DFN packaging welding spot quality analyzer

Abstract

The utility model relates to the field of chip packaging detection, in particular to a DFN packaging welding spot quality analyzer. The packaging welding spot quality analyzer comprises a rack; the conveying structure is mounted on the rack; the conveying structure comprises a conveying belt, a conveying plate arranged on the conveying belt, a driving motor for driving the conveying belt to act, and a clamp arranged on the conveying plate; the visual detection structure is mounted on the rack; the visual detection structure comprises a main camera directly facing the clamp and auxiliary cameras which are arranged on the two sides of the main camera and obliquely face the clamp so as to detect the quality of packaging side edge welding spots. According to the DFN packaging welding spot quality analyzer, the visual detection device is arranged, so that the surface appearance of the packaging welding spot can be detected, and the quality of the packaging welding spot can be analyzed.

Description

Technical Field

[0001] The utility model relates to the field of chip packaging detection, in particular to a DFN packaging solder joint quality analyzer. Background Art

[0002] Semiconductor DFN packaging is a technology that uses a leadless bottom pad and packaging material to encapsulate the chip. It is widely used in the manufacturing process of integrated circuits. After the integrated circuit is packaged, the solder joints need to be inspected to test the packaging effect.

[0003] Chinese utility model patent publication number CN218068208U discloses a chip packaging inspection device. The device comprises an L-shaped support and a fixture. The fixture is provided on the surface of the L-shaped support and includes two vertical plates symmetrically arranged on the surface of the L-shaped support. A crossbar is fixedly mounted between the two vertical plates. Two slides are slidably connected to the surface of the crossbar, and a clamp is fixedly mounted on the end of the slide away from the crossbar. However, this inspection device can only test the electrical performance of the package solder joints, but is unable to inspect their surface appearance, making it impossible to accurately determine the chip packaging quality.

[0004] Therefore, this field needs a new technical solution to solve the above problems. Summary of the Invention

[0005] To improve or resolve the technical problem in existing packaging inspection devices that are unable to inspect the appearance of package solder joints and accurately determine package quality, the present invention provides a DFN package solder joint quality analyzer. The package solder joint quality analyzer comprises: a frame; a conveying structure mounted on the frame; the conveying structure comprises a conveyor belt, a conveyor plate arranged on the conveyor belt, a drive motor for driving the conveyor belt, and a fixture arranged on the conveyor plate; a visual inspection structure mounted on the frame; the visual inspection structure comprises a main camera facing the fixture, and auxiliary cameras arranged on both sides of the main camera and tilted toward the fixture to inspect the quality of the package side solder joints.

[0006] In the utility model, a DFN package solder joint quality analyzer includes a frame, a conveying structure and a visual inspection structure. The frame is used to install the above structures. The conveying structure is used to drive the packaged PCB board to pass through the visual inspection structure, and then the surface appearance of the PCB board is inspected by the visual inspection structure, so as to judge the packaging quality of the chip. The conveying structure includes a conveyor belt, a conveyor plate, a drive motor and a clamp. The clamp is used to clamp the packaged PCB board, the conveyor plate is used to carry the clamp, and the conveyor belt is used to drive the conveyor plate to move. The visual inspection structure includes a main camera and an auxiliary camera. The main camera is facing the PCB board, and the auxiliary camera is facing the package solder joints of the chip and the PCB board. The two cooperate to inspect the surface appearance of the package solder joints, so as to analyze the quality of the package solder joints. Through the above-mentioned settings, the utility model provides a DFN package solder joint quality analyzer with a visual inspection device, which can inspect the surface appearance of the package solder joints, so as to analyze the quality of the package solder joints.

[0007] Furthermore, the conveyor plate is attached to the conveyor belt; a lifting and rotating mechanism is positioned below the conveyor plate, opposite the main camera; the lifting and rotating mechanism includes a DD motor and a lifting cylinder that drives the DD motor upward and downward; the DD motor is configured to form a detachable connection with the conveyor plate and drive the conveyor plate to rotate. This arrangement allows the lifting and rotating mechanism to rotate the conveyor plate, enabling surface appearance inspection on all four sides of the PCB.

[0008] Furthermore, a limit key is provided on the DD motor, and a limit groove matching the limit key is provided on the conveying plate.

[0009] Furthermore, the fixture includes a bottom plate connected to the conveying plate, a reference block arranged on the bottom plate, and a floating block arranged opposite to the reference block; and a positioning block is arranged on the conveying plate to abut against the bottom plate.

[0010] Furthermore, a temporary storage area is provided on one side of the frame, and a push-out cylinder is provided on the other side of the frame; the positioning block is positioned close to the push-out cylinder, and the push-out cylinder is configured to push the clamp toward the temporary storage area.

[0011] Furthermore, a separation structure is provided at the end of the conveying structure. This separation structure includes a material conveyor belt arranged upwardly and an auxiliary material conveyor belt arranged downwardly. The auxiliary material conveyor belt is matched with the conveyor plate. A groove is provided at the end of the conveyor plate near the material conveyor belt to allow the material conveyor belt to pass through. This arrangement allows the conveyor plate and the fixture to be automatically separated by the separation structure, saving manpower and improving the detection efficiency of the mass analyzer.

[0012] In summary, compared with the prior art, the present invention has the following beneficial effects:

[0013] (1) The conveying structure includes a conveyor belt, a conveyor plate, a drive motor, and a clamp. The clamp is used to clamp the packaged PCB board, the conveyor plate is used to carry the clamp, and the conveyor belt is used to drive the conveyor plate to move. The visual inspection structure includes a main camera and an auxiliary camera. The main camera faces the PCB board, and the auxiliary camera faces the package solder joints between the chip and the PCB board. The two cameras work together to inspect the surface appearance of the package solder joints, thereby analyzing the quality of the package solder joints;

[0014] (2) The lifting and rotating structure can rotate the conveyor plate so that the surface appearance of the PCB board can be inspected on all four sides;

[0015] (3) The conveying plate and the fixture are automatically separated by the separation structure, which can save manpower and improve the detection efficiency of the mass analyzer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:

[0017] Figure 1 This is a schematic diagram of an embodiment of a DFN package solder joint quality analyzer of the present utility model;

[0018] Figure 2 This is another schematic diagram of an embodiment of a DFN package solder joint quality analyzer of the present invention.

[0019] List of reference numerals: 1. Frame; 2. Conveying structure; 21. Conveyor belt; 22. Conveying plate; 23. Clamp; 231. Bottom plate; 232. Reference block; 233. Floating block; 24. Limiting groove; 25. Positioning block; 26. Avoiding groove; 3. Visual inspection structure; 31. Main camera; 32. Auxiliary camera; 4. Lifting and rotating structure; 41. DD motor; 42. Lifting cylinder; 43. Limiting key; 5. Temporary storage area; 51. Ejection cylinder; 6. Separation structure; 61. Material conveyor belt; 62. Auxiliary material conveyor belt. DETAILED DESCRIPTION

[0020] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0021] It should be noted that in the description of this utility model, terms such as "upper," "lower," "left," "right," "inner," and "outer" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is merely for ease of description and does not indicate or imply that the device or component described must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, it should not be understood as limiting the utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance.

[0022] Furthermore, it should be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "installed," "set," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0023] To improve or resolve the technical problem in existing packaging inspection devices that are unable to inspect the appearance of package solder joints and accurately determine package quality, the present invention provides a DFN package solder joint quality analyzer. The package solder joint quality analyzer comprises: a frame 1; a conveyor structure 2 mounted on the frame 1; the conveyor structure 2 comprises a conveyor belt 21, a conveyor plate 22 disposed on the conveyor belt 21, a drive motor for driving the conveyor belt 21, and a fixture 23 disposed on the conveyor plate 22; a visual inspection structure 3 mounted on the frame 1; the visual inspection structure 3 comprises a main camera 31 facing the fixture 23, and auxiliary cameras 32 disposed on either side of the main camera 31 and tilted toward the fixture 23 to inspect the quality of the side solder joints of the package.

[0024] Figure 1 This is a schematic diagram of an embodiment of a DFN package solder joint quality analyzer of the present invention. Figure 2 FIG. 1 is another schematic diagram of an embodiment of a DFN package solder joint quality analyzer of the present invention. Figure 1 and Figure 2 As shown, in one or more embodiments, the utility model provides a DFN package solder joint quality analyzer including: a frame 1, a conveying structure 2, a visual inspection structure 3, a lifting and rotating structure 4, a temporary storage area 5 and a separation structure 6.

[0025] Continue to see Figure 1 and Figure 2The frame 1 includes two brackets arranged opposite each other and connected by a crossbeam. In one or more embodiments, the conveying structure 2 includes a conveyor belt 21, a conveyor plate 22 disposed on the conveyor belt 21, a clamp 23 disposed on the conveyor plate 22, and a drive motor for driving the conveyor belt 21. Specifically, a driving shaft is rotatably mounted on one end of the frame 1, with both ends of the driving shaft rotatably mounted on the frame 1. A driven shaft is rotatably mounted on the other end of the frame 1, with both ends of the driven shaft rotatably mounted on the frame 1. The conveyor belt 21 is sleeved over the driving shaft and the driven shaft. The drive motor is connected to the driving shaft to drive the driving shaft to rotate. Alternatively, the drive motor is connected to the driving shaft via a chain. Furthermore, the conveyor plate 22 overlaps the conveyor belt 21. The conveyor plate 22 has an overlapping groove formed in a roughly rectangular shape, and the width of the overlapping groove is slightly larger than the width of the conveyor belt 21. Furthermore, positioning blocks 25 are provided on the conveying plate 22. Specifically, there are three positioning blocks 25, two of which are arranged at right angles, and are used to position the clamp 23. Furthermore, the clamp 23 includes a base plate 231, a reference block 232, and a floating block 233. The reference block 232 and the floating block 233 are mounted on the base plate 231. Specifically, the base plate 231 is a roughly rectangular plate, and a clearance groove 26 is provided on one side of the base plate 231. The clearance groove 26 is a roughly rectangular groove for matching with the separation structure 6. Furthermore, a limiting groove 24 is provided at the bottom of the base plate 231 for connecting to the lifting and rotating structure 4. Furthermore, the reference block 232 and the floating block 233 are arranged opposite each other, and the floating block 233 includes a fixed block fixed to the base plate 231, a compression spring connected to the fixed block, and a floating plate connected to the compression spring. The PCB board is arranged between the floating plate and the reference block 232, and is clamped by the elasticity of the compression spring.

[0026] Continue to see Figure 1 and Figure 2 In one or more embodiments, the visual inspection structure 3 is mounted on the frame 1. The visual inspection structure 3 includes a main camera 31 facing the fixture 23, and auxiliary cameras 32 arranged on both sides of the main camera 31. Specifically, a mounting frame is arranged on the frame 1, the main camera 31 is arranged on the top wall of the mounting frame, and the auxiliary camera 32 is arranged on the side wall of the mounting frame. Both the main camera 31 and the auxiliary camera 32 are industrial cameras. The main camera 31 faces the upper chip of the PCB board and is used to perform appearance inspection on the overall package solder joints; the auxiliary camera 32 faces the side solder joints of the package and is used to perform appearance inspection on the package solder joints at each side.

[0027] Continue to see Figure 1 and Figure 2In one or more embodiments, the lifting and rotating structure 4 is positioned directly below the visual inspection structure 3. The lifting and rotating structure 4 includes a DD motor 41 and a lifting cylinder 42 that drives the DD motor 41 upward and downward. The lifting cylinder 42 drives the DD motor 41 upward and downward, thereby lifting the conveyor plate 22. The DD motor 41 rotates the conveyor plate 22, causing the front and rear sides of the PCB to rotate to the left and right sides, facilitating visual inspection of the left and right solder joints by the auxiliary camera 32. Specifically, a mounting plate is provided on the top of the lifting cylinder 42, and the DD motor 41 is mounted on the mounting plate. Guide posts are arranged around the lifting cylinder 42, and guide holes are provided on the mounting plate to match the guide posts. Furthermore, a limit key 43 is provided on the top of the DD motor 41, which mates with the limit slot 24. When the DD motor 41 is raised, the limit key 43 inserts into the limit slot 24, ensuring a stable connection between the DD motor 41 and the conveyor plate 22.

[0028] Continue to see Figure 1 and Figure 2 In one or more embodiments, a temporary storage area 5 is provided on one side of the frame 1, and a push-out cylinder 51 is provided on the other side of the frame 1, with the positioning block 25 adjacent to the push-out cylinder 51. Specifically, the temporary storage area 5 can be a section of the conveyor belt 21. When a package solder joint fails analysis or material accumulates, the push-out cylinder 51 extends, pushing the clamp 23 on the conveyor plate 22 toward the temporary storage area 5.

[0029] Continue to see Figure 1 and Figure 2 In one or more embodiments, the separation structure 6 is arranged at the end of the conveying structure 2. The separation structure 6 includes a material conveyor belt 21 extending obliquely upward, and an auxiliary material conveyor belt 62 extending obliquely downward. The material conveyor belt 61 is used to convey the clamp 23, and the auxiliary material conveyor belt 62 is used to convey the conveying plate 22. Specifically, the auxiliary material conveyor belt 62 includes two relatively arranged auxiliary material conveyor belts, and the interval between the two auxiliary material conveyor belts 62 is the same as the interval between the two conveyor belts 21. One material conveyor belt 61 is provided, and the material conveyor belt 61 is arranged between the two auxiliary material conveyor belts 62. When the conveying plate 22 moves to the end of the conveying structure 2, the material conveyor belt 61 is connected to the clamp 23 and drives the clamp 23 to move; the conveying plate 22 falls on the auxiliary material conveyor belt 62 due to the arrangement of the avoidance groove 26, and moves under the drive of the auxiliary material conveyor belt 62.

[0030] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is clearly not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. A DFN package solder joint quality analyzer, characterized in that: include: Rack (1); A conveying structure (2) is installed on the frame (1); the conveying structure (2) includes a conveyor belt (21), a conveyor plate (22) arranged on the conveyor belt (21), a driving motor for driving the conveyor belt (21), and a clamp (23) arranged on the conveyor plate (22); A visual inspection structure (3) is installed on the frame (1); the visual inspection structure (3) includes a main camera (31) facing the fixture (23), and auxiliary cameras (32) arranged on both sides of the main camera (31) and tilted toward the fixture (23) to inspect the quality of the side solder joints of the package.

2. A DFN package solder joint quality analyzer according to claim 1, characterized in that: The conveying plate (22) is overlapped on the conveyor belt (21); a lifting and rotating structure (4) is arranged below the conveying plate (22) and is arranged opposite to the main camera (31); the lifting and rotating structure (4) includes a DD motor (41) and a lifting cylinder (42) that drives the DD motor (41) to rise and fall; the DD motor (41) is configured to form a detachable connection with the conveying plate (22) and drive the conveying plate (22) to rotate.

3. A DFN package solder joint quality analyzer according to claim 2, characterized in that: A limit key (43) is provided on the DD motor (41), and a limit groove (24) matching the limit key (43) is provided on the conveying plate (22).

4. A DFN package solder joint quality analyzer according to claim 1, characterized in that: The clamp (23) comprises a bottom plate (231) connected to the conveying plate (22), a reference block (232) arranged on the bottom plate (231), and a floating block (233) arranged opposite to the reference block (232); and a positioning block (25) is arranged on the conveying plate (22) and abuts against the bottom plate (231).

5. A DFN package solder joint quality analyzer according to claim 4, characterized in that: A temporary storage area (5) is provided on one side of the frame (1), and a push-out cylinder (51) is provided on the other side of the frame (1); the positioning block (25) is positioned close to the push-out cylinder (51), and the push-out cylinder (51) is configured to push the clamp (23) toward the temporary storage area (5).

6. A DFN package solder joint quality analyzer according to claim 5, characterized in that: A separation structure (6) is provided at the end of the conveying structure (2), and the separation structure (6) comprises a material conveying belt (61) arranged obliquely upward, and an auxiliary material conveying belt (62) arranged obliquely downward; the auxiliary material conveying belt (62) is matched with the conveying plate (22); and an avoidance groove (26) for avoiding the material conveying belt (61) is provided at one end of the conveying plate (22) close to the material conveying belt (61).

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