Copper bar heat dissipation structure and copper bar assembly

Abstract

The utility model relates to the technical field of heat dissipation of a major loop of an inflatable cabinet, in particular to a copper bar heat dissipation structure and a copper bar assembly. The copper bar heat dissipation structure comprises a base, the base is provided with an installation part and an insertion part, the insertion part is used for being inserted between two adjacent copper bars and attached to the inner side faces of the two adjacent copper bars, and the installation part is provided with a plurality of cooling fins at intervals. And after the insertion part is inserted between two adjacent copper bars, the mounting part is positioned on the outer side of the copper bars and is staggered with the copper bar lap joint part in the copper bar stacking direction. The copper bar heat dissipation structure can be installed between two adjacent copper bars, and certainly can be installed on the outer side of the copper bars, so that the limitation that the existing copper bar heat dissipation structure can only be installed on the outer side of the outermost copper bar is overcome; the copper bar heat dissipation structure can be installed between two adjacent copper bars located on the inner side, so that the heat dissipation effect is further improved, and the heat dissipation requirement is met.

Description

Technical Field

[0001] The utility model relates to the technical field of main circuit heat dissipation of an inflatable cabinet, in particular to a copper busbar heat dissipation structure and a copper busbar assembly. Background Art

[0002] Inflatable cabinets are widely used in the medium-voltage range due to their small size, ability to avoid high-voltage environmental pollution, and insulation properties that are unaffected by ambient atmospheric conditions. For large-capacity inflatable cabinets, increased current inevitably leads to increased heat generation in the main circuit, placing higher heat dissipation requirements on the main circuit structure. The copper busbars in the main circuit are fastened with bolts. Where the bolts are tightened, the copper busbars maintain close contact. Where the bolts are not tightened, there may be a loose connection, increasing the contact resistance between the two busbars and generating greater heat at the copper busbar connection. To improve heat dissipation, most current methods involve installing heat dissipation structures on the outer surfaces of copper bars. For example, Chinese utility model patent No. CN208523123U discloses a copper bar overlap structure (i.e., a copper bar assembly). This copper bar overlap structure includes two or more copper bars stacked and overlapped, and copper bar heat sinks mounted on the outer surfaces of the two outermost copper bars. The copper bar heat sink includes a flat base, one side of which is in contact with the outer surface of the copper bars, and the other side of which is provided with a plurality of heat sinks. By installing copper bar heat sinks on the outer surfaces of the two outermost copper bars, heat dissipation at the copper bar overlap is accelerated. However, existing copper bar heat sinks can only be installed on the outer side of the outermost copper bar, and cannot be installed between two adjacent copper bars. When a large number of copper bars are stacked and overlapped, the heat dissipation effect is limited, and the heat dissipation requirements are still not met. Utility Model Content

[0003] The purpose of the present utility model is to provide a copper bar heat dissipation structure to solve the problem that the existing copper bar radiator can only be installed on the outside of the outermost copper bar, cannot be installed between two adjacent copper bars, and when the number of stacked and overlapping copper bars is large, the heat dissipation effect is limited and the heat dissipation requirements cannot be met; the purpose of the present utility model is also to provide a copper bar assembly to solve the problem that the existing copper bar radiator can only be installed on the outside of the outermost copper bar, cannot be installed between two adjacent copper bars, and when the number of stacked and overlapping copper bars in the copper bar assembly is large, the heat dissipation effect is limited and the heat dissipation requirements cannot be met.

[0004] To achieve the above purpose, the copper bar heat dissipation structure of the present invention adopts the following technical solutions:

[0005] A copper busbar heat dissipation structure includes a base having a mounting portion and a plug-in portion for inserting between two adjacent copper busbars and abutting against the inner side surfaces of the two adjacent copper busbars. The mounting portion is provided with a plurality of heat sinks at intervals. After the plug-in portion is inserted between the two adjacent copper busbars, the mounting portion is located outside the copper busbars and is staggered from the overlapping portion of the copper busbars in the stacking direction of the copper busbars.

[0006] Furthermore, the base includes two substrates that are spaced apart and arranged opposite to each other on the left and right sides, and all the heat sinks are located in a mounting cavity formed between the two substrates.

[0007] Furthermore, the base plate includes a first plate segment, a second plate segment and a bent plate segment connected between the first and second plate segments. The bent plate segment is bent inward relative to the first plate segment so that the second plate segment is located on the inner side of the first plate segment. The first plate segment constitutes the mounting portion and the second plate segment constitutes the plug-in portion.

[0008] Furthermore, the first and second plate segments are parallel to each other, the bent plate segment is vertically connected between the first and second plate segments, and after the second plate segment is inserted between two adjacent copper bars, the bent plate segment fits adjacent side surfaces of at least part of the overlapping surfaces of the copper bars.

[0009] Furthermore, the heat sinks are arranged in groups, and each substrate is mounted with at least one group of heat sinks.

[0010] Furthermore, the heat sinks on the two substrates are spaced apart from each other to form a heat dissipation channel extending vertically between the heat sinks on the two substrates.

[0011] Furthermore, the heat sinks on the two substrates are arranged in a staggered manner.

[0012] Furthermore, the bent plate segment is connected to the first and second plate segments through a rounded transition.

[0013] Furthermore, the heat sink is wedge-shaped, and the end of the heat sink with a larger cross-sectional area is mounted on the mounting portion.

[0014] Beneficial effects: The copper bar heat dissipation structure of the present invention is a pioneering invention. The base has a mounting portion and a plug-in portion, and a plurality of heat sinks are spaced apart on the mounting portion. When in use, the plug-in portion can be inserted between two adjacent copper bars, and the plug-in portion fits the inner side surfaces of the two adjacent copper bars. The mounting portion is on the outside of the copper bar and is staggered with the overlapping portion of the copper bar in the direction of copper bar stacking. The mounting portion and the heat sink will not interfere with the overlapping of the copper bars, and heat dissipation is achieved on this basis. The copper bar heat dissipation structure of the present invention can be installed between two adjacent copper bars, and of course can also be installed on the outside of the copper bars, overcoming the limitation that the existing copper bar radiator can only be installed on the outside of the outermost copper bar. When the number of stacked and overlapping copper bars is large, the copper bar heat dissipation structure of the present invention can be installed between two adjacent copper bars on the inner side, thereby further improving the heat dissipation effect and meeting the heat dissipation requirements.

[0015] The utility model copper busbar assembly adopts the following technical solutions:

[0016] The copper busbar assembly includes two or more copper busbars vertically stacked and overlapped in sequence. A copper busbar heat dissipation structure is installed between at least one of the inner copper busbars and the adjacent copper busbar. The copper busbar heat dissipation structure includes a base. The base has a mounting portion and a plug-in portion inserted between two adjacent copper busbars and fitted with the inner side surfaces of the two adjacent copper busbars. A plurality of heat sinks are arranged at intervals on the mounting portion. The mounting portion is located on the outside of the copper busbar and is staggered with the overlapping portion of the copper busbar in the stacking direction of the copper busbars.

[0017] Furthermore, the base includes two substrates that are spaced apart and arranged opposite to each other on the left and right sides, and all the heat sinks are located in a mounting cavity formed between the two substrates.

[0018] Furthermore, the base plate includes a first plate segment, a second plate segment and a bent plate segment connected between the first and second plate segments. The bent plate segment is bent inward relative to the first plate segment so that the second plate segment is located on the inner side of the first plate segment. The first plate segment constitutes the mounting portion and the second plate segment constitutes the plug-in portion.

[0019] Furthermore, the first and second plate segments are parallel to each other, the bent plate segment is vertically connected between the first and second plate segments, and after the second plate segment is inserted between two adjacent copper bars, the bent plate segment fits adjacent side surfaces of at least part of the overlapping surfaces of the copper bars.

[0020] Furthermore, the heat sinks are arranged in groups, and each substrate is mounted with at least one group of heat sinks.

[0021] Furthermore, the heat sinks on the two substrates are spaced apart from each other to form a heat dissipation channel extending vertically between the heat sinks on the two substrates.

[0022] Furthermore, the heat sinks on the two substrates are arranged in a staggered manner.

[0023] Furthermore, the bent plate segment is connected to the first and second plate segments through a rounded transition.

[0024] Furthermore, the heat sink is wedge-shaped, and the end of the heat sink with a larger cross-sectional area is mounted on the mounting portion.

[0025] Beneficial effects: The copper busbar assembly of the present invention is a pioneering invention. The copper busbar assembly includes two or more copper busbars that are vertically stacked and overlapped in sequence. A copper busbar heat dissipation structure is installed between at least one copper busbar on the inside and the adjacent copper busbar. The copper busbar heat dissipation structure includes a base. The base has a mounting portion and a plug-in portion. A plurality of heat sinks are spaced apart on the mounting portion. The plug-in portion is inserted between two adjacent copper busbars and fits with the inner side surfaces of the two adjacent copper busbars. The mounting portion is on the outside of the copper busbar and is staggered with the overlapping portion of the copper busbars in the direction of copper busbar stacking. The mounting portion and the heat sink will not interfere with the overlapping portion of the copper busbars, and heat dissipation is achieved on this basis. By installing a copper busbar heat dissipation structure between at least one copper busbar on the inside and the adjacent copper busbar, the heat dissipation of the overlapping portion of the inner copper busbar can be accelerated, thereby further improving the heat dissipation effect and meeting the heat dissipation requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic structural diagram of an embodiment of the copper busbar assembly of the present utility model;

[0027] Figure 2 This is a schematic diagram of the copper busbar heat dissipation structure;

[0028] In the figure: 1. Copper busbar; 2. Base plate; 201. First plate segment; 202. Second plate segment; 203. Bent plate segment; 204. Mounting hole; 3. Heat sink; 4. Heat dissipation channel. DETAILED DESCRIPTION

[0029] The present invention is mainly used to solve the problem that the existing copper bar heat sink can only be installed on the outside of the outermost copper bar, and cannot be installed between two adjacent copper bars. When the number of copper bars stacked and overlapped is large, the heat dissipation effect is limited and the heat dissipation requirements cannot be met. The basic design concept of the present invention is to design a copper bar heat dissipation structure, so that the copper bar heat dissipation structure has a mounting portion and a plug-in portion, a heat sink is provided on the mounting portion, and the plug-in portion can be inserted between two adjacent copper bars. After the plug-in portion is inserted, the mounting portion is located on the outside of the copper bar as a whole and is staggered with the copper bar overlap portion in the direction of copper bar stacking. In this way, the mounting portion and the heat sink will not interfere with the copper bar stacking and overlap, and on this basis, the heat dissipation of the copper bar overlap portion on the inner side is accelerated, thereby further improving the heat dissipation effect.

[0030] Based on the above design concept, the embodiments of the present utility model are described in detail below.

[0031] Embodiment of the copper busbar assembly of the present utility model:

[0032] like Figure 1 As shown, the copper busbar assembly includes a plurality of copper busbars 1 stacked vertically in sequence. A copper busbar heat dissipation structure is installed between one of the inner copper busbars 1 and the adjacent copper busbar 1. Part of the copper busbar heat dissipation structure is inserted between the two adjacent copper busbars 1, and the rest is outside the copper busbar 1. Figure 2 As shown, the copper busbar heat dissipation structure includes a base, which includes two base plates 2 spaced apart and arranged opposite each other. A plurality of heat sinks 3 are installed in the mounting cavity formed between the two base plates 2. The two base plates 2 are arranged symmetrically and have the same structure, each including a first plate segment 201, a second plate segment 202, and a bent plate segment 203 connected between the first and second plate segments. The bent plate segment 203 is bent inward relative to the first plate segment 201, so that the second plate segment 202 is located inside the first plate segment 201. The first plate segments 201 of the two base plates 2 constitute the mounting portion of the base, and the heat sinks 3 are mounted on the mounting portion. The second plate segments 202 of the two base plates 2 constitute the plug-in portion of the base, which is used to be inserted between two adjacent copper busbars 1 and to mate with the inner side surfaces of the two adjacent copper busbars 1. The plug-in part is provided with mounting holes 204 for bolts to pass through. The number and position of the mounting holes 204 are the same as the number and position of the bolt mounting holes at the copper busbar overlap. The fixing bolts at the copper busbar overlap pass through the copper busbar 1 and the mounting holes 204 of the plug-in part at the same time, thereby achieving relative fixation between the base and the copper busbar 1. Figure 1 As shown in , after the plug-in portion of the base is inserted between two adjacent copper bars 1, the mounting portion is located outside the copper bars 1 and is staggered from the overlapping portion of the copper bars in the stacking direction of the copper bars 1.

[0033] The first and second plate segments are parallel to each other, and the bent plate segment 203 is vertically connected between the first and second plate segments. Figure 1 As shown in , after the second plate segment 202 is inserted between two adjacent copper bars 1, the bent plate segment 203 is aligned with the adjacent side surfaces of at least part of the overlapping surface of the copper bars 1. This can further increase the contact area between the base and the copper bars 1, allowing the heat of the copper bars 1 to be quickly transferred to the base, thereby accelerating the heat dissipation rate of the overlapping portion of the copper bars 1. In addition, the bent plate segment 203 is vertically connected between the first and second plate segments, which can also reduce the overall size of the base and thus reduce the space occupied by the copper bar heat dissipation structure. Of course, in other embodiments, the bent plate segment 203 can also be connected obliquely between the first and second plate segments, so that after the second plate segment 202 is inserted between the two adjacent copper bars 1, the bent plate segment 203 does not contact the side surfaces of the copper bars 1.

[0034] The bent plate segment 203 is connected to the first and second plate segments via a rounded transition, which can avoid as much as possible the current on the copper bus 1 from generating tip discharge at the connection between the bent plate segment 203 and the first and second plate segments, thereby generating greater heat near the plug-in part of the copper bus 1.

[0035] All the heat sinks 3 are located in the mounting cavity formed between the two substrates 2, so that the two substrates 2 also act as a shield, shielding all the heat sinks 3, further uniformizing the electric field and optimizing the insulation performance. The heat sinks 3 are arranged in groups, and at least one group of heat sinks 3 is installed on each substrate 2. Each group of heat sinks 3 is fixed to the substrate 2 by bolts or screws. One or more groups of heat sinks 3 can be installed as needed. The heat sinks 3 are arranged in groups, which makes installation more convenient and efficient. The heat sinks 3 on the two substrates 2 are arranged at intervals on the left and right, and a heat dissipation channel 4 extending up and down is formed between the heat sinks 3 on the two substrates 2. The heat dissipation channel 4 is connected to the heat dissipation gap between the adjacent heat sinks 3 on each substrate 2, which can further accelerate the flow of gas and thus accelerate the heat dissipation speed. More preferably, the heat sinks 3 on the two substrates 2 are arranged in a staggered manner, and the heat sinks 3 on any substrate 2 correspond to the heat dissipation gap on the other substrate 2. This can further accelerate the flow of gas around the heat sink 3 and thus accelerate the heat dissipation speed. The heat sink 3 is wedge-shaped, and the end with a larger cross-sectional area of ​​the heat sink 3 is installed on the base. The closer to the base, the higher the temperature. The heat sink 3 is a wedge-shaped structure and the end with a larger cross-sectional area is installed on the base, which can make the root of the heat sink 3 have a larger contact area with the base, faster heat conduction, and higher heat dissipation efficiency.

[0036] The copper bar assembly of the present invention adopts a structure in which multiple copper bars are arranged vertically and overlapped. Compared with the structure in which multiple copper bars are arranged horizontally and overlapped, the copper bar assembly has a higher current carrying capacity and increases the current carrying capacity. On the basis of improving the current carrying capacity, a copper bar heat dissipation structure is designed at the copper bar overlap. The copper bar heat dissipation structure can be inserted between two adjacent copper bars and fit with the inner side surfaces of the two adjacent copper bars. The heat sink is located on the outside of the copper bar and is staggered with the copper bar overlap position in the direction of the copper bar stacking, avoiding interference with the copper bar stacking, thereby accelerating the heat dissipation of the copper bar overlap position on the inside. Of course, the copper bar heat dissipation structure in the present invention can also be installed on the outer side of the copper bar on the outside. In specific applications, the copper bar heat dissipation structure in the present invention can be combined with the heat dissipation structure installed on the outside of the copper bar in the prior art to further improve the heat dissipation effect and meet the heat dissipation requirements.

[0037] Of course, the copper busbar assembly of the present invention is not limited to the above-mentioned embodiments.

[0038] For example, in another embodiment, the base includes two substrates spaced apart and arranged opposite to each other on the left and right sides, both substrates are rectangular plates, and the heat sinks are arranged on the outer sides of the two substrates.

[0039] For example, in another embodiment, the base includes two substrates spaced apart and arranged opposite to each other on the left and right sides, both substrates are L-shaped plates, the horizontal sides of the two L-shaped plates extend in opposite directions, the vertical sides of the two L-shaped plates are inserted between two adjacent copper bars and fit against the inner side surfaces of the two adjacent copper bars, and a number of heat sinks are provided on the horizontal sides of the two L-shaped plates.

[0040] For example, in another embodiment, the heat sinks on the two substrates are intersected in the left-right direction, and the heat sink on one substrate is inserted into the heat dissipation gap between the two heat sinks on the other substrate.

[0041] For example, in another embodiment, the heat sinks on the two substrates are arranged opposite each other left and right.

[0042] For example, in another embodiment, the bent plate segment of the base plate is connected to the first and second plate segments through a right-angle transition.

[0043] For example, in another embodiment, the heat sink is rectangular, and the cross-sectional areas of various parts of the heat sink are equal.

[0044] The present invention also provides an embodiment of a copper busbar heat dissipation structure, the specific structure of which is the same as that of the copper busbar heat dissipation structure in the embodiment of the copper busbar assembly, and will not be described in detail here.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. The scope of patent protection of the present invention shall be based on the claims. Any equivalent structural changes made using the description and drawings of the present invention shall also be included in the scope of protection of the present invention.

Claims

1. A copper busbar heat dissipation structure, characterized by: The invention comprises a base, which has a mounting portion and a plug-in portion for being inserted between two adjacent copper bars and fitting with the inner side surfaces of the two adjacent copper bars. The mounting portion is provided with a plurality of heat sinks at intervals. After the plug-in portion is inserted between the two adjacent copper bars, the mounting portion is located outside the copper bars and is staggered with the overlapping portion of the copper bars in the stacking direction of the copper bars.

2. The copper busbar heat dissipation structure according to claim 1, characterized in that: The base comprises two base plates which are spaced apart and arranged opposite to each other, and all the heat sinks are located in a mounting cavity formed between the two base plates.

3. The copper busbar heat dissipation structure according to claim 2, characterized in that: The base plate includes a first plate segment, a second plate segment and a bent plate segment connected between the first and second plate segments. The bent plate segment is bent inward relative to the first plate segment so that the second plate segment is located inside the first plate segment. The first plate segment constitutes the mounting portion and the second plate segment constitutes the plug-in portion.

4. The copper busbar heat dissipation structure according to claim 3, characterized in that: The first and second plate sections are parallel to each other, and the bent plate section is vertically connected between the first and second plate sections. After the second plate section is inserted between two adjacent copper bars, the bent plate section fits adjacent side surfaces of at least part of the overlapping surfaces of the copper bars.

5. The copper busbar heat dissipation structure according to any one of claims 2 to 4, characterized in that: The heat sinks are arranged in groups, and each base plate is equipped with at least one group of heat sinks.

6. The copper busbar heat dissipation structure according to claim 5, characterized in that: The heat sinks on the two substrates are spaced apart from each other to form a heat dissipation channel extending vertically between the heat sinks on the two substrates.

7. The copper busbar heat dissipation structure according to claim 5, characterized in that: The heat sinks on the two substrates are staggered in sequence.

8. The copper busbar heat dissipation structure according to claim 3 or 4, characterized in that: The bent plate segment is connected to the first and second plate segments through a rounded transition.

9. The copper busbar heat dissipation structure according to any one of claims 1 to 4, characterized in that: The heat sink is wedge-shaped, and the end of the heat sink with a larger cross-sectional area is mounted on the mounting portion.

10. Copper busbar assembly, characterized by: The invention comprises two or more copper bars which are vertically stacked and overlapped in sequence, and a copper bar heat dissipation structure as claimed in any one of claims 1 to 9 is installed between at least one of the inner copper bars and the adjacent copper bar.

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