Chip assembly and consumable box

Abstract

The utility model provides a chip assembly and a consumable box, the chip assembly is used for being installed in the consumable box and electrically contacting with a contact pin assembly in a printing device, the contact pin assembly comprises a plurality of contact pins, the chip assembly comprises a chip and a covering part, the chip comprises a substrate and a plurality of contact parts arranged on the substrate; the covering part is arranged on the substrate, the covering part covers the contact part, and the covering part at least comprises a first area and a second area which are arranged at an interval; in the first direction, the contact part is at least partially overlapped with the projection of the corresponding first area, and the first area is used for electrically communicating the contact part with the corresponding contact pin; the first region and the second region extend in a direction inclined with respect to the second direction. The utility model is used for solving the problem that a chip provided with a conductive film is high in precision requirement and easily affects the communication effect.

Description

Technical Field

[0001] The utility model relates to the technical field of printing consumables, in particular to a chip component and a consumables box. Background Art

[0002] During communication between the printer and the filament cartridge, ensuring a reliable electrical connection between the printer's contact pins and the chip on the cartridge is crucial. Over extended use, conductive foreign matter (such as ink droplets, metal filaments, or metal debris) can damage the two contact points of the chip, causing a short circuit. This can damage the chip or cause the printer to fail to recognize the filament cartridge.

[0003] In some solutions, a conductive film is integrally mounted on the chip's contact area to achieve electrical connection between the printer's stylus and the chip on the consumables cartridge, while also preventing short circuits between adjacent contact areas. However, existing technologies place high demands on the conductive film's machining precision and the tolerances required for the film-to-chip assembly process. Specifically, the width of each conductive film's target conductive portion must perfectly match the width of the corresponding chip contact area, and the width of each insulating portion must also perfectly match the distance between adjacent contact areas to ensure proper communication between the printer's stylus and the chip. Failure to do so can easily affect the stability and accuracy of communication within the conductive film printing device.

[0004] Therefore, there is an urgent need to solve the problem that chips with conductive films installed have high precision requirements and are prone to affecting communication effects. Utility Model Content

[0005] The utility model provides a chip assembly and a consumable material box, which are used to solve the problem that chips with conductive films installed have high precision requirements and are prone to affect communication effects.

[0006] In order to achieve the above-mentioned object, the present invention provides a chip assembly for being installed in a consumables box and electrically contacting a stylus assembly in a printing device, wherein the stylus assembly includes a plurality of styluses, and the chip assembly includes:

[0007] A chip comprising a substrate and a plurality of contact portions disposed on the substrate;

[0008] a cover member, the cover member being disposed on the substrate and covering the contact portion, the cover member comprising at least a first region and a second region arranged in an interval manner;

[0009] Along the first direction, the contact portion at least partially overlaps with a projection of the corresponding first region, and the first region is used to electrically connect the contact portion with the corresponding contact pin;

[0010] The first region and the second region extend along a direction inclined with respect to the second direction.

[0011] The present invention provides a chip component, wherein the cover includes at least a first area and a second area arranged in an interval manner, the first area being used to electrically connect the contact part with the corresponding contact pin, and the first area and the second area extending in a direction inclined relative to the second direction, which can increase the contact area between the contact pin and the first area, reduce the processing accuracy requirements for the cover, and solve the problems of short circuit between the contact parts of the chip or inability to communicate stably between the chip and the printing device caused by insufficient processing accuracy of the cover and large errors in the installation process between the cover and the chip. The present application can also improve the safety of the chip component in use and the stability and reliability of communication with the printing device, and reduce the difficulty of processing and assembly.

[0012] Furthermore, because the cover comprises at least a first region and a second region arranged in an interval manner, the first region is used to contact the contact pins and corresponding contact parts of the printing device to achieve electrical connection, while the second region does not contact the contact parts, and the first and second regions are disconnected. This eliminates the need for additional noise reduction circuitry or interference shielding logic, effectively shielding signal interference between the chip's contact parts and physically cutting off the propagation path of interference signals, thus avoiding signal loss, delay, bit error rate, or logical function disturbances. This improves the accuracy and anti-interference performance of data or command transmission between the chip assembly and the printing device, ensuring communication stability and accuracy and enhancing communication effectiveness.

[0013] In a possible implementation, the first regions and the second regions are both divided into multiple groups, the second region is blocked between two adjacent groups of the first regions, and the first regions and the second regions are not connected to each other.

[0014] In a possible implementation, the substrate has a first surface, the plurality of contact portions are arranged at intervals on the first surface, and the cover faces at least a portion of the first surface.

[0015] In a possible implementation, the first region and the second region each include at least two conductive portions, and along the first direction, the contact portion at least partially overlaps with projections of the conductive portions of the first region.

[0016] In a possible implementation, the first region and the second region both further include an insulating portion, the insulating portion blocking two adjacent conductive portions, the conductive portion not conducting with the insulating portion, and the contact pin not conducting with the insulating portion.

[0017] In a possible implementation, the insulating portion extends along a direction inclined relative to the second direction;

[0018] The conductive portion extends in a direction inclined with respect to the second direction.

[0019] In a possible implementation, along the first direction: each of the contact portions partially overlaps with a projection of at least one of the conductive portions in the corresponding first region, and each of the contact portions does not overlap with a projection of the second region;

[0020] Each of the contact pins is electrically connected to the corresponding contact portion through at least one conductive portion located in the first area.

[0021] In a possible implementation, along the first direction, the contact portion partially overlaps with projections of the plurality of conductive portions in the corresponding first region.

[0022] In one possible implementation, the cover is detachably connected to the substrate, and the cover is at least partially formed of a conductive material.

[0023] In a possible implementation, the plurality of contact portions include a plurality of first contact portions and at least one second contact portion, and the first contact portion and the second contact portion are respectively in electrical contact with at least one of the conductive portions in the corresponding first region.

[0024] In one possible implementation, the substrate has a center line A1 extending along the second direction to divide the substrate into a left area and a right area;

[0025] The first contact portion and the second contact portion are respectively arranged in the left area and the right area; or,

[0026] The first contact portion and the second contact portion are both arranged in the left area; or,

[0027] The first contact portion and the second contact portion are both arranged in the right area.

[0028] The utility model provides a consumables box, comprising a box body and the above-mentioned chip component, wherein the chip component is arranged on the box body.

[0029] The present application provides a chip assembly and consumables box. Since the contact pin will be deformed to a certain extent when it contacts the cover, the provision of an insulating portion can reduce the wear or scratch problem of the contact portion between the contact pin and the chip.

[0030] The present application provides a chip assembly and consumables box. Since the first area and the second area extend in a direction inclined relative to the second direction, and since the first area and the second area respectively include at least two conductive parts, the contact pin can contact multiple conductive parts. Even if some conductive parts are worn and fail due to frequent friction of the contact pin, the contact pin can still ensure the stability of communication between the printing device and the chip assembly by contacting the remaining conductive parts.

[0031] In addition to the technical problems solved by the embodiments of the present invention described above, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions, other technical problems that can be solved by an electronic device provided by the embodiments of the present invention, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 A schematic diagram of the three-dimensional structure of the chip assembly and the contact pin assembly provided in an embodiment of the present utility model;

[0034] Figure 2 A schematic diagram of the three-dimensional structure of a chip assembly provided in an embodiment of the present utility model;

[0035] Figure 3 An exploded view of a chip assembly provided in an embodiment of the present utility model;

[0036] Figure 4 A front view of a chip assembly provided by an embodiment of the present utility model;

[0037] Figure 5 A right side view of the chip assembly and the contact pin assembly provided in an embodiment of the present utility model;

[0038] Figure 6 A top view of a chip assembly provided in an embodiment of the present utility model;

[0039] Figure 7 for Figure 6 A magnified view of the structure at point A;

[0040] Figure 8 This is a structural diagram of the chip of the chip assembly provided in an embodiment of the present utility model.

[0041] Description of reference numerals:

[0042] 10-chip;

[0043] 11-Substrate;

[0044] 12-contact part;

[0045] 121-first contact portion;

[0046] 122- second contact portion;

[0047] 13- storage element;

[0048] 14-Left zone;

[0049] 15-right zone;

[0050] 111- first surface;

[0051] 112- second surface;

[0052] 20-covering piece;

[0053] 21-First area;

[0054] 211-conduction part;

[0055] 212-insulation part;

[0056] 22-Second area;

[0057] 30- stylus;

[0058] 31- first contact pin;

[0059] 32- Second contact pin. DETAILED DESCRIPTION

[0060] To make the purpose, technical solutions, and advantages of the present invention more clear, the following will be combined with the accompanying drawings to clearly and completely describe the technical solutions of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0061] In the related art, a carbon film is installed as a whole on the contact part of the chip. Since the carbon film itself is conductive and the resistance of the area on the carbon film that contacts the corresponding contact pin and the contact part is small, the resistance between adjacent contact parts is large. Therefore, it is possible to ensure that the contact part and the contact pin are electrically connected while avoiding short circuits between adjacent contact parts.

[0062] However, since the carbon film covers the data, reset, power and clock contact parts at the same time, and due to the high frequency and rapid change characteristics of the clock signal, it is easy to generate electromagnetic radiation and conduction interference, which can easily affect the stability of other signal transmissions and the accuracy of data signal transmission, thereby causing the consumable box chip to be unable to accurately identify and execute the printing device instructions, affecting the communication effect between the consumable box chip and the printing device.

[0063] To solve the above problem, a conductive film is installed on the surface of the chip. The conductive film is constructed as a conductive grid with conductive parts and insulating parts arranged continuously in an intermittent manner. One side of the conductive part contacts the contact part of the chip, and the other side contacts the corresponding contact pin of the printing device, which is used to achieve normal communication between the chip and the printing device. Since adjacent contact parts are separated from each other by insulating parts, short circuits and signal interference between the contact parts can be avoided.

[0064] However, when this type of chip is used, the conductive part and the insulating part in the conductive film are arranged at intervals in a direction parallel to the contact part on the chip, and the processing accuracy requirements for the conductive film and the error requirements for the conductive film and chip installation process are relatively high. That is, it is necessary to ensure that the width of each target conductive part needs to be fully adapted to the width of the corresponding contact part on the chip, and the width of each insulating part also needs to be fully adapted to the distance size between the two adjacent contact parts on the chip to ensure normal communication between the printing device contact pin and the chip. If the width of the conductive part is too large, one conductive part may cover two adjacent contact parts at the same time, which may cause a short circuit between the contact parts when the chip is in use. Or if the width of the insulating part is greater than the width of the conductive part, the contact pin will directly contact the insulating part, causing the consumable box chip and the printing device to be unable to communicate, affecting the normal use of the consumable box.

[0065] In the present application, since the cover includes at least two groups of first areas and a second area blocked between the two adjacent groups of first areas, the first area is used to electrically connect the contact part with the corresponding contact pin, the first area and the second area extend along a direction inclined relative to the second direction, and the first area and the second area respectively include at least two conductive parts, which increases the contact area between the first area and the contact part, and can effectively reduce the processing accuracy requirements for the cover and the installation process error requirements between the cover and the chip. It is no longer necessary to ensure that the width of each conductive part needs to be fully adapted to the width of the corresponding contact part, and it is no longer necessary to ensure that the width of each insulating part is fully adapted to the distance between the two adjacent contact parts. Normal communication between the contact pin and the chip of the printing device can still be achieved.

[0066] The chip assembly and consumables box provided by the embodiments of the present invention are described below with reference to the accompanying drawings.

[0067] For a better description of the chip components and consumables box, refer to Figure 1 and Figure 2 As shown, a coordinate system is established: the width direction of the chip 10 is the X-axis direction, the height direction of the chip is the Y-axis direction, and the thickness direction of the chip 10 is the Z-axis direction, wherein the X-axis, Y-axis and Z-axis are perpendicular to each other.

[0068] In this example, the first direction is the direction indicated by the +Z axis, and the first direction is referenced to the thickness direction of chip 10; the second direction is the direction indicated by the +Y axis, and the second direction is referenced to the height direction of chip 10; and the third direction is the direction indicated by the +X axis, and the third direction is referenced to the width direction of chip 10. The angle between the first, second, and third directions can be 90°. In other possible implementations, the angle between the first, second, and third directions can be 80° to 100°, for example, 80°, 85°, 90°, 95°, or 100°.

[0069] refer to Figure 1 and Figure 2 As shown, the present invention provides a chip assembly for installation in a consumables box and for electrical contact with a stylus assembly in a printing device. The stylus assembly includes a plurality of stylus pins 30. Figure 3 and Figure 4 As shown, the chip assembly includes: a chip 10 and a cover 20, the chip 10 includes a substrate 11 and a plurality of contact portions 12 arranged on the substrate 11, the cover 20 is arranged on the substrate 11, and the cover 20 covers the contact portions 12, and the cover 20 includes at least a first area 21 and a second area 22 arranged in an interval manner.

[0070] The substrate 11 has a first surface 111, with a plurality of contact portions 12 spaced apart on the first surface 111. The cover 20 faces at least a portion of the first surface 111. The first surface 111 is the side of the substrate 11 facing away from the consumables box. The substrate 11 also has a second surface 112 facing the consumables box. The first surface 111 and the second surface 112 are opposite sides of the substrate 11.

[0071] refer to Figure 2 、 Figure 3 and Figure 4 As shown, the cover 20 is disposed on the first surface 111 and covers the contact portion 12 . The cover 20 includes at least two groups of first regions 21 and a second region 22 separated between the two adjacent groups of first regions 21 .

[0072] refer to Figure 1 and Figure 2As shown, along the first direction, i.e., the Z-axis, the projections of the contact portion 12 and the corresponding first region 21 at least partially overlap. The first region 21 is used to electrically connect the contact portion 12 with the corresponding contact pin 30. The first region 21 and the second region 22 extend along a direction inclined relative to the second direction, i.e., the Y-axis. That is, the extension directions of the first region 21 and the second region 22 both form an angle with the second direction.

[0073] The present invention provides a chip component, in which the cover 20 includes at least a first area 21 and a second area 22 arranged in an interval manner, the first area 21 electrically connects the contact portion 12 with the corresponding contact pin 30, and the first area 21 and the second area 22 extend in a direction inclined relative to the second direction, which can increase the contact area between the contact pin 30 and the first area 21, reduce the processing accuracy requirements for the cover 20, and solve the problems of short circuit between the contact portion 12 of the chip 10 or inability to communicate stably between the chip 10 and the printing device caused by insufficient processing accuracy of the cover 20 and large installation process errors between the cover 20 and the chip 10. The present application can also improve the safety of the chip component in use and the stability and reliability of communication with the printing device, and reduce the difficulty of processing and assembly.

[0074] In addition, reference Figure 1 and Figure 2 As shown, the present application comprises at least a first region 21 and a second region 22 arranged in an interval manner. That is, by isolating the second region 22 between two adjacent groups of first regions 21, the first region 21 is used to contact the contact pins 30 of the printing device and the corresponding contact portion 12 to achieve electrical connection, while the second region 22 does not contact the contact portion 12, and the first region 21 and the second region 22 are disconnected. Without the need for additional noise reduction circuitry or interference shielding logic, the present application can effectively shield signal interference between the contact portions 12 of the chip 10, physically cut off the propagation path of the interference signal, and avoid signal loss, delay, bit error rate, or logical function disorder. This improves the accuracy and anti-interference performance of data or command transmission between the chip component and the printing device, ensuring the stability and accuracy of communication and enhancing the communication effect.

[0075] When the consumables box is detachably installed on the printing device, the chip assembly moves synchronously with the consumables box. The installation direction of the chip assembly on the printing device is the height direction of the chip, that is, the second direction.

[0076] In one possible implementation, the number of contact portions 12 may be, for example, five, with the five contact portions 12 being a power terminal, a ground terminal, a clock terminal, a data terminal, and a chip select terminal. Typically, the ground terminal is spaced relatively far from the other connection terminals. Of course, in other possible implementations, the number of contact portions 12 may be, for example, eight or ten.

[0077] The multiple contact portions 12 may be arranged in a plurality of rows and a plurality of columns. For example, when the number of the contact portions 12 is 5, the multiple contact portions 12 may be arranged in three rows and two columns.

[0078] During the production of chip components, solder may fall between two connection terminals during the PCB patch production process. Since solder and other solder materials have conductive properties, once solder drips between the two connection terminals, it will cause a short circuit between the two connection terminals.

[0079] In one possible implementation, cover 20 is a solder-resistant conductive protective film, such as a carbon film. The protective film is conductive and thin enough to conduct electrical signals. Due to its surface properties, cover 20 resists solder adhesion, preventing short circuits caused by dripping solder.

[0080] The cover 20 is made of a material with a certain conductivity but also a certain resistance, so that the signal sent from the printing device will not be strongly attenuated after passing through the cover 20, thereby ensuring the signal transmission effect between the contact pin 30 of the printing device and the contact part 12 of the chip 10.

[0081] refer to Figure 2 and Figure 3 As shown, along the first direction, the projections of each contact portion 12 and the corresponding first area 21 at least partially overlap, so that when the cover 20 is set on the first surface 111, the contact portion 12 is in direct contact with the corresponding group of first areas 21, ensuring the electrical conduction effect between the contact portion 12 and the corresponding group of first areas 21, so that the contact pin 30 contacts the first area 21 through the contact pin 30 to achieve the corresponding electrical conduction effect with the contact portion 12.

[0082] The cover 20 can be fixed to the first surface 111 of the substrate 11 by gluing, snapping, welding, etc., or the cover 20 can be connected to the substrate 11 by integral molding to ensure that the first area 21 of the cover 20 is in direct or indirect contact with the contact portion 12 to achieve electrical conduction.

[0083] In the chip 10, the number of first regions 21 can be the same as the number of contact portions 12, ensuring a one-to-one correspondence between the first regions 21 and the contact portions 12. The number of first regions 21 is not specifically limited here and can be flexibly selected according to usage needs.

[0084] In one possible implementation, each contact portion 12 corresponds to one of the multiple groups of first regions 21, and the first regions 21 and second regions 22 are not electrically connected to each other. With this structure, even if all contact portions 12 of the chip 10 are covered by the same cover 20, the physical isolation of the first regions 21 by the second regions 22 can isolate the clock terminals from clock signal interference, preventing electromagnetic interference from the clock terminals to the data terminals.

[0085] In one possible implementation, reference Figure 3 、 Figure 6 and Figure 7 As shown, the first region 21 and the second region 22 each include at least two conductive portions 211. Along the first direction, i.e., along the thickness direction of the chip 10, the projections of the contact portion 12 and the conductive portions 211 of the first region 21 at least partially overlap. This is to ensure that the position of the contact portion 12 corresponds to the position of the conductive portions 211 of the first region 21, facilitating contact between the contact portion 12 and the conductive portions 211 of the first region 21.

[0086] refer to Figure 2 、 Figure 6 and Figure 7 As shown, since the first area 21 and the second area 22 respectively include at least two conductive portions 211, and the at least two conductive portions 211 of the first area 21 are electrically connected to the contact portion 12, the number of conductive portions 211 that can be contacted by the stylus 30 increases, thereby increasing the effective contact area between the stylus 30 and the conductive portions 211. This structure enables the stylus 30 to contact multiple conductive portions 211. Even if some conductive portions 211 are worn out and fail due to frequent friction between the stylus 30, the stylus 30 can still contact the remaining conductive portions 211, thereby ensuring the stability of communication between the printing device and the chip component.

[0087] The number of conductive portions 211 in the first region 21 can be flexibly set according to usage needs, for example, it can be 2, 3, 4, or 5, and the number of conductive portions 211 in the second region 22 can be flexibly set according to usage needs, for example, it can be 2, 3, 4, or 5, etc. The number of conductive portions 211 in the first region 21 and the second region 22 can be different.

[0088] In a possible implementation, the conductive portion 211 may be made of metal, such as a copper sheet or a copper bar. Of course, the conductive portion 211 may also be a conductive silicone sheet, wherein the conductive silicone sheet includes a mixture of silicone particles and carbon particles.

[0089] In one possible implementation, reference Figure 2 、 Figure 6 and Figure 7 As shown, the first region 21 and the second region 22 also include an insulating portion 212. The insulating portion 212 blocks two adjacent conductive portions 211. The conductive portions 211 and the insulating portion 212 are not connected, and the contact pins 30 are not connected to the insulating portion 212. The insulating portion 212 has a good insulation effect.

[0090] In addition, since at least a portion of the cover 20 can produce a certain amount of deformation when the contact pin 30 and the cover 20 contact each other, the problem of wear and scratches on the contact pin 30 or the contact portion 12 caused by the contact between the contact pin 30 and the contact portion 12 of the chip 10 in the prior art can be avoided.

[0091] In one possible implementation, the conductive portion 211 includes a conductive silicone sheet, which is mainly composed of silicone and carbon. The silicone particles and conductors such as carbon are first mixed, and then the clinker is continuously rolled to form a conductive silicone sheet. The insulating silicone sheet and the conductive silicone sheet are alternately layered and stacked, and then vulcanized to form a covering part 20. The covering part 20 is in the shape of a zebra strip, and has the advantages of stable and reliable performance, and convenient and efficient production and assembly.

[0092] The main components of the conductive part 211 include silicone and silicone soft glue. When the contact part 12 contacts the contact pin 30, the conductive part 211 can produce a certain deformation, which will not cause the conductive part 211 to be worn. This avoids the problem of the contact part 12 on the chip 10 being worn or scratched in the prior art, which affects the communication stability, and is conducive to ensuring the communication effect.

[0093] refer to Figure 2 、 Figure 6 and Figure 7 As shown, each contact portion 12 is separated from each other by the insulating portion 212 , so it is not easily contaminated by dust, impurities, etc., reducing the possibility of short circuit between the contact portions 12 .

[0094] The cover 20 can also be manufactured in the following manner: the insulating portion 212 is made of an insulating silicone sheet, and the conductive portion 211 is made of a conductive metal sheet. The insulating silicone and conductive metal sheets are alternately layered and stacked to form a zebra stripe pattern. In this structure, the insulating portion 212 has a certain degree of deformation. When the contact portion 12 contacts the stylus 30, the cover 20 is squeezed, and the insulating portion 212 deforms, which also prevents the conductive portion 211 from being worn.

[0095] In a possible implementation, the insulating portion 212 extends along a direction inclined relative to the second direction. The second direction is consistent with the height direction of the chip 10. Figure 1 and Figure 2 The arrow Y indicates the direction.

[0096] In one possible implementation, the extending direction of the insulating portion 212 may be inclined at an angle of 20° to 70° relative to the second direction, for example, 20°, 30°, 35°, 40°, 45°, 50°, 60°, 70°, etc.

[0097] In a possible implementation, the conducting portion 211 extends along a direction inclined relative to the second direction.

[0098] In one possible implementation, the extending direction of the conductive portion 211 may be inclined at an angle of 20° to 70° relative to the second direction, for example, 20°, 30°, 35°, 40°, 45°, 50°, 60°, 70°, etc.

[0099] The width and length of the conductive portion 211 can be flexibly set according to usage requirements. The insulating portion 212 separates the two adjacent conductive portions 211 to ensure that the two adjacent conductive portions 211 are not connected, that is, there is no signal transmission between the two adjacent conductive portions 211, thereby preventing the two adjacent conductive portions 211 from being connected through the insulating portion 212.

[0100] In one possible implementation, reference Figure 2 、 Figure 6 and Figure 7 As shown, along the first direction, i.e., the thickness direction of the chip 10, the projections of each contact portion 12 and at least one conductive portion 211 in the corresponding first area 21 partially overlap, in order to ensure that the positions of each contact portion 12 and at least one conductive portion 211 in the corresponding first area 21 correspond to each other, and to prevent misalignment from affecting the electrical conduction effect.

[0101] Along the first direction, projections of each contact portion 12 and the second region 22 do not overlap, in order to prevent electrical conduction between the second region 22 and the contact portion 12 of the chip.

[0102] Each contact pin 30 is electrically connected to the corresponding contact portion 12 via at least one conductive portion 211 located in the first area 21 , thereby ensuring a communication effect.

[0103] In one possible implementation, along a first direction, i.e., along the thickness direction of the chip 10, the projections of the contact portion 12 and the corresponding plurality of conductive portions 211 in the first region 21 partially overlap. This is to increase the contact area between the contact portion 12 and the corresponding plurality of conductive portions 211 in the first region 21.

[0104] In one possible implementation, reference Figure 1 、 Figure 2 and Figure 3 As shown, the cover 20 is detachably connected to the substrate 11 , and the cover 20 is at least partially formed of a conductive material. In this example, the cover 20 is detachably connected to the first surface 111 of the substrate 11 , and the cover 20 is a conductive film.

[0105] In one possible implementation, the multiple contact pins 30 of the contact pin assembly include a first contact pin 31 and a second contact pin 32, and the multiple contact portions 12 of the chip 10 include a plurality of first contact portions 121 and at least one second contact portion 122, and the first contact portions 121 and the second contact portions 122 are respectively electrically contacted with at least one conductive portion 211 in the corresponding first region 21.

[0106] The first contact portion 121 and the second contact portion 122 are both located on the first surface 111. The first contact portion 121 is used to electrically connect to the corresponding first contact pin 31, and the second contact portion 122 is used to electrically connect to the corresponding second contact pin 32. The plurality of first contact portions 121 can be arranged in a plurality of rows and columns.

[0107] In one possible implementation, reference Figure 8 As shown, the substrate 11 has a center line A1 extending along the second direction to divide the substrate 11 into a left area 14 and a right area 15;

[0108] The first contact portion 121 and the second contact portion 122 are arranged in the left area 14 and the right area 15, respectively; or, the first contact portion 121 and the second contact portion 122 are both arranged in the left area 14; or, the first contact portion 121 and the second contact portion 122 are both arranged in the right area 15. The center line A1 extends along the height direction of the substrate 11, and the center line A1 is a virtual center line in the length direction of the substrate 11. Such a structure makes the structure of the chip assembly in the present application diverse and the arrangement position of the contact portion 12 more flexible. In addition, by arranging all the first contact portion 121 and the second contact portion 122 in the left area 14 or the right area 15, the area of ​​the substrate 11 can be reduced, and the production cost of the chip 10 can be reduced.

[0109] In one possible implementation, the cover 20 covers the entire first surface 111. Of course, the cover 20 may also cover only a portion of the first surface 111. For example, if the first contact portion 121 and the second contact portion 122 are both located in the left area 14, the cover 20 only covers the left area 14. If the first contact portion 121 and the second contact portion 122 are both located in the right area 15, the cover 20 only covers the right area 15, thereby saving material and cost for the cover 20.

[0110] In one possible implementation, reference Figure 5 and Figure 6 As shown, chip 10 further includes a storage element 13, which is disposed on substrate 11. At least some of the plurality of contact portions 12 are electrically connected to storage element 13. Substrate 11 further includes a second surface 112 facing the consumables box, and a processor may also be disposed on second surface 112. Storage element 13 may be disposed on first surface 111 or second surface 112 of the consumables box.

[0111] The storage element 13 is a non-volatile memory, such as EEPROM or FLASH, which stores information related to the ink cartridge, including variable information and constant information. Variable information is information that changes continuously with the printing operation, such as the remaining ink level, printing time, etc. The constant information is information that does not change with the printing operation, such as the ink cartridge model, applicable printing device model, ink color, etc.

[0112] Since all the contact parts 12 in the chip assembly of this embodiment are covered by the cover 20, even if conductive foreign matter such as solder and ink drips onto the surface of the chip 10, it will not cause a short circuit between any two contact parts 12, thereby improving safety of use.

[0113] The present invention also provides a consumables box, comprising a box body and the aforementioned chip assembly, wherein the chip assembly is disposed within the box body. By installing the consumables box within the mounting portion of a printing device, contact pins 30 of the printing device contact contact portions 12 of the chip assembly, thereby facilitating the mutual transmission of electrical signals and information exchange between the printing device and the chip 10.

[0114] In one possible implementation, the printing device may be, for example, a printer, a copier, etc. The consumables box may be, for example, an ink cartridge. The box body may be used to store printing media and provide the printing media to the printing device. The structure of the box body is not specifically limited herein.

[0115] The present application provides a chip assembly and consumables box. Since the first area 21 and the second area 22 extend in a direction inclined relative to the second direction, and since the first area 21 and the second area 22 respectively include at least two conductive portions 211, the contact pin 30 can contact multiple conductive portions 211. Even if some conductive portions 211 are worn out and fail due to frequent friction between the contact pin 30, the contact pin 30 can still ensure the stability of communication between the printing device and the chip assembly by contacting the remaining conductive portions 211.

[0116] In one possible implementation, the box body has an ink outlet, and the interior of the box body is used to store printing media, such as toner or ink. The printing media stored in the box body flows out from the ink outlet and is supplied to the ink supply unit of the printing device.

[0117] When the cartridge is mounted on the mounting portion of the printing device, the ink outlet cooperates with the ink supply portion provided in the mounting portion of the printing device, so that the printing medium stored inside the cartridge flows out from the ink outlet and is supplied to the ink supply portion, and then is transferred to the print head to provide ink for the printing device.

[0118] In the description of the present invention, it should be understood that the terms used, such as "center", "length", "width", "thickness", "top", "bottom", "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside", "axial", and "circumferential", to indicate directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the position or component referred to must have a specific direction, a specific structure and operation, and therefore cannot be understood as a limitation on the present invention.

[0119] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0120] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can mean fixed connection, detachable connection, or integration; they can mean mechanical connection, electrical connection, or mutual communication; they can mean direct connection or indirect connection through an intermediate medium, and they can enable internal communication between two components or interaction between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to the specific circumstances.

[0121] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0122] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip assembly for being mounted on a consumables box and electrically contacting a stylus assembly in a printing device, the stylus assembly comprising a plurality of stylus pins (30), characterized in that: The chip assembly includes: A chip (10), the chip (10) comprising a substrate (11) and a plurality of contact portions (12) arranged on the substrate (11); a covering member (20), the covering member (20) being arranged on the substrate (11), and the covering member (20) covering the contact portion (12), the covering member (20) comprising at least a first region (21) and a second region (22) arranged in an interval manner; Along the first direction, the contact portion (12) and the projection of the corresponding first area (21) at least partially overlap, and the first area (21) is used to electrically connect the contact portion (12) and the corresponding contact pin (30); The first region (21) and the second region (22) extend along a direction inclined relative to the second direction.

2. The chip assembly according to claim 1, wherein: The first region (21) and the second region (22) are both multiple groups, the second region (22) is blocked between two adjacent groups of the first region (21), and the first region (21) and the second region (22) are not conductive to each other.

3. The chip assembly according to claim 1, wherein: The substrate (11) has a first surface (111), a plurality of contact portions (12) are arranged at intervals on the first surface (111), and the cover (20) faces at least a portion of the first surface (111).

4. The chip assembly according to claim 1, wherein: The first region (21) and the second region (22) respectively include at least two conductive portions (211), and along the first direction, the contact portion (12) at least partially overlaps with a projection of the conductive portion (211) of the first region (21).

5. The chip assembly according to claim 4, characterized in that: The first region (21) and the second region (22) both further include an insulating portion (212), wherein the insulating portion (212) is blocked between two adjacent conductive portions (211), the conductive portion (211) and the insulating portion (212) are not conductive, and the contact pin (30) and the insulating portion (212) are not conductive.

6. The chip assembly according to claim 5, characterized in that: The insulating portion (212) extends along a direction inclined relative to the second direction; The conducting portion (211) extends along a direction inclined relative to the second direction.

7. The chip assembly according to any one of claims 4 to 6, characterized in that: Along the first direction: the projection of each contact portion (12) partially overlaps with the projection of at least one conductive portion (211) in the corresponding first region (21), and the projection of each contact portion (12) does not overlap with the projection of the second region (22); Each contact pin (30) is electrically connected to the corresponding contact portion (12) via at least one conductive portion (211) located in the first area (21).

8. The chip assembly according to claim 4, wherein: Along the first direction, the contact portion (12) partially overlaps with projections of the plurality of conductive portions (211) in the corresponding first area (21).

9. The chip assembly according to any one of claims 1 to 5, characterized in that: The covering member (20) is detachably connected to the substrate (11), and the covering member (20) is at least partially formed of a conductive material.

10. The chip assembly according to any one of claims 4 to 6, characterized in that: The plurality of contact portions (12) include a plurality of first contact portions (121) and at least one second contact portion (122), wherein the first contact portion (121) and the second contact portion (122) are respectively in electrical contact with at least one of the conductive portions (211) in the corresponding first region (21).

11. The chip assembly according to claim 10, wherein: The substrate (11) has a center line A1 extending along the second direction, so as to divide the substrate (11) into a left area (14) and a right area (15); The first contact portion (121) and the second contact portion (122) are respectively arranged in the left area (14) and the right area (15); or, The first contact portion (121) and the second contact portion (122) are both arranged in the left area (14); or, The first contact portion (121) and the second contact portion (122) are both arranged in the right area (15).

12. A consumables box, characterized in that: The invention comprises a box body and a chip assembly according to any one of claims 1 to 11, wherein the chip assembly is arranged in the box body.

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