High-density LED matrix type light source

Abstract

The utility model relates to the technical field of illumination, in particular to a high-density light-emitting diode (LED) matrix type light source, which comprises a shell, a packaging layer is fixedly connected inside the shell, and an LED light source module is fixedly connected on the surface of the packaging layer. When in use, through the arrangement of the rotating shaft, the rotating frame, the fixing hole, the attaching groove, the rotating seat, the attaching ring, the limiting button and the limiting bolt, the rotating seat is mounted on one side of the shell, and the attaching groove formed in the surface of the rotating seat is matched with the attaching ring connected with the surface of the rotating shaft, so that the rotating shaft can rotate in the rotating seat and cannot fall off; fixing holes are formed in the rotating seat and the rotating shaft, a limiting button is connected to one side of the rotating frame, a limiting bolt is connected to the middle of the limiting button, and the limiting bolt can be tightened through the fixing holes after the irradiation angle of the shell is adjusted through rotation of the rotating shaft, so that the shell can be fixed at one angle; therefore, the effect of adjusting the irradiation angle is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of lighting, in particular to a high-density LED matrix light source. Background Art

[0002] A high-density LED matrix light source is a lighting system that integrates a large number of LED (light-emitting diode) units. Its design goal is to achieve high brightness and high luminous efficacy within a relatively small area. This light source typically adopts an array layout, closely arranging LEDs to form a matrix to achieve high density. Compared with traditional single-point light sources, high-density LED matrix light sources can provide more uniform light distribution and are suitable for applications requiring high brightness and light uniformity.

[0003] A search revealed a Chinese utility model patent publication numbered CN215731775U, which discloses a matrix LED light source comprising a substrate; an LED chip matrix disposed on and electrically connected to the substrate; the LED chip matrix comprising a plurality of LED chips; a phosphor layer disposed on the upper surface of each LED chip; a white wall glue portion disposed on the substrate and surrounding the LED chips, the white wall glue portion having grooves distributed between adjacent LED chips; and a black wall glue portion disposed within the grooves and on the upper surface of the white wall glue portion, the upper surface of the black wall glue portion being flush with the upper surface of the phosphor layer. The matrix LED light source of this application has grooves disposed in the white wall glue portion between adjacent LED chips, and a black wall glue portion disposed within the grooves. When one LED light source in the matrix LED light source emits light, the side light is absorbed by the black wall glue portion and does not irradiate the phosphor layer on the adjacent LED chip, thereby preventing the adjacent LED light source from also emitting light and preventing interference between adjacent LED light sources.

[0004] However, the device often lacks the function of heat dissipation. When in use, the LED will generate heat when working. The high-density LED matrix will make the heat more concentrated. Without good heat dissipation measures, the heat will accumulate inside the light source, resulting in reduced luminous efficiency and brightness of the LED, and may even cause light decay, shortening the service life of the LED. Not only that, the device also lacks the function of adjusting the angle. When in use, in application scenarios that require specific lighting effects or lighting ranges, because the LED light source cannot adjust the beam angle, the light will be too concentrated or dispersed, resulting in uneven lighting in the target area, affecting the lighting effect and user experience. Utility Model Content

[0005] The purpose of the present invention is to provide a high-density LED matrix light source to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A high-density LED matrix light source comprises a shell, an encapsulation layer is fixedly connected to the inside of the shell, an LED light source module is fixedly connected to the surface of the encapsulation layer, a heat dissipation substrate is fixedly connected to the bottom of the LED light source module, a thermal interface material is fixedly connected to the surface of the heat dissipation substrate, an LED chip is fixedly connected to the surface of the thermal interface material, a heat sink is fixedly connected to the back of the heat dissipation substrate, a heat dissipation groove is provided on the outer surface of the shell, a rotating seat is fixedly connected to one side of the shell, a fixing hole is provided inside the rotating seat, a fitting groove is provided on the surface of the rotating seat, a rotating shaft is rotatably connected to the surface of the fitting groove, a fitting ring is fixedly connected to the surface of the rotating shaft, a rotating frame is rotatably connected to the middle of the rotating shaft, a fixing hole is provided inside the rotating shaft, a limiting button is fixedly connected to one side of the rotating frame, a limiting bolt is threadedly connected to the limiting button, and the limiting bolt is threadedly connected to the fixing hole.

[0008] Preferably, a mounting groove is provided on the surface of the encapsulation layer, and a micro lens is fixedly connected inside the mounting groove.

[0009] Preferably, a mounting frame is fixedly connected to the surface of the shell, and a mounting hole is opened on the surface of the mounting frame.

[0010] Preferably, the surface of the installation frame is threadedly connected to an outer frame, and a fixing hole is opened on one side of the outer surface frame.

[0011] Preferably, an optical lens is clamped inside the outer frame, and a fixing bolt is threadedly connected inside the fixing hole.

[0012] Preferably, a power supply is fixedly connected to the inside of the shell, and one end of the power supply is fixedly connected to an LED light source module.

[0013] Preferably, a phosphor coating is fixedly connected to the surface of the LED chip, and a light-expanding aluminum plate is fixedly connected to the surface of the packaging layer.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. This high-density LED matrix light source, when in use, is provided with a heat dissipation substrate, a thermal interface material heat sink, and a heat dissipation groove. The heat dissipation substrate is installed in the LED light source module. The heat dissipation substrate can quickly transfer the heat generated by the LED chip during operation to the heat sink connected to the back of the heat dissipation substrate to prevent the LED chip from overheating. The thermal interface material is provided on the surface of the heat dissipation substrate. The thermal interface material can make the LED chip fit tightly on the heat dissipation substrate while also forming good thermal contact, ensuring that heat can be quickly transferred from the LED chip to the heat sink. The heat dissipation groove is provided on the side of the housing. The heat dissipation groove can increase the contact area between the heat sink and the surrounding air, so that heat can be more effectively transferred from the LED chip to the heat sink through thermal conduction and dissipated to the environment through convection, thereby achieving the effect of reducing the temperature of the LED chip.

[0016] 2. This high-density LED matrix light source, when in use, is provided with a rotating shaft, a rotating frame, a fixing hole, a fitting groove, a rotating seat, a fitting ring, a limiting button and a limiting bolt. The rotating seat is installed on one side of the housing. The fitting groove provided on the surface of the rotating seat fits with the fitting ring connected to the surface of the rotating shaft, so that the rotating shaft can rotate within the rotating seat without falling. Fixing holes are provided inside the rotating seat and the rotating shaft. A limiting button is connected to one side of the rotating frame, and a limiting bolt is connected to the middle of the limiting button. After the housing is rotated using the rotating shaft to adjust the illumination angle, the limiting bolt can be tightened through the fixing hole so that the housing can be fixed at a certain angle, thereby achieving the effect of adjusting the illumination angle. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall appearance structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the internal structure of the shell of the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the LED light source module of the present utility model;

[0020] Figure 4 This is a schematic diagram of the internal structure of the rotating structure of the present invention.

[0021] In the figure: 1. Shell; 2. Packaging layer; 3. LED light source module; 4. Heat dissipation substrate; 5. Thermal interface material; 6. LED chip; 7. Heat sink; 8. Heat dissipation slot; 9. Rotating seat; 10. Fixing hole; 11. Fitting slot; 12. Rotating axis; 13. Fitting ring; 14. Rotating frame; 15. Limiting button; 16. Limiting bolt; 17. Mounting slot; 18. Micro lens; 19. Mounting frame; 20. Mounting hole; 21. Outer frame; 22. Optical lens; 23. Fixing bolt; 24. Power supply; 25. Phosphor coating; 26. Light-expanding aluminum plate. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] See also Figures 1-4 As shown, the utility model provides a technical solution:

[0024] A high-density LED matrix light source includes a housing 1, an encapsulation layer 2 is fixedly connected to the interior of the housing 1, an LED light source module 3 is fixedly connected to the surface of the encapsulation layer 2, a heat dissipation substrate 4 is fixedly connected to the bottom of the LED light source module 3, a thermal interface material 5 is fixedly connected to the surface of the heat dissipation substrate 4, an LED chip 6 is fixedly connected to the surface of the thermal interface material 5, a heat sink 7 is fixedly connected to the back of the heat dissipation substrate 4, a heat dissipation groove 8 is opened on the outer surface of the housing 1, a rotating base 9 is fixedly connected to one side of the housing 1, a fixing hole 10 is opened inside the rotating base 9, and a fitting groove 11 is opened on the surface of the rotating base 9. The surface of the fitting groove 11 is rotatably connected to a rotating shaft 12, the surface of the rotating shaft 12 is fixedly connected to a fitting ring 13, the middle of the rotating shaft 12 is rotatably connected to a rotating frame 14, the interior of the rotating shaft 12 is provided with a fixing hole 10, one side of the rotating frame 14 is fixedly connected to a limiting button 15, the interior of the limiting button 15 is threadedly connected to a limiting bolt 16, and the limiting bolt 16 is threadedly connected to the fixing hole 10. When in use, a heat dissipation substrate 4 is installed in the LED light source module 3, and the heat dissipation substrate 4 can quickly transfer the heat generated by the LED chip 6 during operation to the heat sink 7 connected to the back of the heat dissipation substrate 4. To prevent the LED chip 6 from overheating, a thermal interface material 5 is provided on the surface of the heat dissipation substrate 4. The thermal interface material 5 can make the LED chip 6 fit tightly on the heat dissipation substrate 4 while forming good thermal contact, ensuring that heat can be quickly transferred from the LED chip 6 to the heat sink 7. A heat dissipation groove 8 is provided on the side of the housing 1. The heat dissipation groove 8 can increase the contact area between the heat sink 7 and the surrounding air, so that heat can be more effectively transferred from the LED chip 6 to the heat sink 7 through heat conduction and dissipated to the environment through convection. The rotating seat 9 is equipped with a fitting groove 11 provided on the surface of the rotating seat 9 and a fitting ring 13 connected to the surface of the rotating shaft 12, so that the rotating shaft 12 can rotate in the rotating seat 9 without falling. A fixing hole 10 is provided inside the rotating seat 9 and the rotating shaft 12. A limiting button 15 is connected to one side of the rotating frame 14, and a limiting bolt 16 is connected to the middle of the limiting button 15. After the housing 1 is rotated using the rotating shaft 12 to adjust the irradiation angle, the limiting bolt 16 can be tightened through the fixing hole 10, so that the housing 1 can be fixed at a certain angle, achieving the function of normal use.

[0025] In this embodiment, preferably, a mounting groove 17 is provided on the surface of the encapsulation layer 2, and a microlens 18 is fixedly connected to the inside of the mounting groove 17. When in use, the mounting groove 17 is provided on the surface of the encapsulation layer 2, and the microlens 18 can be installed on the encapsulation layer 2 through the mounting groove 17. With the microlens 18, the angle and direction of the light beam emitted by the LED light source module 3 can be controlled, and the focusing, diffusion or formation of a specific shape of the light beam can be achieved by changing the refraction path of the light beam, thereby achieving the effect of light beam control.

[0026] In this embodiment, preferably, a mounting frame 19 is fixedly connected to the surface of the shell 1, and a mounting hole 20 is opened on the surface of the mounting frame 19. When in use, the mounting frame 19 is connected to the surface of the shell 1, and the mounting frame 19 can cooperate with the outer frame 21 to fix the optical lens 22 in the shell 1. The mounting hole 20 is opened on the surface of the mounting frame 19, and the outer frame 21 can be fixed on the shell 1 through the mounting hole 20, thereby achieving the fixing effect.

[0027] In this embodiment, preferably, the surface of the mounting frame 19 is threadedly connected to an outer frame 21, and a fixing hole 10 is opened on one side of the outer frame. When in use, the outer frame 21 is installed on the surface of the mounting frame 19, and the fixing hole 10 on one side of the outer frame 21 can be aligned and overlapped with the mounting hole 20 opened on the mounting frame 19 so that the outer frame 21 and the outer shell 1 are fixed together, thereby achieving the connection effect.

[0028] In this embodiment, preferably, an optical lens 22 is clamped inside the outer frame 21, and a fixing bolt 23 is threadedly connected to the inner part of the fixing hole 10. When in use, the optical lens 22 is connected inside the outer frame 21. After the optical lens 22 is placed in the outer frame 21, the fixing hole 10 of the outer frame 21 is overlapped with the mounting hole 20 of the outer shell 1, and the fixing bolt 23 is installed inside to fix the optical lens 22 in the outer shell 1, thereby achieving the purpose of installing the optical lens 22.

[0029] In this embodiment, preferably, a power supply 24 is fixedly connected to the inside of the shell 1, and one end of the power supply 24 is fixedly connected to the LED light source module 3. When in use, the power supply 24 is installed inside the shell 1, and a stable current can be input to the LED light source module 3 through the power supply 24, ensuring that the LED module operates under safe and optimal working conditions, thereby achieving the purpose of transmitting current.

[0030] In this embodiment, preferably, a fluorescent coating 25 is fixedly connected to the surface of the LED chip 6, and a light-expanding aluminum plate 26 is fixedly connected to the surface of the packaging layer 2. When in use, a layer of fluorescent coating 25 is applied to the surface of the LED chip 6. The fluorescent coating 25 can convert the light source emitted by the LED chip 6 to achieve color conversion of the light source. A light-expanding aluminum plate 26 is installed on the surface of the packaging layer 2. The light-expanding aluminum plate 26 can reflect the light emitted by the LED chip 6 to reduce light loss, thereby achieving the effect of improving light efficiency.

[0031] When a high-density LED matrix light source of this embodiment is in use, a heat dissipation substrate 4, a thermal interface material 5 heat sink 7 and a heat dissipation groove 8 are set. A heat dissipation substrate 4 is installed in the LED light source module 3. The heat dissipation substrate 4 can quickly transfer the heat generated by the LED chip 6 during operation to the heat sink 7 connected to the back of the heat dissipation substrate 4 to prevent the LED chip 6 from overheating. A thermal interface material 5 is set on the surface of the heat dissipation substrate 4. The thermal interface material 5 can make the LED chip 6 fit tightly on the heat dissipation substrate 4 while forming good thermal contact, ensuring that heat can be quickly conducted from the LED chip 6 to the heat sink 7. A heat dissipation groove 8 is opened on the side of the shell 1. The heat dissipation groove 8 can increase the contact area between the heat sink 7 and the surrounding air, so that heat can be more effectively transferred from the LED chip 6 to the heat sink 7 through heat conduction, and through The light is dissipated into the environment through convection, thereby achieving the effect of lowering the temperature of the LED chip 6. When in use, the rotating seat 9 is installed on one side of the shell 1 through the arrangement of the rotating shaft 12, the rotating frame 14, the fixing hole 10, the fitting groove 11, the rotating seat 9, the fitting ring 13, the limiting button 15 and the limiting bolt 16. The fitting groove 11 opened on the surface of the rotating seat 9 fits with the fitting ring 13 connected to the surface of the rotating shaft 12 so that the rotating shaft 12 can rotate in the rotating seat 9 without falling off. A fixing hole 10 is opened inside the rotating seat 9 and the rotating shaft 12, and a limiting button 15 is connected to one side of the rotating frame 14. The limiting bolt 16 is connected to the middle of the limiting button 15. The limiting bolt 16 can be tightened after the shell 1 is rotated using the rotating shaft 12 to adjust the illumination angle through the fixing hole 10, so that the shell 1 can be fixed at an angle, thereby achieving the effect of adjusting the illumination angle.

[0032] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-density LED matrix light source, characterized by: The invention comprises a shell (1), wherein an encapsulation layer (2) is fixedly connected inside the shell (1), an LED light source module (3) is fixedly connected to the surface of the encapsulation layer (2), a heat dissipation substrate (4) is fixedly connected to the bottom of the LED light source module (3), a thermal interface material (5) is fixedly connected to the surface of the heat dissipation substrate (4), an LED chip (6) is fixedly connected to the surface of the thermal interface material (5), a heat sink (7) is fixedly connected to the back of the heat dissipation substrate (4), a heat dissipation groove (8) is provided on the outer surface of the shell (1), a rotating seat (9) is fixedly connected to one side of the shell (1), and the rotating seat (9) is fixedly connected to the rotating seat. A fixing hole (10) is provided inside the seat (9), a fitting groove (11) is provided on the surface of the rotating seat (9), a rotating shaft (12) is rotatably connected to the surface of the fitting groove (11), a fitting ring (13) is fixedly connected to the surface of the rotating shaft (12), a rotating frame (14) is rotatably connected to the middle of the rotating shaft (12), a fixing hole (10) is provided inside the rotating shaft (12), a limiting button (15) is fixedly connected to one side of the rotating frame (14), a limiting bolt (16) is threadedly connected to the inside of the limiting button (15), and the limiting bolt (16) is threadedly connected to the fixing hole (10).

2. The high-density LED matrix light source according to claim 1, wherein: A mounting groove (17) is provided on the surface of the packaging layer (2), and a microlens (18) is fixedly connected inside the mounting groove (17).

3. The high-density LED matrix light source according to claim 1, wherein: A mounting frame (19) is fixedly connected to the surface of the housing (1), and a mounting hole (20) is provided on the surface of the mounting frame (19).

4. The high-density LED matrix light source according to claim 3, wherein: The surface of the installation frame (19) is threadedly connected to an outer frame (21), and a fixing hole (10) is opened on one side of the outer frame.

5. The high-density LED matrix light source according to claim 4, characterized in that: An optical lens (22) is clamped inside the outer frame (21), and a fixing bolt (23) is threadedly connected inside the fixing hole (10).

6. The high-density LED matrix light source according to claim 1, characterized in that: A power source (24) is fixedly connected to the interior of the housing (1), and an LED light source module (3) is fixedly connected to one end of the power source (24).

7. The high-density LED matrix light source according to claim 1, characterized in that: A phosphor coating (25) is fixedly connected to the surface of the LED chip (6), and a light-expanding aluminum plate (26) is fixedly connected to the surface of the packaging layer (2).

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