Refrigerating device for sealing device of filter stick forming machine

Abstract

The utility model relates to a refrigeration device for a filter stick forming machine sealer, which comprises a cooling mechanism, a semiconductor refrigeration module and a heat dissipation mechanism, the cooling mechanism comprises a cooling sealing strip and a cooling plate, the cooling sealing strip is provided with a sealing working surface used for being contacted with a filter stick, and the semiconductor refrigeration module is arranged on the cooling sealing strip. The sealing working face extends along a moving path when the filter stick is cooled and is kept parallel to the moving path, the cooling plate is attached to the cooling sealing strip, heat conduction can be conducted between the cooling sealing strip and the cooling plate, and the semiconductor refrigeration module comprises a plurality of semiconductor refrigeration element plates; the semiconductor refrigeration element plates are arranged in the length extending direction of the sealing working face, each semiconductor refrigeration element plate comprises a hot end and a cold end, the cold ends of the semiconductor refrigeration element plates make contact with the cooling plate, heat conduction can be conducted between the cold ends of the semiconductor refrigeration element plates and the cooling plate, and the heat dissipation mechanisms are arranged at the hot ends of the semiconductor refrigeration element plates. And heat dissipation of the hot end can be promoted.

Description

Technical Field

[0001] The utility model relates to the technical field of tobacco packaging, in particular to a refrigeration device for a sealer of a filter rod forming machine. Background Art

[0002] In the cigarette production industry, filter rod forming machines are one of the key equipment, and their performance and efficiency directly affect the quality of cigarette products and the overall production capacity of the production line. The sealer is the core component in the filter rod forming process. It is the mechanism that bonds the filter paper wrapped around the filter tip during filter rod production. The rapid cooling of the filter rod causes the hot melt adhesive to generate bonding force, thereby completing the bonding and forming of the filter rod. Its design and operating efficiency are particularly critical. Currently, various types of filter rod forming machines produced and sold domestically use traditional refrigeration methods. A dedicated chiller is required to provide cooling water to ensure that the filter tip forming paper can be quickly and firmly bonded, thereby completing the formation of the filter rod. However, this solution that relies on a chiller has the following technical problems in actual application: 1. The traditional chiller system is bulky, which not only increases the overall footprint of the filter rod forming machine, but also limits the flexibility of the production line layout. In a modern, compact production environment, this space occupation becomes a significant issue. Secondly, when the filter rod forming machine is turned on, the slow startup of the chiller affects the time required to replace the sealing strip when changing filter rod specifications, thus affecting work efficiency. Thirdly, from an economic perspective, the high price of dedicated chillers directly drives up the overall procurement cost of the filter rod forming machine. This cost burden is particularly heavy for cigarette manufacturers, especially when upgrading equipment or expanding production capacity. Utility Model Content

[0003] In view of the above-mentioned shortcomings of the prior art, the technical problem to be solved by the present invention is to provide a refrigeration device for a filter rod forming machine sealer, which has a compact structure, fast start and stop response speed, and can improve work efficiency.

[0004] To achieve the above-mentioned objectives, the utility model provides a refrigeration device for a filter rod forming machine sealer, comprising a cooling mechanism, a semiconductor refrigeration module and a heat dissipation mechanism, the cooling mechanism comprising a cooling sealing strip and a cooling plate, the cooling sealing strip being provided with a sealing working surface for contacting the filter rod, and the sealing working surface extending along the moving path of the filter rod during cooling and remaining parallel to the moving path, the cooling plate being in abutment with the cooling sealing strip, and heat conduction can be performed between the cooling sealing strip and the cooling plate, the semiconductor refrigeration module comprising a plurality of semiconductor refrigeration element plates, and the plurality of semiconductor refrigeration element plates being arranged along the length extension direction of the sealing working surface, the semiconductor refrigeration element plate comprising a hot end and a cold end, the cold end of the semiconductor refrigeration element plate being in contact with the cooling plate, and heat conduction can be performed between the two, the heat dissipation mechanism being arranged at the hot end of the semiconductor refrigeration element plate, and being able to promote heat dissipation from the hot end.

[0005] Furthermore, the cooling sealing strip and the sealing working surface thereon both extend in a straight line direction.

[0006] Furthermore, a strip-shaped accommodating groove is provided on the cooling plate, the cooling sealing strip is installed in the accommodating groove, and the sealing working surface is located outside the accommodating groove, and the cooling sealing strip is in contact with the wall surface of the accommodating groove.

[0007] Furthermore, the cooling mechanism further comprises a pressing plate fixedly mounted on the cooling plate, and the pressing plate presses and fixes the cooling sealing strip in the accommodating groove.

[0008] Furthermore, it also includes a protective plate, and the two plate surfaces of the cooling plate in the thickness direction are respectively the first plate surface and the second plate surface, the semiconductor refrigeration element plate is arranged on the first plate surface of the cooling plate, and the cooling sealing strip is arranged on the second plate surface of the cooling plate. The two side surfaces of the cooling plate in the width direction are fixedly connected with protective plates, and the semiconductor refrigeration element plate is located between the protective plates on both sides. The protective plate is also provided with a through hole for the wires of the semiconductor refrigeration element plate to pass through.

[0009] Furthermore, the guard plate is made of heat-insulating material.

[0010] Furthermore, a limiting groove is provided on the first plate surface of the cooling plate, and the multiple semiconductor refrigeration element plates of the semiconductor refrigeration module are all located in the limiting groove.

[0011] Furthermore, the heat dissipation mechanism includes a heat dissipation pipe for cooling water to pass through, the length extension direction of the heat dissipation pipe extends along the length of the sealing working surface of the cooling sealing strip, and the heat dissipation working surface of the outer wall of the heat dissipation pipe is in contact with the hot end of the semiconductor refrigeration element plate.

[0012] Furthermore, it also includes a first temperature sensor, which is used to measure the temperature of the heat dissipation working surface of the heat dissipation pipe.

[0013] Furthermore, a second temperature sensor for measuring the temperature of the cooling plate is included.

[0014] As described above, the refrigeration device involved in the present utility model has the following beneficial effects:

[0015] The semiconductor refrigeration element plate is powered on for cooling, so that the cooling sealing strip of the cooling mechanism is kept in a low-temperature state to achieve the cooling of the filter rod. Compared with the existing method of providing low-temperature cold water by a chiller for cooling, the semiconductor refrigeration element plate has a compact structure and occupies a small space, which can effectively reduce the space size of the filter rod forming machine, eliminate the chiller, and reduce manufacturing costs; and the semiconductor refrigeration element plate has a fast response speed when starting and stopping, and can be quickly started and stopped when maintenance and replacement are required, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of the refrigeration device of the present invention.

[0017] Figure 2 This is a schematic structural diagram of the cooling plate, cooling sealing strip and pressing plate in the present invention.

[0018] Figure 3 This is a schematic diagram of the installation of the cooling sealing strip on the cooling plate in the present invention.

[0019] Figure 4 This is a schematic diagram of the installation of the pressing plate crimping the cooling sealing strip in the present invention.

[0020] Figure 5 This is a schematic diagram of the installation of the semiconductor refrigeration element plate on the cooling plate in the present invention.

[0021] Figure 6 This is a structural diagram of the heat dissipation pipeline and the semiconductor refrigeration element plate in the utility model.

[0022] Figure 7 This is a schematic diagram of the refrigeration devices of the present invention arranged in parallel.

[0023] Explanation of Figure Numbers

[0024] 1 Cooling seal strip

[0025] 101 Sealing working surface

[0026] 2 cooling plates

[0027] 201 Accommodating groove

[0028] 3 Semiconductor Refrigeration Module

[0029] 301 semiconductor refrigeration element board

[0030] 4 heat dissipation pipes

[0031] 401 heat sink

[0032] 402 heat dissipation cover

[0033] 403 water pipe connector

[0034] 5 guard plate

[0035] 6. First temperature sensor

[0036] 7 Second temperature sensor

[0037] 8 pressure plate

[0038] 9 Shelves

[0039] 10 Terminal clamp

[0040] 11 Connector DETAILED DESCRIPTION

[0041] The following describes the implementation of the present invention through specific embodiments. People familiar with this technology can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0042] It should be noted that the structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in this specification for the understanding and reading of those familiar with this technology, and are not used to limit the conditions for the implementation of this utility model. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this utility model without affecting the efficacy and purpose of the utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle", etc. quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this utility model. Changes or adjustments in their relative relationships should also be considered as the scope of the implementation of this utility model without substantially changing the technical content.

[0043] See also Figures 1 to 7The utility model provides a refrigeration device for a filter rod forming machine sealer, comprising a cooling mechanism, a semiconductor refrigeration module 3 and a heat dissipation mechanism. The cooling mechanism comprises a cooling sealing strip 1 and a cooling plate 2. The cooling sealing strip 1 is provided with a sealing working surface 101 for contacting the filter rod, and the sealing working surface 101 extends along the movement path of the filter rod during cooling and remains parallel to the movement path. The cooling plate 2 is in contact with the cooling sealing strip 1, and heat conduction can be carried out between the cooling sealing strip 1 and the cooling plate 2. Preferably, the cooling sealing strip 1 and the cooling plate 2 are both made of a metal material with good thermal conductivity; the semiconductor refrigeration module 3 comprises a plurality of semiconductor refrigeration element plates 301, and the plurality of semiconductor refrigeration element plates 301 are arranged along the length extension direction of the sealing working surface 101. The semiconductor refrigeration element plates 301 include a hot end and a cold end. The cold end of the semiconductor refrigeration element plate 301 contacts the cooling plate 2, and heat conduction can be carried out between the two. The heat dissipation mechanism is arranged at the hot end of the semiconductor refrigeration element plate 301 and can promote heat dissipation from the hot end. The semiconductor cooling element plate 301 is of existing design, which uses an electric couple composed of N-type and P-type semiconductor materials to transfer heat from the cold end to the hot end when DC current passes through, thereby achieving a cooling effect. Its specific structure and principle will not be described in detail.

[0044] The basic operating principle of the refrigeration device involved in the present invention is as follows: during operation, each semiconductor refrigeration element plate 301 of the semiconductor refrigeration module 3 is energized, and heat is transferred from the cold end of the semiconductor refrigeration element plate 301 to the hot end. Therefore, the cold end of the semiconductor refrigeration element plate 301 can cool the cooling plate 2, and the cooling plate 2 cools the cooling sealing strip 1 through heat conduction. On the hot end side of the semiconductor refrigeration element plate 301, the heat from the hot end of the semiconductor refrigeration element plate 301 is promptly dissipated through a heat dissipation mechanism, so that the semiconductor refrigeration element plate 301 can continuously and stably cool the cooling plate 2, ensuring that the cooling sealing strip 1 continuously and stably maintains a specified low temperature state. Moreover, multiple semiconductor refrigeration element plates 301 are arranged along the length extension direction of the sealing working surface 101, so that each position of the sealing working surface 101 can maintain a low temperature state. The filter rod to be cooled moves into one end of the sealing working surface 101 and contacts the sealing working surface 101, and always keeps in contact with the sealing working surface 101 during the movement of the filter rod. The filter rod is cooled by the sealing working surface 101, so that the hot melt adhesive generates bonding force to complete the bonding and forming of the filter rod.

[0045] See also Figures 1 to 7 The present invention is further described below with a specific embodiment:

[0046] In this embodiment, see Figure 1 and Figure 2In a filter rod forming machine, the filter rods typically move in a horizontal, straight line during cooling. Accordingly, the cooling and sealing strips 1 and their sealing working surfaces 101 extend in a horizontal, straight line, forming a long, strip-shaped structure. The cooling plate 2 is also preferably a straight, long strip. Of course, in other embodiments, when the filter rods' movement path is in other directions, such as a curve, the cooling and sealing strips 1 and their sealing working surfaces 101 extend along the curve.

[0047] In this embodiment, see Figure 2 、 Figure 3 and Figure 4 As a preferred design, a strip-shaped accommodating groove 201 is opened on the cooling plate 2, the cooling sealing strip 1 is installed in the accommodating groove 201, and the sealing working surface 101 is located outside the accommodating groove 201, and the cooling sealing strip 1 is in contact with the wall surface of the accommodating groove 201. In this way, in addition to the sealing working surface 101, the side surface of the cooling sealing strip 1 can also be kept in contact with the cooling plate 2 as much as possible, thereby increasing the contact area between the two and better realizing heat conduction.

[0048] In this embodiment, see Figure 2 、 Figure 3 and Figure 4 As a preferred design, the cooling sealing strip 1 is detachably mounted on the cooling plate 2. Specifically, the cooling mechanism further includes a pressing plate 8 fixedly mounted on the cooling plate 2, wherein the pressing plates 8 are two long strips and are located on both sides of the accommodating groove 201. The pressing plates 8 are fixedly connected to the cooling plate 2 by bolts. The two pressing plates 8 are respectively pressed on both sides of the cooling sealing strip 1. The pressing plates 8 press the cooling sealing strip 1 tightly and fix it in the accommodating groove 201, and the sealing working surface 101 is exposed from the gap between the two pressing plates 8, without affecting the contact with the filter rod. In this way, the cooling sealing strip 1 can be flexibly replaced according to actual needs to meet the use needs of filter rods of different specifications.

[0049] In this embodiment, see Figure 1 、 Figure 2 and Figure 5As a preferred design, it also includes a guard plate 5. The length extension direction of the cooling plate 2 is the same as the length extension direction of the cooling plate 2. The two plate surfaces of the cooling plate 2 in the thickness direction are respectively a first plate surface and a second plate surface. The semiconductor refrigeration element plate 301 is arranged on the first plate surface of the cooling plate 2, and the cooling sealing strip 1 is arranged on the second plate surface of the cooling plate 2. In actual use, the first plate surface is generally facing upward and the second plate surface is facing downward. The filter rod to be cooled enters the lower side of the sealing working surface 101 of the cooling sealing strip 1. The guard plate 5 is fixedly connected to both side surfaces of the cooling plate 2 in the width direction, and the semiconductor refrigeration element plate 301 is located between the guard plates 5 on both sides. The guard plate 5 is also provided with a through hole for the wires of the semiconductor refrigeration element plate 301 to pass through. The guard plate 5 can effectively protect the cooling plate 2 and the semiconductor refrigeration element plate 301. Further preferably, the guard plate 5 is made of a heat-insulating material, has a good thermal insulation effect, reduces heat conduction on both sides of the cooling plate 2, and ensures the cooling effect.

[0050] In this embodiment, see Figure 5 As a preferred design, a limiting groove is provided on the first plate surface of the cooling plate 2, and multiple semiconductor refrigeration element plates 301 of the semiconductor refrigeration module 3 are all located in the limiting groove, which facilitates the installation and positioning of the semiconductor refrigeration element plates 301.

[0051] In this embodiment, see Figure 1 and Figure 6 As a preferred design, the heat dissipation mechanism includes a heat dissipation pipe 4 for the passage of cooling water. The heat dissipation pipe 4 extends along the length of the sealing working surface 101 of the cooling sealing strip 1. The outer wall of the heat dissipation pipe 4 has a heat dissipation working surface. The heat dissipation working surface is in contact with the hot end of the semiconductor refrigeration element plate 301, and the two can conduct heat. The heat dissipation pipe 4 is preferably made of a metal material with good thermal conductivity. In this embodiment, the heat dissipation pipe 4 is a square pipe, including a heat dissipation base 401 and a heat dissipation cover 402 fixed to the heat dissipation base 401. A water channel for the passage of heat dissipation cooling water is defined between the heat dissipation base 401 and the heat dissipation cover 402. The heat dissipation cover 402 is provided with water pipe connectors 403 at both ends of the length direction for the inlet and outlet of water through the water channel. The bottom plane of the heat dissipation base 401 constitutes the heat dissipation working surface, which is in contact with the hot ends of all semiconductor refrigeration element plates 301. During use, cooling water is introduced into the water channel through the water pipe joints 403 at both ends. Heat is promptly removed from the hot end of the semiconductor cooling element board 301 by heat conduction. The cooling water does not need to be low-temperature, but can be room-temperature water. It only needs to be able to promptly remove heat from the hot end of the semiconductor cooling element board 301, so a water chiller is not required. Of course, the heat dissipation mechanism can also adopt other heat dissipation methods, such as air cooling, as long as the heat from the hot end of the semiconductor cooling element board 301 is promptly removed.

[0052] In this embodiment, see Figure 1 As a preferred design, a first temperature sensor 6 is further included. The first temperature sensor 6 can be provided at both ends of the heat dissipation pipe 4. The first temperature sensor 6 is used to measure the temperature of the heat dissipation working surface of the heat dissipation pipe 4, thereby detecting the heat dissipation effect of the heat dissipation pipe 4. A second temperature sensor 7 is also included to measure the temperature of the cooling plate 2. The second temperature sensor 7 can be provided at both ends of the cooling plate 2 to monitor the cooling effect. Both the first temperature sensor 6 and the second temperature sensor 7 can be resistive temperature sensors, respectively in contact with the heat dissipation working surface and the cooling plate 2. The first temperature sensor 6 and the second temperature sensor 7 can also be other suitable types of sensors.

[0053] In this embodiment, see Figure 1 As a preferred design, an upper frame 9 is fixedly mounted on the upper side of the heat dissipation pipe 4. A wiring clamp 10 is provided on the upper frame 9. The wiring clamp 10 is used to route the wires of the first temperature sensor 6, the second temperature sensor 7, and the semiconductor cooling element board 301. A connecting seat 11 is also provided at the end of the cooling plate 2 that enters the filter rod. The connecting seat 11 can be used to install and secure the first temperature sensor 6 and the second temperature sensor 7.

[0054] See also Figure 7 The refrigeration device involved in the utility model can be used alone or in pairs or in parallel, and can be applied to the dual-channel filter rod forming unit ZL28.

[0055] As can be seen from the above, the refrigeration device of the present invention has the following beneficial effects:

[0056] The semiconductor refrigeration element plate 301 is powered on for cooling, so that the cooling sealing strip 1 of the cooling mechanism is kept in a low-temperature state to achieve cooling of the filter rod. Compared with the existing method of providing low-temperature cold water through a chiller for cooling, the semiconductor refrigeration element plate 301 has a compact structure and occupies a small space, which can effectively reduce the space size of the filter rod forming machine, eliminate the chiller, and reduce manufacturing costs; and the semiconductor refrigeration element plate 301 has a fast response speed when starting and stopping, and can be quickly started and stopped when maintenance and replacement are required, thereby improving work efficiency.

[0057] In summary, the present invention effectively overcomes various shortcomings of the prior art and has high industrial utilization value.

[0058] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by persons skilled in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A refrigeration device for a filter rod forming machine sealer, characterized in that: The invention comprises a cooling mechanism, a semiconductor refrigeration module (3) and a heat dissipation mechanism, wherein the cooling mechanism comprises a cooling sealing strip (1) and a cooling plate (2), wherein the cooling sealing strip (1) is provided with a sealing working surface (101) for contacting a filter rod, and the sealing working surface (101) extends along a moving path of the filter rod during cooling and remains parallel to the moving path, the cooling plate (2) is in contact with the cooling sealing strip (1), and heat conduction can be performed between the cooling sealing strip (1) and the cooling plate (2), wherein the semiconductor refrigeration module (3) comprises a plurality of semiconductor refrigeration element plates (301), and the plurality of semiconductor refrigeration element plates (301) are arranged along a length extension direction of the sealing working surface (101), wherein the semiconductor refrigeration element plates (301) comprise a hot end and a cold end, wherein the cold end of the semiconductor refrigeration element plate (301) contacts the cooling plate (2), and heat conduction can be performed between the two, and the heat dissipation mechanism is arranged at the hot end of the semiconductor refrigeration element plate (301) and can promote heat dissipation at the hot end.

2. The refrigeration device for the filter rod forming machine sealer according to claim 1, characterized in that: The cooling sealing strip (1) and the sealing working surface (101) thereon both extend in a straight line direction.

3. The refrigeration device for the filter rod forming machine sealer according to claim 1 or 2, characterized in that: A strip-shaped receiving groove (201) is provided on the cooling plate (2), the cooling sealing strip (1) is installed in the receiving groove (201), and the sealing working surface (101) is located outside the receiving groove (201), and the cooling sealing strip (1) is in contact with the wall surface of the receiving groove (201).

4. The refrigeration device for the filter rod forming machine sealer according to claim 3, characterized in that: The cooling mechanism further comprises a pressing plate (8) fixedly mounted on the cooling plate (2), wherein the pressing plate (8) presses and fixes the cooling sealing strip (1) in the accommodating groove (201).

5. The refrigeration device for the filter rod forming machine sealer according to claim 1 or 2, characterized in that: The cooling plate (2) further comprises a protective plate (5), wherein the two plate surfaces of the cooling plate (2) in the thickness direction are respectively a first plate surface and a second plate surface, the semiconductor refrigeration element plate (301) is arranged on the first plate surface of the cooling plate (2), the cooling sealing strip (1) is arranged on the second plate surface of the cooling plate (2), the two side surfaces of the cooling plate (2) in the width direction are fixedly connected with the protective plate (5), and the semiconductor refrigeration element plate (301) is located between the protective plates (5) on both sides, and the protective plate (5) is further provided with a through hole for the wires of the semiconductor refrigeration element plate (301) to pass through.

6. The refrigeration device for the filter rod forming machine sealer according to claim 5, characterized in that: The guard plate (5) is made of heat-insulating material.

7. The refrigeration device for the filter rod forming machine sealer according to claim 5, characterized in that: A limiting groove is provided on the first plate surface of the cooling plate (2), and the plurality of semiconductor refrigeration element plates (301) of the semiconductor refrigeration module (3) are all located in the limiting groove.

8. The refrigeration device for the filter rod forming machine sealer according to claim 1, characterized in that: The heat dissipation mechanism comprises a heat dissipation pipe (4) for cooling water to pass through, the heat dissipation pipe (4) extending in a length direction along the length of the sealing working surface (101) of the cooling sealing strip (1), and the heat dissipation working surface of the outer wall of the heat dissipation pipe (4) abuts against the hot end of the semiconductor refrigeration element plate (301).

9. The refrigeration device for the filter rod forming machine sealer according to claim 8, characterized in that: It also includes a first temperature sensor (6), which is used to measure the temperature of the heat dissipation working surface of the heat dissipation pipe (4).

10. The refrigeration device for a filter rod forming machine sealer according to claim 1 or 9, characterized in that: Also included is a second temperature sensor (7) for measuring the temperature of the cooling plate (2).

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