LED packaging structure, light-emitting device and light-emitting device

Abstract

The utility model provides an LED packaging structure, a light-emitting device and a light-emitting device. The utility model discloses an LED packaging structure. The LED packaging structure comprises a support; the at least one light emitting unit is fixedly arranged on the bracket; the at least one light-emitting unit comprises a red light-emitting unit, a green light-emitting unit and / or a blue light-emitting unit; the transparent adhesive layer completely covers the light-emitting unit and extends to cover at least part of the bracket; and the thickness of the transparent adhesive layer ranges from 0.1 mm to 0.35 mm. By arranging the light-emitting unit, the red light-emitting unit, the green light-emitting unit and the blue light-emitting unit with three different light-emitting colors in the LED packaging structure, the LED packaging structure can be used for emitting white light or realizing full-color display. Therefore, when white light needs to be obtained or full-color display needs to be achieved, only one LED packaging structure needs to be selected, and the packaging cost is low.

Description

Technical Field

[0001] The present application relates to the field of LED packaging, and specifically to an LED packaging structure, a light-emitting device, and a light-emitting apparatus. Background Art

[0002] The LED (Light Emitting Diode) packaging structure is a semiconductor packaging structure that can directly convert electrical energy into light energy. The LED packaging structure has the characteristics of high efficiency, long life, and low energy consumption, and is widely used in modern lighting, display technology, communications and other fields. Specifically, the LED packaging structure refers to the process of solid-state die bonding the light-emitting chip on a bracket and encapsulating it. When applied to a light-emitting device or a light-emitting apparatus, at least one LED packaging structure is mounted on a substrate, such as a PCB substrate. However, the traditional LED packaging structure can only emit light of one color. Therefore, when white light or full-color display is required, multiple LED packaging structures that can emit light of different colors need to be set up, and the packaging cost is relatively high. Summary of the Invention

[0003] Multiple embodiments in this specification provide an LED packaging structure that can reduce packaging costs when white light or full-color display is required.

[0004] In one aspect, the present application provides an LED packaging structure, comprising:

[0005] Bracket;

[0006] at least one light-emitting unit, the light-emitting unit being fixed on the bracket; the at least one light-emitting unit comprising a red light-emitting unit, a green light-emitting unit and / or a blue light-emitting unit; and

[0007] A transparent adhesive layer completely covers the light-emitting unit and extends to cover at least a portion of the bracket; the thickness of the transparent adhesive layer falls within the range of 0.1 mm to 0.35 mm.

[0008] In some embodiments, the LED packaging structure further includes a packaging layer; the thickness of the packaging layer falls within the range of 0.2 mm to 0.5 mm.

[0009] In some embodiments, a conductive hole is provided on the bracket; a conductive member is provided in the conductive hole, and two ends of the conductive member are electrically connected to the electrode terminal of the light-emitting unit and the external circuit respectively.

[0010] In some embodiments, the red light emitting unit includes a blue light chip and a first conversion structure; the first conversion structure is used to convert the light emitted by the blue light chip into red light;

[0011] And / or, the green light emitting unit includes a blue light chip and a second conversion structure; the second conversion structure is used to convert the light emitted by the blue light chip into green light;

[0012] And / or, the blue light emitting unit includes a blue light chip.

[0013] In some embodiments, the first conversion structure is a red fluorescent glue layer;

[0014] And / or, the second conversion structure is a green fluorescent glue layer.

[0015] In some embodiments, the outer surface of the light emitting unit includes a light-shielding area and a light-transmitting area;

[0016] The LED packaging structure further includes a light-shielding structure, and the light-shielding structure covers the light-shielding area of ​​the light-emitting unit.

[0017] In some embodiments, the at least one light-emitting unit includes a red light-emitting unit; in the red light-emitting unit, the first conversion structure covers the light-transmitting area;

[0018] And / or, the at least one light-emitting unit includes a green light-emitting unit; in the green light-emitting unit, the second conversion structure covers the light-transmitting area.

[0019] In some embodiments, the outer surface of the light emitting unit includes a top surface and several side surfaces; the shading area includes at least a portion of at least a portion of the side surfaces of the light emitting unit and / or at least a portion of the top surface of the light emitting unit.

[0020] In some embodiments, the number of the light-emitting unit is one; the light-transmitting area includes at least one side surface of the light-emitting unit.

[0021] In some embodiments, the several side surfaces include a first side surface and a fourth side surface disposed opposite to each other, and a second side surface and a third side surface disposed opposite to each other; the second side surface and the third side surface are respectively connected to both sides of the first side surface; the light-shielding area includes the fourth side surface; the light-transmitting area includes the first side surface, at least part of the second side surface, and / or at least part of the third side surface.

[0022] In some embodiments, there are multiple light-emitting units; the bracket has a first side, and the side of the light-emitting unit facing the first side of the bracket is the first side; the light-transmitting area includes the first side.

[0023] In some embodiments, the several side surfaces include a fourth side surface disposed opposite to the first side surface, a second side surface and a third side surface disposed opposite to each other; the second side surface and the third side surface are respectively connected to both sides of the first side surface; the shading area includes the fourth side surface; the shading area also includes at least part of the second side surface, and / or at least part of the third side surface.

[0024] In some embodiments, the light-transmitting region is continuous.

[0025] In some embodiments, the light-emitting unit has a first side surface and a fourth side surface arranged opposite to each other, and a second side surface and a third side surface arranged opposite to each other; the second side surface and the third side surface are respectively connected to the two sides of the first side surface; the light-transmitting area includes the first side surface; the light-shielding area includes the second side surface, the third side surface, the fourth side surface and the top surface.

[0026] In some embodiments, the light emitting unit is arranged to be inclined toward one side of the first side surface.

[0027] In some embodiments, the surface of the bracket on which the light-emitting units are arranged is a bearing surface, and a direction parallel to both the bearing surface and the first side surface is a first direction; along the first direction, any two light-emitting units do not overlap.

[0028] In some embodiments, the at least one light emitting unit is arranged along the first direction.

[0029] In some embodiments, the light shielding structure is a white glue layer or a black glue layer.

[0030] In some embodiments, the transparent adhesive layer is provided with a first adhesive groove adjacent to the first conversion structure and located on a side of the first conversion structure away from the blue light chip.

[0031] And / or, a second surrounding adhesive groove is provided on the transparent adhesive layer, adjacent to the second conversion structure and located on a side of the second conversion structure away from the corresponding blue light chip.

[0032] On the other hand, the present application also provides a light-emitting device, which includes a substrate and several LED packaging structures provided by the present application; the several LED packaging structures are arranged on the substrate.

[0033] On the other hand, the present application also provides a light-emitting device, which includes the light-emitting device provided by the present application, or the LED packaging structure provided by the present application.

[0034] In some embodiments, the light-emitting device is a spotlight strip.

[0035] This specification provides several embodiments that can be used to emit white light or achieve full-color display by incorporating three different color light-emitting units—red, green, and blue—into an LED package structure. Therefore, when white light or full-color display is required, a single LED package structure can be used, resulting in lower packaging costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A cross-sectional view of an LED packaging structure provided in one embodiment of this specification.

[0037] Figure 2 for Figure 1 Cross-sectional view of the LED package structure along the MM direction.

[0038] Figure 3a This is a cross-sectional view of an LED packaging structure provided in another embodiment of this specification.

[0039] Figure 3b for Figure 3a The LED package structure shown is a schematic diagram of light when used in a follow-up light strip for a TV.

[0040] Figure 3c Schematic diagram of the light of a traditional spotlight strip (the light-emitting angle of the light-emitting unit is 120°).

[0041] Figure 4 for Figure 3a Cross-sectional view of the LED package structure along the MM direction.

[0042] Figure 5 This is a cross-sectional view of an LED packaging structure provided in another embodiment of this specification.

[0043] Figure 6 This is a cross-sectional view of an LED packaging structure provided in another embodiment of this specification.

[0044] Figure 7 for Figure 6 Cross-sectional view of the LED package structure along the MM direction.

[0045] Figure 8 This is a cross-sectional view of an LED packaging structure provided in another embodiment of this specification.

[0046] Description of Reference Numerals

[0047] 100 / 200 / 300 / 400, LED packaging structure; 110, bracket; 111, conductive hole; 112, conductive part; 113, bearing surface; 114, first side; 120, light-emitting unit; 121, red light-emitting unit; 1211, first conversion structure; 122, green light-emitting unit; 1221, second conversion structure; 123, blue light-emitting unit; 120a, blue light chip; 124, shading area; 125, light-transmitting area; 126, first side; 127, second side; 128, third side; 129, fourth side; 130, transparent adhesive layer; 131, first adhesive groove; 132, second adhesive groove; 133, third adhesive groove; 140, packaging layer; 150, shading structure; aa, first direction; 01, conductive wire; 02, wall. DETAILED DESCRIPTION

[0048] The technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0049] In this specification, the drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show details of the local features.

[0050] Unless otherwise indicated, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the art in the technical field of this specification. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the scope of this specification. The term "and / or" used in this specification includes any and all combinations of one or more of the relevant listed items. The singular forms "a", "above", and "the" used in this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0051] In the description of this specification, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more of the described features. In the description of this specification, "plurality" means two or more, unless otherwise specifically defined.

[0052] In the description of this specification, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and so on indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of simplifying the description of this specification, and do not indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation to this application.

[0053] Throughout this specification, unless otherwise expressly defined, terms such as "installed," "connected," "connect," "fixed," and "disposed" should be interpreted broadly. For example, "connection" can refer to fixed or removable connections, or integration; mechanical or electrical connections; direct or indirect connections through an intermediary; or internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this specification based on the specific circumstances.

[0054] In the description of this specification, unless otherwise explicitly defined, when a first feature is “on,” “above,” “above,” “above,” “below,” “below,” or “below” a second feature, the first feature and the second feature may be in direct contact, or the first feature and the second feature may be in indirect contact via an intermediate medium. Moreover, when a first feature is “on,” “above,” or “above” a second feature, it may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. When a first feature is “below,” “below,” or “below” a second feature, it may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0055] See also Figure 1 and Figure 2 An LED package structure provided in one embodiment of the present disclosure includes a bracket 110, at least one light-emitting unit 120, and a transparent adhesive layer 130. The light-emitting unit 120 is fixed to the bracket 110; the at least one light-emitting unit 120 includes a red light-emitting unit 121, a green light-emitting unit 122, and a blue light-emitting unit 123.

[0056] The transparent adhesive layer 130 completely covers the light-emitting unit 120 and extends to cover at least a portion of the bracket 110; the thickness of the transparent adhesive layer 130 falls within the range of 0.1mm to 0.35mm. Specifically, the thickness of the transparent adhesive layer 130 can be any value within the range of 0.1mm to 0.35mm, such as 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm or 0.35mm. The provision of the transparent adhesive layer 130 can achieve the fixation of the light-emitting unit 120 and the bracket 110, and avoid corrosion and oxidation of the light-emitting unit 120, further extending the service life of the LED. The thickness of the transparent adhesive layer 130 falls within the range of 0.1mm to 0.35mm, and can also avoid a significant increase in the size of the LED packaging structure due to the provision of the transparent adhesive layer 130.

[0057] In addition, the transparent adhesive layer 130 is transparent, and the thickness of the transparent adhesive layer 130 falls within the range of 0.1 mm to 0.35 mm, so that the light intensity of the light emitted by the light emitting unit 120 is slightly weakened after passing through the transparent adhesive layer 130 .

[0058] Further optionally, the thickness of the transparent adhesive layer 130 falls within the range of 0.2 mm to 0.3 mm.

[0059] Optionally, the transparent adhesive layer 130 may be, but is not limited to, a hydrocarbon adhesive layer or a silicon oxide adhesive layer. The transparent adhesive layer 130 may be formed by, but is not limited to, vapor deposition.

[0060] By providing three different color light-emitting units 120 within the LED package structure—red, green, and blue—the LED package structure can be used to emit white light or achieve a full-color display. Therefore, when white light or a full-color display is required, a single LED package structure can be used, resulting in lower packaging costs.

[0061] It is understandable that by adjusting the brightness ratio of the red light emitting unit 121 , the green light emitting unit 122 and the blue light emitting unit 123 , white light can be generated or full-color display can be achieved.

[0062] Specifically in this embodiment, the number of red light emitting units 121, green light emitting units 122, and blue light emitting units 123 is the same. It is understandable that in other embodiments, the number of red light emitting units 121, green light emitting units 122, and blue light emitting units 123 may also be different.

[0063] Specifically in this embodiment, the red light-emitting units 121, the green light-emitting units 122, and the blue light-emitting units 123 are arranged in a straight line. It is understood that in other embodiments, the red light-emitting units 121, the green light-emitting units 122, and the blue light-emitting units 123 are not limited to being arranged in a straight line, and can also be arranged in other regular or irregular ways, such as a herringbone arrangement.

[0064] Optionally, in some other embodiments, at least one light-emitting unit may further include one or two of a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit, which may be set according to specific needs and is not specifically limited here.

[0065] In some embodiments, the red light emitting unit 121 includes a red light chip, the green light emitting unit 122 includes a green light chip, and the blue light emitting unit 123 includes a blue light chip. It is understood that the red light chip can emit red light, the green light chip can emit green light, and the blue chip can emit blue light.

[0066] The LED package structure further includes an encapsulation layer 140. The thickness of the encapsulation layer 140 is within a range of 0.2 mm to 0.5 mm, thereby achieving an effective encapsulation effect while avoiding a significant increase in the size of the LED package structure. Specifically, the thickness of the encapsulation layer 140 is any value within the range of 0.2 mm to 0.5 mm, such as 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, or 0.5 mm.

[0067] Further optionally, the thickness of the encapsulation layer 140 falls within the range of 0.3 mm to 0.4 mm.

[0068] In some embodiments, the bracket 110 is provided with a conductive hole 111; a conductive member 112 is disposed within the conductive hole 111. The ends of the conductive member 112 are electrically connected to the electrode terminals of the light-emitting unit 120 and external circuitry, respectively. In other words, the electrode terminals of the light-emitting unit 120 are electrically connected to the external circuitry via the conductive member 112. It will be appreciated that the conductive member 112 is hermetically sealed against the sidewalls of the conductive hole 111 to prevent moisture from entering the light-emitting unit 120 through the conductive hole 111.

[0069] It is understood that the connection method between the conductive member 112 and the electrode terminal of the light emitting unit 120 is different depending on the configuration of the light emitting unit 120. If the light emitting unit 120 adopts a flip-chip type, the conductive member 112 can be directly electrically connected to the electrode terminal of the light emitting unit 120; if the light emitting unit 120 adopts other installation methods, the conductive member 112 can be electrically connected to the electrode terminal of the light emitting unit 120 through a conductive wire 01, see Figure 1 .

[0070] In this embodiment, the bracket 110 is in a plate shape. It is understood that in other feasible embodiments, the bracket 110 is not limited to being in a plate shape, but may also be in a bowl or cup shape.

[0071] It is understandable that a channel line (not shown) is further provided on the bracket 110 to avoid electrical connection between different light-emitting units.

[0072] See also Figure 3a and Figure 4 The LED package structure 200 provided in one embodiment of this specification differs from the LED package structure 100 in that the red light-emitting unit 121 includes a blue light chip 120a and a first conversion structure 1211; the first conversion structure 1211 is used to convert the light emitted by the blue light chip 120a into red light for emission. The green light-emitting unit 122 includes a blue light chip 120a and a second conversion structure 1221; the second conversion structure 1221 is used to convert the light emitted by the blue light chip 120a into green light for emission. The blue light-emitting unit 123 includes the blue light chip 120a.

[0073] The blue light emitted by the corresponding blue light chip 120a is converted into red light through the first conversion structure 1211, and the blue light emitted by the corresponding blue light chip 120a is converted into green light through the second conversion structure 1221. The light-emitting chip of the light-emitting unit 120 only needs to be the blue light chip 120a, thereby reducing the cost of the LED packaging structure 200.

[0074] In addition, the light emitting chip of the light emitting unit 120 is only a blue light chip 120a. Therefore, when the light emitting chip is mounted on the bracket 110, there is no need to distinguish the types of the light emitting chips, which is convenient for operation.

[0075] Furthermore, by using only blue light chips 120a as the light-emitting chips for the light-emitting units 120, the driving voltages of the driver circuits of the different light-emitting units 120 can be kept consistent, facilitating circuit configuration. Consequently, the drive circuit design of the LED package structure 200 is simpler and easier to control, and the voltage is more stable. Furthermore, the more stable voltage and easier control of the drive circuit make it easier to control the luminous intensity of the light-emitting chips, and thus the light output intensity of the light-emitting units 120, allowing for more precise control of the color of the light emitted by the LED package structure 200.

[0076] The light-emitting chip of the light-emitting unit 120 is only a blue light chip 120 a , which makes the driving circuit design of the LED package structure 200 simpler, easier to control, and the voltage more stable.

[0077] Furthermore, generally, the thickness of the blue chip 120a is relatively small. Selecting only the blue chip 120a as the light-emitting chip of the light-emitting unit 120 facilitates the miniaturization design of the LED package structure 200 and improves the application range of the LED package structure 200.

[0078] Optionally, the first conversion structure 1211 is a red fluorescent adhesive layer, which contains red fluorescent powder and packaging adhesive, and the red fluorescent powder can convert blue light into red light.

[0079] Optionally, the second conversion structure 1221 is a green fluorescent adhesive layer, which contains green fluorescent powder and packaging adhesive, and the green fluorescent powder can convert blue light into green light.

[0080] Optionally, the first conversion structure 1211 and the second conversion structure 1221 can both be formed by dispensing glue, that is, by dispensing glue on the transparent adhesive layer 130. Of course, the first conversion structure 1211 and the second conversion structure 1221 can also be independently formed as fluorescent adhesive films containing corresponding fluorescent powders, and then the first conversion structure 1211 and the second conversion structure 1221 are attached to the transparent adhesive layer 130 by patching.

[0081] In some embodiments, the outer surface of the light-emitting unit 120 includes a shading area 124 and a light-transmitting area 125; the LED packaging structure further includes a shading structure 150, and the shading structure 150 covers the shading area 124 of the light-emitting unit 120. It can be understood that the outer surface of the light-emitting unit 120 refers to the surface of the light-emitting unit 120 that is not in contact with the bracket 110. The shading structure 150 covers the shading area 124 of the light-emitting unit 120 to prevent light from being emitted from the shading area 124 and instead emits light from the light-transmitting area 125, thereby adjusting the light-emitting direction and angle of the light-emitting unit 120. In addition, part of the light emitted by the light-emitting unit 120 to the shading area 124 is reflected by the shading structure 150 and then emitted from the light-transmitting area 125, thereby increasing the intensity of the light emitted from the light-transmitting area 125.

[0082] In this embodiment, the light shielding structure 150 is disposed on the transparent adhesive layer 130. In other words, the light shielding structure 150 is disposed on a side of the transparent adhesive layer 130 that is away from the light emitting chip.

[0083] In some embodiments, in the red light-emitting unit 121, the first conversion structure 1211 covers the light-transmitting area 125; in the green light-emitting unit 122, the second conversion structure 1221 covers the light-transmitting area 125. Since the light emitted by the light-emitting unit 120 is emitted from the light-transmitting area 125, the color of the light emitted by the light-emitting chip can be changed by placing the conversion structure in the light-transmitting area 125.

[0084] In this embodiment, the first conversion structure 1211 is disposed on the transparent adhesive layer 130, and the second conversion structure 1221 is also disposed on the transparent adhesive layer 130. In other words, the first conversion structure 1211 is disposed on the side of the transparent adhesive layer 130 facing away from the light-emitting chip, and the second conversion structure 1221 is disposed on the side of the transparent adhesive layer 130 facing away from the light-emitting chip.

[0085] The conversion structure and the shading structure 150 are both arranged on the transparent adhesive layer 130, and the conversion structure is arranged in the light-transmitting area 125, and the shading structure 150 is arranged in the shading area 124, thereby avoiding overlap of the conversion structure and the shading structure 150 in a direction perpendicular to the transparent adhesive layer 130, facilitating the miniaturization design of the LED packaging structure.

[0086] Optionally, the outer surface of the light emitting unit 120 includes a top surface and several side surfaces; the shading area includes at least a portion of at least part of the side surfaces of the light emitting unit and / or at least part of the top surface of the light emitting unit.

[0087] In some embodiments, the bracket 110 has a first side 114, and the side of the light-emitting unit 120 facing the first side 114 of the bracket 110 is a first side 126. The light-transmitting area 125 includes the first side 126. The light emitted by the light-emitting unit 120 is emitted from the first side 126, which limits the light-emitting direction of the light-emitting unit 120 and improves the intensity of the light emitted by the light-emitting unit 120, so as to be suitable for some application scenarios that require a special light-emitting direction, such as a spotlight strip used in a TV. It can be understood that, in this embodiment, the remaining outer surfaces of the light-emitting unit 120 except the first side 126 constitute the shading area 124. More specifically, in this embodiment, the light-emitting unit 120 is in the shape of a rectangular parallelepiped, and the other three side surfaces and the top surface of the light-emitting unit 120 except the first side 126 constitute the shading area 124.

[0088] See also Figure 3c , a conventional spotlight strip for TV, such as a light emitting unit 120 with a light emitting angle of 120°, partially emits light onto the wall 02 behind the TV and is blocked by the TV, see Figure 3c This part of the light is blocked and cannot be seen, becoming invalid light, resulting in positive light loss. The light that is not blocked by the TV has lower light intensity and a weaker tracking effect.

[0089] If the LED package structure 200 is applied to a spotlight strip on a TV, the light emitting angle is reduced and the light is emitted from the side of the LED package structure 200, thereby adjusting the direction of the light emitted by the spotlight strip, reducing the phenomenon that the light emitted by the spotlight strip hits the wall 02 and is blocked by the TV, and reducing the front light loss. Figure 3bFurthermore, as mentioned above, the intensity of the light emitted from the light-transmitting area 125 is increased, so the intensity of the light emitted from the chasing light strip is increased, and the chasing light atmosphere is improved.

[0090] Optionally, in some embodiments, the LED package structure 200 emits light only from the side, and the light-emitting angle can be reduced to within 90°.

[0091] In some embodiments, the surface of the bracket 110 on which the light-emitting units 120 are mounted serves as a bearing surface 113. A direction parallel to both the bearing surface 113 and the first side surface 126 serves as a first direction aa. Adjacent light-emitting units 120 do not overlap along the first direction aa. Therefore, light emitted from the first side surface 126 of a light-emitting unit 120 is not blocked by other light-emitting units 120, thereby ensuring the intensity and range of the emitted light.

[0092] Specifically in this embodiment, the at least one light emitting unit 120 is arranged along the first direction aa.

[0093] Optionally, the light-shielding structure 150 is a white glue layer or a black glue layer.

[0094] In some embodiments, the transparent adhesive layer 130 is provided with a first adhesive groove 131 adjacent to the first conversion structure 1211 and located on a side of the first conversion structure 1211 away from the corresponding blue light chip 120a. During the formation of the first conversion structure 1211, the first adhesive groove 131 can receive excess material, preventing the material forming the first conversion structure 1211 from flowing into other light-emitting units 120 and affecting the light-emitting color of the other light-emitting units 120.

[0095] In some embodiments, the transparent adhesive layer 130 is provided with a second adhesive groove 132 adjacent to the second conversion structure 1221 and located on a side of the second conversion structure 1221 away from the corresponding blue light chip 120a. During the formation of the second conversion structure 1221, the second adhesive groove 132 can receive excess material, preventing the material forming the second conversion structure 1221 from flowing into other light-emitting units 120 and affecting the light-emitting color of the other light-emitting units 120.

[0096] In some embodiments, the transparent adhesive layer 130 is provided with a third adhesive groove 133. This third adhesive groove 133 is located on one side of the light-transmitting area of ​​the blue light-emitting unit 123. Forming the third adhesive groove 133 simultaneously with the first adhesive groove 131 and the second adhesive groove 132 ensures a uniform distribution of adhesive grooves on the transparent adhesive layer, facilitating process implementation. It is understood that in other embodiments, the third adhesive groove 133 may not be provided.

[0097] See also Figure 5An LED packaging structure 300 provided in another embodiment of the present specification is different from the LED packaging structure 200 in that the blue light chip in the light-emitting unit 120 is tilted toward one side of the first side 126 to further adjust the light emitting direction of the light-emitting unit 120 to be further tilted toward the direction of the first side 126.

[0098] Specifically, optionally, the bracket 110 has a supporting surface 113 for arranging the light-emitting unit 120, and the position of the supporting surface 113 where the light-emitting unit 120 is arranged is inclined so that the light-emitting unit 120 is arranged obliquely toward one side of the first side surface 126. Of course, in other embodiments, a supporting structure may also be provided on the supporting surface 113 of the bracket 110 to support the side of the light-emitting unit 120 opposite to the first side surface 126, so that the light-emitting unit 120 is arranged obliquely toward one side of the first side surface 126.

[0099] In another feasible embodiment, the light-transmitting area 125 is not limited to including the first side surface 126. For example, Figure 6 and Figure 7 In the LED package structure 400 shown, the light-emitting unit 120 has a fourth side surface 129 disposed opposite the first side surface 126, a second side surface 127 and a third side surface 128 respectively connected to the first side surface 126 on both sides; the second side surface 127 and the third side surface 128 are disposed opposite each other; the light-transmitting area 125 includes the first side surface 126, a portion of the top surface, a portion of the second side surface 127, and a portion of the third side surface 128. The light-shielding area 124 includes the fourth side surface 129, a portion of the top surface, a portion of the second side surface 127, and a portion of the third side surface 128.

[0100] For example, in some other embodiments, the light-transmitting region 125 includes a first side surface 126 , a top surface, the second side surface 127 , and the third side surface 128 . The light-shielding region 124 includes a fourth side surface 129 .

[0101] Optionally, the light-transmitting area 125 is continuous, and the light emitted by the light-emitting unit 120 is continuous.

[0102] It is understandable that the configuration of the light-transmitting area 125 is limited to this, including at least a portion of the side surface of the light-emitting unit 120 and / or at least a portion of the top surface of the light-emitting unit 120 .

[0103] See also Figure 8Another embodiment of the present application provides an LED package structure 500. Unlike LED package structure 200, LED package structure 500 includes only one light-emitting unit 120. The light-transmitting area includes a first side surface 126, while the remaining outer surface is a light-shielding area. It is understood that in LED package structure 500, first side surface 126 can be any side surface of light-emitting unit 120. During use, LED package structure 500 can be positioned appropriately according to needs.

[0104] Of course, in some other embodiments, the light-transmitting area may also include at least a portion of one or two side surfaces adjacent to the first side surface 126, and / or the top surface. Figure 6 As shown, no further details are given here.

[0105] An embodiment of the present specification provides a light-emitting device, which includes a substrate and a plurality of LED package structures provided by any embodiment of the present specification; the plurality of LED package structures are arranged on the substrate.

[0106] Optionally, the substrate is a PCB board.

[0107] The aforementioned light-emitting device, by incorporating three different color light-emitting units—red, green, and blue—into an LED package, can be used to emit white light or achieve full-color display. Therefore, when white light or full-color display is required, a single LED package structure can be used, resulting in lower packaging costs.

[0108] An embodiment of the present specification provides a light-emitting device, including the light-emitting device provided in any embodiment of the present specification, or the LED packaging structure provided in any embodiment of the present specification.

[0109] The aforementioned light-emitting device, by incorporating three different color light-emitting units—red, green, and blue—into an LED package, can be used to emit white light or achieve a full-color display. Therefore, when white light or a full-color display is required, a single LED package structure can be used, resulting in lower packaging costs.

[0110] Optionally, the light-emitting device is a spotlight strip.

[0111] It can be understood that in the various embodiments in this specification, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this specification.

[0112] It can be understood that the various implementation methods described in this specification can be implemented individually or in combination, and the embodiments of this specification are not limited to this.

[0113] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described systems, devices and units can refer to the corresponding processes in the aforementioned method implementation methods and will not be repeated here.

[0114] The above description is merely a specific embodiment of this specification, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this specification should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An LED packaging structure, characterized in that: The LED packaging structure includes: Bracket; at least one light-emitting unit, the light-emitting unit being fixed on the bracket; the at least one light-emitting unit comprising a red light-emitting unit, a green light-emitting unit and / or a blue light-emitting unit; and A transparent adhesive layer completely covers the light-emitting unit and extends to cover at least a portion of the bracket; the thickness of the transparent adhesive layer falls within the range of 0.1 mm to 0.35 mm.

2. The LED packaging structure according to claim 1, wherein: The LED packaging structure further includes a packaging layer; the thickness of the packaging layer falls within the range of 0.2 mm to 0.5 mm.

3. The LED packaging structure according to claim 1, wherein: A conductive hole is provided on the bracket; a conductive member is provided in the conductive hole, and two ends of the conductive member are electrically connected to the electrode terminal of the light-emitting unit and the external circuit respectively.

4. The LED packaging structure according to claim 1, wherein: The outer surface of the light emitting unit includes a light-shielding area and a light-transmitting area; The LED packaging structure further includes a light-shielding structure, and the light-shielding structure covers the light-shielding area of ​​the light-emitting unit.

5. The LED packaging structure according to claim 4, characterized in that: The red light emitting unit includes a blue light chip and a first conversion structure; the first conversion structure is used to convert the light emitted by the blue light chip into red light.

6. The LED packaging structure according to claim 4, characterized in that: The green light emitting unit includes a blue light chip and a second conversion structure; the second conversion structure is used to convert the light emitted by the blue light chip into green light for emission.

7. The LED packaging structure according to claim 4, characterized in that: The blue light emitting unit includes a blue light chip.

8. The LED packaging structure according to claim 5, characterized in that: The first conversion structure is a red fluorescent glue layer.

9. The LED packaging structure according to claim 6, characterized in that: The second conversion structure is a green fluorescent glue layer.

10. The LED packaging structure according to claim 5, characterized in that: The at least one light-emitting unit includes a red light-emitting unit; in the red light-emitting unit, the first conversion structure covers the light-transmitting area.

11. The LED packaging structure according to claim 6, characterized in that: The at least one light-emitting unit includes a green light-emitting unit; in the green light-emitting unit, the second conversion structure covers the light-transmitting area.

12. The LED packaging structure according to claim 4, characterized in that: The outer surface of the light emitting unit includes a top surface and several side surfaces; the shading area includes at least a portion of at least a portion of the side surfaces of the light emitting unit and / or at least a portion of the top surface of the light emitting unit.

13. The LED packaging structure according to claim 12, wherein: The number of the light-emitting unit is one; the light-transmitting area includes at least one side surface of the light-emitting unit.

14. The LED packaging structure according to claim 13, characterized in that: The several side surfaces include a first side surface and a fourth side surface arranged opposite to each other, and a second side surface and a third side surface arranged opposite to each other; the second side surface and the third side surface are respectively connected to the two sides of the first side surface; the shading area includes the fourth side surface; the light-transmitting area includes the first side surface, at least part of the second side surface, and / or at least part of the third side surface.

15. The LED packaging structure according to claim 12, wherein: There are multiple light-emitting units; the bracket has a first side, and the side of the light-emitting unit facing the first side of the bracket is the first side; the light-transmitting area includes the first side.

16. The LED packaging structure according to claim 15, characterized in that: The several side surfaces include a fourth side surface arranged opposite to the first side surface, a second side surface and a third side surface arranged opposite to each other; the second side surface and the third side surface are respectively connected to the two sides of the first side surface; the shading area includes the fourth side surface; the shading area also includes at least part of the second side surface, and / or at least part of the third side surface.

17. The LED packaging structure according to any one of claims 13 to 16, characterized in that: The light-transmitting area is continuous.

18. The LED packaging structure according to claim 12, wherein: The light-emitting unit has a first side surface and a fourth side surface arranged opposite to each other, and a second side surface and a third side surface arranged opposite to each other; the second side surface and the third side surface are respectively connected to the two sides of the first side surface; the light-transmitting area includes the first side surface; the light-shielding area includes the second side surface, the third side surface, the fourth side surface and the top surface.

19. The LED packaging structure according to any one of claims 14 to 16, characterized in that: The light emitting unit is arranged to be inclined toward one side of the first side surface.

20. The LED packaging structure according to any one of claims 14 to 16, characterized in that: The surface of the bracket where the light emitting units are arranged is a bearing surface, and a direction parallel to both the bearing surface and the first side surface is a first direction; along the first direction, any two light emitting units do not overlap.

21. The LED packaging structure according to claim 20, characterized in that: The at least one light emitting unit is arranged along the first direction.

22. The LED packaging structure according to claim 12, wherein: The light-shielding structure is a white glue layer or a black glue layer.

23. The LED packaging structure according to claim 5, characterized in that: A first surrounding adhesive groove is provided on the transparent adhesive layer, adjacent to the first conversion structure and located on a side of the first conversion structure away from the blue light chip.

24. The LED packaging structure according to claim 6, characterized in that: A second surrounding adhesive groove is provided on the transparent adhesive layer, adjacent to the second conversion structure and located on a side of the second conversion structure away from the blue light chip.

25. A light emitting device, characterized in that: It comprises a substrate and several LED packaging structures according to any one of claims 1 to 24; the several LED packaging structures are arranged on the substrate.

26. A light emitting device, characterized in that: It comprises the light-emitting device according to claim 25, or the LED packaging structure according to any one of claims 1 to 24.

27. The light emitting device according to claim 26, characterized in that The light emitting device is a spotlight strip.

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