Chip testing equipment

Abstract

The utility model relates to the technical field of chip testing, and provides chip testing equipment which comprises a base, a supporting shaft, a disc support and a feeding device. The supporting shaft is located on the base, and the disc support is installed on the supporting shaft. A feeding assembly, an imaging device, a first defective material box, a first conveying assembly, a plurality of testing stations, a first material box, a marking device, a second conveying assembly, a second material box, a braiding assembly and a second defective material box are sequentially arranged in the circumferential direction of the disc support. The feeding device comprises a feeding port, a vibration disc body, a communication line, a power line, a shielding cover and a magnetic element. The shielding cover covers the vibration disc body, the magnetic element is of an annular structure, and the communication line and / or the power line penetrate through the annular structure. By adopting the scheme of the invention, the problem of inaccurate test result or misoperation of test equipment caused by electromagnetic interference in the test process can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a chip testing device. Background Art

[0002] Chip packaging and testing is the final step in the chip manufacturing process. Its primary task is to package the chip and conduct multiple tests on its functionality, performance, and reliability to ensure that its quality and performance meet design requirements. Chip packaging and testing is a critical step in chip manufacturing, directly impacting both chip quality and cost.

[0003] Currently, the industry primarily uses gravity-type sorters to test high-frequency products such as audio SOCs, Bluetooth, and RF. This method suffers from slow UPH (Units per Hour) rates, low efficiency, and the tendency to cause lead deformation, making it unsuitable for large-scale testing.

[0004] During the test process, the electromagnetic noise of the test equipment itself will affect other equipment or test results (electromagnetic interference, EMI). The test equipment may also malfunction due to external electromagnetic interference (electromagnetic susceptibility immunity EMS), affecting the accuracy and reliability of the test results.

[0005] The above problems are problems that existing testing equipment urgently needs to solve. Utility Model Content

[0006] The purpose of the present invention is to provide a chip testing device to meet the testing requirements of high-frequency products, improve test efficiency while reducing electromagnetic interference between devices, and improve test reliability and stability.

[0007] The chip testing equipment provided by the utility model includes: a base, a supporting shaft, a disc bracket, and a feeding device;

[0008] The support shaft is located on the base, and the disc bracket is installed on the support shaft; the disc bracket is sequentially provided with a feeding assembly, an imaging device, a first defective material box, a first transport assembly, a plurality of testing stations, a first material box, a marking device, a second transport assembly, a second material box, a braiding assembly, and a second defective material box in a circumferential direction;

[0009] The feeding device includes a feed port, a vibration disk body, a communication line, a power line, a shielding cover and a magnetic element; the shielding cover is provided on the vibration disk body, the magnetic element is a ring structure, and the communication line and / or the power line passes through the ring structure.

[0010] Optionally, the first transport component and / or the second transport component comprises a vacuum nozzle and a drive motor; the vacuum nozzle and the motor are mechanically connected, and the drive motor is coated with an absorbing material.

[0011] Optionally, each of the test stations includes a test board, a positioning unit and a gold finger unit; the positioning unit is located between two gold finger units.

[0012] Optionally, the positioning unit includes a positioning block and a metal probe; the positioning block includes a positioning groove for accommodating the chip to be tested; the metal probe passes through the positioning block and is grounded.

[0013] Optionally, the positioning block includes at least two small holes, and one of the metal probes is disposed in each small hole.

[0014] Optionally, a shielding layer is provided around the positioning block; the shielding layer is grounded.

[0015] Optionally, at least one grounding connection hole is provided at an edge of the test board, and the grounding connection hole is grounded through a wire.

[0016] Optionally, the test board is a copper-clad board with low dielectric constant, low dielectric loss factor and low impedance.

[0017] Optionally, an appearance inspection device is provided between the second transport assembly and the second material box. Optionally, there are at least eight testing stations.

[0018] The chip testing equipment provided by the present invention can complete the whole process test of the chip by sequentially arranging a feeding component, an imaging device, a first defective material box, a first transport component, multiple test stations, a first material box, a marking device, a second transport component, a second material box, a braiding component, and a second defective material box on a disc bracket, and moving the chip to be tested between various inspection stations through the transport component, which improves the testing capability and testing efficiency of the testing equipment and meets the current market's urgent demand for improving the production capacity of testing equipment; by arranging a shielding cover on the vibration disk, arranging magnetic elements on the signal line and the power line, and arranging absorbing materials on the motor, the anti-interference ability of the testing equipment can be improved and the test reliability can be increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A schematic diagram of the test equipment provided by the utility model;

[0021] Figure 2 A top view of the vibration plate provided by the utility model;

[0022] Figure 3 The vibration disk shield provided by the utility model;

[0023] Figure 4 The positioning unit provided by the utility model;

[0024] Figure 5 A test station provided by the utility model. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] See also Figure 1-Figure 2 , the utility model provides a chip testing device 100, which includes: a base, a support shaft, a disc holder, and a feeding device 12;

[0027] The support shaft is located on the base, and the disc bracket is installed on the support shaft; along the circumference of the disc bracket, a feeding component 1, an imaging device 2, a first defective material box 3, a first transport component 4, multiple testing stations 5, a first material box 6, a marking device 7, a second transport component 8, a second material box 9, a braiding component 10, and a second defective material box 3 are arranged in sequence;

[0028] The feeding device 12 includes a feed port, a vibration disk body, a communication line, a power line, a shielding cover 11 and a magnetic element; the shielding cover 11 is covered on the vibration disk body, the magnetic element is a ring structure, and the communication line and / or power line passes through the ring structure.

[0029] In the present invention, the base and support seat can be integrated or independently configured. The disc holder is directly fixed to the support shaft. The feed assembly 1, imaging device 2, first defective material box 3, first transport assembly 4, multiple test stations 5, first material box 6, marking device 7, second transport assembly 8, second material box 9, braiding assembly 10, and second defective material box 3 are arranged on the disc holder in a counterclockwise or clockwise direction. By integrating the various components and rationally arranging their positions, the present invention can improve testing efficiency.

[0030] In the present utility model, Figure 2 The feeding device 12 can be a vibration plate, preferably a piezoelectric vibration plate. The chips to be tested enter through the vibration plate feed port, are arranged into a predetermined shape that meets the test requirements, and then output to the feeding assembly 1 through the discharge port and enter the test state.

[0031] Since the vibration plate will generate harmonics during operation, resulting in low efficiency, low reliability, and even equipment damage, the utility model improves the vibration plate in two aspects:

[0032] On the one hand, if Figure 3 , a shielding cover structure 11 is set to block the electromagnetic noise from being radiated into space, forming electric field shielding, magnetic field shielding and electromagnetic field shielding space, so as to achieve the purpose of suppressing radiated electromagnetic interference;

[0033] On the other hand, annular magnetic elements are installed on the signal and power lines of the vibration disk to ensure that normal useful signals pass through smoothly while effectively suppressing the passage of high-frequency interference signals. In this way, even if ordinary signal lines are not shielded, electromagnetic leakage can be reduced and the circuit can be protected from interference.

[0034] In some embodiments, the first transport assembly 4 and / or the second transport assembly 8 includes a vacuum nozzle and a drive motor; the vacuum nozzle and the drive motor are mechanically connected, and the drive motor is coated with an absorbing material. As is well known, the drive motor generates a rotating magnetic field during operation, which can exacerbate EMI. Applying absorbing material around the motor can significantly reduce electromagnetic interference.

[0035] In the present invention, the first transport component 4 and / or the second transport component 8 also has a positioning component, which is used to accurately absorb the chip to be tested in the vacuum nozzle and move the chip to be tested to a preset position, for example, to the test station 5, to the defective material box 3, to the ordinary material box, etc.

[0036] In some embodiments, Figure 5 Each test station 5 (preferably 8) includes a test board 51, a positioning unit 52, and a gold finger unit 53. The positioning unit 52 is located between two gold finger units 53. The test board 51 is a PCB board, which can be a copper-clad board with low dielectric constant, low dielectric loss factor, and low impedance.

[0037] Low-dielectric-constant (Dk) circuit board substrates have a signal transmission rate that is inversely proportional to the square root of the material's dielectric constant, thus preventing signal transmission delays. Lower dielectric loss also reduces signal loss. Lower PCB impedance improves conductivity and signal transmission performance after electronic components are installed on the PCB.

[0038] The test board has high water absorption, which will cause the dielectric constant and dielectric loss of the test board to decrease when it is wet. Therefore, it is preferred that the test board use a circuit board substrate with low water absorption.

[0039] In the present invention, the positioning unit 52 is used to accommodate and position the chip under test during testing to facilitate testing. During testing, after the nozzle picks up the chip and moves it above the positioning unit 52 of the test station 5, the motor presses the nozzle with the chip under test downward against the positioning unit 52, causing the pins of the chip under test to contact the gold fingers 51, thereby transmitting the test signal.

[0040] In one embodiment, Figure 4 The positioning unit 52 includes a positioning block 521 and a metal probe 522; the positioning block 521 includes a positioning groove for accommodating the chip to be tested; the metal probe 522 passes through the positioning block 521 and is grounded.

[0041] In the present invention, a metal probe 522 is provided to contact the heat sink (generally a large exposed base island) on the back of the chip to be tested, thereby being grounded.

[0042] Preferably, if Figure 4 As shown, the positioning block 521 includes at least two small holes, and a metal probe 522 is disposed in each small hole.

[0043] In some embodiments, a shielding layer is provided around the positioning block; the shielding layer is grounded. By optimizing the design of the entire test socket, the shielding layer product and the aforementioned heat sink can be grounded separately, thereby blocking the impact of EMI on the product during testing.

[0044] In some embodiments, Figure 5 At least one grounding connection hole 54 is provided at the edge of the test board 51, and the grounding connection hole 54 is grounded through a wire.

[0045] Optionally, the ground connection hole 54 can be provided at one edge of the test board, and a plurality of ground connection holes 54 can be provided. Figure 5 , there are two ground connection holes 54 ; illustratively, the ground connection holes 54 are arranged in two rows, and each row includes a plurality of ground connection holes 54 .

[0046] In some embodiments, an appearance inspection device is provided between the second transport assembly 8 and the second magazine 9 to inspect whether the appearance of the chips meets the requirements. Preferably, the appearance inspection device is a 3D5S.

[0047] It should be noted that the first material box 6 and the second material box 9 are used to store chips that have passed the previous inspection and wait for the right time to be moved to the next station.

[0048] The working principle of the testing device of the present invention will be described below with reference to the accompanying drawings.

[0049] After the chips to be tested are adjusted into the appropriate posture by the vibration plate, they enter the test state. The bottom imaging device 2 inspects the chip's appearance. If the chip fails the inspection, it is moved by the first transport device 4 to the defective material box 3. If it passes the inspection, the chip is sequentially moved to different stations 5 for testing. Only chips that pass the inspection at the current station can be moved to the next station. If the chip fails the inspection, it is moved to the defective material box 3. After a series of tests, the marking device 7 marks the chip, and finally, the qualified chips are heat-pressed and sealed by the braiding assembly 10, and counted and reeled. This arrangement integrates various functions, greatly improving testing efficiency.

[0050] At the same time, when the chip is in the vibration disk, the internal chip will not be affected by electromagnetic interference due to the provision of the shielding box 11; and since the vibration disk signal line and power line are both provided with magnetic rings, this also greatly reduces electromagnetic interference.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip testing device, characterized in that: include: Base, support shaft, disc bracket, feeding device; The support shaft is located on the base, and the disc bracket is installed on the support shaft; the disc bracket is sequentially provided with a feeding assembly, an imaging device, a first defective material box, a first transport assembly, a plurality of testing stations, a first material box, a marking device, a second transport assembly, a second material box, a braiding assembly, and a second defective material box in a circumferential direction; The feeding device includes a feed port, a vibration disk body, a communication line, a power line, a shielding cover and a magnetic element; the shielding cover is provided on the vibration disk body, the magnetic element is a ring structure, and the communication line and / or the power line passes through the ring structure.

2. The chip testing device according to claim 1, characterized in that: The first transport component and / or the second transport component comprises a vacuum nozzle and a drive motor; the vacuum nozzle and the drive motor are mechanically connected, and the drive motor is coated with an absorbing material.

3. The chip testing device according to claim 1, characterized in that: Each of the test stations comprises a test board, a positioning unit and a gold finger unit; the positioning unit is located between two gold finger units.

4. The chip testing device according to claim 3, characterized in that: The positioning unit includes a positioning block and a metal probe; the positioning block includes a positioning groove for accommodating the chip to be tested; the metal probe passes through the positioning block and is grounded.

5. The chip testing device according to claim 4, characterized in that: The positioning block includes at least two small holes, and one metal probe is arranged in each small hole.

6. The chip testing device according to claim 4, characterized in that: A shielding layer is provided around the positioning block; the shielding layer is grounded.

7. The chip testing device according to claim 3, characterized in that: At least one grounding connection hole is provided at the edge of the test board, and the grounding connection hole is grounded through a wire.

8. The chip testing device according to claim 7, characterized in that: The test board is a copper-clad board with low dielectric constant, low dielectric loss factor and low impedance.

9. The chip testing device according to any one of claims 1 to 8, characterized in that: An appearance detection device is provided between the second transport component and the second material box.

10. The chip testing device according to any one of claims 1 to 8, characterized in that: There are at least eight testing stations.

Images