LED packaging structure, LED module and LED light-emitting device

Abstract

The embodiment of the utility model provides an LED packaging structure, an LED module and an LED light-emitting device, the LED packaging structure comprises an LED substrate, the surface of the LED substrate is provided with an installation area used for installing an LED chip, a groove arranged around the installation area, and a peripheral area surrounding the groove; an LED chip, wherein the LED chip is installed in the installation area; the shading glue layer surrounds the LED chip and is arranged on the surface of the LED substrate; the packaging adhesive layer is arranged on one side of the surface of the LED substrate; wherein at least part of the shading adhesive layer is located in the groove; and the packaging adhesive layer directly covers at least part of the peripheral area. The shading glue is drained through the grooves, so that the peripheral area can be prevented from being covered by the shading glue to a certain extent, the contact area between the surface of the LED substrate and the packaging glue is increased, and the influence of the layering phenomenon on the LED packaging structure is reduced.

Description

Technical Field

[0001] The embodiments in this specification relate to the field of LED technology, and in particular to an LED packaging structure, an LED module, and an LED light-emitting device. Background Art

[0002] During the manufacturing process of LED packaging structure, after installing the LED chip on the LED substrate, it is usually necessary to fill the area around the LED chip with light-shielding glue to prevent the side light and bottom light of the LED chip from leaking and improve the light output effect.

[0003] However, the surface structure design of existing LED substrates results in poor flowability of the light-shielding adhesive on the substrate surface. If a large amount of light-shielding adhesive is used, it will almost cover the entire substrate surface. As a result, when the encapsulating adhesive is subsequently applied, it is difficult to form a strong bond with the encapsulating adhesive covering the light-shielding adhesive, which is prone to delamination and affects the performance of the LED packaging structure. Utility Model Content

[0004] In view of this, multiple embodiments of this specification are dedicated to providing an LED packaging structure, an LED module, and an LED light-emitting device, which can reduce the delamination phenomenon to a certain extent and improve the performance of the LED packaging structure.

[0005] One embodiment of the present specification provides an LED packaging structure, which includes: an LED substrate, the surface of which has a mounting area for mounting an LED chip, a groove arranged around the mounting area, and a peripheral area surrounding the groove; an LED chip, the LED chip being mounted in the mounting area; a light-shielding adhesive layer, the light-shielding adhesive layer being arranged on the surface of the LED substrate around the LED chip; an encapsulation adhesive layer, the encapsulation adhesive layer being arranged on one side of the surface of the LED substrate; wherein the light-shielding adhesive layer is at least partially located in the groove; and the encapsulation adhesive layer directly covers at least a portion of the peripheral area.

[0006] Optionally, the surface of the peripheral area is a metal plating layer; and the packaging adhesive layer directly covers the metal plating layer located in the peripheral area.

[0007] Optionally, the LED substrate includes a base and a metal plating layer arranged on the base; the groove extends from the surface of the metal plating layer to the base, and the depth of the groove is not less than the thickness of the metal plating layer.

[0008] Optionally, the depth of the groove ranges from 50 to 80 μm.

[0009] Optionally, the groove forms an outer contour on the LED substrate; wherein the outer contour has a plurality of straight edges, and the corners between adjacent straight edges are rounded; or, the shape of the outer contour is circular.

[0010] Optionally, the groove width is not less than 0.1 mm.

[0011] Optionally, the distance between any point of the outer contour and any point on the outer edge of the LED substrate is not less than 0.1 mm.

[0012] Optionally, the groove forms an outer contour on the LED substrate; the light-shielding adhesive layer covers the inner area enclosed by the outer contour on the surface of the LED substrate; the encapsulation adhesive layer covers the peripheral area and the surface of the light-shielding adhesive layer away from the LED substrate; wherein the thickness of the part of the light-shielding adhesive layer located outside the groove gradually increases from the outer contour inward.

[0013] Optionally, the LED packaging structure also includes a fluorescent film; the fluorescent film is arranged on the side of the LED chip away from the LED substrate; wherein, the fluorescent film includes a red phosphor layer and a yellow-green phosphor layer; the yellow-green phosphor layer is arranged on the side of the red phosphor layer away from the LED chip.

[0014] One embodiment of the present specification provides an LED module, including the LED packaging structure described in any of the above embodiments.

[0015] One embodiment of the present specification provides an LED light-emitting device, including the LED module as described in any of the above embodiments.

[0016] The multiple implementation methods provided in this specification are to set a groove around the installation area of ​​the LED chip, and use the groove to drain the light-shielding glue set around the LED chip, so that the light-shielding glue flowing from the periphery of the LED chip to the peripheral area can be accommodated in the groove, which can prevent the peripheral area from being covered by the light-shielding glue to a certain extent. Therefore, when filling the packaging glue, the surface of the substrate located in the peripheral area can directly contact the packaging glue, reducing the stratification phenomenon between the light-shielding glue and the packaging glue, thereby improving the performance of the LED packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A top view of an LED substrate provided in accordance with one embodiment of this specification.

[0018] Figure 2 A top view of an LED substrate provided in accordance with another embodiment of the present disclosure.

[0019] Figure 3A cross-sectional view of an LED package structure provided in accordance with one embodiment of the present disclosure.

[0020] Description of reference numerals:

[0021] 10. LED substrate; 101. Base; 102. Metal plating; 11. Mounting area; 12. Groove; 13. Outer contour; 14. Inner contour; 15. Outer edge; 16. Isolation channel; 20. LED packaging structure; 21. LED chip; 22. Shading adhesive layer; 23. Packaging adhesive layer; 24. Phosphor film; 25. Internal area; 26. Peripheral area. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this specification, all other embodiments obtained by those skilled in the art without making any creative efforts are within the scope of protection of this application.

[0023] In this specification, the drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show details of the local features.

[0024] Unless otherwise indicated, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art in the technical field of this specification. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the scope of this specification. The term "and / or" used in this specification includes any and all combinations of one or more related listed items. The singular forms "a", "above", and "the" used in the embodiments of this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0025] In the description of this specification, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of this specification, the meaning of "plurality" is two or more, unless otherwise explicitly and specifically defined.

[0026] In the description of this specification, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of a simplified description of this application, and do not indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation to this application.

[0027] Throughout this specification, unless otherwise expressly defined, the terms "installed," "connected," "connect," "fixed," and "disposed" should be interpreted broadly. For example, "connection" can refer to fixed or removable connections, or integration; mechanical or electrical connections; direct or indirect connections through an intermediary; or internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0028] In the description of this specification, unless otherwise explicitly defined, when a first feature is “on,” “above,” “above,” “above,” “below,” “below,” or “below” a second feature, the first feature and the second feature may be in direct contact, or the first feature and the second feature may be in indirect contact via an intermediate medium. Moreover, when a first feature is “on,” “above,” or “above” a second feature, it may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. When a first feature is “below,” “below,” or “below” a second feature, it may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0029] Existing LED packaging structures often feature a patterned surface on the LED substrate. This hinders the flow of light-shielding adhesive around the LED chip, resulting in poor flowability. To prevent light leakage from the sides and bottom of the LED chip, the amount of light-shielding adhesive used is increased, often covering a large portion of the LED substrate surface.

[0030] Because the entire surface of the LED substrate is covered with a layer of light-shielding adhesive, the encapsulating adhesive must be applied over the light-shielding adhesive when filling the encapsulating adhesive. However, the adhesion between the two layers is poor, making it difficult to securely bond, which can easily lead to delamination, which in turn affects the performance of the LED package structure. For example, delamination between the light-shielding adhesive and the encapsulating adhesive can reduce the mechanical stability of the LED package structure, or cause light leakage or scattering due to poor adhesion, affecting the light output.

[0031] Therefore, it is necessary to provide an LED substrate that can reduce the delamination phenomenon between the light-shielding glue and the packaging glue and improve the performance of the LED packaging structure.

[0032] See also Figure 1 One embodiment of the present disclosure provides an LED substrate 10 , wherein a surface of the LED substrate 10 has a mounting area 11 for mounting an LED chip, a groove 12 disposed around the mounting area 11 , and a peripheral area 26 surrounding the groove 12 .

[0033] The LED substrate 10 can be used to support LED chips and provide power to the LED chips. Specifically, the LED substrate 10 can be made of different materials based on different requirements. For example, it can be a printed circuit board (PCB) suitable for low-power LEDs, a metal substrate such as an aluminum substrate suitable for medium- and high-power LEDs, or a ceramic substrate such as an Al2O3 ceramic substrate, an AlN ceramic substrate, or a BeO ceramic substrate.

[0034] The LED chip can be mounted on the surface of the LED substrate 10. Specifically, the surface of the LED substrate 10 has a mounting area 11 corresponding to the mounting position of the LED chip. The LED chip can be fixed to the mounting area 11 by welding.

[0035] The mounting area 11 can be located at the center of the surface of the LED substrate 10 or within a predetermined light-emitting area. The specific location is not specifically limited in this specification and can be determined based on the specific application and design requirements of the actual product. For example, for a flip-chip substrate, the LED chip is mounted between the positive and negative electrode areas on the surface of the LED substrate 10, and an isolation channel 16 is provided between the positive and negative electrode areas to distinguish polarity. Accordingly, the mounting area 11 can be located between the positive and negative electrode areas and include a portion of the isolation channel 16. For another example, for a face-mounted substrate, the LED chip is mounted on the electrode area on one side with a larger soldering surface, and then connected to the electrode on the other side by a solder wire to form a pathway. In this case, the corresponding mounting area 11 can be located within the electrode area on one side.

[0036] Around the mounting area 11, the surface of the LED substrate 10 is provided with a recess 12. Recess 12 is provided around the mounting area 11 and forms a closed shape. The area enclosed by recess 12 on the surface of the LED substrate 10 may include the mounting area 11, that is, recess 12 encloses the mounting area 11 within its interior. Specifically, recess 12 may be formed by stamping at a corresponding location on the surface of the LED substrate 10, or by other methods such as cutting, etching, or ultrasonic etching, which are not specifically limited in this specification.

[0037] In this embodiment, the groove 12 may be formed on the LED substrate 10 with an outer contour 13 and an inner contour 14. The outer contour 13 or the inner contour 14 may be in a square, circular, elliptical, polygonal, or other shape, and may be flexibly configured according to specific circumstances. The shapes of the outer contour 13 and the inner contour 14 may be the same or different.

[0038] In this embodiment, the portion of the LED substrate 10 located in the peripheral region 26 may be the base 101, or may include the base 101 and other structures disposed on the base 101, such as a metal plating layer, a solder resist layer, etc. Accordingly, the surface of the peripheral region 26 may be the surface of the base 101, or may include the surface of other structures disposed on the base 101, or may include both the surface of the base 101 and the surfaces of other structures disposed on the base 101. This depends on the structure and surface patterning design of the LED substrate 10, as well as the location of the peripheral region 26, and can be flexibly configured according to actual needs, and this specification does not specifically limit this.

[0039] The LED substrate 10 can be used to prepare an LED packaging structure. In some embodiments, a light-shielding glue can be provided around the LED chip to prevent the side light and bottom light of the LED chip from leaking. Specifically, when the light-shielding glue is filled around the LED chip, the light-shielding glue flows around after contacting the LED substrate 10. Part of the light-shielding glue flowing toward the LED chip will adhere to the chip after contacting the LED chip, while the part of the light-shielding glue that does not adhere to the LED chip and flows from the LED chip to the peripheral area 26 will flow into the groove 12, be accommodated in the groove 12, and flow autonomously in the groove 12. In the process of preparing the LED packaging structure using the LED substrate 10, at least part of the light-shielding glue that flows from the LED chip to the peripheral area 26 can be accommodated in the groove 12.

[0040] The outer wall of the groove 12 forms a barrier that limits the flow range of the light-shielding adhesive, so that at least a portion of the light-shielding adhesive flowing toward the peripheral area 26 does not overflow into the peripheral area 26 outside the outer contour 13. Therefore, when filling the encapsulating adhesive, at least a portion of the encapsulating adhesive can directly contact the peripheral area 26 on the LED substrate 10, which can reduce the delamination of the encapsulating adhesive and the light-shielding adhesive in the LED package structure to a certain extent, thereby improving the performance of the LED package structure.

[0041] At the same time, when using existing LED substrates to manufacture LED packaging structures, a large amount of light-shielding glue is used. Therefore, the light-shielding glue may also climb around the LED chip to the chip surface, causing the LED chip to easily suffer from problems such as heat dissipation and poor optical performance. In this embodiment, due to the provision of grooves 12 around the mounting area 11, the light-shielding glue can be drained through the grooves 12, so that the flow range of the light-shielding glue can be limited to the grooves 12 and the area surrounded by the grooves 12. This reduces the amount of light-shielding glue used and improves the fluidity of the light-shielding glue, thereby reducing the risk of the light-shielding glue climbing to the surface of the LED chip to a certain extent.

[0042] In some embodiments, the LED substrate 10 may include a base 101 and a metal coating layer 102 disposed on the base 101 .

[0043] Corresponding to different types of LED substrates 10 , the base 101 can be made of different materials. For example, for a ceramic substrate, the base 101 can be made of aluminum oxide, silicon nitride, silicon carbide, or aluminum nitride.

[0044] The metal coating 102 provides an electrical connection surface for the LED chip, protects the substrate 101, and improves heat dissipation. The metal coating 102 can be made of a metal with good electrical and thermal conductivity, such as copper, nickel, or silver. Specifically, the metal coating 102 can be formed on the substrate 101 by physical vapor deposition (PVD), electroplating, sputtering, or other methods.

[0045] In some embodiments, the surface of the peripheral area 26 is a metal coating 102; in the process of preparing an LED packaging structure using the LED substrate 10, when setting the packaging glue, at least part of the packaging glue can directly contact the metal coating 102 located in the peripheral area 26, so that the packaging glue layer directly covers the metal coating located in the peripheral area.

[0046] During the manufacturing process of the LED packaging structure, since the bonding between the packaging glue and the metal coating 102 is good, when the surface of the peripheral area 26 is the metal coating 102 , the reliability of the LED packaging structure can be improved and the delamination phenomenon can be more effectively reduced.

[0047] In some embodiments, the groove 12 extends from the surface of the metal coating 102 toward the substrate 101 , and the depth of the groove 12 is not less than the thickness of the metal coating 102 .

[0048] The groove 12 can be formed by the metal plating 102 and the substrate 101. The groove 12 can just penetrate the metal plating 102, so that the sidewalls of the groove 12 are part of the metal plating 102 and the bottom of the groove is part of the substrate 101. In this case, the depth of the groove 12 is consistent with the thickness of the metal plating 102. Specifically, the depth can range from 50 to 80 μm. For example, the depth of the groove 12 can be 50 μm, 70 μm, or 80 μm. Of course, in some possible embodiments, the depth of the groove 12 can also be greater than the thickness of the metal plating 102, that is, the groove 12 penetrates the metal plating 102 and passes through a portion of the substrate 101.

[0049] Specifically, the metal plating layer 102 can be punched, etched, or other processes can be used to penetrate the metal plating layer 102 to form a closed groove 12. Of course, in some possible implementations, the groove 12 structure can be retained when the metal plating layer 102 is formed on the substrate 101.

[0050] See also Figure 1 and Figure 2 In some embodiments, the outer contour 13 has a plurality of straight edges, and the corners between adjacent straight edges are rounded.

[0051] like Figure 2 As shown, when the outer contour 13 of the groove 12 has multiple straight edges, that is, the shape is square or polygonal, by setting the position of the corner where the outer contour 13 has straight edges to a rounded transition, the obstruction of the groove wall at the corner to the flow of the light-shielding glue in the groove 12 can be reduced, and the fluidity of the light-shielding glue in the groove 12 can be improved. It can further prevent the light-shielding glue from overflowing to the peripheral area 26, and can reduce the amount of light-shielding glue used, and further reduce the risk of the light-shielding glue climbing to the surface of the chip.

[0052] Optionally, the shape of the outer contour 13 is as follows Figure 1 When the outer contour 13 is circular, the light shielding glue is less obstructed in the flow of the groove 12, and the light shielding glue has better fluidity, thereby having a better effect in reducing delamination and reducing the risk of the light shielding glue climbing onto the chip surface.

[0053] In some embodiments, the groove 12 has a width of not less than 0.1 mm. When the groove 12 has a width less than 0.1 mm, the effect of draining and containing the light-shielding adhesive is poor. Specifically, the groove 12 may have a width of 0.1 mm, 0.2 mm, or even 0.3 mm, which is not specifically limited in this specification.

[0054] Optionally, the groove 12 has a width of 0.15 mm.

[0055] In some embodiments, the distance between any point on the outer contour 13 and any point on the outer edge 15 of the LED substrate 10 is not less than 0.1 mm. If the outer contour 13 is too close to the outer edge 15, the structural strength and electrical performance of the LED substrate 10 may be affected, and the light shielding glue may overflow.

[0056] In some embodiments, the LED substrate 10 may further include a back pad structure, and the size of the pad may be flexibly set according to requirements. For example, the size of the pad may be uniform, or some of the pads may be made into small pads based on specific requirements.

[0057] See also Figure 3 One embodiment of the present specification provides an LED package structure 20, comprising: an LED substrate 10 as described in any of the aforementioned embodiments; an LED chip 21; the LED chip 21 being mounted in the mounting area 11; a light-shielding adhesive layer 22; the light-shielding adhesive layer 22 being disposed on the surface of the LED substrate 10 around the LED chip 21; and an encapsulating adhesive layer 23; the encapsulating adhesive layer 23 being disposed on one side of the surface of the LED substrate 10; wherein the light-shielding adhesive layer 22 is at least partially located within the groove 12; and the encapsulating adhesive layer 23 directly covers at least a portion of the peripheral area 26.

[0058] LED chip 21 serves as the core semiconductor element within LED package 20, converting electrical energy into light. When LED package 20 is operating, current flows through LED chip 21, causing electrons and holes to recombine at the PN junction, releasing energy that is emitted as photons, thereby generating light.

[0059] The light-shielding adhesive layer 22 is disposed on the LED substrate 10 and surrounds the LED chip 21, thereby encapsulating the LED chip 21. The light-shielding adhesive layer 22 prevents light leakage from the sides and bottom of the LED chip 21, blocks side light, prevents light crosstalk, and isolates and protects the LED chip 21. The light-shielding adhesive layer 22 can be made of a light-shielding adhesive. Specifically, the light-shielding adhesive can be made of polyethylene terephthalate, acrylic, epoxy resin, or the like.

[0060] The outer contour 13 can divide the surface of the LED substrate 10 into an inner area 25 and a peripheral area 26; wherein, since the groove 12 limits the flow range of the light-shielding glue, the area of ​​the surface of the LED substrate 10 covered by the light-shielding glue layer 22 can be only located within the inner area 25.

[0061] The encapsulating adhesive layer 23 can be made of molding adhesive, and specific materials include epoxy resin, silicone, polyurethane, etc. Because the groove 12 blocks the light-shielding adhesive, the encapsulating adhesive layer 23 can directly cover at least a portion of the peripheral area 26. This effectively reduces the delamination of the encapsulating adhesive and the light-shielding adhesive. Optionally, the encapsulating adhesive can cover the entire substrate surface, but the size, angle, and shape of the molded circular lens can be set according to the specific usage scenario, and the ball head can be as large as the edge of the peripheral area 26.

[0062] In some embodiments, an isolation trench 16 for distinguishing between positive and negative electrodes may be further provided on the surface of the LED substrate 10. The isolation trench 16 is at least partially located within the mounting area 11 of the LED chip 21. It should be noted that, in some embodiments, at least a portion of the light-shielding adhesive layer 22 is also contained within the isolation trench 16.

[0063] In some embodiments, the groove 12 forms an outer contour 13 on the LED substrate 10; the light-shielding adhesive layer 22 covers the inner area 25 enclosed by the outer contour 13 on the surface of the LED substrate 10; the encapsulation adhesive layer 23 covers the outer peripheral area 26 and the surface of the light-shielding adhesive layer 22 away from the LED substrate 10; wherein the thickness of the part of the light-shielding adhesive layer 22 located outside the groove 12 gradually increases from the outer contour 13 inward.

[0064] In some embodiments, the LED packaging structure 20 further includes a fluorescent film 24; the fluorescent film 24 is arranged on the side of the LED chip 21 away from the LED substrate 10; wherein, the fluorescent film 24 includes a red phosphor layer and a yellow-green phosphor layer; the yellow-green phosphor layer is arranged on the side of the red phosphor layer away from the LED chip 21.

[0065] The fluorescent film 24 can be made of red fluorescent powder and yellow-green fluorescent powder through a layering process, which can improve the problem of uneven distribution of fluorescent powder in the LED packaging structure 20. The red fluorescent powder layer is closer to the light source, which can improve the color concentration and light output effect.

[0066] In some embodiments, the LED packaging structure 20 may further include auxiliary materials such as film glue and flux.

[0067] Embodiments of this specification may provide an LED module comprising an LED package structure as described in any of the aforementioned embodiments. The LED module may serve as a component of an LED display device or lighting device. Specifically, the LED module may further include a control unit, a driver circuit, and electronic components with current limiting and filtering functions. In some embodiments, the LED module may further include other components, such as a polarizer, a CF layer, a TFT layer, and the like.

[0068] The embodiments of this specification may also provide an LED light-emitting device, including the LED packaging structure or LED module as described in any of the aforementioned embodiments. The LED light-emitting device can be a lighting device, and specifically can include lighting fixtures, such as LED filaments, LED light strips, LED special-shaped lights, safety indicator lights, mining lamps, etc., and can also include automotive LED lights, such as position lights, brake lights, turn signals, daytime running lights, atmosphere lights, etc. The lighting device can also include optical components, such as lenses, reflectors, etc., or mounting structures, such as booms, suspension devices, mounting brackets, etc. The LED light-emitting device can also be a display device, and specifically can include LED digital tubes, LED display panels, LED display screens, LED TV walls, etc.

[0069] It should be understood that the specific examples herein are only intended to help those skilled in the art better understand the embodiments of this specification, rather than to limit the scope of the present invention.

[0070] It can be understood that in the various implementations of this specification, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the implementation methods of this specification.

[0071] It can be understood that the various embodiments described in this specification can be implemented individually or in combination, and the embodiments in this specification are not limited to this.

[0072] Unless otherwise indicated, all technical and scientific terms used in the embodiments of this specification have the same meaning as those commonly understood by those skilled in the art in the technical field of this specification. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the scope of this specification. The term "and / or" used in this specification includes any and all combinations of one or more related listed items. The singular forms "a", "above", and "the" used in the embodiments of this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0073] The above description is merely a specific embodiment of this specification, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this specification should be included in the scope of protection of this specification. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An LED packaging structure, characterized in that: The LED packaging structure includes: An LED substrate, wherein a surface of the LED substrate has a mounting area for mounting an LED chip, a groove arranged around the mounting area, and a peripheral area surrounding the groove; LED chip, the LED chip is mounted in the mounting area; A light-shielding adhesive layer, the light-shielding adhesive layer surrounding the LED chip and disposed on the surface of the LED substrate; An encapsulation adhesive layer, the encapsulation adhesive layer being disposed on one side of the surface of the LED substrate; The light shielding adhesive layer is at least partially located in the groove; and the packaging adhesive layer directly covers at least a portion of the peripheral area.

2. The LED packaging structure according to claim 1, wherein: The surface of the peripheral area is a metal plating layer; the packaging glue layer directly covers the metal plating layer located in the peripheral area.

3. The LED packaging structure according to claim 1, wherein: The LED substrate includes a base and a metal plating layer arranged on the base; the groove extends from the surface of the metal plating layer to the base, and the depth of the groove is not less than the thickness of the metal plating layer.

4. The LED packaging structure according to claim 3, characterized in that: The depth of the groove ranges from 50 to 80 μm.

5. The LED packaging structure according to claim 1, wherein: The groove forms an outer contour on the LED substrate; wherein the outer contour has a plurality of straight edges, and the corners between adjacent straight edges are rounded; or, the shape of the outer contour is circular.

6. The LED packaging structure according to claim 5, characterized in that: The groove width of the groove is not less than 0.1 mm; and / or the distance between any point on the outer contour and any point on the outer edge of the LED substrate is not less than 0.1 mm.

7. The LED packaging structure according to claim 1, wherein: The groove forms an outer contour on the LED substrate; the light-shielding adhesive layer covers the inner area enclosed by the outer contour on the surface of the LED substrate; the encapsulation adhesive layer covers the outer peripheral area and the surface of the light-shielding adhesive layer away from the LED substrate; wherein the thickness of the part of the light-shielding adhesive layer located outside the groove gradually increases from the outer contour inward.

8. The LED packaging structure according to claim 1, wherein: The LED packaging structure also includes a fluorescent film; the fluorescent film is arranged on the side of the LED chip away from the LED substrate; wherein, the fluorescent film includes a red phosphor layer and a yellow-green phosphor layer; the yellow-green phosphor layer is arranged on the side of the red phosphor layer away from the LED chip.

9. An LED module, characterized in that: The LED packaging structure comprises the LED packaging structure according to any one of claims 1 to 8.

10. An LED light emitting device, characterized in that: The LED module comprises the LED module as claimed in claim 9.

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