Die for processing movable conducting rod

Abstract

The utility model relates to a movable conducting rod processing mould relates to stamping mould technical field, including including support, mould subassembly, connecting subassembly and fixing subassembly, mould subassembly includes first module and second module, first module and second module are provided with mould cavity, the second module is provided on the support, and the connecting subassembly is connected with the fixing subassembly. The first die block is rotationally connected to the second die block through the connecting assembly, and the fixing assembly is arranged on the first die block and used for fixing the first die block to the second die block. The first die block and the second die block can be opened, and the die can be easily taken out after stamping is completed.

Description

Technical Field

[0001] The present application relates to the technical field of stamping dies, and in particular to a die for processing a movable conductive rod. Background Art

[0002] Stamping is a forming process that uses a press and die to apply external forces to sheet metal, strip, tube, and profiles, causing them to plastically deform or separate, thereby achieving the desired shape and size. Stamping dies are essential and technology-intensive process equipment for stamping production. These tools, made of metal and other rigid materials, are used for forming parts. The quality, production efficiency, and cost of stamped parts are directly related to the design and manufacture of stamping dies.

[0003] A stamping die in the related art, currently, a stamping die disclosed in a Chinese patent announcement with publication date of November 19, 2014 and announcement number CN102744320B, includes an upper die, a lower die and a support seat; the upper die includes an upper male and female die, the lower die includes a lower male and female die, and the upper male and female die cooperate with the lower male and female die; the lower die is installed on the support seat; the lower die also includes a guide device, the guide device is installed on the upper end surface of the lower male and female die, and has a guide portion that can cooperate with the upper male and female die so that the upper male and female die can slide therein. The stamping die provided by the present invention includes an upper die, a lower die and a support seat, the lower die has a guide device, and the guide portion of the guide device cooperates with the upper male and female die of the upper die. Due to the simple structure of the guide device, compared with the prior art, the stamping die omits the structure of the guide column and the guide sleeve, simplifies the overall structure of the stamping die, reduces the difficulty of the processing technology, and reduces production costs.

[0004] However, this stamping die can conveniently guide the cooperation between the upper and lower dies through the guiding parts of the upper convex and concave dies of the upper die to achieve the stamping of the workpiece, but the stamping pressure is high and the object is difficult to remove from the die after the stamping is completed, so it needs to be improved. Utility Model Content

[0005] The embodiment of the present application provides a mold for processing a dynamic conductive rod, which can improve the technical problem in the related art that objects placed in the mold are difficult to remove after stamping is completed.

[0006] An embodiment of the present application provides a mold for processing a dynamic conductive rod, including a bracket, a mold assembly, a connecting assembly and a fixing assembly. The mold assembly includes a first module and a second module. The first module and the second module are both provided with a mold cavity. The second module is arranged on the bracket. The first module is rotatably connected to the second module through the connecting assembly. The fixing assembly is arranged on the first mold block and is used to fix the first mold block on the second mold block.

[0007] The above-mentioned technical solution in the embodiment of the present application has at least the following technical effects: the first module is rotatably connected to the second module through a connecting component, the first module and the second module can be opened, the user places the mold into the mold cavity, and then fixes the first module and the second module through the fixing component. After the stamping is completed, the first module is rotated to open the mold assembly. The mold is only connected to the second module, and half of it is exposed to the air, so the mold can be easily taken out.

[0008] An embodiment of the present application provides a mold for processing a dynamic conductive rod, in which the first module is rotatably connected to the second module through a connecting assembly, and the first module and the second module can be opened. After the stamping is completed, the first module is rotated to open the mold assembly. The mold is only connected to the second module, and half of it is exposed to the air. The mold can be easily taken out, and the setting of the support seat and the upper cover can play a limiting role to prevent the mold assembly from shifting during the stamping process.

[0009] In some embodiments, the mold assembly also includes a first guide shaft and a second guide shaft, the first module includes a first upper mold block and a first lower mold block, the second module includes a second upper mold block and a second lower mold, the first upper mold block and the second upper mold block are rotatably connected by a connecting assembly, the first lower mold block and the second lower mold block are rotatably connected by a connecting assembly, the first upper mold block and the first lower mold block are slidably connected by a first guide shaft, and the second upper mold block and the second lower mold block are slidably connected by a second guide shaft.

[0010] In some embodiments, the connection assembly includes a base, a hinge head, and a connecting column. The base is connected to one side of the first module and the second module by bolts. The hinge head is fixedly connected to the base, and the connecting column is arranged inside the hinge head.

[0011] In some embodiments, the fixing assembly includes a first protrusion, a second protrusion, a rotating column and a bolt cap, the first protrusion is arranged on the side of the first module away from the connecting assembly, the second protrusion is arranged on the side of the second module away from the connecting assembly, the rotating column is arranged on the second protrusion, the rotating column is rotatably connected to the second protrusion, a through groove is provided on the first protrusion, an external thread is provided on the end of the rotating column away from the second protrusion, and the bolt cap is bolted to the external thread.

[0012] In some embodiments, a support seat is further provided on the bracket, a first threaded hole is provided on the support seat, a second threaded hole is provided on the bracket, and the bracket and the support seat are connected by bolts.

[0013] In some embodiments, a first positioning pin is provided on a side of the first lower mold block close to the bracket, and a first positioning groove is provided on a side of the support seat away from the bracket.

[0014] In some embodiments, the mold assembly is further provided with an upper cover, the first upper mold block is provided with a second positioning pin on the side close to the upper cover, the upper cover is provided with a second positioning groove on the side close to the mold assembly, and the upper cover is provided with a support and a connecting ring on the side away from the mold assembly. The support and the connecting ring are slidably connected, and the inner circumference of the connecting ring is provided with an internal thread. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0016] Figure 1 A schematic diagram of the three-dimensional structure of a mold for processing a movable conductive rod provided in an embodiment of the present application;

[0017] Figure 2 for Figure 1 Enlarged view of part A in the middle;

[0018] Figure 3 A schematic diagram of the support structure of a mold for processing a dynamic conductive rod provided in an embodiment of the application;

[0019] Figure 4 A schematic diagram of the upper cover and bottom structure of a mold for processing a dynamic conductive rod provided in an embodiment of the application.

[0020] Among them, the reference numerals in the figures are:

[0021] 100. Bracket; 110. Second threaded hole; 210. First module; 211. First upper mold block; 212. First lower mold block; 220. Second module; 221. Second upper mold block; 222. Second lower mold block; 230. Mold cavity; 240. First guide shaft; 250. Second guide shaft; 310. Base; 320. Hinge; 330. Connecting column; 410. First protrusion; 411. Through groove; 420. Second protrusion; 430. Rotating column; 440. Bolt cap; 510. Support seat; 520. First bolt hole; 610. First positioning pin; 620. First positioning groove; 710. Upper cover; 720. Second positioning pin; 730. Second positioning groove; 740. Pillar; 750. Connecting ring. DETAILED DESCRIPTION

[0022] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are for the purpose of describing specific embodiments only and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the accompanying drawings are intended to cover non-exclusive inclusions.

[0024] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0025] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0027] In this application, "and / or" is simply a way to describe the relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. Additionally, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0028] It should be noted that, in this application, words such as "in some embodiments", "exemplarily", "for example", etc. are used to indicate examples, illustrations or explanations. Any embodiment or design described in this application as "in some embodiments", "exemplarily", "for example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "in some embodiments", "exemplarily", "for example" is intended to present related concepts in a concrete way, meaning that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the above words in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0029] Stamping is a forming process that uses a press and die to apply external forces to sheet metal, strip, tube, and profiles, causing them to plastically deform or separate, thereby achieving the desired shape and size. Stamping dies are essential and technology-intensive process equipment for stamping production. These tools, made of metal and other rigid materials, are used for forming parts. The quality, production efficiency, and cost of stamped parts are directly related to the design and manufacture of stamping dies.

[0030] However, this stamping die can conveniently guide the cooperation between the upper and lower dies through the guiding parts of the upper convex and concave dies of the upper die to achieve the stamping of the workpiece, but the stamping pressure is high and the object is difficult to remove from the die after the stamping is completed, so it needs to be improved.

[0031] Based on this, in order to improve the problem in the related art that objects placed in the mold are difficult to remove after stamping is completed, the embodiments of the present application provide the following solution.

[0032] Please also refer to Figures 1 to 4 An embodiment of the present application provides a mold for processing a dynamic conductive rod, including a bracket 100, a mold assembly, a connecting assembly, and a fixing assembly. The mold assembly includes a first module 210 and a second module 220. A mold cavity 230 is provided on the first module 210 and the second module 220. The second module 220 is arranged on the bracket 100. The first module 210 is rotatably connected to the second module 220 through the connecting assembly. The fixing assembly is arranged on the first mold 210 and is used to fix the first mold 220 on the second mold block.

[0033] From the above, it can be seen that the first module 210 is rotatably connected to the second module 220 through a connecting component. The first module 210 and the second module 220 can be opened. The user puts the mold into the mold cavity 230 therein, and then fixes the first module 210 and the second module 220 through the fixing component. After the stamping is completed, the first module 210 is rotated to open the mold assembly. The mold is only connected to the second module 220, and half of it is exposed to the air, so the mold can be easily taken out.

[0034] In some embodiments, please refer to Figures 1 to 4 The mold assembly also includes a first guide shaft 240 and a second guide shaft 250. The first module 210 includes a first upper mold block 211 and a first lower mold block 212. The second module 220 includes a second upper mold block 221 and a second lower mold. The first upper mold block 211 and the second upper mold block 221 are rotatably connected by a connecting assembly. The first lower mold block 212 and the second lower mold block 222 are rotatably connected by a connecting assembly. The first upper mold block 211 and the first lower mold block 212 are slidably connected by the first guide shaft 240. The second upper mold block 221 and the second lower mold block 222 are slidably connected by the second guide shaft 250.

[0035] With such arrangement, the first upper mold block 211 and the first lower mold block 212 are slidably connected by the first guide shaft 240, and the second upper mold block 221 and the second lower mold block 222 are slidably connected by the second guide shaft 250. When the punch press presses the punch downward, the mold inside the mold cavity 230 will follow the first upper mold block 211, the first lower mold block 212, the second upper mold block and the second lower mold block 222 to move and extrude. After use, the first upper mold block 211, the first lower mold block 212, the second upper mold block and the second lower mold block 222 will return to their original positions and will also drive the mold to move, making it easier to remove the mold.

[0036] Optionally, see Figures 1 to 4 The connecting assembly includes a base 310, a hinge head 320 and a connecting column 330. The base 310 is connected to one side of the first module 210 and the second module 220 by bolts. The hinge head 320 is fixedly connected to the base 310, and the connecting column 330 is arranged inside the hinge head 320.

[0037] With this arrangement, the first module 210 and the second module 220 are hingedly connected via the hinge head 320 and the connecting column 330 disposed inside the hinge head 320 , making it easy to open or close the first module 210 and the second module 220 .

[0038] In some embodiments, see Figures 1 to 4The fixing assembly includes a first protrusion 410, a second protrusion 420, a rotating column 430 and a bolt cap 440. The first protrusion 410 is arranged on the side of the first module 210 away from the connecting assembly, the second protrusion 420 is arranged on the side of the second module 220 away from the connecting assembly, the rotating column 430 is arranged on the second protrusion 420, and the rotating column 430 is rotatably connected to the second protrusion 420. A through groove 411 is provided on the first protrusion 410, and an external thread is provided on the end of the rotating column 430 away from the second protrusion 420, and the bolt cap 440 is bolted to the external thread.

[0039] With such a configuration, when stamping, it is necessary to first close the first module 210 and the second module 220, then engage the rotating column 430 on the second protrusion into the through groove 411 of the first protrusion 410, and then fix it with the bolt cap 440 to prevent the first module 210 and the second module 220 from being opened during the stamping process.

[0040] Optionally, in some embodiments, see Figures 1 to 4 The bracket 100 is further provided with a support seat 510, the support seat 510 is provided with a first threaded hole, the bracket 100 is provided with a second threaded hole 110, and the bracket 100 and the support seat 510 are connected by bolts.

[0041] In this arrangement, a first threaded hole is provided on the support seat 510, and a second threaded hole 110 is provided on the bracket 100. Bolts pass through the first threaded hole and the second threaded hole 110 for bolt connection. When the mold assembly needs to be replaced, the bolts can be unscrewed and replaced directly.

[0042] Optionally, see Figures 1 to 4 The first lower mold block 212 is provided with a first positioning pin 610 on a side close to the bracket 100 , and the support seat 510 is provided with a first positioning groove 620 on a side away from the bracket 100 .

[0043] With such arrangement, during the stamping process, the first positioning pin 610 is pressed down to the first positioning groove, which can prevent the support seat 510 from being offset during the stamping process.

[0044] Optionally, see Figures 1 to 4 The mold assembly is also provided with an upper cover 710. The first upper mold block 211 is provided with a second positioning pin 720 on the side close to the upper cover 710. The upper cover 710 is provided with a second positioning groove 730 on the side close to the mold assembly. The upper cover 710 is provided with a support 740 and a connecting ring 750 on the side away from the mold assembly. The support 740 and the connecting ring 750 are slidably connected, and the inner circumference of the connecting ring 750 is provided with an internal thread.

[0045] With such arrangement, during the stamping process, the second positioning pin 720 is pressed down to the second positioning groove, which can prevent the upper cover 710 from shifting during the stamping process. At the same time, a support 740 and a connecting ring 750 are provided on the upper cover 710, and an internal thread is provided on the inner circumference of the connecting ring 750 to facilitate the connection between the connecting ring 750 and the stamping head.

[0046] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A mold for processing a dynamic conductive rod, characterized by: The invention comprises a bracket (100), a mold assembly, a connecting assembly and a fixing assembly, wherein the mold assembly comprises a first module (210) and a second module (220), wherein the first module (210) and the second module (220) are both provided with a mold cavity (230), the second module (220) is arranged on the bracket (100), the first module (210) is rotatably connected to the second module (220) via the connecting assembly, and the fixing assembly is arranged on the first mold block and is used for fixing the first mold (210) on the second mold (220).

2. A mold for processing a dynamic conductive rod according to claim 1, characterized in that: The mold assembly further comprises a first guide shaft (240) and a second guide shaft (250); the first module (210) comprises a first upper mold block (211) and a first lower mold block (212); the second module (220) comprises a second upper mold block (221) and a second lower mold; the first upper mold block (211) and the second upper mold block (221) are rotatably connected via a connecting assembly; the first lower mold block (212) and the second lower mold block (222) are rotatably connected via a connecting assembly; the first upper mold block (211) and the first lower mold block (212) are slidably connected via a first guide shaft (240); and the second upper mold block (221) and the second lower mold block (222) are slidably connected via a second guide shaft (250).

3. A mold for processing a dynamic conductive rod according to claim 2, characterized in that: The connection assembly includes a base (310), a hinge head (320) and a connecting column (330), wherein the base (310) is fixedly connected to one side of the first module (210) and the second module (220), the hinge head (320) is fixedly connected to the base (310), and the connecting column (330) is arranged inside the hinge head (320).

4. A mold for processing a movable conductive rod according to any one of claims 1 to 3, characterized in that: The fixing assembly includes a first protrusion (410), a second protrusion (420), a rotating column (430) and a bolt cap (440), wherein the first protrusion (410) is arranged on a side of the first module (210) away from the connecting assembly, the second protrusion (420) is arranged on a side of the second module (220) away from the connecting assembly, the rotating column (430) is arranged on the second protrusion (420), the rotating column (430) is rotatably connected to the second protrusion (420), a through groove (411) is provided on the first protrusion (410), an external thread is provided on one end of the rotating column (430) away from the second protrusion (420), and the bolt cap (440) is bolted to the external thread.

5. The mold for processing a movable conductive rod according to claim 4, characterized in that: The bracket (100) is further provided with a support seat (510), a first threaded hole is provided on the support seat (510), a second threaded hole (110) is provided on the bracket (100), and the bracket (100) and the support seat (510) are connected by bolts.

6. The mold for processing a movable conductive rod according to claim 5, characterized in that: A first positioning pin (610) is provided on a side of the first lower mold block (212) close to the bracket (100), and a first positioning groove (620) is provided on a side of the support seat (510) away from the bracket (100).

7. The mold for processing a movable conductive rod according to claim 6, characterized in that: The mold assembly is further provided with an upper cover (710), a second positioning pin (720) is provided on a side of the first upper mold block (211) close to the upper cover (710), a second positioning groove (730) is provided on a side of the upper cover (710) close to the mold assembly, and a support (740) and a connecting ring (750) are provided on a side of the upper cover (710) away from the mold assembly. The support (740) and the connecting ring (750) are slidably connected, and an inner circumferential surface of the connecting ring (750) is provided with an internal thread.

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