Probe type temperature measuring device

Abstract

The utility model discloses a probe type temperature measuring device. The probe type temperature measuring device comprises a probe assembly, a spring mechanism, a measuring conductor and a packaging shell, the probe assembly is detachably sleeved in the spring mechanism; the measuring conductor is arranged in the probe assembly; the spring mechanism is detachably connected in the packaging shell; the center of the probe assembly, the center of the spring mechanism and the center of the packaging shell are located on the same central axis. The probe assembly comprises an ejector pin and an ejector pin clamping piece. The ejector pin comprises an ejector pin head and an ejector pin tail, and the ejector pin tail is integrally provided with a disc structure; the disk structure includes a first surface and a second surface. The temperature measuring head can tightly abut against the surface of the measured substrate, and errors caused by the distance between a temperature measuring point and a heat source and errors caused by thickness estimation of a heat-conducting medium are eliminated.

Description

Technical Field

[0001] The present application relates to the fields of sensor technology and temperature measurement technology, and in particular to a probe-type temperature measurement device. Background Art

[0002] As important temperature sensors, thermocouples are widely used in a variety of fields, including industrial automation, new energy, and automotive manufacturing. For example, in the construction of smart factories, thermocouples need to seamlessly integrate with automated control systems to achieve real-time temperature monitoring and data transmission. In the new energy sector, thermocouples can be used to monitor the temperature of battery modules to improve power generation efficiency. In the environmental protection field, thermocouples are used to monitor temperature changes during exhaust gas treatment to ensure treatment effectiveness.

[0003] Although thermocouples are widely used in various fields, their performance may be limited in certain environments, such as extreme temperatures and strong magnetic fields. Furthermore, factors such as the thermocouple's installation position and insertion depth may also affect its measurement accuracy.

[0004] Existing temperature measurement technology involves machining thermocouple slots in the heat sink substrate and embedding the thermocouple probes in the substrate beneath the chip. This thermocouple structure first directly measures the heat sink substrate temperature with the thermocouple probes, then infers the junction temperature rise based on the thermal resistance of the heat transfer medium and the junction-to-case thermal resistance. This testing method for thermocouples can introduce errors due to slot tolerances and inconsistent placement depths. Furthermore, the need to estimate the thermal resistance of the heat transfer medium can lead to inaccurate estimates of the chip junction temperature.

[0005] At present, the traditional thermocouple structure is commonly used in wire slot embedded thermocouples, which mainly have the following problems:

[0006] (1) The depth of the wire groove (0.8mm) is larger than the diameter of the temperature measuring welding head (about 0.2mm). When manually embedded, the distance between the temperature measuring welding head and the heat source is inconsistent, resulting in test errors. The higher the power density, the greater the error. Therefore, this problem is caused by the large measurement error caused by the temperature measuring probe.

[0007] (2) The wire trough is usually buried in the substrate and separated from the heat source by a thermal conductive medium. When deriving the junction temperature, the thickness of the thermal conductive medium can only be estimated based on experience, which will lead to calculation errors;

[0008] (3) In addition, high-temperature glue is required to bury the thermocouple wire in the wire trough. If the temperature measuring wire is damaged, the temperature sensing wire and glue in the wire trough need to be cleaned and buried again, which makes maintenance more difficult. Utility Model Content

[0009] The present application provides a probe-type temperature measurement device for solving technical problems in existing thermocouple structures, such as excessive measurement errors caused by temperature measuring probes, which in turn significantly shorten the service life of the thermocouple.

[0010] In a first aspect, the present application provides a probe-type temperature measuring device, comprising: a probe assembly, a spring mechanism, a measuring conductor, and a packaging shell; the probe assembly is detachably inserted into the spring mechanism; the measuring conductor is disposed within the probe assembly; the spring mechanism is detachably connected to the packaging shell; the centers of the probe assembly, the spring mechanism, and the packaging shell are all located on the same central axis; wherein the probe assembly comprises: a pin and a pin clamp; the pin comprises a pin head and a pin tail, and the pin tail is integrated into a disc structure; the disc structure comprises a first surface and a second surface.

[0011] In one embodiment of the present application, the interior of the ejector pin adopts a through-hole structure; the measuring conductor passes through the ejector pin via the through-hole.

[0012] In one embodiment of the present application, the thimble clamp is fixedly disposed on the thimble head; the thimble clamp is detachably connected to one end of the measuring conductor.

[0013] In one embodiment of the present application, the diameter of the ejector pin clamp is larger than the diameter of the through hole of the ejector pin.

[0014] In one embodiment of the present application, the spring mechanism is disposed at the tail of the ejector pin and contacts the second surface of the disk structure at the tail of the ejector pin.

[0015] In one embodiment of the present application, the probe assembly is built into the packaging shell; the first surface of the disc structure is blocked inside the packaging shell, and the probe assembly extends out of the packaging shell by a preset distance.

[0016] In one embodiment of the present application, the packaging shell includes: a first shell and a second shell; the second shell is engaged with the first shell.

[0017] In one embodiment of the present application, at least one card slot is provided on the tail of the first shell; at least one card hook is provided on the second shell; the number of the card slots is equal to the number of the card hooks; the positions of the card slots and the card hooks correspond to each other.

[0018] In one embodiment of the present application, a first hole is further provided on the first housing; the first hole is engaged with the ejector pin and extends out to a predetermined length.

[0019] In one embodiment of the present application, a thread is provided on the outer surface of the first housing.

[0020] As described above, the probe-type temperature measurement device described in this application has the following beneficial effects:

[0021] (1) The probe-type temperature measurement device structure provided in the present application, through the combination of the probe assembly and the spring structure, can tightly press the temperature measuring head against the surface of the substrate to be measured, thereby avoiding errors caused by the distance between the temperature measuring point and the heat source; at the same time, the temperature measuring head can penetrate the thermal conductive medium (flexible conductive medium) to directly measure the chip shell temperature, eliminating errors caused by the thickness estimation of the thermal conductive medium;

[0022] (2) The probe-type temperature measurement device structure provided in the present application is simple and convenient to install by simply unscrewing the probe-type thermocouple as a whole (the outer shell thread can be directly installed in the threaded hole of the substrate), repairing it, and then screwing it back on; therefore, the installation method is simple and convenient;

[0023] (3) The probe-type temperature measuring device of the present application has a simple structure, is beautiful, and has a small size; at the same time, this structure is highly versatile and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1A Shown is a schematic diagram of the overall structure and appearance of the probe-type temperature measurement device described in an embodiment of the present application.

[0025] Figure 1B Shown is an exploded view of a probe-type temperature measurement device according to an embodiment of the present application.

[0026] Figure 2 Shown is a schematic structural diagram of a probe assembly of a probe-type temperature measurement device according to an embodiment of the present application.

[0027] Figure 3 Shown is a cross-sectional schematic diagram of the probe assembly and spring mechanism combination in the probe-type temperature measurement device according to an embodiment of the present application.

[0028] Figure 4 FIG2 is a schematic cross-sectional view of a probe-type temperature measurement device according to an embodiment of the present application after assembly in one embodiment.

[0029] Figure 5 Shown is a side view of a probe-type temperature measurement device according to an embodiment of the present application.

[0030] Figure 6 Shown is a cross-sectional layered schematic diagram of a probe-type temperature measurement device according to an embodiment of the present application.

[0031] Figure 7Shown are a cross-sectional schematic diagram of the probe-type temperature measurement device according to an embodiment of the present application installed at a certain temperature measurement point and a cross-sectional schematic diagram after packaging.

[0032] Figure 8 Shown is a cross-sectional schematic diagram of the probe-type temperature measurement device according to an embodiment of the present application installed at a certain temperature measurement point.

[0033] Description of Figure Numbers:

[0034] Serial number name

[0035] 1 Probe temperature measuring device

[0036] 100 Probe Assembly

[0037] 200 Spring Mechanism

[0038] 300 Measuring conductor

[0039] 400 package shell

[0040] 110 thimble

[0041] 111 Ejector head

[0042] 112 thimble tail

[0043] 1121 Disc Structure

[0044] 1121A First surface

[0045] 1121B Second surface

[0046] 120 ejector pin

[0047] 410 First Shell

[0048] 411 First Hole

[0049] 412 card slot

[0050] 420 Second Shell

[0051] 421 Hook

[0052] 2. Heat dissipation substrate

[0053] 3 Thermal grease

[0054] 4-chip copper substrate

[0055] 5. Chip housing

[0056] 6 Thermocouple Wire Slots DETAILED DESCRIPTION

[0057] The present application is further described below in conjunction with the accompanying drawings, but the scope of protection of the present application is not limited to the following description.

[0058] The following describes the embodiments of the present application through specific examples. Those skilled in the art can easily understand the other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0059] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. Therefore, the illustrations only show components related to the present application and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0060] The probe-type temperature measurement device provided in the following embodiments of the present application solves technical problems in existing thermocouple structures, such as excessive measurement errors caused by temperature measuring probes, which in turn significantly shortens the service life of the thermocouple.

[0061] The present invention provides a probe-type temperature measurement device that utilizes a combination of a probe assembly and a spring structure. This device can firmly press the temperature probe against the surface of the substrate being measured, avoiding errors caused by the distance between the temperature measurement point and the heat source. Furthermore, the probe can penetrate a thermally conductive medium (flexible conductive medium) to directly measure the chip shell temperature, resolving errors caused by thickness estimation of the thermally conductive medium. Furthermore, this structure simplifies installation, reduces maintenance costs, and increases its service life.

[0062] The following will describe in detail the principle and implementation of a probe-type temperature measurement device according to this embodiment with reference to the accompanying drawings.

[0063] See also Figure 1A 、 Figure 1B , respectively showing the overall structure and appearance of the probe-type temperature measuring device according to the embodiment of the present application, and the exploded view of the probe-type temperature measuring device according to the embodiment of the present application. Figure 1A 、 Figure 1BAs shown, the probe-type temperature measurement device 1 comprises a probe assembly 100, a spring mechanism 200, a measuring conductor 300, and an encapsulating housing 400. The probe assembly 100 is removably inserted into the spring mechanism 200; the measuring conductor 300 is disposed within the probe assembly 100; and the spring mechanism 200 is removably connected to the encapsulating housing 400. The centers of the probe assembly 100, the spring mechanism 200, and the encapsulating housing 400 are all located on the same central axis. This probe-type temperature measurement structure, through the combination of the probe assembly 100 and the spring mechanism 200, firmly presses the temperature measuring head against the surface of the substrate being measured, avoiding measurement errors caused by the distance between the temperature measurement point and the heat source.

[0064] See also Figures 2 to 5 , respectively showing a schematic diagram of the structure of the probe assembly of the probe-type temperature measuring device according to an embodiment of the present application, a schematic cross-sectional diagram of the combination of the probe assembly and the spring mechanism in the probe-type temperature measuring device according to an embodiment of the present application, a schematic cross-sectional diagram of the probe-type temperature measuring device according to an embodiment of the present application after assembly in one embodiment, and a side view of the probe-type temperature measuring device according to an embodiment of the present application.

[0065] In one embodiment, the probe assembly 100 includes: an ejector pin 110 and an ejector pin clamp 120; the ejector pin 110 includes an ejector pin head 111 and an ejector pin tail 112, and the ejector pin tail 112 is integrated into a disk structure 1121; the disk structure 1121 includes a first surface 1121A and a second surface 1121B.

[0066] The interior of the ejector pin 110 adopts a through-hole structure; the measuring conductor 300 passes through the ejector pin 110 through the through-hole.

[0067] The ejector clamp 120 is fixedly mounted on the ejector head 111 and is detachably connected to one end of the measuring conductor 300. The diameter of the ejector clamp 120 is larger than the diameter of the through hole of the ejector 110.

[0068] In this embodiment, preferably, the ejector pin 120 can be a temperature measuring welding head; the measuring conductor 300 can be preferably made of two conductors or wires of different materials; and the diameter of the temperature measuring welding head is preferably 0.2 mm.

[0069] Specifically, probe assembly 100 includes an ejector pin 110 and an ejector clamp 120. Ejector pin 110 includes an ejector head 111 and an ejector tail 112. Ejector clamp 120 is fixedly mounted on ejector head 111 and removably connected to one end of measuring conductor 300. Ejector head 111 and ejector clamp 120 are fixedly welded together. Here, ejector clamp 120 serves as a welding head, one end of which is connected to the thermocouple wire. A thermocouple wire slot 6 is located within the through-hole of ejector pin 110.

[0070] Here, ejector pin 110 is needle-shaped and features a through-hole structure (or, alternatively, a hollow structure) within it. The measuring conductor 300 (thermocouple wire) passes through the through-hole structure and is connected to a weld head on ejector pin 110 at one end. Specifically, the thermocouple wire is passed through ejector pin 110, and a weld head is formed at the end of the thermocouple wire that passes through ejector pin head 111. The weld head has a diameter larger than the through-hole diameter of ejector pin 110, preventing it from being released. The weld head diameter can be adjusted to meet specific requirements to ensure accurate test positioning.

[0071] Furthermore, the ejector tail 112 is integrally provided with a disk structure 1121. The disk structure 1121 is perpendicular to the thermocouple wire and has an inverted T-shaped cross section. The disk structure 1121 includes a first surface 1121A and a second surface 1121B.

[0072] Specifically, a first surface 1121A (ie, an upper surface) of the disk structure 1121 is close to one side of the welding head, and a second surface 1121B (ie, a lower surface) of the disk structure 1121 is close to one side of the spring mechanism 200 .

[0073] Please continue reading Figure 3 and Figure 4 .

[0074] In one embodiment, the spring mechanism 200 is disposed on the ejector tail 112 and contacts the second surface 1121B of the disk structure 1121 of the ejector tail 112. The probe assembly 100 is built into the package housing 400. The first surface 1121A of the disk structure 1121 is locked within the package housing 400, and the probe assembly 100 extends out of the package housing 400 by a predetermined distance.

[0075] Specifically, spring mechanism 200 is installed beneath disk structure 1121 of ejector tail 112, threaded through the thermocouple wires, and positioned below second surface 1121B of disk structure 1121. The tail of probe assembly 100 and the thermocouple wires extend through spring mechanism 200, with the central axis of spring mechanism 200 aligning with that of probe assembly 100. Furthermore, first surface 1121A of disk structure 1121 of ejector tail 112 is secured within package housing 400.

[0076] In one embodiment, the packaging housing 400 includes a first housing 410 and a second housing 420 . The second housing 420 is engaged with the first housing 410 .

[0077] At least one slot 412 is provided on the rear portion of the first housing 410 , and at least one hook 421 is provided on the second housing 420 . The number of the slots 412 is equal to the number of the hooks 421 , and the positions of the slots 412 and the hooks 421 correspond to each other.

[0078] Specifically, the packaging shell 400 includes two parts, namely: a first shell 410 and a second shell 420. Among them, one end of the first shell 410 (i.e.: the head of the first shell) is configured as a constriction, and the constriction is located at the center of the head of the first shell 410. A first hole 411 is provided at the center. The other end of the first shell 410 (i.e.: the tail of the first shell) is configured as an opening, and a plurality of slots 412 are provided near the opening at the tail of the first shell. Similarly, a plurality of hooks 421 are provided at the head of the second shell 420, and the number of hooks 421 must be consistent with the number of slots 412, and the positions of the hooks 421 must correspond to the positions of the slots 412, so that the hooks 421 can be locked with the slots 412, so that the first shell 410 and the second shell 420 form a packaging structure after the thermocouple is assembled.

[0079] Likewise, the first hole 411 at the head of the first housing 410 is used to allow the ejector pin 110 to extend a certain distance from the top of the packaging housing 400 and ensure that the probe assembly 100 cannot be pulled out.

[0080] Furthermore, a thread M3 is provided on the outer side wall of the first housing 410 for mounting the probe-type temperature measuring device on the target object to be measured. This structure is easy to disassemble and install and can be reused.

[0081] In addition, in the present application, except for the thermocouple wire and the spring mechanism 200, the materials of the device are preferably high-temperature resistant plastic materials.

[0082] As can be seen from the above, the probe-type temperature measuring device 1 of the present application, through the combination of the probe assembly 100 and the spring structure, can press the temperature measuring head tightly against the surface of the substrate to be measured, avoiding errors caused by the distance between the temperature measuring point and the heat source; at the same time, the temperature measuring head can penetrate the heat-conducting medium (flexible leading medium) to directly measure the chip shell temperature, eliminating the error caused by the thickness estimation of the heat-conducting medium. At the same time, during the installation process of this structure, it is only necessary to unscrew the probe-type thermocouple as a whole (the outer shell thread can be directly installed in the substrate threaded hole) to carry out maintenance or replacement, and then install it after the processing is completed. Therefore, the installation method of the thermocouple of this structure is simple and convenient, which is convenient for reducing operation and maintenance costs.

[0083] The following describes the installation process of the probe-type temperature measuring device in this application as an example.

[0084] See also Figure 6 、 Figure 7 and Figure 8 , respectively showing a cross-sectional layered schematic diagram of the probe-type temperature measuring device described in an embodiment of the present application, a cross-sectional schematic diagram of the probe-type temperature measuring device described in an embodiment of the present application installed at a certain temperature measuring point, a cross-sectional schematic diagram after packaging, and a cross-sectional schematic diagram of the probe-type temperature measuring device described in an embodiment of the present application installed at a certain temperature measuring point.

[0085] In this embodiment, the probe-type thermocouple structure 1 includes a probe assembly 100, a spring mechanism 200, a measuring conductor 300, and a housing 400. The probe assembly 100 includes an ejector pin 110 and an ejector pin holder 120. The ejector pin 110 includes an ejector head 111 and an ejector tail 112, with the ejector tail 112 integrally forming a disk structure 1121. The disk structure 1121 includes a first surface 1121A and a second surface 1121B. The housing 400 includes a first housing 410 and a second housing 420.

[0086] Specifically, ejector pin 110 has a through-hole structure, allowing thermocouple wire to be passed through it. A weld joint is formed at the end of the thermocouple wire that passes through ejector head 111. The diameter of the weld joint is larger than the diameter of the through-hole in ejector pin 110, allowing the weld joint to be stuck in ejector head 111 and prevented from withdrawing. Here, the weld joint diameter is only 0.2 mm to ensure accurate test position.

[0087] Then, the spring mechanism 200 passes through the thermocouple wire and is installed on the lower surface of the disc structure 1121 of the ejector tail 112. The upper surface of the disc of the ejector tail 112 is stuck inside the constriction of the first shell 410, so that the probe assembly can extend a distance from the top of the packaging shell 400, but cannot be pulled out.

[0088] The second housing 420 is threaded through the thermocouple wires and pressed against the rear end of the spring mechanism 200. The hook 421 of the second housing 420 engages with the slot 412 in the rear sidewall of the first housing 410 (that is, applying a force to the hook 421 on the second housing 420 corresponding to the position of the slot 412 causes the hook 421 to move along the inner sidewall of the first housing 410, causing the hook 421 to elastically deform until it reaches the position of the slot 412, at which point the hook 421 recovers its deformation and engages with the slot 412). This prevents the second housing 420 from falling off the rear end of the first housing 410. Simultaneously, the spring mechanism 200 is compressed a certain distance, pre-applying the spring force to the lower surface (second surface 1121B) of the ejector tail 112.

[0089] Specifically, when ejector pin 110 is pressed against the object being measured, it is compressed a certain distance. Within this compression distance, the thermocouple tip maintains firm contact with the surface of the object being measured, reducing temperature measurement errors. Furthermore, because ejector pin 110 is preloaded with spring force, the thermocouple assembly can penetrate the thermal grease 3 and directly measure the surface temperature of the chip's copper substrate 4, eliminating junction temperature estimation errors caused by the thickness of the thermal conductive medium.

[0090] At this point, the probe-type temperature measurement device (ie, the probe-type thermocouple) of the present application has completed its own assembly.

[0091] Please continue reading Figures 6 to 8 .

[0092] For example, when testing the temperature of the chip substrate, the welding head of the probe-type thermocouple can be connected along the direction from the heat dissipation substrate 2 to the chip housing 5, and combined with the threads on the heat dissipation substrate 2 (that is, the inner wall of the thermocouple mounting groove is provided with threads to facilitate the installation of the thermocouple), and the thermocouple is fastened to the heat dissipation substrate 2. This structure can directly place the thermocouple temperature measuring point on the chip substrate to directly measure the chip shell temperature. Finally, on the basis of directly measuring the chip shell temperature, the chip junction temperature is directly obtained through the junction-shell thermal resistance. During use, this structure can greatly reduce the error caused by the distance between the temperature measuring point and the heat source; at the same time, the temperature measuring head is penetrated through the heat-conducting medium (flexible heat-conducting medium) to directly measure the chip shell temperature, and it can also avoid the occurrence of errors caused by the thickness estimation of the heat-conducting medium.

[0093] It should be noted that after the probe-type temperature measurement device 1 is installed, the ejector pin 110 extends a distance from the first housing 410. The maximum distance at this point is the retractable distance H. The spring-loaded ejector pin 110 can be retracted a certain distance, allowing it to press against the surface of the object being measured, reducing contact problems caused by different installation heights or thermal barriers and shrinkage. This reduces temperature measurement errors.

[0094] In summary, the probe-type temperature measuring device provided by the present application, through the combination of the probe assembly and the spring structure, can press the temperature measuring head tightly against the surface of the substrate to be measured, thereby avoiding the error caused by the distance between the temperature measuring point and the heat source; at the same time, the temperature measuring head can penetrate the heat-conducting medium (flexible conductive medium) to directly measure the chip shell temperature, eliminating the error caused by the thickness estimation of the heat-conducting medium. The probe-type temperature measuring device structure provided by the present application only needs to unscrew the probe-type hot spot thermocouple as a whole (the shell thread can be directly installed in the threaded hole of the substrate) during installation, perform maintenance, and then screw it back on after repair; therefore, the installation method is simple and convenient. In addition, the probe-type temperature measuring device of the present application has a simple structure, beautiful appearance, and small size; at the same time, this structure has strong versatility, a wide range of applicability, and high practical value.

[0095] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.

Claims

1. A probe-type temperature measuring device, characterized in that: The probe-type temperature measuring device comprises: a probe assembly, a spring mechanism, a measuring conductor and a packaging shell; The probe assembly is detachably sheathed in the spring mechanism; The measuring conductor is disposed in the probe assembly; The spring mechanism is detachably connected to the packaging shell; The centers of the probe assembly, the spring mechanism and the packaging shell are all located on the same central axis; The probe assembly includes: an ejector pin and an ejector pin clamp; the ejector pin includes an ejector pin head and an ejector pin tail, and the ejector pin tail is integrated into a disc structure; the disc structure includes a first surface and a second surface.

2. The probe-type temperature measuring device according to claim 1, characterized in that: The interior of the ejector pin adopts a through-hole structure; The measuring conductor passes through the ejector pin via the through hole.

3. The probe-type temperature measuring device according to claim 1, characterized in that: The ejector clamp is fixedly arranged on the ejector head; The thimble clamp is detachably connected to one end of the measuring conductor.

4. The probe-type temperature measuring device according to claim 3, characterized in that: The diameter of the ejector pin clamp is larger than the diameter of the through hole of the ejector pin.

5. The probe-type temperature measuring device according to claim 1, characterized in that: The spring mechanism is arranged at the tail of the ejector pin and contacts the second surface of the disc structure of the tail of the ejector pin.

6. The probe-type temperature measuring device according to claim 1, characterized in that: The probe assembly is built into the packaging shell; The first surface of the disk structure is blocked inside the packaging shell, and the probe assembly extends out of the packaging shell by a preset distance.

7. The probe-type temperature measuring device according to claim 1, characterized in that: The packaging shell includes: a first shell and a second shell; The second shell is engaged with the first shell.

8. The probe-type temperature measuring device according to claim 7, characterized in that: At least one card slot is provided on the tail of the first shell; at least one card hook is provided on the second shell; The number of the card slots is equal to the number of the card hooks; The positions of the card slot and the card hook correspond to each other.

9. The probe-type temperature measuring device according to claim 7, characterized in that: A first hole is also provided on the first shell; the first hole is engaged with the ejector pin and extends out to a preset distance.

10. The probe-type temperature measuring device according to claim 7, characterized in that: A thread is provided on the outer surface of the first shell.

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