Cleaning equipment for reaction chamber of semiconductor equipment

Abstract

The utility model discloses cleaning equipment for a semiconductor equipment reaction chamber, which comprises a semiconductor main body and a contact cover plate, the inner side of the semiconductor main body is provided with a cavity, the two sides of the semiconductor main body and the cavity are respectively provided with an injection pipe, the outer ends of the injection pipes are respectively provided with an injection regulator, and the injection regulators are connected with the semiconductor main body. A transmission pipe is arranged in the upper portion of the injection pipe and on the outer side of the upper portion of the semiconductor body, a dry powder storage container is arranged at the outer end of the transmission pipe, a communicating groove is formed in the surface of the middle of the contact cover plate, and a supporting ring is arranged in the communicating groove. Dry gas or dry powder stored in the dry powder storage container can be jetted to a part needing to be cleaned through the jet pipe, the pressure of the jetted gas is adjusted through the jet regulator, damage to a cavity or equipment is prevented, and liquid pollution to the interior of the semiconductor body in the liquid cleaning process is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a cleaning device for a reaction chamber of a semiconductor device. Background Art

[0002] Semiconductor equipment reaction chambers are devices that carry out reactions such as material deposition and etching under vacuum conditions. They are one of the most important components in the semiconductor industry. Semiconductor device manufacturing requires multiple reactions, and the design and manufacture of the reaction chamber are crucial to the stability, uniformity, and efficiency of these reactions.

[0003] Currently, the liquid cleaning process inside the reaction chamber of semiconductor equipment is prone to liquid contamination problems and cannot effectively remove particles and dust in the air, which has a certain impact on semiconductor devices. Utility Model Content

[0004] The purpose of the present utility model is to provide a cleaning device for the reaction chamber of a semiconductor device. By providing a spray regulator and a spray pipe, the dry gas or dry powder stored in a dry powder storage container can be sprayed to the part that needs to be cleaned by using the spray pipe. The spray regulator is used to adjust the pressure of the spray gas to prevent damage to the chamber or equipment and avoid liquid contamination of the inside of the semiconductor body during the liquid cleaning process.

[0005] To achieve the above-mentioned object, a cleaning device for a semiconductor device reaction chamber is provided, comprising a semiconductor body and a contact cover plate, wherein a cavity is provided inside the semiconductor body, injection pipes are provided on both sides of the semiconductor body and the cavity, injection regulators are provided on the outer ends of the injection pipes, transfer pipes are provided above the injection pipes and above the outer side of the semiconductor body, and a dry powder storage container is provided on the outer end of the transfer pipes, a connecting groove is provided on the middle surface of the contact cover plate, a support ring is provided inside the connecting groove, cross support frames are provided at the upper and lower ends of the inner side of the support ring, an electric shaft is provided in the middle part of the inner side of the cross support frame, a supply fan is provided on the outer surface of the middle part of the electric shaft, positioning rings are provided at the upper and lower ends of the outer side of the electric shaft, fan-shaped sealing plates are provided on all sides of the inner side of the cross support frame, a base is provided at the bottom of the semiconductor body, a chuck is provided at the middle part above the base, T-shaped clips are provided on both sides of the top of the semiconductor body, T-shaped slots are provided on both sides of the bottom of the contact cover plate, and a drive motor is provided on one side of the top of the contact cover plate.

[0006] According to the cleaning equipment for the reaction chamber of a semiconductor device, the inner wall of the cavity is made of high-purity titanium alloy, the cavity is connected to the front inner side of the semiconductor body by a recessed engagement, two injection tubes and two injection regulators are provided, and the two injection tubes are connected to the outer sides of the semiconductor body by engaging with each other through the two sides of the cavity, and the two injection regulators are fixedly connected to the outer ends of the injection tubes.

[0007] According to the cleaning equipment for the reaction chamber of a semiconductor device, two transmission tubes and two dry powder storage containers are provided, the lower parts of the two transmission tubes are fixedly connected to the inner part of the upper part of the injection tube, and the two dry powder storage containers are fixedly connected to the outer ends of the transmission tubes through fixed contact connections on both sides of the outer surface of the semiconductor body.

[0008] According to the cleaning device for a semiconductor device reaction chamber, the communicating groove is connected to the middle surface of the contact cover plate by interlocking engagement, and the supporting ring is connected to the inner thread of the communicating groove by sealing contact.

[0009] According to the cleaning equipment for the reaction chamber of a semiconductor device, two cross support frames are provided, the middle parts of the inner sides of the two cross support frames are connected to the electric shaft for limited rotation, and the four sides of the inner sides above the cross support frames are sealed and adsorbed with the fan-shaped sealing plate.

[0010] According to the cleaning equipment for the reaction chamber of a semiconductor device, two positioning rings are provided, both of which are fixedly contacted and connected with the top and bottom of the supply fan, and both of which are movably connected with the upper and lower end surfaces of the outer side of the electric shaft, the outer surface of the middle part of the electric shaft is fixedly contacted and connected with the supply fan, the electric shaft is electrically rotationally connected with the drive motor, and the drive motor is fixedly contacted and connected with one side of the top of the contact cover plate.

[0011] According to the cleaning device for the reaction chamber of a semiconductor device, the base is fixedly connected to the bottom of the semiconductor body, the chuck is fixedly connected to the upper middle part of the base, and the chuck is connected to the lower inner side of the semiconductor body through the base.

[0012] According to the cleaning equipment for the reaction chamber of a semiconductor device, two T-shaped clips and two T-shaped grooves are provided, the two T-shaped clips are fixedly contacted and connected with the two sides of the top of the semiconductor body, the two T-shaped grooves are engaged and recessed with the two sides of the bottom of the contact cover plate, and the contact cover plate is engaged and sealed with the top of the semiconductor body through the T-shaped clips and the T-shaped grooves.

[0013] The above scheme has the beneficial effects: through the injection regulator and the injection tube, the dry gas or dry powder stored in the dry powder storage container can be sprayed to the part that needs to be cleaned by using the injection tube, and the injection regulator can adjust the pressure of the injection gas to prevent damage to the chamber or equipment, and avoid liquid contamination of the inside of the semiconductor body during the liquid cleaning process. In addition, the dry gas or dry powder inside the semiconductor body can be blown out of the cavity through the drive motor, electric shaft and air blower, which is convenient for cleaning the inside of the semiconductor equipment and maintaining a dry environment.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0016] Figure 1 This is a schematic structural diagram of a cleaning device for a semiconductor device reaction chamber according to the present invention;

[0017] Figure 2 This is a structural cross-sectional view of a cleaning device for a semiconductor device reaction chamber according to the present invention;

[0018] Figure 3 This is a structural cross-sectional view from another angle of a cleaning device for a semiconductor device reaction chamber according to the present invention;

[0019] Figure 4 This is a schematic structural diagram of a support ring of a cleaning device for a semiconductor device reaction chamber according to the present invention;

[0020] Figure 5 This is a structural cross-sectional view of a support ring of a cleaning device for a semiconductor device reaction chamber according to the present invention.

[0021] Legend:

[0022] 1. Semiconductor body; 2. Base; 3. Contact cover; 4. Drive motor; 5. Connecting groove; 6. T-shaped clip; 7. T-shaped slot; 8. Injection regulator; 9. Dry powder storage container; 10. Fan-shaped sealing plate; 11. Injection pipe; 12. Chuck; 13. Cavity; 14. Support ring; 15. Cross support frame; 16. Electric shaft; 17. Supply fan; 18. Positioning ring; 19. Transmission pipe. DETAILED DESCRIPTION

[0023] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0024] Reference Figure 1-5 The embodiment of the present invention is a cleaning device for a semiconductor device reaction chamber, which includes a semiconductor body 1 and a contact cover 3. A cavity 13 is provided inside the semiconductor body 1. Injection pipes 11 are provided on both sides of the semiconductor body 1 and the cavity 13. Injection regulators 8 are provided on the outer ends of the injection pipes 11. A transmission pipe 19 is provided above the injection pipe 11 and above the outer side of the semiconductor body 1. A dry powder storage container 9 is provided on the outer end of the transmission pipe 19. A connecting groove 5 is provided on the middle surface of the contact cover 3. A support ring 14 is provided inside the connecting groove 5. The upper and lower inner sides of the support ring 14 are provided with a plurality of support rings. A cross support frame 15 is provided at each end, an electric rotating shaft 16 is provided at the middle part of the inner side of the cross support frame 15, a supply fan 17 is provided on the outer surface of the middle part of the electric rotating shaft 16, and positioning rings 18 are provided at the upper and lower ends of the outer side of the electric rotating shaft 16. Fan-shaped sealing plates 10 are provided on all sides of the inner side above the cross support frame 15, a base 2 is provided at the bottom of the semiconductor body 1, a chuck 12 is provided in the middle part above the base 2, T-shaped clips 6 are provided on both sides of the top of the semiconductor body 1, T-shaped grooves 7 are provided on both sides of the bottom of the contact cover plate 3, and a drive motor 4 is provided on one side of the top of the contact cover plate 3.

[0025] The inner wall of the cavity 13 is made of high-purity titanium alloy. The cavity 13 is connected to the inner front of the semiconductor body 1 by a recessed connection. Two injection pipes 11 and two injection regulators 8 are provided. The two injection pipes 11 are connected to the outer sides of the semiconductor body 1 through the two sides of the cavity 13. The two injection regulators 8 are fixedly connected to the outer ends of the injection pipes 11. By setting the injection regulator 8 and the injection pipe 11, the dry gas or dry powder stored in the dry powder storage container 9 can be sprayed to the part that needs to be cleaned by the injection pipe 11. The pressure of the injection gas is adjusted by the injection regulator 8 to prevent damage to the chamber or equipment and avoid excessive liquid cleaning. The process causes liquid contamination inside the semiconductor body 1, and two transmission pipes 19 and dry powder storage containers 9 are provided. The lower parts of the two transmission pipes 19 are fixedly connected to the upper part of the injection pipe 11. The two dry powder storage containers 9 are fixedly connected to the outer ends of the transmission pipes 19 through fixed contact with the surfaces on both sides of the outer surface of the semiconductor body 1. The connecting groove 5 is connected to the middle surface of the contact cover 3 in an interlocking manner. The support ring 14 is in sealed contact with the internal thread of the connecting groove 5. Two cross support frames 15 are provided. The middle part of the inner side of the two cross support frames 15 is connected to the electric shaft 16 for limited rotation. The inner sides of the cross support frames 15 are sealed with the fan-shaped sealing plate 10 on all sides. Adsorption connection, two positioning rings 18 are provided, both positioning rings 18 are fixedly contacted and connected with the top and bottom of the supply fan 17, both positioning rings 18 are movably connected with the upper and lower surfaces of the outer side of the electric shaft 16, the outer surface of the middle part of the electric shaft 16 is fixedly contacted and connected with the supply fan 17, the electric shaft 16 is electrically connected to the drive motor 4, and the dry gas or dry powder inside the semiconductor body 1 can be blown out of the chamber 13 by setting the drive motor 4, the electric shaft 16 and the supply fan 17, so as to facilitate the cleaning of the interior of the semiconductor equipment and maintain a dry environment. The drive motor 4 is fixedly contacted and connected with one side of the top of the contact cover 3, and the base 2 is connected to the semiconductor The bottom of the body body 1 is fixedly contacted and connected, the chuck 12 is fixedly contacted and connected to the middle of the upper part of the base 2, the chuck 12 is contacted and connected to the inner lower part of the semiconductor body 1 through the base 2, and two T-shaped clips 6 and two T-shaped grooves 7 are provided. The two T-shaped clips 6 are fixedly contacted and connected to the two sides of the top of the semiconductor body 1, and the two T-shaped grooves 7 are engaged and recessed with the two sides of the bottom of the contact cover plate 3. The contact cover plate 3 is engaged and sealed with the upper part of the semiconductor body 1 through the T-shaped clips 6 and the T-shaped grooves 7. By setting the T-shaped clips 6 and the T-shaped grooves 7, the contact cover plate 3 can be separated from the semiconductor body 1, which is convenient for the later inspection and maintenance of the internal part of the semiconductor equipment.

[0026] Working principle: Start the injection regulator 8 to adjust the pressure of the injection gas of the injection pipe 11 to prevent damage to the chamber or equipment. The injection pipe 11 can be used to spray the dry gas or dry powder stored in the dry powder storage container 9 to the part that needs to be cleaned, so as to avoid liquid contamination of the interior of the semiconductor body 1 during the liquid cleaning process. The dry gas or dry powder inside the semiconductor body 1 can be blown out of the cavity 13 through the drive motor 4, the electric shaft 16 and the blower fan 17, so as to facilitate the cleaning of the interior of the semiconductor equipment and maintain a dry environment. The above is a detailed description of the embodiment of the utility model in conjunction with the accompanying drawings, but the utility model is not limited to the above embodiment. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the utility model.

Claims

1. A cleaning device for a semiconductor device reaction chamber, comprising: A semiconductor body (1) and a contact cover plate (3), characterized in that a cavity (13) is provided inside the semiconductor body (1), injection tubes (11) are provided on both sides of the semiconductor body (1) and the cavity (13), injection regulators (8) are provided at the outer ends of the injection tubes (11), a transmission tube (19) is provided inside the upper part of the injection tube (11) and outside the upper part of the semiconductor body (1), a dry powder storage container (9) is provided at the outer end of the transmission tube (19), a connecting groove (5) is provided on the middle surface of the contact cover plate (3), a support ring (14) is provided inside the connecting groove (5), and a cross support frame (15) is provided at the upper and lower ends of the inner side of the support ring (14). ), an electric rotating shaft (16) is provided in the middle of the inner side of the cross support frame (15), a supply fan (17) is provided on the outer surface of the middle part of the electric rotating shaft (16), positioning rings (18) are provided at both upper and lower ends of the outer side of the electric rotating shaft (16), fan-shaped sealing plates (10) are provided on all four sides of the inner side above the cross support frame (15), a base (2) is provided at the bottom of the semiconductor body (1), a chuck (12) is provided at the middle part above the base (2), T-shaped clamping strips (6) are provided on both sides of the top of the semiconductor body (1), T-shaped strip grooves (7) are provided on both sides of the bottom of the contact cover plate (3), and a driving motor (4) is provided on one side of the top of the contact cover plate (3).

2. The cleaning device for a semiconductor device reaction chamber according to claim 1, characterized in that: The inner wall of the cavity (13) is made of high-purity titanium alloy. The cavity (13) is connected to the inner front of the semiconductor body (1) by a recessed engagement. Two injection tubes (11) and two injection regulators (8) are provided. The two injection tubes (11) are connected to the outer sides of the semiconductor body (1) by an engagement engagement through the two sides of the cavity (13). The two injection regulators (8) are fixedly connected to the outer ends of the injection tubes (11).

3. The cleaning device for a semiconductor device reaction chamber according to claim 1, wherein: The transmission tubes (19) and the dry powder storage containers (9) are both provided with two, and the lower parts of the two transmission tubes (19) are fixedly connected to the upper part of the injection tube (11), and the two dry powder storage containers (9) are fixedly connected to the outer ends of the transmission tubes (19) through fixed contact connection with the outer surfaces of the semiconductor body (1).

4. The cleaning device for a semiconductor device reaction chamber according to claim 1, wherein: The communication groove (5) is connected to the middle surface of the contact cover plate (3) in an engaging manner, and the support ring (14) is connected to the inner thread of the communication groove (5) in a sealing contact manner.

5. The cleaning device for a semiconductor device reaction chamber according to claim 1, wherein: Two cross support frames (15) are provided, and the middle parts of the inner sides of the two cross support frames (15) are connected to the electric rotating shaft (16) for limited rotation, and the four sides of the inner sides above the cross support frames (15) are all connected to the fan-shaped sealing plate (10) for sealing and adsorption.

6. The cleaning device for a semiconductor device reaction chamber according to claim 5, characterized in that: Two positioning rings (18) are provided, and both positioning rings (18) are fixedly connected to the top and bottom of the supply fan (17). Both positioning rings (18) are movably connected to the upper and lower outer surfaces of the electric rotating shaft (16). The outer surface of the middle part of the electric rotating shaft (16) is fixedly connected to the supply fan (17). The electric rotating shaft (16) is electrically connected to the drive motor (4). The drive motor (4) is fixedly connected to the top side of the contact cover (3).

7. The cleaning device for a semiconductor device reaction chamber according to claim 1, characterized in that: The base (2) is fixedly contacted and connected to the bottom of the semiconductor body (1), the chuck (12) is fixedly contacted and connected to the upper middle portion of the base (2), and the chuck (12) is contacted and connected to the inner lower portion of the semiconductor body (1) through the base (2).

8. The cleaning device for a semiconductor device reaction chamber according to claim 1, characterized in that: Two T-shaped clamping strips (6) and two T-shaped slots (7) are provided, and the two T-shaped clamping strips (6) are fixedly contacted and connected with the two sides of the top of the semiconductor body (1), and the two T-shaped slots (7) are engaged and recessed with the two sides of the bottom of the contact cover plate (3). The contact cover plate (3) is engaged and sealed with the upper part of the semiconductor body (1) through the T-shaped clamping strips (6) and the T-shaped slots (7).

Images