Integrated high-performance shielding film

Abstract

The utility model discloses an integrated high-performance shielding film, which is characterized by comprising a heat conduction layer, a soaking layer is arranged on one side of the heat conduction layer, a heat insulation layer is arranged on one side, far away from the heat conduction layer, of the soaking layer, a protection layer is arranged on one side, far away from the soaking layer, of the heat insulation layer, and a release layer is arranged on one side, far away from the soaking layer, of the heat conduction layer. The soaking layer comprises a conductive material, and a polymer flexible film is compounded on one side of the conductive material; the integrated high-performance shielding film with the structure has good heat conduction, soaking and heat insulation performance and excellent electromagnetic shielding performance, so that the defect that the heat conduction, soaking, heat insulation and shielding performance of a common single material is limited is overcome, and the integrated high-performance shielding film is very in line with the mainstream trend of current electronic informatization development; the material can replace a pure heat conduction and soaking material or heat insulation material or shielding material, integrates heat conduction, soaking, heat insulation and electromagnetic shielding performance, and achieves high performance.

Description

Technical Field

[0001] The utility model relates to the field of heat-conducting shielding materials, in particular to an integrated high-performance shielding film. Background Art

[0002] With the development of modern society, the demand for intelligent information technology is increasing. Electronic components in everything from mobile phones to automobiles are undergoing iterative functional upgrades, leading to a series of issues such as high power consumption and strong electromagnetic interference. High power consumption increases the heat generated by electronic components. Once electronic components operate in high-temperature environments for extended periods, their functional parameters are affected and degrade, shortening their service life or even causing them to burn out. Strong electromagnetic interference can impair the inherent performance of electronic components, reducing their operating efficiency and even causing them to malfunction, directly endangering human health.

[0003] Therefore, to meet these development needs and effectively address the heating and electromagnetic interference issues of electronic components, it is necessary to introduce and utilize materials with both thermal insulation, heat dissipation, and shielding capabilities. However, currently available materials have relatively single functions, primarily thermal insulation materials such as aerogel and shielding materials such as copper foil. There are no multifunctional materials that can simultaneously meet the requirements of heat dissipation, thermal insulation, and shielding. Therefore, there is an urgent need to develop an integrated, high-performance thermally conductive shielding film. Utility Model Content

[0004] The technical problem solved by the utility model is to provide an integrated high-performance shielding film, which has the properties of high shielding, high thermal conductivity and strong heat insulation.

[0005] The technical solution adopted by the utility model to solve the technical problem is: an integrated high-performance shielding film, including a heat-conducting layer, a heat-absorbing layer is provided on one side of the heat-conducting layer, a heat-insulating layer is provided on the side of the heat-absorbing layer away from the heat-conducting layer, a protective layer is provided on the side of the heat-insulating layer away from the heat-absorbing layer, and a release layer is provided on the side of the heat-conducting layer away from the heat-absorbing layer;

[0006] The heat-conducting layer is a heat-conducting adhesive.

[0007] The heat-sparing layer comprises a conductive material, and one side of the conductive material is compounded with a polymer flexible film;

[0008] The heat insulation layer is an aerogel layer.

[0009] Furthermore, the thermally conductive adhesive is a glass fiber cloth-based thermally conductive adhesive or a substrate-free thermally conductive adhesive or a thermally conductive silica gel, and the thickness of the thermally conductive layer is 0.03 mm to 0.3 mm.

[0010] Furthermore, the release layer is made of polyethylene terephthalate, and the thickness of the release layer is 0.025 mm to 0.075 mm.

[0011] Furthermore, the thickness of the heat-sparing layer is 0.03 to 0.3 mm, the conductive material is a copper nanoparticle graphene composite material, and the polymer flexible film is ethylene glycol terephthalate.

[0012] Furthermore, the protective layer is a polyester film, and the thickness of the protective layer is 0.025 mm to 0.075 mm.

[0013] Furthermore, the conductive material is a silver nanoparticle graphene composite material, an epoxy resin and graphene composite material, a polyvinyl alcohol and graphene nanosheet composite material, a polydimethylsiloxane and graphene composite material, or a ferrite and graphene composite material.

[0014] Furthermore, the polymer flexible film is a polyimide film.

[0015] The beneficial effects of the present invention are: the integrated high-performance shielding film of this structure has good thermal conductivity, heat equalization and heat insulation performance and excellent electromagnetic shielding performance, thereby making up for the defects of limited thermal conductivity, heat equalization and heat insulation shielding performance of ordinary single materials, which is very consistent with the current mainstream trend of electronic information development, and can replace simple thermal conductivity, heat equalization and heat insulation materials or thermal insulation materials or shielding materials, and combine thermal conductivity, heat equalization and heat insulation with electromagnetic shielding performance into one to achieve high performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of the integrated high-performance shielding film of an embodiment of the present application.

[0017] The markings in the figure are: 1. Release layer; 2. Thermal conductive layer; 3. Heat dissipating layer; 4. Thermal insulation layer; 5. Protective layer. DETAILED DESCRIPTION

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0019] like Figure 1 As shown, the embodiment of the present application discloses an integrated high-performance shielding film, comprising a heat-conducting layer 2, a heat-spreading layer 3 is provided on one side of the heat-conducting layer 2, a heat-insulating layer 4 is provided on the side of the heat-spreading layer 3 away from the heat-conducting layer 2, a protective layer 5 is provided on the side of the heat-insulating layer 4 away from the heat-spreading layer 3, and a release layer 1 is provided on the side of the heat-conducting layer 2 away from the heat-spreading layer 3;

[0020] The heat conducting layer 2 is a heat conducting adhesive;

[0021] The heat-dissipating layer 3 comprises a conductive material, one side of which is composited with a polymer flexible film;

[0022] The heat insulation layer 4 is an aerogel layer.

[0023] Specifically, in this structure, the setting of the thermal conductive layer 2 provides a path for heat transfer. At the same time, the setting of the heat-dissipating layer 3 can change the heat dissipation direction and greatly increase the heat dissipation uniformity. The use of the thermal insulation layer 4 can block the heat from being conducted to the surrounding electronic components, protecting the surrounding electronic components from being heated and affecting their performance and reducing their service life.

[0024] Specifically, the thickness of the thermal insulation layer 4 can range from 0.04 to 0.5 mm, for example: 0.04 mm, 0.1 mm, 0.3 mm, 0.5 mm, etc. Aerogel is the material with the lowest thermal conductivity in the thermal insulation industry, with a thermal conductivity as low as 0.01 W / (mK), and has excellent properties such as hydrophobicity and environmental protection. It can effectively solve the insulation problem of small spaces in electronic products, and timely provide thermal insulation protection for weak heat-resistant components to form a thermal barrier layer, thereby maintaining the stable performance of electronic products and increasing the service life of electronic products.

[0025] When the above structure is used, the heat source is quickly conducted to the heat-dissipating layer 3 through the heat-conducting layer 2, realizing the rapid and uniform diffusion of heat from the point heat source to the surface heat source. The remaining minimal heat is blocked by the aerogel, thereby protecting the surrounding electronic components.

[0026] In this embodiment, the heat-conducting layer 2 is a glass fiber cloth-based heat-conducting adhesive, and the thickness of the heat-conducting layer 2 is 0.03 mm to 0.3 mm, specifically 0.03 mm, 0.05 mm, 0.1 mm, 0.3 mm, etc.

[0027] Specifically, the thermally conductive layer may also be a substrate-free thermally conductive adhesive or thermally conductive silica gel. When the thermally conductive adhesive layer is thermally conductive silica gel, a silica gel treatment agent is required to combine it with the heat-dissipating layer.

[0028] Specifically, when using glass fiber cloth-based thermal conductive adhesive, its thermal conductivity is greater than 1W / (m·K), and can reach up to 15W / (m·K). Therefore, it has good thermal conductivity and can achieve rapid heat transfer.

[0029] In this embodiment, the release layer 1 is made of polyethylene terephthalate, and the thickness of the release layer 1 is 0.025 mm to 0.075 mm, specifically 0.025 mm, 0.05 mm, 0.075 mm, etc.

[0030] In this structure, the release layer 1 is provided to protect the adhesive surface, thereby preventing the adhesive surface from being contaminated, thereby ensuring the performance of the thermally conductive adhesive.

[0031] In this embodiment, the thickness of the heat-dissipating layer 3 is 0.03-0.3 mm, specifically 0.03 mm, 0.2 mm, 0.3 mm, etc. The conductive material is a copper nanoparticle graphene composite material, and the polymer flexible film is polyethylene terephthalate.

[0032] In this embodiment, the protective layer 5 is a polyester film, and the thickness of the protective layer 5 is 0.025mm~0.075mm, specifically 0.025mm, 0.05mm, 0.025mm, etc. The use of polyester film in this structure can protect the surface of the material from water vapor erosion and dirt contamination, thereby preventing the performance of the entire material from being affected.

[0033] The copper nanoparticle graphene composite and polymer flexible film composite in this structure provide excellent electromagnetic shielding effectiveness and extremely high three-dimensional thermal conductivity. The copper nanoparticle graphene composite has an XY thermal conductivity of up to 1700W / (m·K) and a Z thermal conductivity of up to 400W / (m·K). This material solves the problem of low XY thermal conductivity of traditional graphite materials and also improves the low horizontal thermal conductivity of single copper foil materials. The shielding effectiveness of this structure is greater than 53dB in the 1-18GHz frequency band, thus also improving the electromagnetic shielding effectiveness of conventional metal materials across a wide frequency band. Furthermore, the introduction of polyethylene terephthalate helps to improve the toughness and flexibility of this structure, making it suitable for use in environments such as wrapping and winding.

[0034] At the same time, it should be explained that the heat-saturating layer 3 is not limited to the combination of copper nanoparticle graphene composite and PET film. Among them, the composite of the conductive material composite can also be metal nanoparticles, polymers, magnetic substances, etc. Specifically, the metal nanoparticles are not limited to copper, but can also be silver, to make a silver nanoparticle graphene composite; the polymer can be epoxy resin, polyvinyl alcohol, polydimethylsiloxane, etc., which can be made into epoxy resin and graphene composite, polyvinyl alcohol and graphene nanosheet composite, polydimethylsiloxane and graphene composite, etc. respectively; the magnetic substance can be ferrite, which can be made into ferrite and graphene composite; the polymer flexible film is not limited to PET, but can also be a polyimide (PI) film, etc.

[0035] In the above structure, when the composite of the conductive material is metal nanoparticles, the absorption of incident electromagnetic waves is enhanced by strengthening the conductivity loss, thereby improving the electromagnetic interference shielding effectiveness; when the composite of the conductive material is a polymer, the efficient electromagnetic interference shielding effectiveness is achieved through the construction of multiple conductive networks and the coordination of polarization losses; when the composite of the conductive material is a magnetic material, more electromagnetic waves are converted into heat energy through magnetic hysteresis loss and multiple interface scattering, thereby improving the electromagnetic interference shielding effectiveness of the composite material.

[0036] To sum up, the integrated high-performance shielding film of this structure has good thermal conductivity, heat equalization and thermal insulation performance and excellent electromagnetic shielding performance, which makes up for the defects of limited thermal conductivity, heat equalization and thermal insulation shielding performance of ordinary single materials. It is very consistent with the current mainstream trend of electronic information development. It can replace simple thermal conductivity, heat equalization and thermal insulation materials or thermal insulation materials or shielding materials, and combine thermal conductivity, heat equalization and thermal insulation with electromagnetic shielding performance to achieve high performance.

[0037] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. Integrated high-performance shielding film, characterized by: The heat conducting layer (2) is provided with a heat absorbing layer (3) on one side of the heat conducting layer (2), a heat insulating layer (4) is provided on the side of the heat absorbing layer (3) away from the heat conducting layer (2), a protective layer (5) is provided on the side of the heat insulating layer (4) away from the heat absorbing layer (3), and a release layer (1) is provided on the side of the heat conducting layer (2) away from the heat absorbing layer (3); The heat-conducting layer (2) is a heat-conducting adhesive; The heat-dissipating layer (3) comprises a conductive material, and one side of the conductive material is composited with a polymer flexible film; The heat insulation layer (4) is an aerogel layer.

2. The integrated high-performance shielding film according to claim 1, wherein: The thermally conductive adhesive is a glass fiber cloth-based thermally conductive adhesive or a substrate-free thermally conductive adhesive or a thermally conductive silica gel, and the thickness of the thermally conductive layer (2) is 0.03 mm to 0.3 mm.

3. The integrated high-performance shielding film according to claim 1, wherein: The release layer (1) is polyethylene terephthalate, and the thickness of the release layer (1) is 0.025 mm to 0.075 mm.

4. The integrated high-performance shielding film according to claim 1, wherein: The thickness of the heat-dissipating layer (3) is 0.03-0.3 mm, the conductive material is a copper nanoparticle graphene composite material, and the polymer flexible film is ethylene glycol terephthalate.

5. The integrated high-performance shielding film according to claim 1, wherein: The protective layer (5) is a polyester film, and the thickness of the protective layer (5) is 0.025 mm to 0.075 mm.

6. The integrated high-performance shielding film according to claim 1, wherein: The conductive material is a silver nanoparticle graphene composite material, an epoxy resin and graphene composite material, a polyvinyl alcohol and graphene nanosheet composite material, a polydimethylsiloxane and graphene composite material, or a ferrite and graphene composite material.

7. The integrated high-performance shielding film according to claim 1, wherein: The polymer flexible film is a polyimide film.

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