Radar transmit-receive assembly and missile-borne radar

Abstract

The utility model discloses a radar transmit-receive assembly and a missile-borne radar, and relates to the technical field of missile-borne radar guidance, the radar transmit-receive assembly comprises a cavity, a power amplifier module and a heat conduction layer, the cavity is provided with a first chamber and a second chamber, and the first chamber and the second chamber are vertically separated; the power amplifier modules are arranged in the first cavity, the power amplifier modules are arranged at intervals, and when the power amplifier modules are vertically projected to the second cavity, projection areas of the power amplifier modules do not have overlapped parts; the heat conduction layer is arranged in the second cavity, and the heat conduction area of the heat conduction layer covers the projection area of each power amplifier module. According to the radar transmit-receive assembly, the heat conduction layer covering the projection area of the power amplifier module is arranged in the second cavity, so that the heat conduction efficiency is effectively improved, uniform distribution of temperature is realized, and the problems of non-uniform heat distribution and insufficient heat dissipation caused by limited heat conduction performance of aluminum alloy mentioned in the background technology are solved.

Description

Technical Field

[0001] The present application relates to the field of missile-borne radar guidance technology, and in particular to a radar transceiver component and a missile-borne radar. Background Art

[0002] The radar transceiver assembly (also known as the T / R assembly, meaning transmitter and receiver) is a key component of missile-borne radar, responsible for transmitting and receiving electromagnetic waves. Its performance and stability are crucial to the entire system. With the rapid advancement of electronic technology, the integration of radar transceivers has become increasingly high, and the power density of power amplifier chips has also increased. This has led to a significant amount of heat generated within the confined space on board the missile.

[0003] While existing radar transceiver components employ some heat dissipation measures, such as using aluminum alloy components for heat conduction and storage, these methods are insufficient when dealing with the high-power density of power amplifier chips. Aluminum alloy's limited thermal conductivity makes it difficult to dissipate heat. The accumulated heat is unevenly distributed within the radar transceiver, with areas closer to the heat source experiencing higher temperatures and areas farther away from the heat source experiencing lower temperatures. This temperature gradient not only impacts the performance of the radar transceiver but can also shorten its service life. Utility Model Content

[0004] The present application aims to provide a radar transceiver assembly that effectively improves heat conduction efficiency and achieves uniform temperature distribution by providing a heat-conducting layer in the second chamber that covers the projection area of ​​the power amplifier module, thereby resolving the problems of uneven heat distribution and insufficient heat dissipation caused by the limited thermal conductivity of aluminum alloys mentioned in the background art. Another object of the present application is to provide a missile-borne radar.

[0005] To achieve the above objectives, the present application provides a radar transceiver assembly, comprising:

[0006] The cavity comprises a first chamber and a second chamber, wherein the first chamber and the second chamber are vertically separated;

[0007] A power amplifier module is disposed in the first cavity, and the power amplifier modules are arranged in an interval arrangement. When the power amplifier modules are vertically projected onto the second cavity, the projection areas of the power amplifier modules do not overlap with each other.

[0008] The heat-conducting layer is provided in the second cavity, and the heat-conducting area of ​​the heat-conducting layer covers the projection area of ​​each power amplifier module.

[0009] In some embodiments, the radar transceiver assembly further comprises:

[0010] A heat storage layer is provided in the second chamber, the heat storage layer is combined with the heat conducting layer, and the specific heat capacity of the heat storage layer is higher than the specific heat capacity of the heat conducting layer.

[0011] In some embodiments, the heat storage area of ​​the heat storage layer in the second chamber does not overlap with the projection area of ​​the power amplifier module.

[0012] In some embodiments, the heat storage area of ​​the heat storage layer is located at the tail of the heat conducting layer, and the projection area of ​​the power amplifier module is located at the head of the heat conducting layer.

[0013] In some embodiments, the heat-conducting layer and the heat storage layer are matched in a concave-convex manner at the combined position.

[0014] In some embodiments, the heat storage layer is embedded in the heat conducting layer;

[0015] The heat-conducting layer is provided with a plane portion and a rib portion, the rib portion is arranged at intervals along the surface of the plane portion, and the rib portion and the plane portion define an interlocking cavity for combining with the heat storage layer.

[0016] In some embodiments, a tooth groove structure is provided on a surface of the rib portion on one side close to the heat storage layer.

[0017] In some embodiments, the cavity comprises:

[0018] a chamber housing, provided with a partition, the first chamber and the second chamber, wherein the partition separates the first chamber and the second chamber;

[0019] a cover plate, provided on the cavity shell, the cover plate covering the first cavity;

[0020] The power amplifier module is fixed to a side surface of the partition close to the first cavity, a circuit board is fixed in the first cavity, and the circuit board is signal-connected to the power amplifier module.

[0021] In some embodiments, the first chamber is mirror-symmetrical with respect to the second chamber as a symmetry plane, and the radar transceiver assembly is a mirror-symmetrical structure.

[0022] The present application also provides a missile-borne radar, including the above-mentioned radar transceiver component.

[0023] Compared with the above background technology, the radar transceiver assembly provided in this application mainly includes a cavity, a power amplifier module and a thermal conductive layer. The cavity is provided with a first cavity and a second cavity, and the first cavity and the second cavity are vertically separated; the power amplifier module is arranged in the first cavity, and the power amplifier modules are arranged in a spaced manner. When the power amplifier modules are vertically projected to the second cavity, there is no overlapping part between the projection areas of each power amplifier module; the thermal conductive layer is provided in the second cavity, and the thermal conductive area of ​​the thermal conductive layer covers the projection area of ​​each power amplifier module.

[0024] In the field of missile-borne radar guidance technology, the performance and stability of radar transceiver components are crucial to the entire system. With the rapid development of electronic technology, the integration of radar transceiver components has increased, and the power density of power amplifier chips has increased, resulting in a large amount of heat generated within the confined missile-borne space. Existing heat dissipation measures, such as using aluminum alloy structural components for heat conduction and heat storage, are insufficient when dealing with high-power-density power amplifier chips. The limited thermal conductivity of aluminum alloys makes it difficult to effectively dissipate heat. The accumulated heat is unevenly distributed within the radar transceiver component, especially in areas close to the heat source where the temperature is higher, while areas farther away from the heat source are cooler. This temperature gradient not only affects the performance of the radar transceiver component but can also shorten its service life.

[0025] To address this technical problem, the radar transceiver assembly provided in this application adopts an innovative structural design. The assembly includes a cavity, a power amplifier module, and a heat-conducting layer, wherein the cavity is provided with a first cavity and a second cavity. The power amplifier module is arranged in the first cavity and spaced apart to ensure that the projected areas of the power amplifier module in the second cavity do not overlap. The heat-conducting layer is arranged in the second cavity, and its heat-conducting area covers the projected area of ​​the power amplifier module. This design effectively improves the heat conduction efficiency and achieves uniform temperature distribution by providing a heat-conducting layer in the second cavity that covers the projected area of ​​the power amplifier module.

[0026] Because the thermal layer's material and structure are optimized for higher thermal conductivity than aluminum alloy, it more efficiently conducts heat transferred from the first chamber. Since the thermal layer covers the projected area of ​​all power amplifier modules, it evenly disperses heat, reducing heat accumulation in the second chamber and achieving a more uniform temperature distribution. This design not only improves heat transfer efficiency but also reduces temperature gradients by evenly distributing heat, which is critical for improving the performance and reliability of radar transceiver components. By reducing heat accumulation and temperature unevenness, the risk of component performance degradation and shortened life due to overheating is reduced.

[0027] Combined with the above structure and process description, it can be seen that the radar transceiver assembly has at least the following beneficial effects: the radar transceiver assembly effectively improves the heat conduction efficiency and achieves uniform temperature distribution by setting a heat-conducting layer covering the projection area of ​​the power amplifier module in the second chamber, thereby solving the problems of uneven heat distribution and insufficient heat dissipation caused by the limited thermal conductivity of aluminum alloy mentioned in the background technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0029] Figure 1 An exploded view of a radar transceiver assembly provided in an embodiment of the present application;

[0030] Figure 2 A schematic diagram of the heat-conducting layer provided in an embodiment of the present application when the cavity is transparent;

[0031] Figure 3 A schematic diagram of the heat-conducting layer and the heat-storage layer provided in an embodiment of the present application when the cavity is made transparent;

[0032] Figure 4 A cross-sectional view of a radar transceiver assembly provided in an embodiment of the present application;

[0033] Figure 5 Temperature diagram of radar transceiver components provided by the prior art;

[0034] Figure 6 This is a temperature diagram of the radar transceiver assembly provided in an embodiment of the present application.

[0035] in:

[0036] Cavity 1, cavity shell 11, partition 111, first cavity 112, second cavity 113, cover 12, power amplifier module 2, heat conducting layer 3, plane portion 31, rib portion 32, interlocking cavity 301, tooth groove structure 321, heat storage layer 4, circuit board 5. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0038] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0039] Please refer to Figure 1 and Figure 2 ,in, Figure 1 This is an exploded view of the radar transceiver assembly provided in an embodiment of the present application. Figure 2 This is a schematic diagram of the heat-conducting layer provided in the embodiment of the present application when the cavity is transparent. Figure 2 In the embodiment, the cavity 1 is made transparent by making part of the structure of the cavity 1 (such as the partition structure between the first cavity 112 and the second cavity 113 ) transparent so that the heat conducting layer 3 is exposed from the cavity 1 .

[0040] In a first specific embodiment, the radar transceiver assembly provided in the embodiment of the present application mainly includes a cavity 1, a power amplifier module 2, and a thermal conductive layer 3. The cavity 1 is provided with a first cavity 112 and a second cavity 113, and the first cavity 112 and the second cavity 113 are vertically separated. The specific positions of the first cavity 112 and the second cavity 113 are not limited here. In other words, the first cavity 112 can be located directly above the second cavity 113, or directly below the second cavity 113, and both are within the scope of the description of this embodiment.

[0041] At the same time, this embodiment does not limit the number and arrangement relationship of the first chamber 112 and the second chamber 113. For example, the first chamber 112 and the second chamber 113 can be in a one-to-one correspondence, in which case a single first chamber 112 is located above or below a single second chamber 113; or the first chamber 112 and the second chamber 113 can be in a one-to-many or many-to-one relationship, in which case multiple first chambers 112 are located above and / or below the second chamber 113, or multiple second chambers 113 are located above and / or below the first chamber 112, all of which fall within the scope of the description of this embodiment. The power amplifier module 2 is provided in the first chamber 112, and the power amplifier modules 2 are arranged in an interval arrangement. When the power amplifier modules 2 are vertically projected onto the second chamber 113, there is no overlap between the projection areas of the power amplifier modules 2. The specific arrangement of the power amplifier modules 2 is not limited here. That is, the power amplifier modules 2 can be arranged horizontally and spaced apart in the first chamber 112, or can be arranged vertically and spaced apart in the first chamber 112, or can be arranged at intervals in other directions such as at intervals in a diagonal direction, or can be arranged at intervals in a combination of multiple directions, all of which fall within the scope of the description of this embodiment.

[0042] It should be noted that this embodiment does not limit the materials of the cavity 1 and the thermal conductive layer 3. The cavity 1 can be made of a material that takes into account both structural strength and thermal conductivity, such as aluminum alloy; the thermal conductive layer 3 can be made of a material with high thermal conductivity, preferably a material with a thermal conductivity higher than that of aluminum alloy, such as a material with a comprehensive thermal conductivity of up to 600 W / m·K, which are not listed here one by one.

[0043] In addition to the components in the above embodiment, the radar transceiver assembly can also add other components as needed, which are not listed here one by one.

[0044] When in use, the power amplifier module 2 generates heat, most of which is transferred by the heat-conducting layer 3 with high thermal conductivity, and a small part of the heat is transferred by the cavity 1 itself; the transferred heat can be released through the heat exchange process between the cavity 1 and the outside world, or it can be released to the outside world through components outside the cavity 1 by adding components, which is not limited here.

[0045] In the field of missile-borne radar guidance technology, the performance and stability of radar transceiver components are crucial to the entire system. With the rapid development of electronic technology, the integration of radar transceiver components has increased, and the power density of power amplifier chips has increased, resulting in a large amount of heat generated within the confined missile-borne space. Existing heat dissipation measures, such as using aluminum alloy structural components for heat conduction and heat storage, are insufficient when dealing with high-power-density power amplifier chips. The limited thermal conductivity of aluminum alloys makes it difficult to effectively dissipate heat. The accumulated heat is unevenly distributed within the radar transceiver component, especially in areas close to the heat source where the temperature is higher, while areas farther away from the heat source are cooler. This temperature gradient not only affects the performance of the radar transceiver component but can also shorten its service life.

[0046] To address this technical problem, the radar transceiver assembly provided in this application adopts an innovative structural design. The assembly includes a cavity 1, a power amplifier module 2, and a heat-conducting layer 3, wherein the cavity 1 is provided with a first cavity 112 and a second cavity 113. The power amplifier module 2 is provided in the first cavity 112 and is arranged at intervals to ensure that the projection area of ​​the power amplifier module 2 in the second cavity 113 does not overlap. The heat-conducting layer 3 is provided in the second cavity 113, and its heat-conducting area covers the projection area of ​​the power amplifier module 2. The heat-conducting area of ​​the heat-conducting layer 3 corresponds to its own structural entity and is specifically reflected as a heat-conducting surface in the second cavity 113. That is, the area of ​​the heat-conducting layer 3 is large enough to just cover the projection area of ​​the power amplifier module 2, or there is still margin after just covering, so it includes two situations: just covering and over-covering. This design effectively improves the heat conduction efficiency and achieves uniform temperature distribution by providing a heat-conducting layer 3 covering the projection area of ​​the power amplifier module 2 in the second cavity 113.

[0047] Because the material and structure of the thermally conductive layer 3 are optimized for higher thermal conductivity than aluminum alloy, it more efficiently conducts heat transferred from the first chamber 112. Since the thermally conductive layer 3 covers the entire projected area of ​​the power amplifier modules 2, it evenly disperses heat, reducing heat accumulation in the second chamber 113 and achieving a more uniform temperature distribution. This design not only improves the efficiency of heat conduction but also reduces temperature gradients by evenly distributing heat, which is crucial for improving the performance and reliability of radar transceiver components. By reducing heat accumulation and temperature unevenness, the risk of component performance degradation and shortened life due to overheating is reduced.

[0048] In combination with the above structure and process description, it can be seen that the radar transceiver assembly has at least the following beneficial effects: the radar transceiver assembly effectively improves the heat conduction efficiency and achieves uniform temperature distribution by setting a heat-conducting layer 3 covering the projection area of ​​the power amplifier module 2 in the second chamber 113, thereby solving the problems of uneven heat distribution and insufficient heat dissipation caused by the limited thermal conductivity of aluminum alloy mentioned in the background technology.

[0049] Please refer to Figure 3 and Figure 4 ,in, Figure 3 This is a schematic diagram of the heat-conducting layer and the heat storage layer provided in the embodiment of the present application when the cavity is transparent. Figure 4 A cross-sectional view of a radar transceiver assembly provided in an embodiment of the present application. Figure 3 In the embodiment, the transparency of the cavity 1 refers to the transparency treatment of part of the structure of the cavity 1 (such as the partition structure between the first cavity 112 and the second cavity 113) so that the heat conducting layer 3 and the heat storage layer 4 are exposed from the cavity 1.

[0050] In some embodiments, the radar transceiver assembly further comprises:

[0051] The heat storage layer 4 is disposed in the second chamber 113 . The heat storage layer 4 is combined with the heat conducting layer 3 . The specific heat capacity of the heat storage layer 4 is higher than that of the heat conducting layer 3 .

[0052] In this embodiment, the radar transceiver assembly further includes a heat storage layer 4, which is disposed within the second chamber 113 and tightly coupled to the heat conductive layer 3. This design utilizes the high specific heat capacity of the heat storage layer 4, meaning that the heat storage layer 4 can absorb and store more heat. Compared to the heat conductive layer 3, the heat storage layer 4 has a higher specific heat capacity.

[0053] With this design, the heat storage layer 4 can be considered to transfer heat generated by the power amplifier module 2, especially heat generated in a local area, to other areas of the radar transceiver assembly. This heat redistribution helps reduce heat accumulation near the power amplifier module 2, thereby reducing temperature peaks in that area and improving the heat dissipation efficiency of the entire assembly.

[0054] Specifically, when the power amplifier module 2 generates heat during operation, this heat is first rapidly conducted to the second chamber 113 by the heat-conducting layer 3. Subsequently, due to the high specific heat capacity of the heat storage layer 4, this conducted heat is absorbed and dispersedly stored by the heat storage layer 4, thereby preventing excessive heat concentration near the power amplifier module 2. This dispersed heat storage facilitates more even distribution within the radar transceiver assembly, reducing the risk of localized overheating and thereby improving the thermal stability and overall performance of the assembly.

[0055] In some cases, the heat-conducting layer 3 is made of a high-thermal-conductivity material, and the heat-storage layer 4 is made of a high-specific-heat-capacity material. Furthermore, the density of the heat-storage layer 4 is lower than that of aluminum alloy, potentially as low as one-third. This results in a smaller and lighter radar transceiver assembly compared to external or pure aluminum components.

[0056] In some embodiments, the heat storage area of ​​the heat storage layer 4 in the second chamber 113 does not overlap with the projection area of ​​the power amplifier module 2 .

[0057] In this embodiment, the design of the heat storage layer 4 specifically considers its thermal management relationship with the power amplifier module 2. Specifically, the heat storage area of ​​the heat storage layer 4 within the second chamber 113 is designed to completely overlap with the projected area of ​​the power amplifier module 2. The heat storage area of ​​the heat storage layer 4 corresponds to its own structural entity, specifically reflected as a heat storage surface in the second chamber 113. In other words, the heat storage layer 4 is positioned sufficiently away from the projected area of ​​the power amplifier module 2, with no overlap between them. This design facilitates more efficient thermal management by allowing the heat storage layer 4 to specifically absorb and store heat that does not directly originate from the power amplifier module 2. This improves the heat storage efficiency of the heat storage layer 4 while ensuring the thermal conductivity of the heat conductive layer 3.

[0058] In addition, this non-overlap design helps reduce the impact of thermal stress on the power amplifier module 2, because heat will not be accumulated directly below or above the power amplifier module 2. This helps protect the power amplifier module 2 from overheating damage, thereby improving the reliability and life of the radar transceiver assembly.

[0059] In general, this design achieves more effective heat management and distribution by separating the heat storage area of ​​the heat storage layer 4 from the projection area of ​​the power amplifier module 2, thereby improving the thermal stability and performance of the radar transceiver assembly.

[0060] In some embodiments, the heat storage area of ​​the heat storage layer 4 is located at the tail of the heat conducting layer 3 , and the projection area of ​​the power amplifier module 2 is located at the head of the heat conducting layer 3 .

[0061] In this embodiment, the spatial layout of the heat storage layer 4 and the power amplifier module 2 is carefully designed to optimize heat transfer and management. Specifically, the heat storage area of ​​the heat storage layer 4 is located at the rear of the thermal conductive layer 3, while the projected area of ​​the power amplifier module 2 is located at the head of the thermal conductive layer 3. This layout means that the heat transfer path is along the thermal conductive layer 3, from the head to the tail.

[0062] This design allows heat to be absorbed first at the head of the thermally conductive layer 3, closest to the power amplifier module 2, and then transferred along the thermally conductive layer 3 to the tail. During this process, the thermally conductive layer 3 leverages its high thermal conductivity to effectively transfer heat from the power amplifier module 2, acting as the heat source, to the heat storage layer 4. Because the heat storage layer 4 is located at the tail of the thermally conductive layer 3, it captures and stores heat transferred from the thermally conductive layer 3, thereby reducing heat accumulation near the power amplifier module 2 and preventing localized overheating.

[0063] This end-to-end heat transfer path design not only improves heat conduction efficiency but also helps distribute it more evenly within the radar transceiver assembly, reducing the risk of localized overheating. In this way, the heat storage layer 4 can effectively absorb and disperse heat, lowering the operating temperature of the entire assembly and improving its thermal stability and performance.

[0064] In general, this design optimizes heat transfer and management by rationally arranging the heat storage layer 4 and the power amplifier module 2, ensuring that heat can be effectively transferred from the heat source to the heat storage area along the heat conductive layer 3, thereby improving the heat dissipation efficiency and reliability of the radar transceiver assembly.

[0065] In some embodiments, the heat-conducting layer 3 and the heat-storage layer 4 are matched in a concave-convex manner at the bonding position.

[0066] In this embodiment, the connection between the heat-conducting layer 3 and the heat-storing layer 4 adopts a concave-convex design. The main purpose of this design is to increase the contact area between the two. By increasing the contact area, the efficiency of heat transfer from the heat-conducting layer 3 to the heat-storing layer 4 and the efficiency of heat storage in the heat-storing layer 4 can be improved.

[0067] The concave-convex design also allows the use of materials with lower thermal conductivity in the heat storage layer 4. Typically, to improve heat transfer efficiency, materials with higher thermal conductivity are preferred. However, by adopting a concave-convex design, even if the thermal conductivity of the heat storage layer 4 is lower, the increased contact area can compensate for the lower thermal conductivity, thus ensuring efficient heat transfer from the heat conducting layer 3 to the heat storage layer 4.

[0068] This design also increases the freedom in material selection for the heat storage layer 4. Since high thermal conductivity isn't required for the heat storage layer 4, materials with higher specific heat capacity but lower thermal conductivity can be chosen. Such materials can store heat more efficiently because they can store more heat in the same volume. This is a significant advantage for applications that seek to increase the thermal capacity of a component without sacrificing significant thermal conductivity.

[0069] It should be noted that this embodiment does not strictly limit the specific form of the concave-convex matching. The heat conducting layer 3 may be designed as a convex portion, while the heat storage layer 4 may be designed as a concave portion, or vice versa, that is, the heat conducting layer 3 may be a concave portion and the heat storage layer 4 may be a convex portion. The flexibility of this design allows the determination of which layer to be used as the convex or concave portion according to the specific manufacturing process and design requirements. In addition, the shape of the concave and convex can also be diversified. It can be a simple geometric shape such as a circle, square or rectangle, or a complex non-geometric shape to adapt to specific thermal management requirements and spatial layout. The key point is to optimize the contact area through the concave-convex matching, thereby improving the efficiency of heat transfer, and the specific implementation method can be flexibly adjusted according to the actual application scenario and design requirements.

[0070] In some embodiments, the heat storage layer 4 is embedded in the heat conducting layer 3;

[0071] The heat conducting layer 3 includes a plane portion 31 and rib portions 32 . The rib portions 32 are spaced apart along the surface of the plane portion 31 . The rib portions 32 and the plane portion 31 define a fitting cavity 301 for combining with the heat storage layer 4 .

[0072] In this embodiment, the heat storage layer 4 and the heat conductive layer 3 are combined using an inlay design, which allows the heat storage layer 4 to be tightly embedded in the heat conductive layer 3. The heat conductive layer 3 is specially designed with a planar portion 31 and rib portions 32, wherein the rib portions 32 are arranged at regular intervals along the surface of the planar portion 31. This structural design forms multiple interlocking cavities 301 between the planar portion 31 and the rib portions 32, which are specifically designed to engage with the heat storage layer 4.

[0073] This design of the interlocking cavity 301 not only strengthens the mechanical bond between the heat-conducting layer 3 and the heat storage layer 4, but also enhances heat exchange efficiency by increasing the contact area. The ribs 32 can be considered raised portions of the heat-conducting layer 3. They form multiple, separate areas on the planar portion 31 that serve to secure and support the heat storage layer 4. The heat storage layer 4 can be designed to match the shape and size of the interlocking cavity 301 to ensure good contact and heat transfer between the two.

[0074] This mosaic structure allows the heat storage layer 4 to more effectively absorb and store heat transferred from the power amplifier module 2 to the heat conducting layer 3. The mosaic cavity 301 provides a structurally stable platform, enabling the heat storage layer 4 to maintain its position despite thermal expansion and mechanical stress. Furthermore, the design of the ribs 32 increases the surface area of ​​the heat conducting layer 3, further improving heat dispersion and conduction efficiency.

[0075] In some embodiments, a tooth groove structure 321 is provided on the surface of the rib portion 32 on one side close to the heat storage layer 4 .

[0076] In this embodiment, the design of the rib portion 32 is further optimized to enhance its integration with the heat storage layer 4. Specifically, the surface of the rib portion 32 adjacent to the heat storage layer 4 is designed to have a tooth-groove structure 321. This tooth-groove structure 321 enhances the interaction between the rib portion 32 and the heat storage layer 4 on two levels.

[0077] The tooth-groove structure 321 increases the contact area between the rib portion 32 and the heat storage layer 4. This increased contact area helps improve the efficiency of heat transfer from the heat-conducting layer 3 to the heat storage layer 4, as more contact points promote heat dispersion and absorption. Furthermore, the tooth-groove structure 321 enhances the bond strength between the rib portion 32 and the heat storage layer 4. This structure, similar to an interlocking mechanism, strengthens the mechanical connection between the two and reduces relative movement or separation that could occur due to thermal expansion or other mechanical stresses.

[0078] The design of the tooth groove structure 321 on the rib portion 32 not only optimizes thermal management performance but also enhances the stability and durability of the entire structure. This design strengthens the bond between the heat-conducting layer 3 and the heat-storage layer 4, improving the overall structural strength of the radar transceiver assembly in high-temperature and mechanically stressed environments. This is crucial for ensuring the reliability and long-term stability of the radar transceiver assembly under various operating conditions.

[0079] In some embodiments, the cavity 1 comprises:

[0080] The chamber housing 11 is provided with a partition 111, a first chamber 112 and a second chamber 113, wherein the partition 111 separates the first chamber 112 and the second chamber 113;

[0081] The cover plate 12 is provided on the chamber housing 11 , and the cover plate 12 covers the first chamber 112 ;

[0082] The power amplifier module 2 is fixed to a side surface of the partition 111 close to the first chamber 112 . A circuit board 5 is fixed in the first chamber 112 . The circuit board 5 is signal-connected to the power amplifier module 2 .

[0083] In this embodiment, the structural design of the chamber body 1 considers the chamber shell 11 as a single integral structure, comprising a partition 111, a first chamber 112, and a second chamber 113. The partition 111 serves as a dividing interface, dividing the interior space of the chamber shell 11 into two independent parts: the second chamber 113, which serves as the inner core chamber, and the first chamber 112, which serves as the outer core chamber. This design allows the two chambers to function independently while maintaining structural integrity.

[0084] Second chamber 113, serving as the inner core cavity, can be designed to house thermal management components such as the heat storage layer 4 and the heat conductive layer 3. These components are responsible for absorbing and dissipating heat from the power amplifier module 2. First chamber 112, serving as the outer core cavity, houses the power amplifier module 2 and the circuit board 5. The power amplifier module 2 is secured to one side of the partition 111, adjacent to the first chamber 112, while the circuit board 5 is secured within the first chamber 112 and provides signal connections to the power amplifier module 2.

[0085] This design not only provides a stable structure to protect and support key components of the radar transceiver assembly, but also enables effective heat management and signal transmission. The partition 111 separates the heat generation area (first chamber 112) from the heat management area (second chamber 113), helping to control heat distribution and improve heat dissipation efficiency. Furthermore, the cover 12 ensures the sealing of the first chamber 112, protecting the internal components from external influences and maintaining internal stability.

[0086] Please continue to refer to Figure 2 and Figure 3 Since the partition 111 is a partition structure between the first chamber 112 and the second chamber 113, Figure 2 and Figure 3 The transparent treatment of the cavity 1 is equivalent to making the partition 111 transparent. Figure 2 Thermal conductive layer 3, Figure 3 The heat conducting layer 3 and the heat storage layer 4 are exposed from the cavity shell 11.

[0087] by Figure 1 For example, the cavity 1 includes a cavity shell 11 and two cover plates 12, and the two cover plates 12 are respectively located on the upper and lower sides of the cavity shell 11; the cavity shell 11 has upper and lower partitions 111, and the upper first chamber 112 is located between the upper partition plate 111 and the upper cover plate 12, and the lower first chamber 112 is located between the lower partition plate 111 and the lower cover plate 12. There is a second chamber 113 between the upper and lower first chambers 112, and the upper and lower sides of the second chamber 113 are separated from the two first chambers 112 by two partitions 111 respectively.

[0088] In this embodiment, the second chamber 113 can be regarded as the inner cavity of the cavity 1, and the first chamber 112 can be regarded as the outer cavity of the cavity 1. The inner cavity is embedded between the two outer cavities, and the power amplifier module 2 and the circuit board 5 are installed in the outer cavity. The thermal conductive layer 3 is integrated in the inner cavity. The thermal conductive layer 3 can be regarded as being embedded in the inner cavity without a gap. After the thermal conductive layer 3 is formed, the heat storage layer 4 is formed in the inner cavity by filling processing, and the heat storage layer 4 is combined with the thermal conductive layer 3 as one.

[0089] In some cases, the packaging process of the radar transceiver assembly is described as follows.

[0090] The manufacturing process of the cavity shell 11 and the heat-conducting layer 3 utilizes an integrated casting technology, which not only improves production efficiency but also enhances structural integrity. During the casting process, specific windows are reserved on the cavity shell 11. These windows are designed for the subsequent manufacture of the heat storage layer 4. Specifically, the material used to manufacture the heat storage layer 4 is poured into the cavity shell 11 through these windows, and then the heat storage layer 4 is formed in the cavity shell 11, embedded with the heat-conducting layer 3. Once the material of the heat storage layer 4 solidifies and forms in the cavity shell 11, these windows are sealed, completing the manufacturing process of the heat storage layer 4.

[0091] The power amplifier module 2 is secured directly to the partition 111 of the housing 11 by welding. This welding method provides a stable and secure connection, ensuring the stability and reliability of the power amplifier module 2 during operation. The circuit board 5 is secured to the partition 111 of the housing 11 by bolts. This fixing method ensures good electrical insulation between the circuit board 5 and the partition 111, while also facilitating installation and maintenance of the circuit board 5.

[0092] The signal connection between the power amplifier module 2 and the circuit board 5 is achieved via gold wire bonds. Gold wire bonds are a commonly used interconnect technology in microelectronic packaging. They provide a small yet robust connection capable of transmitting signals between the power amplifier module 2 and the circuit board 5. This connection is not only stable but also can withstand significant mechanical stress, making it suitable for radar transceiver components operating in harsh environments.

[0093] Finally, the cover plate 12 is fixed to the cavity shell 11 as a whole, ensuring the sealing and integrity of the radar transceiver assembly, protecting the internal components from the influence of the external environment, and also helping to maintain the stability of the internal environment.

[0094] In some embodiments, the first chamber 112 is mirror-symmetrical with the second chamber 113 as a symmetry plane, and the radar transceiver assembly is a mirror-symmetrical structure.

[0095] In this embodiment, the radar transceiver assembly is designed with a mirror-symmetric structure. This structure, with the second chamber 113 as the plane of symmetry, creates a vertically symmetrical layout for the first chamber 112, cover plate 12, power amplifier module 2, circuit board 5, and heat storage layer 4. Specifically, when the radar transceiver assembly is laid flat, the second chamber 113 is located in the center, with a first chamber 112 located on each side. These two first chambers 112 are mirror-symmetric in structure and function.

[0096] Each first chamber 112 is equipped with a cover plate 12, which seals the corresponding first chamber 112 and ensures the sealing of the first chamber 112. A power amplifier module 2 and a circuit board 5 are secured within each first chamber 112. The circuit board 5 is connected to the power amplifier module 2 via a signal connection. This design is implemented in both first chambers 112, achieving symmetry in the layout. In particular, the rear end of the heat-conducting layer 3 is surrounded by two heat storage layers 4, thereby improving the efficiency of heat transfer from the heat-conducting layer 3 to the heat storage layer 4.

[0097] This mirror-symmetric structural design not only improves the radar transceiver's thermal management efficiency but also enhances its balance and stability. By arranging the first chamber 112 and its internal components symmetrically above and below the second chamber 113, heat is evenly distributed throughout the radar transceiver, preventing localized overheating. This also improves component space utilization and structural compactness. Furthermore, the symmetrical design simplifies manufacturing and assembly, as many components and structures can share the same design and manufacturing process, improving production efficiency and reducing costs.

[0098] Please refer to Figure 5 and Figure 6 ,in, Figure 5 Temperature diagram of radar transceiver components provided by existing technology, Figure 6 This is a temperature diagram of the radar transceiver assembly provided in an embodiment of the present application.

[0099] contrast Figure 5 and Figure 6 The maximum temperature of the radar transceiver assembly provided by the embodiment of the present application is 175.14°C, while the maximum temperature of the radar transceiver assembly provided by the prior art is 215.34°C. The temperature is reduced by at least 40°C.

[0100] The present application also provides a missile-borne radar, including the above-mentioned radar transceiver component.

[0101] The missile-borne radar should have all the beneficial technical effects of the above-mentioned radar transceiver components.

[0102] The missile-borne radar can effectively reduce the operating temperature of the power amplifier module 2 in the cavity 1, thereby improving the reliability of the radar transceiver component; the use of embedded thermal conductive layer 3 and heat storage layer 4 makes the radar transceiver component in the cavity 1 lighter and smaller than previous components; the above two points can further extend the working time of the missile-borne radar and improve the combat performance of the missile.

[0103] It should be noted that many of the components mentioned in this application are universal standard parts or components known to those skilled in the art, and their structures and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0104] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0105] The above provides a detailed introduction to the radar transceiver assembly and missile-borne radar provided by this application. This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is intended only to facilitate understanding of the method and core concepts of this application. It should be noted that those skilled in the art may make various improvements and modifications to this application without departing from the principles of this application, and such improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A radar transceiver assembly, characterized in that: include: The cavity comprises a first chamber and a second chamber, wherein the first chamber and the second chamber are vertically separated; A power amplifier module is disposed in the first cavity, and the power amplifier modules are arranged in an interval arrangement. When the power amplifier modules are vertically projected onto the second cavity, the projection areas of the power amplifier modules do not overlap with each other. The heat-conducting layer is provided in the second cavity, and the heat-conducting area of ​​the heat-conducting layer covers the projection area of ​​each power amplifier module.

2. The radar transceiver assembly according to claim 1, characterized in that: Also includes: A heat storage layer is provided in the second chamber, the heat storage layer is combined with the heat conducting layer, and the specific heat capacity of the heat storage layer is higher than the specific heat capacity of the heat conducting layer.

3. The radar transceiver assembly according to claim 2, characterized in that: The heat storage area of ​​the heat storage layer in the second chamber does not overlap with the projection area of ​​the power amplifier module.

4. The radar transceiver assembly according to claim 2, characterized in that: The heat storage area of ​​the heat storage layer is located at the tail of the heat conducting layer, and the projection area of ​​the power amplifier module is located at the head of the heat conducting layer.

5. The radar transceiver assembly according to claim 2, characterized in that: The heat-conducting layer and the heat storage layer are matched with each other in a concave-convex manner at a combined position.

6. The radar transceiver assembly according to claim 5, characterized in that: The heat storage layer is embedded in the heat conducting layer; The heat-conducting layer is provided with a plane portion and a rib portion, the rib portion is arranged at intervals along the surface of the plane portion, and the rib portion and the plane portion define an interlocking cavity for combining with the heat storage layer.

7. The radar transceiver assembly according to claim 6, characterized in that: A tooth groove structure is provided on a surface of the rib portion on one side close to the heat storage layer.

8. The radar transceiver assembly according to any one of claims 1 to 7, characterized in that: The cavity comprises: a chamber housing, provided with a partition, the first chamber and the second chamber, wherein the partition separates the first chamber and the second chamber; a cover plate, provided on the cavity shell, the cover plate covering the first cavity; The power amplifier module is fixed to a side surface of the partition close to the first cavity, a circuit board is fixed in the first cavity, and the circuit board is signal-connected to the power amplifier module.

9. The radar transceiver assembly according to claim 8, characterized in that: The first chamber is mirror-symmetrical with the second chamber as a symmetry plane, and the radar transceiver assembly is a mirror-symmetrical structure.

10. A missile-borne radar, characterized in that: The radar transceiver assembly comprises the radar transceiver assembly according to any one of claims 1 to 9.

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