lower costs; the split structure makes the shape of the FP-coil 300 more regular, improves the material utilization rate during production, and avoids the waste caused by hollowing out the middle during production of a traditional integrated structure; Figure 1 As shown, the FP-coil300 includes four pieces. The shape of a single FP-coil300 is close to a rectangle and regular, which can improve the material utilization rate when digging holes. Similarly, when the FP-coil300 is split into two or three pieces, the utilization rate can be significantly improved, thereby reducing costs. On the other hand, it can avoid the overall scrapping problem caused by the traditional integrated structure connected in series. With the split structure FP-coil300 of the utility model, when one of the FP-coil300 is damaged, it can be replaced separately, effectively reducing costs. The FP-coil300 can be a hard board multi-layer structure or a soft board multi-layer structure.

[0028] In one embodiment, a limiting groove 320 is provided at the end of the FP-coil 300; a limiting column 110 is provided on the base 100 to cooperate with the limiting groove 320; the cooperation between the limiting groove 320 and the limiting column 110 can achieve rapid positioning of the FP-coil 300 during installation.

[0029] In one embodiment, the conductive circuit 200 is electrically connected to a plurality of sensing elements 210. Two sensing elements 210 are generally provided, and the two sensing elements 210 are respectively disposed on two perpendicular sides of the base 100, thereby respectively detecting the displacement of the lens module relative to the base 100 along the X-axis and the Y-axis. The sensing elements 210 may be, but are not limited to, a Hall sensor, a magnetoresistive sensor (MRSensor), a fluxgate, an optical position sensor, or an optical encoder.

[0030] like Figure 1-3 As shown, in one embodiment, a first soldering pad 330 is provided at the bottom of the FP-coil 300; a second soldering pad 220 is provided on the base 100 and is arranged opposite to the first soldering pad 330; the FP-coil 300 is electrically connected to the conductive circuit 200 by welding the first soldering pad 330 and the second soldering pad 220.

[0031] In one embodiment, a hollow portion 221 is defined on the second pad 220 .

[0032] In one embodiment, the hollow portion 221 is connected to the light-through hole 120;

[0033] In one embodiment, the base 100 is provided with a through hole 130; the second pad 220 is provided at the through hole 130; the hollow portion 221 is located in the middle of the second pad 220; Figure 3 The second soldering pad 220 on the left side, the hollow portion 221 is connected to the light hole 120, so that a visual observation area is formed at the light hole 120, which is convenient for directly observing the welding quality of the soldering point after soldering; Figure 3 The second soldering pad 220 on the middle right side has a hollow portion 221 that is not connected to the light-through hole 120. At this time, an extension portion 222 that is connected to the hollow portion 221 and located outside the hollow portion 221 is formed on the through hole 130. After the soldering is completed, the soldering quality of the soldering point can be directly observed through the extension portion 222. The extension portion 222 is usually also a through hole. In one embodiment, the extension portion 222 can be a blind hole formed from the bottom of the base 100 to connect to the hollow portion 221. Since the extension portion 222 is located at the bottom of the base 100, the extension portion 222 can be connected to the light-through hole 120. The hole at the bottom of the base 100, even if it is a blind hole, can achieve the effect of observing the welding quality at the second pad 220; the advantage of setting the through hole 130 is that the first pad 330 and the second pad 220 can be easily welded through the bottom of the base 100, which is convenient for operation; before welding begins, it is usually necessary to use glue to attach the FP-coil300 to the upper surface of the base 100; the welding of the first pad 330 and the second pad 220 can be achieved by laser welding, solder paste welding or conductive glue.

[0034] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the description and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A base structure of an OIS drive device, characterized by: The invention comprises a base (100); a light-through hole (120) is formed in the middle of the base (100); a multi-piece FP-coil (300) is provided on the base (100); the FP-coil (300) is mounted on the base (100) and forms a light-transmitting hole (310) in the middle thereof, which is opposite to the light-through hole (120).

2. The base structure of the OIS driving device according to claim 1, characterized in that: The FP-coils (300) are provided in two, three or four configurations.

3. The base structure of the OIS driving device according to claim 1, characterized in that: A limiting groove (320) is provided at the end of the FP-coil (300); and a limiting column (110) is provided on the base (100) and is matched with the limiting groove (320).

4. The base structure of the OIS driving device according to claim 1, characterized in that: A conductive circuit (200) is embedded in the base (100).

5. The base structure of the OIS driving device according to claim 4, characterized in that: A plurality of sensing elements (210) are electrically connected to the conductive circuit (200).

6. The base structure of the OIS driving device according to claim 4, characterized in that: The bottom of the FP-coil (300) is provided with a first soldering pad (330); the base (100) is provided with a second soldering pad (220) arranged opposite to the first soldering pad (330); the FP-coil (300) is electrically connected to the conductive circuit (200) by welding the first soldering pad (330) and the second soldering pad (220).

7. The base structure of the OIS driving device according to claim 6, characterized in that: A hollow portion (221) is provided on the second solder pad (220).

8. The base structure of the OIS driving device according to claim 7, characterized in that: The hollow portion (221) is connected to the light-through hole (120).

9. The base structure of the OIS driving device according to claim 7, characterized in that: A through hole (130) is provided on the base (100); the second solder pad (220) is arranged at the through hole (130); and the hollow portion (221) is located in the middle of the second solder pad (220).

10. The base structure of the OIS driving device according to claim 9, characterized in that: An extension portion (222) is formed on the through hole (130), which is connected to the hollow portion (221) and is located outside the hollow portion (221).

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