Battery pack

Abstract

The utility model discloses a battery pack, and belongs to the technical field of batteries. The battery pack comprises a relay, a busbar and a heat dissipation structure, the relay is provided with a contact, the busbar is electrically connected with the contact, the heat dissipation structure comprises a substrate and a plurality of heat dissipation pieces, and the substrate is connected with the busbar, so that heat on the busbar and the contact of the relay is transferred to the substrate and the heat dissipation pieces, the rapid heat dissipation effect on the relay is achieved, and the heat dissipation efficiency is improved. Therefore, the temperature of the busbar and the relay can be reduced. And the plurality of heat dissipation pieces are arranged on the side, away from the busbar, of the substrate at intervals, and extend from the substrate to the direction away from the busbar, so that the heat dissipation area is increased, and the heat dissipation efficiency is further improved.

Description

Technical Field

[0001] The present application belongs to the field of battery technology, and specifically relates to a battery pack. Background Art

[0002] Battery packs typically feature a battery disconnect unit (BDU), a power distribution box designed specifically for electric vehicle power batteries. It plays a crucial role in ensuring system safety by shutting off the internal current when an error occurs in the electric vehicle's power battery system. As battery charging rates increase, the heat generated by components like busbars and relays within the battery pack increases significantly, impacting the lifespan and safety of the components.

[0003] In the related art, increasing the busbar flow area is usually used to reduce resistance and thus reduce heat generation. However, this method cannot effectively reduce the temperature of the relay, and excessively high temperature can easily affect the performance of the relay. Utility Model Content

[0004] The present application aims to provide a battery pack that can solve the problem in related technologies that the method of increasing the copper busbar flow area to reduce resistance and thus reduce heat generation cannot effectively reduce the temperature of the relay, thereby affecting the performance of the relay.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a battery pack, comprising: a relay, a busbar, and a heat dissipation structure, wherein the relay is provided with contacts, and the busbar is electrically connected to the contacts;

[0007] The heat dissipation structure includes a substrate and a plurality of heat dissipation elements. The substrate is connected to the bus bar. The heat dissipation elements are spaced apart on a side of the substrate away from the bus bar. The heat dissipation elements extend from the substrate toward a direction away from the bus bar.

[0008] Optionally, a plurality of heat dissipating elements are arranged in rows at intervals on the substrate;

[0009] And / or, a plurality of the heat dissipating elements are arranged in an array.

[0010] Optionally, the heat dissipating elements in two adjacent rows are staggered;

[0011] Alternatively, two adjacent rows of heat dissipating elements are aligned.

[0012] Optionally, an extension direction of the heat sink forms an angle α with the surface of the substrate, and the angle α satisfies: 45°≤α≤90°.

[0013] Optionally, along the extension direction of the heat dissipation element, the cross-sectional area of ​​the heat dissipation element gradually decreases.

[0014] Optionally, the thickness d of the substrate satisfies: 0.1 mm ≤ d ≤ 30 mm;

[0015] And / or, a dimension h of the heat sink along its extension direction satisfies: 0.1 mm ≤ h ≤ 500 mm.

[0016] Optionally, the thermal conductivity coefficient λ of the heat dissipation structure satisfies: λ≥40W / (m·K).

[0017] Optionally, along the extension direction of the heat sink, the orthographic projections of the substrate and the contact on the busbar at least partially overlap.

[0018] Optionally, the relay is provided with at least two contacts, the number of the busbars is at least two, each of the contacts is electrically connected to one of the busbars, and each of the busbars is provided with the heat dissipation structure.

[0019] Optionally, the substrate is provided with a heat conducting portion at a position corresponding to each of the heat dissipating elements, and the heat dissipating elements are connected to the heat conducting portion.

[0020] In an embodiment of the present application, a battery pack includes a relay, a busbar, and a heat dissipation structure. The relay has contacts, and the busbar is electrically connected to the contacts. The heat dissipation structure includes a substrate and a plurality of heat sinks. The substrate is connected to the busbar, and the heat sinks are disposed on the substrate to transfer heat from the busbar and relay contacts to the substrate and heat sinks, thereby rapidly dissipating heat from the relay and reducing the temperature of the busbar and relay. Furthermore, the heat sinks are spaced apart on a side of the substrate facing away from the busbar, extending from the substrate away from the busbar, thereby increasing the heat dissipation area and further improving heat dissipation efficiency.

[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 is a schematic diagram of a battery pack according to an embodiment of the present application;

[0024] Figure 2 is a schematic diagram of a battery pack from another perspective according to an embodiment of the present application;

[0025] Figure 3is a cross-sectional view along line AA according to an embodiment of the present application;

[0026] Figure 4 is a schematic diagram of another battery pack according to an embodiment of the present application;

[0027] Figure 5 is a schematic diagram of another battery pack according to an embodiment of the present application.

[0028] Reference numerals:

[0029] 10: relay; 11: contact; 20: busbar; 21: through hole; 30: heat dissipation structure; 31: substrate; 311: mounting hole; 32: heat sink; X: extension direction of the heat sink; α: angle between the extension direction of the heat sink and the substrate surface; d: substrate thickness; h: extension dimension of the heat sink; w: outer diameter of the heat sink. DETAILED DESCRIPTION

[0030] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0031] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0032] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0034] Below, in conjunction with the accompanying drawings, a battery pack provided in an embodiment of the present application is described in detail through specific embodiments and application scenarios.

[0035] like Figure 1 As shown, the battery pack according to some embodiments of the present application includes: a relay 10, a bus 20 and a heat dissipation structure 30, the relay 10 is provided with a contact 11, and the bus 20 is electrically connected to the contact 11; the heat dissipation structure 30 includes a substrate 31 and a plurality of heat dissipation members 32, the substrate 31 is connected to the bus 20, and the plurality of heat dissipation members 32 are arranged at intervals on the side of the substrate 31 away from the bus 20, and the heat dissipation members 32 extend from the substrate 31 toward a direction away from the bus 20.

[0036] In the embodiment of the present application, the battery pack includes a relay 10, a busbar 20, and a heat dissipation structure 30. The relay 10 is provided with a contact 11, and the busbar 20 is electrically connected to the contact 11. The heat dissipation structure 30 includes a substrate 31 and a plurality of heat sinks 32. The substrate 31 is connected to the busbar 20, thereby transferring heat from the busbar 20 and the contact 11 of the relay 10 to the substrate 31 and the heat sinks 32, achieving rapid heat dissipation for the relay 10, thereby reducing the temperature of the busbar 20 and the relay 10. In addition, the plurality of heat sinks 32 are spaced apart on the side of the substrate 31 facing away from the busbar 20. The heat sinks 32 extend from the substrate 31 in a direction away from the busbar 20, thereby increasing the heat dissipation area and further improving heat dissipation efficiency.

[0037] In specific applications, the heat sink 32 is made of a high thermal conductivity material, including but not limited to: aluminum nitride, silicon carbide, graphite, copper, tungsten, platinum, aluminum, etc. Those skilled in the art can choose according to their needs, and this application does not impose any restrictions on this.

[0038] Preferably, the heat sink 32 can be made of aluminum, which can meet certain thermal conductivity requirements while being more cost-effective.

[0039] It can be understood that the number of heat sinks 32 is determined based on the surface area of ​​the side of the substrate 31 facing away from the relay 10 and the spacing between adjacent heat sinks 32, so as to ensure that the heat sinks 32 can be spread all over the side of the substrate 31 facing away from the relay 10, and that adjacent heat sinks 32 do not contact each other, so that heat can have enough space to escape.

[0040] Specifically, in the battery pack, the temperature of the relay 10 is relatively high, so a heat dissipation structure 30 is provided on the bus 20 connected to the contact 11 of the circuit breaker 10, so as to facilitate direct heat conduction of the relay 10 to the heat dissipation structure through heat conduction, thereby reducing the temperature of the relay 10.

[0041] It can be understood that heat transfer generally takes three forms: conduction, convection, and radiation. Conduction is the transfer of heat from the hotter part of an object to the cooler part along the object, and is the primary method of heat transfer in solids. Convection is the transfer of heat through a flowing substance (such as a liquid or gas). Radiation is the emission of heat from an object, without the need for a medium. In the battery pack, to improve heat transfer across the relay 10, on the one hand, a substrate 31 is in direct contact with the bus 20, thereby conducting heat away from the relay 10. On the other hand, a heat sink 32 extending away from the bus 20 is provided on the substrate 31, thereby increasing the heat dissipation area of ​​the heat dissipation structure 30. The gaps between adjacent heat sinks 32 form airflow channels, which enhance convection within the heat dissipation structure 30 and further improve heat dissipation efficiency.

[0042] like Figure 1-5 As shown, in some embodiments of the present application, a plurality of heat dissipating elements 32 are arranged in rows at intervals on the substrate 31 .

[0043] In the embodiment of the present application, a plurality of heat sinks 32 are arranged in rows on the substrate 31, thereby increasing the heat dissipation area and allowing heat to pass through the gaps between two adjacent rows of heat sinks 32 and be carried away by the air, thereby further improving the heat dissipation efficiency.

[0044] In specific applications, a cooling fan is generally provided in the battery pack to form a cooling airflow inside the battery pack. A plurality of heat sinks 32 are arranged in rows on the substrate 31 to form an airflow channel between two adjacent rows of heat sinks 32, so that the cooling airflow can take away the heat of the heat sink 32 and improve the heat dissipation efficiency.

[0045] In some embodiments of the present application, a plurality of heat dissipating elements 32 are arranged in an array.

[0046] In the embodiment of the present application, a plurality of heat dissipating elements 32 are arranged in an array, so that the space on the substrate 31 can be fully utilized, the heat dissipation area can be further increased, and the heat dissipation efficiency can be improved.

[0047] It is understood that the heat sinks 32 are arranged in an array, specifically on the side of the substrate 31 facing away from the busbar 20. The heat sinks 32 can be arranged in a rectangular array, a hexagonal array, or a circular array, etc., to fully utilize the surface of the substrate 31, increase the number of heat sinks 32, and thereby improve the heat dissipation area and heat dissipation efficiency. Those skilled in the art can make these arrangements based on actual needs, and this application does not impose any restrictions on this.

[0048] like Figure 4 As shown, in some embodiments of the present application, two adjacent rows of heat dissipation elements 32 are staggered.

[0049] In the embodiment of the present application, two adjacent rows of heat sinks 32 are staggered so that the cooling airflow passing through the heat sinks 32 forms turbulent flow, making it easier to remove heat.

[0050] like Figure 2 As shown, in some embodiments of the present application, two adjacent rows of heat dissipation elements 32 are aligned.

[0051] In the embodiment of the present application, two adjacent rows of heat sinks 32 are aligned to form a stable gas channel, so that the cooling airflow can pass smoothly, thereby increasing the flow rate of the cooling airflow and further improving the heat dissipation efficiency.

[0052] like Figure 3 As shown, in some embodiments of the present application, the extension direction X of the heat sink 32 forms an angle α with the surface of the substrate 31 , and the angle α satisfies: 45°≤α≤90°.

[0053] In the embodiment of the present application, by forming an angle α between the extension direction X of the heat sink 32 and the surface of the substrate 31, the heat sink 32 can be made longer. In other words, the heat sink 32 has a larger heat dissipation area, thereby improving heat dissipation efficiency. At the same time, if the angle α is too small, the distance between some heat sinks 32 and the substrate 31 is too small, which is not conducive to heat dissipation. If the angle α is too large, the heat dissipation area of ​​the heat sink 32 is limited, which is not conducive to improving heat dissipation efficiency.

[0054] It can be understood that the extension direction X of the heat sink 32 is also the stacking direction of the relay 10 , the busbar 20 and the substrate 31 , so that the heat sink 32 has a larger extension space.

[0055] Exemplarily, the angle α between the extension direction X of the heat sink 32 and the surface of the substrate 31 can be set to any angle such as 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, 90°, or a range between any two angles.

[0056] It should be noted that the specific value of the angle α between the extension direction X of the heat sink 32 and the surface of the substrate 31 can be set according to the size of the heat sink 32 along the extension direction X and the internal space of the battery pack, and this application does not impose any restrictions on this.

[0057] like Figure 3 As shown, in some embodiments of the present application, along the extension direction X of the heat dissipation element 32 , the cross-sectional area of ​​the heat dissipation element 32 gradually decreases.

[0058] In the embodiment of the present application, the cross-sectional area of ​​the heat sink 32 gradually decreases along the extension direction X of the heat sink 32, so that the contact area between the heat sink 32 and the substrate 31 is larger, which is more conducive to heat conduction; and along the extension direction X, the heat sink 32 is in a "small at the top and large at the bottom" shape, so that the spacing between adjacent heat sinks 32 along the extension direction X of the heat sink 32 is different, so that the cooling air flow flowing through forms turbulence, which makes it easier to take away heat.

[0059] In specific applications, such as Figure 5 As shown, the cross-section of the heat sink 32 along the extension direction X can be circular or polygonal, such as a quadrilateral, a pentagon, etc., and those skilled in the art can choose according to their needs, and this application does not impose any restrictions on this.

[0060] like Figure 2 As shown, in some embodiments of the present application, when the cross-section of the heat sink 32 is circular, its diameter W is 0.1 mm to 10 mm. Similarly, when the cross-section of the heat sink 32 is quadrilateral, its side length W is 0.1 mm to 10 mm. If the diameter (or side length) W of the heat sink 32 is too small, the heat dissipation area of ​​a single heat sink 32 is too small, which is not conducive to heat dissipation; if the diameter (or side length) W of the heat sink 32 is too large, the heat dissipation area of ​​the entire heat dissipation structure 30 is too small, which is also not conducive to heat dissipation.

[0061] It can be understood that the diameter (or side length) W of the heat sink 32 can be set to any value such as 0.1mm, 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, or a range between any two values.

[0062] It should be noted that the specific value of the diameter (or side length) W of the heat sink 32 can be set according to the spacing between adjacent heat sinks 32 and the surface area of ​​the substrate 31, and this application does not impose any restrictions thereon.

[0063] like Figure 3 As shown, in some embodiments of the present application, the thickness d of the substrate 31 satisfies: 0.1 mm ≤ d ≤ 30 mm.

[0064] In the embodiment of the present application, by setting the specific size of the thickness d of the substrate 31, it is avoided that when the thickness d of the substrate 31 is too small, the heat dissipation area of ​​the substrate 31 itself is too small; at the same time, it is avoided that when the thickness d of the substrate 31 is too large, the size of the heat dissipation member 32 is too small, which is not conducive to heat dissipation.

[0065] It can be understood that the thickness d of the substrate 31 can be set to any value such as 0.1 mm, 1 mm, 5 mm, 8 mm, 10 mm, 15 mm, 18 mm, 20 mm, 25 mm, 28 mm, 30 mm, or a range between any two values.

[0066] It should be noted that the thickness d of the substrate 31 can be determined according to the structural dimensions of the internal space of the battery pack, and this application does not impose any limitation thereto.

[0067] like Figure 3 As shown, in some embodiments of the present application, the dimension h of the heat dissipation element 32 along its extension direction X satisfies: 0.1 mm≤h≤500 mm.

[0068] In the embodiment of the present application, by setting the dimension h of the heat sink 32 along its extension direction X, it is avoided that when the dimension h of the heat sink 32 is too small, the heat dissipation area of ​​the heat sink 32 itself is too small; at the same time, it is avoided that when the dimension h of the heat sink 32 is too large, the heat conduction efficiency between the substrate 31 and the bus 20 is too low, which is not conducive to heat dissipation.

[0069] Specifically, the dimension h of the heat dissipation element 32 along the extending direction X thereof refers to the length of the center line of the heat dissipation element 32 in the extending direction X thereof.

[0070] It should be noted that the specific value of the dimension h of the heat sink 32 along its extension direction X can be set according to the thickness d of the substrate 31, the internal space of the battery pack and the height of the relay 10, and this application does not impose any restrictions here.

[0071] In some embodiments of the present application, the thermal conductivity λ of the heat dissipation structure 30 satisfies: λ≥40 W / (m·K).

[0072] In the embodiment of the present application, the heat dissipation efficiency of the heat dissipation structure 30 is ensured by setting the thermal conductivity λ of the heat dissipation structure 30 to satisfy: λ≥40W / (m·K).

[0073] It can be understood that the thermal conductivity λ of the heat dissipation structure 30 can be set to: 40W / (m·K), 80W / (m·K), 120W / (m·K), 160W / (m·K), 200W / (m·K), 240W / (m·K), 280W / (m·K), 320W / (m·K), 360W / (m·K), 400W / (m·K), 440W / (m·K) or any other value or a range between any two values.

[0074] Specifically, the thermal conductivity λ of the heat dissipation structure 30 depends on the materials of the substrate 31 and the heat dissipation element 32 . For example, when the substrate 31 and the heat dissipation element 32 are both made of aluminum, the thermal conductivity λ of the heat dissipation structure 30 is 237 W / (m·K).

[0075] In some embodiments of the present application, along the extension direction X of the heat dissipation element 32 , the orthographic projections of the substrate 31 and the contacts 11 on the busbar 20 at least partially overlap.

[0076] In the embodiment of the present application, along the extension direction X of the heat sink 32, the orthographic projection of the substrate 31 on the bus 20 and the orthographic projection of the contact 11 of the relay 10 on the bus 20 at least partially overlap, so that the heat generated by the contact 11 of the relay 10 can be transferred to the substrate 31 via a shorter path, thereby improving the heat dissipation efficiency.

[0077] In specific applications, the contacts 11 of the relay 10 form a heat-covered area that spreads around the contacts 11. The temperature decreases as the heat-covered area spreads. Therefore, the greater the overlap between the orthographic projection of the substrate 31 and the orthographic projection of the contacts 11 of the relay 10, the greater the overlap between the heat-covered areas of the substrate 31 and the contacts 11 of the relay 10. This allows for more direct heat conduction, shortens the heat transfer path, and improves heat dissipation efficiency.

[0078] In some embodiments of the present application, a through hole 21 is provided on the bus 20 at a position corresponding to the contact 11 of the relay 10, and a corresponding mounting hole 311 is provided on the substrate 31, so that the contact 11 of the relay 10 can be screwed to the bus 20 and the substrate 31, thereby improving the installation convenience of the battery pack.

[0079] In a specific application, the diameters of the through hole 21 and the mounting hole 311 are the same, which facilitates installation.

[0080] like Figure 1-Figure 5 As shown, in some embodiments of the present application, the relay 10 is provided with at least two contacts 11 , the number of bus bars 20 is at least two, each contact 11 is electrically connected to a bus bar 20 , and each bus bar 20 is provided with a heat dissipation structure 30 .

[0081] In the embodiment of the present application, each contact 11 is electrically connected to a bus bar 20 , and each bus bar 20 is provided with a heat dissipation structure 30 , thereby further increasing the heat dissipation area of ​​the relay 10 and thereby improving the heat dissipation efficiency.

[0082] In specific applications, the number of contacts 11 of the relay 10 is determined according to the actual model of the relay. A bus 20 and a heat dissipation structure 30 are provided on the contacts 11 where electrical connection actually occurs, which can conduct the heat generated by each contact 11 where electrical connection occurs, so as to reduce the temperature of the relay 10 and avoid damage to the relay 10.

[0083] like Figure 3 As shown, in some embodiments of the present application, the substrate 31 is provided with a heat conducting portion (not shown in the figure) at a position corresponding to each heat sink 32, and the heat sink 32 is connected to the heat conducting portion.

[0084] In the embodiment of the present application, a heat conducting portion is provided on the substrate 31 at a position corresponding to each heat sink 32, and the heat sink 32 is connected to the heat conducting portion. This can further improve the heat conduction efficiency between the heat sink 32 and the substrate 31. In addition, the heat dissipation area can be increased, thereby improving the heat dissipation efficiency.

[0085] In a specific application, the heat conducting portion is attached to the substrate 31 , so that heat is conducted from the substrate 31 to the heat conducting portion, and then transferred to the heat sink 32 through the heat conducting portion.

[0086] Specifically, the heat sink 32 is generally a hollow structure. Under this structure, the contact area between the heat sink 32 and the substrate 31 is small, and heat conduction cannot be performed well. Therefore, adding a heat conducting part improves the efficiency of heat conduction.

[0087] In some embodiments of the present application, the heat sink 32 is at least partially embedded in the heat conducting portion, thereby increasing the direct contact area between the heat sink 32 and the substrate 31, thereby increasing the heat conduction transfer area and improving the heat dissipation efficiency.

[0088] In some embodiments of the present application, the battery pack further includes a plurality of busbars, which are electrically connected to components other than the relay 10 , and each busbar is provided with a heat dissipation structure 30 .

[0089] In the embodiment of the present application, in addition to the bus 20 that is directly electrically connected to the relay 10, the battery pack is also provided with busbars that are electrically connected between other components, and a heat dissipation structure 30 is provided on each busbar, thereby increasing the heat dissipation area of ​​the entire battery pack and further improving the heat dissipation efficiency of the entire battery pack.

[0090] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0091] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A battery pack, characterized in that: include: A relay (10), a busbar (20) and a heat dissipation structure (30), wherein the relay (10) is provided with a contact (11), and the busbar (20) is electrically connected to the contact (11); The heat dissipation structure (30) comprises a substrate (31) and a plurality of heat dissipation elements (32); the substrate (31) is connected to the busbar (20); the plurality of heat dissipation elements (32) are arranged at intervals on a side of the substrate (31) away from the busbar (20); and the heat dissipation elements (32) extend from the substrate (31) in a direction away from the busbar (20).

2. The battery pack according to claim 1, wherein: A plurality of heat dissipating elements (32) are arranged in a row at intervals on the substrate (31); And / or, a plurality of the heat dissipating elements (32) are arranged in an array.

3. The battery pack according to claim 2, wherein: The heat dissipating elements (32) in two adjacent rows are staggered; Alternatively, two adjacent rows of heat dissipating elements (32) are aligned.

4. The battery pack according to claim 1, wherein: The extension direction (X) of the heat sink (32) forms an included angle α with the surface of the substrate (31), and the included angle α satisfies: 45°≤α≤90°.

5. The battery pack according to claim 1, wherein: Along the extension direction (X) of the heat dissipation element (32), the cross-sectional area of ​​the heat dissipation element (32) gradually decreases.

6. The battery pack according to claim 1, wherein: The thickness d of the substrate (31) satisfies: 0.1 mm ≤ d ≤ 30 mm; And / or, the dimension h of the heat sink (32) along its extension direction (X) satisfies: 0.1 mm ≤ h ≤ 500 mm.

7. The battery pack according to claim 1, wherein: The thermal conductivity coefficient λ of the heat dissipation structure (30) satisfies: λ≥40W / (m·K).

8. The battery pack according to claim 1, wherein: Along the extension direction (X) of the heat sink (32), the substrate (31) and the orthographic projection of the contact (11) on the busbar (20) at least partially overlap.

9. The battery pack according to claim 1, wherein: The relay (10) is provided with at least two contacts (11), the number of the busbars (20) is at least two, each of the contacts (11) is electrically connected to one of the busbars (20), and each of the busbars (20) is provided with the heat dissipation structure (30).

10. The battery pack according to any one of claims 1 to 9, characterized in that: The base plate (31) is provided with a heat conducting portion at a position corresponding to each heat dissipating element (32), and the heat dissipating element (32) is connected to the heat conducting portion.

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