Flexible circuit board and display device

Abstract

The utility model provides a flexible circuit board and a display device, the flexible circuit board comprises a main body area and a binding area located at one side of the main body area, and the flexible circuit board further comprises a first wiring layer and at least two second wiring layers; the first wiring layer comprises a plurality of first signal lines located in the main body area and a plurality of binding terminals located in the binding area, and the binding terminals are electrically connected with the first signal lines respectively; the at least two second wiring layers are located on the same side of the first wiring layer, the at least two second wiring layers comprise a plurality of second signal lines, and orthographic projections of the second signal lines on the first wiring layer are overlapped with the binding terminals.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a flexible circuit board and a display device. Background Art

[0002] With the development of active-matrix organic light emitting diode (AMOLED) display technology, higher requirements are being placed on the overall thickness and size of AMOLED display devices. Among them, the size of flexible circuit boards is also required to be smaller and smaller. Multi-layer flexible printed circuits (MFPC) are widely used because they can compress the wiring space to a smaller size. However, the wiring space layout in related technologies is unreasonable, resulting in an increase in overall size and cost.

[0003] The above information disclosed in this section is only for understanding the background of the inventive concept of the present disclosure and therefore the above information may contain information that does not constitute prior art. Utility Model Content

[0004] In one aspect, a flexible circuit board is provided, comprising a main body area and a binding area located on one side of the main body area, the flexible circuit board also comprising a first routing layer and at least two second routing layers; the first routing layer comprises a plurality of first signal lines located in the main body area and a plurality of binding terminals located in the binding area, the plurality of binding terminals being electrically connected to the first signal lines, respectively; the at least two second routing layers are located on the same side of the first routing layer, the at least two second routing layers comprise a plurality of second signal lines, and the orthographic projections of the second signal lines on the first routing layer overlap with the binding terminals.

[0005] According to some exemplary embodiments, the second routing layer located in the binding region and closest to the first routing layer is connected to a common reference voltage.

[0006] According to some exemplary embodiments, the flexible circuit board also includes a first protective layer, which is located on a side of the first routing layer away from the second routing layer, and the first protective layer is connected to the first routing layer through a first adhesive layer, and the orthographic projections of the first protective layer and the first adhesive layer on the first routing layer do not overlap with the multiple binding terminals.

[0007] According to some exemplary embodiments, the flexible circuit board further includes a driving device, and the driving device is connected to the first routing layer, or connected to the second routing layer farthest from the first routing layer.

[0008] According to some exemplary embodiments, the flexible circuit board further includes a first alignment mark, which is located in the binding area, and the orthographic projections of the multiple binding terminals and the multiple second signal lines on the layer where the first alignment mark is located do not overlap with the first alignment mark.

[0009] According to some exemplary embodiments, the first alignment mark is provided on the same layer as the first routing layer and any one of the at least two second routing layers.

[0010] According to some exemplary embodiments, the first alignment mark includes at least two sub-marks; and the direction from the main area to the binding area is a first direction, and in a direction perpendicular to the first direction, the orthographic projections of the at least two sub-marks on the first routing layer are respectively located on both sides of the multiple binding terminals.

[0011] According to some exemplary embodiments, the first alignment mark includes at least two sub-marks, and the orthographic projections of at least two of the sub-marks on the first routing layer are located on the same side of the multiple binding terminals; and the distance between two adjacent sub-marks is a first value, and the shortest distance between the orthographic projections of the at least two sub-marks on the first routing layer and the multiple binding terminals is a second value, and the ratio of the first value to the second value is greater than 0 and less than or equal to 0.5.

[0012] In another aspect, a display device is provided. The display device includes a display panel and the flexible circuit board as described above, wherein a plurality of binding terminals of the flexible circuit board are connected to the display panel.

[0013] According to some exemplary embodiments, the flexible circuit board includes a first alignment mark, the display panel is provided with a second alignment mark, and an orthographic projection of the second alignment mark on the flexible circuit board overlaps with the first alignment mark. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Other objects and advantages of the present disclosure will become apparent from the following description of the present disclosure with reference to the accompanying drawings, which will help to provide a comprehensive understanding of the present disclosure.

[0015] Figure 1a and Figure 1b The front view and side view of a flexible circuit board in the related art are schematically shown.

[0016] Figure 2 Schematically illustrates a side view of a flexible circuit board according to some embodiments of the present disclosure.

[0017] Figure 3 Schematically shows a front view of a flexible circuit board according to some embodiments of the present disclosure.

[0018] Figure 4 The figure schematically shows a side view of a flexible circuit board according to some other embodiments of the present disclosure.

[0019] Figure 5 The figure schematically shows a wiring diagram of the first routing layer according to some embodiments of the present disclosure.

[0020] Figure 6 The figure schematically shows a wiring diagram of the first routing sub-layer according to some embodiments of the present disclosure.

[0021] Figure 7 The figure schematically shows a wiring diagram of the second routing sub-layer according to some embodiments of the present disclosure.

[0022] Figure 8 The figure schematically shows a wiring diagram of the third routing sub-layer according to some embodiments of the present disclosure.

[0023] Figure 9 The figure schematically shows a structural diagram of a display device according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0024] In the following description, for purposes of explanation, numerous specific details are set forth to provide a comprehensive understanding of the various exemplary embodiments. However, it is apparent that the various exemplary embodiments can be implemented without these specific details or with one or more equivalent arrangements. Furthermore, the various exemplary embodiments can be different, but not necessarily exclusive. For example, the specific shapes, configurations, and features of an exemplary embodiment can be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0025] In the accompanying drawings, for the purpose of clarity and / or description, the size and relative size of the elements may be exaggerated. Thus, the size and relative size of each element are not necessarily limited to the size and relative size shown in the drawings. In addition, the same reference numerals represent the same elements.

[0026] When an element is described as being “on”, “connected to” or “coupled to” another element, the element may be directly on, directly connected to or directly coupled to the other element, or there may be intervening elements. However, when an element is described as being “directly on”, “directly connected to” or “directly coupled to” another element, there are no intervening elements. Other terms and / or expressions used to describe the relationship between elements should be interpreted in a similar manner, for example, “between” versus “directly between,” “adjacent” versus “directly adjacent,” or “on” versus “directly on,” etc. Additionally, the term “connected” may refer to a physical connection, an electrical connection, a communicative connection, and / or a fluid connection.

[0027] It should be understood that although the terms first, second, etc. may be used herein to describe different elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, a first element may be named a second element, and similarly, a second element may be named a first element without departing from the scope of the exemplary embodiments.

[0028] Figure 1a and Figure 1b 1. The front view and side view of a flexible circuit board in the related art.

[0029] Reference Figure 1a and Figure 1b , specifically, Figure 1b yes Figure 1a In the related art, the flexible circuit board includes a binding area A1, such as Figure 1a As shown, in the X direction, the binding area A1 is located on one side of the flexible circuit board. The flexible circuit board also includes a binding layer 1 and multiple other wiring layers 2. The multiple other wiring layers 2 are respectively located on opposite sides of the binding layer 1, for example Figure 1b As shown, one other wiring layer 2 is located on the left side of the binding layer 1, and two other wiring layers 2 are located on the right side of the binding layer 1. Since the binding layer 1 needs to be bound to the display panel in the binding area A1, specifically, the binding layer 1 in the binding area A1 needs to be exposed (for example, Figure 1bThe left side of the binding layer 1 shown is exposed), thereby binding to the display panel. Therefore, the other wiring layers 2 of the flexible circuit board need to be removed in the binding area A1, and only the binding layer 1 is retained. In the X direction, the minimum height of the binding area A1 is 3.35 mm. The other wiring layers 2 cannot be routed in the binding area A1, resulting in the inability to further compress the size of the flexible circuit board, resulting in high production costs for the flexible circuit board. Therefore, in order to solve at least one aspect of the above-mentioned technical problems, the embodiments of the present disclosure provide a flexible circuit board and a display device, which are conducive to reducing the overall size of the flexible circuit board and reducing costs.

[0030] Figure 2 is a side view of a flexible circuit board according to some embodiments of the present disclosure. Figure 3 is a front view of a flexible circuit board according to some embodiments of the present disclosure.

[0031] Reference Figure 2 and Figure 3 , specifically, Figure 2 yes Figure 3 The right side view of the flexible circuit board is shown. The flexible circuit board includes a main body area A2 and a binding area A1 located to one side of the main body area A2. The flexible circuit board also includes a first routing layer 10, at least two second routing layers 20, and a first alignment mark 30. The first routing layer 10 includes multiple first signal lines 101 located within the main body area A2 and multiple binding terminals 102 located within the binding area A1. The multiple binding terminals 102 are electrically connected to the first signal lines 101. At least two second routing layers 20 are located on the same side of the first routing layer 10. The at least two second routing layers 20 include multiple second signal lines 21. The orthographic projections of the second signal lines 21 on the first routing layer 10 overlap with the binding terminals 102. The first alignment mark 30 is located in the binding area A1. The orthographic projections of the multiple binding terminals 102 and the multiple second signal lines 21 on the layer containing the first alignment mark 30 do not overlap with the first alignment mark 30.

[0032] It should be noted that the flexible circuit board provided in the embodiment of the present disclosure includes at least three routing layers, namely a first routing layer 10 and at least two second routing layers 20 . Figure 2 In the description, a flexible circuit board including a first wiring layer 10 and three second wiring layers 20 is taken as an example.

[0033] It is understood that in this embodiment, the plurality of binding terminals 102 are located in the first wiring layer 10. By arranging at least two second wiring layers 20 on the same side of the first wiring layer 10, it is possible to avoid the at least two second wiring layers 20 from blocking the plurality of binding terminals 102. That is, the plurality of binding terminals 102 can be exposed away from the side of the second wiring layer 20, thereby being aligned with the display panel 700 (see FIG. Figure 9) binding, so that multiple second signal lines 21 of at least two second wiring layers 20 can be set in the binding area A1, which is equivalent to expanding the wiring space of the second wiring layer 20. Therefore, the overall size of the flexible circuit board can be reduced, the cost is saved, and it is beneficial to the overall structure design.

[0034] It can be understood that, in this embodiment, by making the orthographic projection of the second signal line 21 on the first wiring layer 10 overlap with the binding terminal 102, that is, perpendicular to Figure 3 In the direction of the front view of the flexible circuit board shown, a second signal line 21 is arranged above the binding terminal 102, thereby achieving the effect of expanding the wiring space of the second wiring layer 20. Therefore, the overall size of the flexible circuit board can be reduced, cost can be saved, and it is beneficial to the overall structural design.

[0035] like Figure 3 As shown, a first alignment mark 30 is also provided within the binding area A1 of the flexible circuit board. When the display panel 700 is bonded to the flexible circuit board, the first alignment mark 30 on the flexible circuit board is identified through a camera image to facilitate alignment. It is understood that camera photography requires lighting. If a metal layer other than the first alignment mark 30 remains within the area A12 where the first alignment mark 30 is located, light will not penetrate, resulting in camera recognition errors and misalignment. In this embodiment, by ensuring that the orthographic projections of the multiple binding terminals 102 and the multiple second signal lines 21 on the layer where the first alignment mark 30 reside do not overlap with the first alignment mark 30, that is, by eliminating the binding terminals 102 and the multiple second signal lines 21 within the area A12 where the first alignment mark 30 is located, the multiple binding terminals 102 and the multiple second signal lines 21 can be prevented from obstructing the first alignment mark 30. This prevents the camera from capturing images with any clarity, and thus does not affect the alignment operation during the bonding process.

[0036] It should be noted that the layer where the first alignment mark 30 is located can be the first routing layer 10 or any layer of the at least two second routing layers 20, as long as there is no binding terminal 102 or other routing obstruction in the setting area A12 of the first alignment mark 30.

[0037] It is understandable that in this embodiment, the overall size of the flexible circuit board can be reduced without affecting the alignment of the display panel 700 and the flexible circuit board, thereby saving costs and facilitating the overall structural design.

[0038] In some embodiments of the present disclosure, the second routing layer 20 located in the binding area A1 and closest to the first routing layer 10 is connected to the common reference voltage.

[0039] It is understood that in this embodiment, by connecting the second routing layer 20 closest to the first routing layer 10 to a common reference voltage in the binding area A1, signal interference caused by the multiple binding terminals 102 of the first routing layer 10 to other second routing layers 20 in the binding area A1 can be avoided. The common reference voltage is, for example, a ground voltage (GND).

[0040] In some embodiments of the present disclosure, the flexible circuit board also includes a first protective layer 40, which is located on the side of the first routing layer 10 away from the second routing layer 20. The first protective layer 40 is connected to the first routing layer 10 through a first adhesive layer 41. The orthographic projections of the first protective layer 40 and the first adhesive layer 41 on the first routing layer 10 do not overlap with the multiple binding terminals 102.

[0041] It is understood that in this embodiment, the first wiring layer 10 can be protected by providing a first protective layer 40. The material of the first protective layer 40 is, for example, polyimide (abbreviated as P1). The first protective layer 40 is connected to the first wiring layer 10 via a first adhesive layer 41. The first adhesive layer 41 is, for example, an adhesive (abbreviated as ADH).

[0042] It is understood that since the side of the multiple binding terminals 102 away from the second wiring layer 20 is to be bound to the display panel 700, the first protective layer 40 and the first adhesive layer 41 above the multiple binding terminals 102 must be removed. In this embodiment, by ensuring that the orthographic projections of the first protective layer 40 and the first adhesive layer 41 on the first wiring layer 10 do not overlap with the multiple binding terminals 102, the first protective layer 40 and the first adhesive layer 41 can be prevented from blocking the multiple binding terminals 102, thereby preventing the binding process from being affected.

[0043] It should be noted that when the first protective layer 40 and the first adhesive layer 41 are made of translucent materials, the first protective layer 40 and the first adhesive layer 41 located in the setting area A12 of the first alignment mark 30 can be retained; when the transmittance of the first protective layer 40 and the first adhesive layer 41 will affect the clarity of the camera photo, the first protective layer 40 and the first adhesive layer 41 located in the setting area A12 of the first alignment mark 30 need to be removed.

[0044] like Figure 2 As shown, in some embodiments of the present disclosure, the flexible circuit board further includes a driving device 51 , and the driving device 51 is connected to the second wiring layer 20 farthest from the first wiring layer 10 .

[0045] It should be noted that the side where the driving device 51 is set is the front side of the flexible circuit board, that is, the exposed side of the plurality of binding terminals 102 of the first wiring layer 10 is the back side of the flexible circuit board, that is, Figure 2The flexible circuit board shown is a back-bound structure, wherein the driving device 51 is fixed to the second wiring layer 20 farthest from the first wiring layer 10 via a first adhesive layer 52 .

[0046] Continue to refer to Figure 2 and Figure 3 In some embodiments of the present disclosure, the first alignment mark 30 is provided on the same layer as the first routing layer 10 and any one of the at least two second routing layers 20. That is, the first alignment mark 30 can be formed in the same process as the first routing layer 10, or in the same process as any one of the at least two second routing layers 20. This saves a process for forming the first alignment mark 30.

[0047] like Figure 3 As shown, in some embodiments of the present disclosure, the first alignment mark 30 includes at least two sub-marks 301. The direction from the main area A2 to the binding area A1 is a first direction X. In a direction perpendicular to the first direction X (the Y direction), the orthographic projections of the at least two sub-marks 301 on the first routing layer 10 are respectively located on both sides of the plurality of binding terminals 102.

[0048] It will be appreciated that, in this embodiment, by ensuring that the first alignment mark 30 includes at least two sub-marks 301, and that the orthographic projections of the at least two sub-marks 301 on the first wiring layer 10 are located on either side of the arrangement area A11 of the plurality of binding terminals 102, the alignment accuracy between the display panel 700 and the flexible circuit board can be improved. In some embodiments of the present disclosure, the orthographic projection of the sub-mark 301 on the first wiring layer 10 includes a cross. In other embodiments, the orthographic projection of the sub-mark 301 on the first wiring layer 10 may also be a triangle or other shape.

[0049] Continue to refer to Figure 2 In some embodiments of the present disclosure, at least two second routing layers 20 include a first routing sub-layer 201, a second routing sub-layer 202, and a third routing sub-layer 203. The first routing sub-layer 201 is located on one side of the first routing layer 10; the second routing sub-layer 202 is located on a side of the first routing sub-layer 201 away from the first routing layer 10; and the third routing sub-layer 203 is located on a side of the second routing sub-layer 202 away from the first routing sub-layer 201.

[0050] It is understood that in this embodiment, the driving device 51 is connected to the third routing sub-layer 203. In this embodiment, by connecting the first routing sub-layer 201 to a common reference voltage in the binding area A1, the plurality of binding terminals 102 of the first routing layer 10 can be prevented from causing signal interference to the second routing sub-layer 202 and the third routing sub-layer 203 in the binding area A1.

[0051] In some embodiments of the present disclosure, the flexible circuit board further includes a second adhesive layer 42, a second protective layer 43, a third adhesive layer 44, a base 45, a fourth adhesive layer 46, a third protective layer 47, a fifth adhesive layer 48, a sixth adhesive layer 49, and a fourth protective layer 50. The second protective layer 43 is used to protect the first routing sublayer 201. The second protective layer 43 is connected to the first routing sublayer 10 via the second adhesive layer 42, and the second protective layer 43 is connected to the first routing sublayer 201 via the third adhesive layer 44. The base 45 is used to support the first routing sublayer 201 and the second routing sublayer 202. The fourth protective layer 47 is used to protect the second routing sublayer 202. The third protective layer 47 is connected to the second routing sublayer 202 via the fourth adhesive layer 46, and the third protective layer 47 is connected to the third routing sublayer 203 via the fifth adhesive layer 48. The fourth protective layer 50 is used to protect the third routing sublayer 203. The fourth protective layer 50 is connected to the third routing sublayer 203 via the sixth adhesive layer 49.

[0052] It should be noted that in some embodiments, the second protective layer 43, the substrate 45, the third protective layer 47 and the fourth protective layer 50 are made of PI, for example. The second adhesive layer 42, the third adhesive layer 44, the fourth adhesive layer 46, the fifth adhesive layer 48 and the sixth adhesive layer 49 are made of ADH, for example.

[0053] Continue to refer to Figure 3 In some embodiments of the present disclosure, the flexible circuit board further includes a connection terminal 60 , and the flexible circuit board is connected to the main board via the connection terminal 60 .

[0054] Figure 4 is a side view of a flexible circuit board according to other embodiments of the present disclosure, specifically, Figure 4 yes Figure 3 Right side view of the flexible circuit board shown.

[0055] Reference Figure 4 In some embodiments of the present disclosure, the flexible circuit board further includes a driving device 51 , which is connected to the first wiring layer 10 .

[0056] It can be understood that the side of the driver 51 is set as the front side of the flexible circuit board, that is, the exposed side of the plurality of binding terminals 102 of the first wiring layer 10 is the front side of the flexible circuit board, that is, Figure 4 The flexible circuit board shown is a front-side binding structure, wherein the driving device 51 and the first wiring layer 10 are fixed via a first adhesive layer 52 .

[0057] Figure 5 is a wiring diagram of the first routing layer 10 according to some embodiments of the present disclosure. Figure 6 is a wiring diagram of the first routing sub-layer 201 according to some embodiments of the present disclosure. Figure 7is a wiring diagram of the second routing sub-layer 202 according to some embodiments of the present disclosure. Figure 8 is a wiring diagram of the third routing sub-layer 203 according to some embodiments of the present disclosure.

[0058] Reference Figures 5 to 8 In this embodiment, if Figure 5 As shown, the first wiring layer 10 includes a plurality of first signal lines 101 located in the main body area A2 and a plurality of binding terminals 102 located in the binding area A1. The plurality of binding terminals 102 are electrically connected to the first signal lines 101 respectively. The first signal lines 101 may include power lines and drive signal lines. The power lines are used to supply power to the display panel 700 (see FIG. Figure 9 ) provides a power supply voltage, and the drive signal line is used to provide a drive signal (e.g., a display drive signal) to the display panel 700. The first alignment mark 30 is provided on the same layer as the first routing layer 10, and the first alignment mark 30 includes at least two sub-marks 301. The direction from the main area A2 to the binding area A1 is a first direction X. In a direction perpendicular to the first direction X (the Y direction), the at least two sub-marks 301 are located on either side of the area A11 where the multiple binding terminals 102 are provided.

[0059] It should be noted that the first alignment mark 30 can also be set on a different layer from the first routing layer 10, that is, the first alignment mark 30 can also be set on the same layer as any one of at least two second routing layers 20, as long as there are no binding terminals 102 and other routing obstructions in the setting area A12 of the first alignment mark 30.

[0060] In some embodiments of the present disclosure, the first alignment mark 30 includes at least two sub-marks 301, and the orthographic projections of the at least two sub-marks 301 on the first wiring layer 10 are located on the same side of the plurality of binding terminals 102 (see Figure 5 ). The distance between two adjacent sub-marks 301 is a first value a, the shortest distance between the orthographic projections of at least two sub-marks 301 on the first routing layer 10 and the multiple binding terminals 102 is a second value b, and the ratio a / b of the first value a to the second value b is greater than 0 and less than or equal to 0.5. Exemplarily, the first value a is greater than 0 and less than or equal to 0.5 mm, for example, the first value a is any value of 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, and 0.5 mm. The second value b is greater than or equal to 1 mm and less than or equal to 5 mm, for example, the second value b is any value of 1 mm, 2 mm, 3 mm, 4 mm, and 5 mm.

[0061] It can be understood that in this embodiment, by making the ratio of the distance between two adjacent sub-marks 301 and the shortest distance between the positive projections of at least two sub-marks 301 on the first routing layer 10 and the multiple binding terminals 102 greater than 0 and less than or equal to 0.5, it is possible to avoid the sub-marks 301 occupying too much area of ​​the binding area A1 to increase the routing space, and to avoid the multiple binding terminals 102 affecting the alignment recognition of the sub-marks 301.

[0062] like Figure 6 As shown, the second signal line 21 in the first routing sublayer 201 is mainly distributed in the main body area A2. There is no wiring in the setting area A12 of the first alignment mark 30, which can avoid interference with the camera taking pictures. There is no wiring in the setting area A11 of the multiple binding terminals 102, that is, the first routing sublayer 201 in the binding area A1 is grounded (GND), which can avoid the multiple binding terminals 102 of the first routing layer 10 causing signal interference to the second routing sublayer 202 and the third routing sublayer 203 of the binding area A1.

[0063] like Figure 7 and Figure 8 As shown, the second signal line 21 in the second routing sublayer 202 and the third routing sublayer 203 can be distributed in both the main area A2 and the binding area A1. The second signal line 21 in the second routing sublayer 202 is, for example, a power line, which is connected to the power line in the first routing layer 10, that is, the power line in the flexible circuit board can be partially set in the first routing layer 10, and the other part is set in the second routing sublayer 202, thereby reducing the size of the flexible circuit board. The second signal line 21 in the third routing sublayer 203 is, for example, a drive signal line, which is connected to the drive signal line in the first routing layer 10, that is, the drive signal line in the flexible circuit board can be partially set in the first routing layer 10, and the other part is set in the third routing sublayer 203, which can also reduce the size of the flexible circuit board.

[0064] It can be understood that the second signal lines 21 in the second routing sublayer 202 and the third routing sublayer 203 are not wired in the setting area A12 of the first alignment mark 30, which can avoid interference with the camera taking pictures. Part of the second signal lines 21 in the second routing sublayer 202 and the third routing sublayer 203 can be set in the setting area A11 of multiple binding terminals 102, which is equivalent to expanding the wiring space of the second routing sublayer 202 and the third routing sublayer 203. Therefore, the overall size of the flexible circuit board can be reduced, the cost can be saved, and it is beneficial to the overall structural design of the machine.

[0065] Figure 9 is a schematic structural diagram of a display device according to some embodiments of the present disclosure.

[0066] Reference Figure 9The embodiment of the present disclosure further provides a display device, including a display panel 700 and the above-mentioned flexible circuit board. The multiple binding terminals 102 of the flexible circuit board are connected to the display panel 700. For the specific structure of the flexible circuit board, please refer to Figures 2 to 8 And related instructions will not be repeated here.

[0067] In some embodiments of the present disclosure, a second alignment mark 70 is provided on the display panel 700. The orthographic projection of the second alignment mark 70 on the flexible circuit board overlaps with the first alignment mark 30. That is, during the alignment operation, the second alignment mark 70 (cross hatching) on ​​the display panel 700 needs to at least partially overlap with the first alignment mark 30 (cross hatching) on ​​the flexible circuit board to achieve alignment.

[0068] Although some embodiments according to the general inventive concept of the present disclosure have been illustrated and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept of the present disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A flexible circuit board, characterized in that: The flexible circuit board includes a main body area and a binding area located on one side of the main body area, and the flexible circuit board further includes: A first routing layer includes a plurality of first signal lines located in the main body area and a plurality of binding terminals located in the binding area, wherein the plurality of binding terminals are electrically connected to the first signal lines respectively; and At least two second routing layers are located on the same side of the first routing layer, the at least two second routing layers include a plurality of second signal lines, and the orthographic projections of the second signal lines on the first routing layer overlap with the binding terminals.

2. The flexible circuit board according to claim 1, wherein: The second wiring layer, which is located in the binding area and closest to the first wiring layer, is connected to a common reference voltage.

3. The flexible circuit board according to claim 1, wherein: The flexible circuit board also includes a first protective layer, which is located on a side of the first routing layer away from the second routing layer. The first protective layer is connected to the first routing layer through a first adhesive layer, and the orthographic projections of the first protective layer and the first adhesive layer on the first routing layer do not overlap with the multiple binding terminals.

4. The flexible circuit board according to claim 1, wherein: The flexible circuit board further includes a driving device, and the driving device is connected to the first wiring layer, or connected to the second wiring layer farthest from the first wiring layer.

5. The flexible circuit board according to any one of claims 1 to 4, characterized in that: The flexible circuit board further includes a first alignment mark, which is located in the binding area. The orthographic projections of the plurality of binding terminals and the plurality of second signal lines on the layer where the first alignment mark is located do not overlap with the first alignment mark.

6. The flexible circuit board according to claim 5, characterized in that: The first alignment mark is provided on the same layer as the first routing layer and any one of the at least two second routing layers.

7. The flexible circuit board according to claim 5, characterized in that: The first alignment mark includes at least two sub-marks; and A direction from the main area to the binding area is a first direction. In a direction perpendicular to the first direction, orthographic projections of the at least two sub-marks on the first wiring layer are respectively located on both sides of the plurality of binding terminals.

8. The flexible circuit board according to claim 5, wherein: The first alignment mark includes at least two sub-marks, and the orthographic projections of the at least two sub-marks on the first routing layer are located on the same side of the plurality of binding terminals; as well as The distance between two adjacent sub-marks is a first value, the shortest distance between the positive projections of the at least two sub-marks on the first routing layer and the multiple binding terminals is a second value, and the ratio of the first value to the second value is greater than 0 and less than or equal to 0.

5.

9. A display device, characterized in that: The display device includes: display panel; and According to any one of claims 1 to 8, the flexible circuit board has a plurality of binding terminals connected to the display panel.

10. The display device according to claim 9, wherein The flexible circuit board includes a first alignment mark, and the display panel is provided with a second alignment mark, wherein an orthographic projection of the second alignment mark on the flexible circuit board overlaps with the first alignment mark.

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