Photovoltaic Schottky module lead frame

Abstract

The utility model discloses a photovoltaic Schottky module lead frame which comprises a lead frame structure. A plurality of lead frame units are arranged on the lead frame structure in parallel along the transverse direction and the longitudinal direction; each lead frame unit comprises a base island, a positive electrode pin and a negative electrode pin, the base island comprises a first base island part arranged on the positive electrode pin and a second base island part arranged on the negative electrode pin, and the positive electrode pin and the negative electrode pin are both of a rectangular structure; the upper side and the lower side of each of the first base island part and the second base island part are zigzag to form zigzag glue locking positions, and at least one V-shaped groove is formed in the edge of each of the first base island part and the second base island part; and a plurality of pocks are arranged on the backs of the first base island part and the second base island part. According to the utility model, wastes generated in the processing process of the lead frame structure are reduced, multi-row and high-density matrix arrangement of the base islands is realized, the cost is saved, the utilization rate of equipment in the production process is increased, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a photovoltaic Schottky module lead frame. Background Art

[0002] Photovoltaic Schottky modules are Schottky diode-based photovoltaic components that feature high efficiency, low thermal resistance, and a compact size. They are widely used in various scenarios within photovoltaic power generation systems, such as solar power stations, distributed power generation systems, and mobile power supplies. Currently used photovoltaic Schottky modules typically use lead frames to connect photovoltaic cells and other electrical components to extract the generated current and achieve power transmission. However, existing photovoltaic Schottky module lead frames still have the following problems:

[0003] 1. Low production efficiency and material utilization: Existing photovoltaic Schottky module lead frames mostly adopt a single-row design, which results in low material utilization during the production process and relatively high frame costs;

[0004] 2. Insufficient bonding strength: Existing photovoltaic Schottky module lead frames add pitting on the back of the base island of the positive pin to enhance the bonding strength between the frame unit and the product jumper, but this enhancement effect is still limited;

[0005] 3. Vibration cracking: During the punching process, large vibrations may cause vibration cracking between the plastic package and the lead frame of the photovoltaic Schottky module, leading to problems such as difficulty in pin fixation, low high temperature withstand voltage, leakage and electrical failure, increasing the product defect rate;

[0006] 4. Unreasonable electrode pin structure: The positive and negative pins of the existing photovoltaic Schottky module lead frame both adopt a "T"-shaped structure, which has low material utilization. Since semiconductor devices generate a lot of heat when working at a large forward current, all materials in the device will expand and contract with heat; in particular, the jumper and base frame are made of metal, which expands greatly when heated, which can easily lead to untimely heat dissipation, resulting in electrical spark failure and thermal stress failure. Utility Model Content

[0007] In view of the deficiencies in the prior art, the utility model provides a photovoltaic Schottky module lead frame.

[0008] The utility model discloses a photovoltaic Schottky module lead frame, comprising a lead frame structure;

[0009] The lead frame structure is provided with a plurality of lead frame units arranged in parallel in the horizontal and vertical directions;

[0010] Each of the lead frame units includes a base island, a positive electrode pin and a negative electrode pin, the base island includes a first base island portion provided on the positive electrode pin and a second base island portion provided on the negative electrode pin, and the positive electrode pin and the negative electrode pin are both rectangular structures;

[0011] The upper and lower sides of the first base island portion and the second base island portion are serrated to form serrated glue locking positions, and the edges of the first base island portion and the second base island portion are each provided with at least one V-shaped groove; the backs of the first base island portion and the second base island portion are each provided with multiple pitting spots.

[0012] As a further improvement of the present invention, the lead frame structure is provided with side strips on both sides in the longitudinal direction, and a mounting area for mounting multiple lead frame units is formed between the upper and lower side strips;

[0013] A plurality of sideband positioning holes are provided at intervals on both the upper and lower sidebands; and the sideband ends of at least one side of the upper and lower sidebands are provided with identifiable corners for identifying the front and back sides and direction of the lead frame structure.

[0014] As a further improvement of the present invention, the plurality of lead frame units are arranged in five rows along the longitudinal direction on the lead frame structure, and each row includes six lead frame units;

[0015] The two upper and lower adjacent lead frame units are connected by a first connecting rib, and the two left and right adjacent lead frame units are connected by a second connecting rib.

[0016] As a further improvement of the present invention, a tin storage area is provided on the upper surface of the positive electrode pin and the upper surface of the negative electrode pin.

[0017] As a further improvement of the present invention, both the positive electrode pin and the negative electrode pin are provided with positioning holes, and at least one limiting hole is provided on the positive electrode pin or the negative electrode pin.

[0018] As a further improvement of the present invention, the positioning hole is a circular hole, and the limiting hole is an arc-shaped hole.

[0019] As a further improvement of the present invention, the first base island portion and the second base island portion are respectively arranged at an end close to the positive electrode pin and the negative electrode pin;

[0020] At least one V-shaped groove is provided on the front surface of one end of the first base island portion and the second base island portion that is away from each other.

[0021] As a further improvement of the present invention, the plurality of pits are arranged in a matrix on the back of the first base island portion and the back of the second base island portion.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] The utility model reduces waste generated during the processing of the lead frame structure by arranging multiple lead frame units in parallel along the horizontal and vertical directions on the lead frame structure, realizes a multi-row, high-density matrix arrangement of the base islands, saves costs, increases the utilization rate of equipment in the production process, and improves production efficiency.

[0024] The utility model provides a plurality of pits on the back of the first base island portion and the second base island portion, which can effectively reduce the position deviation of the lead frame unit during molding, so that the lead frame unit is better combined with the jumper and the interior.

[0025] The utility model forms a serrated glue locking position by making the upper and lower sides of the first base island part and the second base island part serrated, and the edges of the first base island part and the second base island part are provided with at least one V-shaped groove. During plastic packaging molding, the stability of the internal components can be effectively guaranteed, the friction between the plastic packaging body and the base island can be reduced, the structural strength can be enhanced, and deformation of varying degrees can be avoided.

[0026] In the utility model, multiple lead frame units are arranged in a multi-row matrix, and the positive pins and the negative pins are set to a rectangular structure, so the material utilization rate is high. During use, the lead frame unit has a large heat dissipation surface, which solves the problem of large thermal expansion of metal, resulting in untimely heat dissipation and later electrical spark failure and thermal stress failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic structural diagram of a photovoltaic Schottky module lead frame disclosed in an embodiment of the present utility model;

[0028] Figure 2 This is a structural schematic diagram of a lead frame unit of a photovoltaic Schottky module lead frame disclosed in an embodiment of the present utility model;

[0029] Figure 3 A schematic diagram of pitting of a photovoltaic Schottky module lead frame disclosed in an embodiment of the present utility model;

[0030] Figure 4 This is a schematic diagram of the pitting structure of the photovoltaic Schottky module lead frame disclosed in one embodiment of the utility model;

[0031] Figure 5 A schematic diagram of a V-groove of a photovoltaic Schottky module lead frame disclosed in an embodiment of the present utility model;

[0032] Figure 6 The figure is a schematic diagram of the base island plastic package area of ​​the photovoltaic Schottky module lead frame disclosed in one embodiment of the present utility model.

[0033] In the picture:

[0034] 1. Lead frame structure; 11. Sideband; 111. Sideband positioning hole; 12. Identifiable corners;

[0035] 2. Lead frame unit; 21. Base island; 211. First base island portion; 212. Second base island portion; 213. V-shaped groove; 214. Serrated glue lock position; 22. Positive lead; 23. Negative lead; 24. First connecting rib; 25. Second connecting rib; 26. Positioning hole; 27. Limiting hole; 28. Tin storage area;

[0036] 3. pitting;

[0037] 4. Plastic sealing body. DETAILED DESCRIPTION

[0038] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0039] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0041] The present invention is described in further detail below with reference to the accompanying drawings:

[0042] like Figure 1-2 As shown, a photovoltaic Schottky module lead frame provided by the utility model includes a lead frame structure 1, and a plurality of lead frame units 2 are arranged in parallel in the horizontal and vertical directions on the lead frame structure 1. Each lead frame unit 2 includes a base island 21, a positive pin 22 and a negative pin 23. The base island 21 includes a first base island portion 211 arranged on the positive pin 22 and a second base island portion 212 arranged on the negative pin 23. The positive pin 22 and the negative pin 23 are both rectangular structures. The upper and lower sides of the first base island portion 211 and the second base island portion 212 are serrated to form a serrated glue locking position 214. The edges of the first base island portion 211 and the second base island portion 212 are provided with at least one V-shaped groove 213; the backs of the first base island portion 211 and the second base island portion 212 are provided with a plurality of pitting spots 3.

[0043] In this embodiment, by arranging a plurality of lead frame units 2 in parallel in the horizontal and vertical directions on the lead frame structure 1, waste generated during the processing of the lead frame structure 1 is reduced, a multi-row, high-density matrix arrangement of the base island 21 is achieved, cost is saved, and the utilization rate of equipment is increased during the production process, thereby improving production efficiency; by providing a plurality of pits 3 on the back of the first base island portion 211 and the second base island portion 212, the position deviation of the lead frame unit 2 during molding can be effectively reduced, so that the lead frame unit 2 is better combined with the jumper and the internal strength; by providing a serrated shape on the upper and lower sides of the first base island portion 211 and the second base island portion 212 To form a serrated glue lock position 214, the edges of the first base island portion 211 and the second base island portion 212 are each provided with at least one V-shaped groove 213, which can effectively ensure the stability of the internal components during plastic packaging molding, reduce the friction between the plastic packaging body and the base island 21, enhance the structural strength, and avoid deformation to varying degrees; multiple lead frame units 2 are arranged in a multi-row matrix, and the positive pins 22 and the negative pins 23 are both set to a rectangular structure, with high material utilization. During use, the lead frame unit 2 has a large heat dissipation surface, which solves the problem of large thermal expansion of metal, resulting in untimely heat dissipation and later electrical spark failure and thermal stress failure.

[0044] Specifically:

[0045] like Figure 1As shown, in the above embodiment, preferably, the lead frame structure 1 is provided with side bands 11 on both sides in the longitudinal direction, and an installation area for installing multiple lead frame units 2 is formed between the upper and lower side bands 11; a plurality of side band positioning holes 111 are provided on the upper and lower side bands 11 at intervals; and an identifiable corner 12 for identifying the front and back sides and direction of the lead frame structure 1 is provided at the end of the side band 11 on at least one side of the upper and lower side bands 11. The identifiable corner 12 in this embodiment is formed by the edge chamfer at the left end of the lower side band 11; the provision of multiple side band positioning holes 111 can ensure that the position and accuracy of the lead frame structure 1 are within a controllable range during the production process.

[0046] In the above embodiment, preferably, a plurality of lead frame units 2 are arranged in five rows along the longitudinal direction on the lead frame structure 1, and each row includes six lead frame units 2; the two upper and lower adjacent lead frame units 2 are connected by a first connecting rib 24, and the two left and right adjacent lead frame units 2 are connected by a second connecting rib 25.

[0047] like Figure 2 As shown, in the above embodiment, preferably, the positive pin 22 and the negative pin 23 are both rectangular structures, and the ends of the positive pin 22 and the negative pin 23 away from each other are each provided with a second connecting rib 25, and the upper and lower sides of the positive pin 22 and the negative pin 23 are each provided with a first connecting rib 24; the end of the positive pin 22 and the negative pin 23 close to each other is provided with a base island 21, and the base island 21 includes a first base island portion 211 and a second base island portion 212 respectively provided at the end close to the positive pin 22 and the negative pin 23, and the first base island portion 211 and At least one V-shaped groove 213 is provided on the front of the end away from the second base island portion 212; the upper and lower sides of the first base island portion 211 and the second base island portion 212 are serrated to form a serrated glue locking position 214; the upper surface of the positive pin 22 and the upper surface of the negative pin 23 are both provided with a tin storage area 28 near the middle position, which is used to store tin blocks and apply tin when the product is in use; the serrated glue locking position 214 can ensure the stability of the internal components during plastic packaging molding, enhance the structural strength, and avoid deformation of varying degrees.

[0048] In the above embodiment, preferably, a positioning hole 26 is provided on the positive pin 22 and the negative pin 23, and at least one limiting hole 27 is provided on the positive pin 22 or the negative pin 23. Specifically, in this embodiment, a positioning hole 26 is provided on the upper side of the end portion of the positive pin 22 away from the base island 21, and a limiting hole 27 is provided on the lower side. A positioning hole 26 is provided on the upper side of the end portion of the negative pin 23 away from the base island 21, and a positioning hole 26 is provided on the lower side. The setting of the limiting hole 27 can realize the limitation of the lead frame unit 2.

[0049] In the above embodiment, preferably, the positioning hole 26 is a circular hole, and the limiting hole 27 is an arc-shaped hole.

[0050] like Figure 3-4 As shown, in the above embodiment, preferably, the plurality of pits 3 are arranged in a matrix on the back of the first base island portion 211 and the back of the second base island portion 212 .

[0051] In the above embodiment, preferably, the length and width of the pits 3 are both 0.2 mm. The provision of multiple pits 3 can ensure the stability of internal components, enhance structural strength, increase surface friction, and avoid deformation to varying degrees during plastic packaging.

[0052] like Figure 5 As shown, in the above embodiment, preferably, the angle of the V-shaped groove 213 is 90 degrees, and the width of the V-shaped groove 213 is 0.1 mm; when multiple V-shaped grooves 213 are provided, the spacing between two adjacent V-shaped grooves 213 is 0.1 mm; the provision of the V-shaped groove 213 can reduce the friction between the plastic package body 4 and the base island 21 during the plastic packaging process.

[0053] like Figure 6 The diagram shows a schematic diagram of the base island plastic package area, where the base island plastic package area 4 is located in the first base island portion 211 and the second base island portion 212 area.

[0054] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A photovoltaic Schottky module lead frame, characterized in that: A lead frame structure (1) is included; A plurality of lead frame units (2) are arranged in parallel in the transverse and longitudinal directions on the lead frame structure (1); two upper and lower adjacent lead frame units (2) are connected by a first connecting rib (24), and two left and right adjacent lead frame units (2) are connected by a second connecting rib (25); Each of the lead frame units (2) comprises a base island (21), a positive electrode pin (22) and a negative electrode pin (23); the base island (21) comprises a first base island portion (211) arranged on the positive electrode pin (22) and a second base island portion (212) arranged on the negative electrode pin (23); and the positive electrode pin (22) and the negative electrode pin (23) are both rectangular structures; The upper and lower sides of the first base island portion (211) and the second base island portion (212) are both serrated to form serrated glue locking positions (214); the edges of the first base island portion (211) and the second base island portion (212) are both provided with at least one V-shaped groove (213); and the backs of the first base island portion (211) and the second base island portion (212) are both provided with a plurality of pitting spots (3).

2. The photovoltaic Schottky module lead frame according to claim 1, characterized in that: The lead frame structure (1) is provided with side strips (11) on both sides in the longitudinal direction, and an installation area for installing a plurality of lead frame units (2) is formed between the upper and lower side strips (11); A plurality of sideband positioning holes (111) are provided at intervals on both the upper and lower sidebands (11); and an identifiable corner (12) for identifying the front and back sides and the direction of the lead frame structure (1) is provided at the end of the sideband (11) on at least one side of the upper and lower sidebands (11).

3. The photovoltaic Schottky module lead frame according to claim 1, characterized in that: The plurality of lead frame units (2) are arranged in five rows along the longitudinal direction on the lead frame structure (1), and each row includes six lead frame units (2).

4. The photovoltaic Schottky module lead frame according to claim 1, characterized in that: The upper surface of the positive electrode pin (22) and the upper surface of the negative electrode pin (23) are both provided with a tin storage area (28).

5. The photovoltaic Schottky module lead frame according to claim 1, characterized in that: The positive electrode pin (22) and the negative electrode pin (23) are both provided with a positioning hole (26), and the positive electrode pin (22) or the negative electrode pin (23) is provided with at least one limiting hole (27).

6. The photovoltaic Schottky module lead frame according to claim 5, characterized in that: The positioning hole (26) is a circular hole, and the limiting hole (27) is an arc-shaped hole.

7. The photovoltaic Schottky module lead frame according to claim 1, characterized in that: The first base island portion (211) and the second base island portion (212) are respectively arranged at one end close to the positive electrode pin (22) and the negative electrode pin (23); At least one V-shaped groove (213) is provided on the front side of one end of the first base island portion (211) and the second base island portion (212) that is away from each other.

8. The photovoltaic Schottky module lead frame according to claim 1, characterized in that: The plurality of pits (3) are arranged in a matrix on the back of the first base island portion (211) and the back of the second base island portion (212).

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