Substrate processing apparatus

Abstract

The utility model relates to a substrate processing device. The present invention suppresses an increase in size of a substrate processing apparatus due to increase in productivity. The substrate processing apparatus includes: a feed-in / feed-out module including a container placement portion on which a plurality of containers configured to be capable of accommodating substrates are placed; and a processing module which is provided adjacent to the feed / discharge module in the width direction and has a plurality of processing units for processing the substrate, and a handover module in which handover units for handover of the substrate are stacked is provided on the processing module side of the feed / discharge module for handover with the processing module. The feeding and discharging module further comprises a first conveying mechanism for conveying the substrate between the container carrying part and the transfer module, the processing module further comprises a second conveying mechanism for conveying the substrate between the transfer module and the processing unit, and the first conveying mechanism comprises a supporting part for supporting the substrate. The substrate supported by the support portion can pass through the transfer module in a depth direction intersecting with the width direction in a plan view.

Description

Technical Field

[0001] The utility model relates to a substrate processing device. Background Art

[0002] The coating and developing device disclosed in Patent Document 1 forms a coating film including an anti-etching film on a substrate that is fed into a carrier module using a carrier, and then develops the exposed substrate that is fed to an exposure device via an interface module and returned via the interface module and hands it over to a carrier module. The coating and developing device includes a processing module. The processing module includes a unit module for forming a coating film and a unit module for developing that is stacked on the unit module for forming a coating film. Each unit module includes a liquid processing unit, a heating unit, a cooling unit, and a conveying component for conveying substrates between units. In addition, a conveying area for substrates that connects the carrier module and the interface module is formed in the unit module. The area adjacent to the carrier module in the conveying area is a handover area for the substrate. A rack unit with one or more handover stations is provided in the handover area.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2006-203075 Utility Model Content

[0006] Problems to be solved by utility models

[0007] The technology of the present invention suppresses the increase in size of a substrate processing apparatus due to increased productivity.

[0008] Solutions for solving problems

[0009] A technical solution of the present invention is a substrate processing device, characterized in that the substrate processing device comprises: a feed-in and feed-out module, which has a container loading portion for loading a plurality of containers configured to accommodate substrates; and a processing module, which is arranged adjacent to the feed-in and feed-out module along the width direction and has a plurality of processing units for processing the substrates, a handover module is provided at a position close to the processing module side in the feed-in and feed-out module for handover with the processing module, the handover module is formed by stacking the handover units for handing over the substrates, the feed-in and feed-out module further has a first conveying mechanism for conveying the substrate between the container loading portion and the handover module, the processing module further has a second conveying mechanism for conveying the substrate between the handover module and the processing unit, the first conveying mechanism has a supporting portion for supporting the substrate, and the first conveying mechanism is configured to enable the substrate supported by the supporting portion to pass through the handover module along a depth direction intersecting the width direction when viewed from above.

[0010] The first conveying mechanism may transfer the substrate to and from the transfer module only in the depth direction.

[0011] Alternatively, the substrate processing device further includes a first air supply unit that supplies clean gas from above to the first conveying space in the input and output module in which the first conveying mechanism is provided, and the first conveying mechanism only transfers the substrate with the handover module from one side in the depth direction, and the first air supply unit is configured to supply the clean gas only to the portion of the first conveying space that is closer to the one side in the depth direction than the handover module, and the portion of the first conveying space that is closer to the other side in the depth direction than the handover module is filled with a storage portion for storing electrical appliances.

[0012] The container placement portion may be provided on a side of the carry-in / out module opposite to the processing module side in the width direction.

[0013] The first transport mechanism may transfer the substrate to and from the container mounting portion from the process module side in the width direction.

[0014] Alternatively, the first conveying mechanism further comprises: a first guide portion for guiding the movement of the support portion in the vertical direction; and a second guide portion for guiding the movement of the first guide portion in the depth direction, wherein in the width direction, the size of the gap between the container loading portion and the handover module is larger than the length of the first guide portion and smaller than the length of the support portion.

[0015] The second conveying mechanism may transfer the substrate to and from the transfer module in the width direction.

[0016] Alternatively, the processing module may be divided into a plurality of modules in the vertical direction, the second conveying mechanism may be provided in each of the plurality of modules, and the delivery module may be configured to be capable of delivering the substrate to and from the second conveying mechanisms of all the plurality of modules.

[0017] Alternatively, the substrate processing device further includes: other modules, which are arranged on the side of the processing module opposite to the input and output module in the width direction; and a second air supply unit, which transports clean gas from above to the second conveying space in the processing module which is the space where the second conveying mechanism is provided, and a part of the second air supply unit overlaps on the other modules.

[0018] Alternatively, the processing module may be divided into a plurality of divided modules along the width direction, and each divided module may be provided with: a plurality of the processing units; and a reciprocating transport mechanism that transports the substrate linearly only along the width direction.

[0019] Alternatively, the processing module further includes an intermediate module between the adjacent dividing modules, the intermediate module includes the transfer module, and the reciprocating transport mechanism transports the substrate linearly along the width direction between the transfer modules.

[0020] Alternatively, the plurality of splitting modules are connected along the width direction, and the reciprocating conveying mechanism conveys the substrate linearly along the width direction between the handover unit in the splitting module in which the reciprocating conveying mechanism is provided and the handover unit in other splitting modules adjacent to the splitting module.

[0021] The linear wafer W transport path of the shuttle transport mechanism and the delivery unit for transporting the wafer W by the shuttle transport mechanism may overlap with the processing unit in a plan view.

[0022] The first conveying mechanism may also convey the substrate to the delivery unit in the dividing module on the side of the carry-in / out module in the width direction, to which the reciprocating conveying mechanism conveys the substrate.

[0023] It is also possible that the first conveying mechanism only transfers the substrate with the transfer module from one side in the depth direction, and the transfer unit in the dividing module on the side of the input and output module in the width direction, for conveying the substrate by the reciprocating conveying mechanism, is arranged in a position closer to the side than the transfer module of the input and output module in the depth direction.

[0024] Effect of utility model

[0025] According to the present invention, it is possible to suppress the increase in size of a substrate processing apparatus due to increased productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is an explanatory diagram showing a schematic configuration of a coating and developing device as a substrate processing apparatus according to the present embodiment.

[0027] Figure 2 Yes Figure 1 An explanatory diagram of the schematic structure of the front side of the coating and developing device.

[0028] Figure 3 It is an explanatory diagram schematically showing the general structure of the processing module.

[0029] Figure 4 This is an explanatory diagram of the structure of the process module side in the box module.

[0030] Figure 5 This is a diagram illustrating the dimensions of the box module.

[0031] Figure 6 This diagram illustrates the structure of the interface module.

[0032] Figure 7 It is an explanatory diagram of a modified example of the delivery module included in the cassette module.

[0033] Figure 8 This is an explanatory diagram of a specific example of the upper layer of the upper submodule of the processing module.

[0034] Figure 9 This is an explanatory diagram of a specific example of the upper layer of the upper submodule of the processing module.

[0035] Figure 10 This is an explanatory diagram of a specific example of the upper layer of the upper submodule of the processing module.

[0036] Figure 11 This is an explanatory diagram of a specific example of the upper layer of the upper submodule of the processing module.

[0037] Figure 12 It is an explanatory diagram showing a schematic configuration of a first modification of the processing module.

[0038] Figure 13 Yes Figure 12 An illustration of the schematic structure of the front side of the processing module.

[0039] Figure 14 It is an explanatory diagram schematically showing the general structure of the split module.

[0040] Figure 15 This is a diagram illustrating the structure of the middle module.

[0041] Figure 16 It is an explanatory diagram showing the schematic structure of a second modification of the processing module.

[0042] Figure 17 yes Figure 16 An illustration of the structure of the intermediate module of the processing module.

[0043] Figure 18 It is an explanatory diagram showing the schematic structure of a third modification of the processing module.

[0044] Figure 19 yes Figure 18An illustration of the structure of the split module of the processing module.

[0045] Description of Reference Numerals

[0046] 1. 1A, 1B, 1C, coating and developing device; 10, cassette module; 11. 11A, 11B, 11C, processing module; 20, cassette mounting table; 30, handover module; 31, handover unit; 40, first conveying mechanism; 41, fork; 70, second conveying mechanism; C, cassette; COT, resist film forming unit; DEV, developing unit; HT, heat treatment unit; W, wafer. DETAILED DESCRIPTION

[0047] In the photolithography process of manufacturing semiconductor devices, for example, prescribed processes are performed to form a resist pattern on a substrate such as a semiconductor wafer (hereinafter referred to as a "wafer"). These prescribed processes include, for example, a resist coating process in which a resist liquid is applied to the substrate to form a resist film, an exposure process in which a predetermined pattern is exposed, and a development process in which the exposed resist film is developed. The resist coating process and the development process are performed by a coating and developing device, which is a substrate processing apparatus equipped with various processing units that perform various processes on the substrate and a transport unit that transports the substrate.

[0048] High productivity is sought in substrate processing equipment. To achieve this, it is necessary to increase the number of processing units that can be mounted on the substrate processing equipment. However, such an increase in the number of units mounted results in an increase in the size of the equipment. Specifically, this results in an increase in the equipment's footprint.

[0049] Therefore, the technology of the present invention suppresses the increase in size of the substrate processing apparatus due to the improvement in productivity.

[0050] Hereinafter, a substrate processing apparatus according to the present embodiment will be described with reference to the accompanying drawings. In addition, in this specification and the accompanying drawings, elements having substantially the same functional configuration are denoted by the same reference numerals to omit repeated descriptions.

[0051] <Coating and developing device>

[0052] Figure 1 It is an explanatory diagram showing a schematic configuration of a coating and developing device as a substrate processing apparatus according to the present embodiment. Figure 2 Yes Figure 1 An explanatory diagram of the schematic structure of the front side of the coating and developing device. Figure 3 Schematically shows the schematic structure of the processing module described later. Figure 2 In the figure, the storage portion 50 described later is omitted.

[0053] like Figure 1 and Figure 2 As shown, the coating and developing apparatus 1 includes a cassette module 10 serving as a loading and unloading module, a processing module 11, and an interface module 12 serving as another module. The coating and developing apparatus is connected to an exposure apparatus (not shown). The cassette module 10, processing module 11, and interface module 12 are arranged in this order along the width direction (the Y direction in the figure), which is one of the horizontal directions, and are connected as a whole. Furthermore, the exposure apparatus is connected to the side of the interface module 12 opposite the processing module 11. The exposure apparatus performs exposure processing on the wafer W.

[0054] A cassette C, which is a container capable of accommodating wafers W, is carried in and out of the cassette module 10 .

[0055] The cartridge module 10 includes a cartridge mounting table 20 as a container mounting portion for mounting a plurality of cartridges C. In the cartridge module 10, the cartridge mounting table 20 is provided, for example, at an end portion on one side in the width direction (the negative side in the Y direction in the figure), that is, at an end portion on the side opposite to the process module 11 side in the width direction.

[0056] A plurality of cartridges C are placed on the cartridge placement table 20 in a row along the depth direction (the X direction in the figure). Specifically, a plurality (e.g., four) placement plates 21 are arranged in a row along the depth direction on the cartridge placement table 20. When the cartridges C are transported to and from the exterior of the coating and developing apparatus 1, the cartridges C can be placed on each placement plate 21. The depth direction is a direction intersecting the width direction (the Y direction in the figure) when viewed from above, and specifically, a direction perpendicular to the width direction when viewed from above.

[0057] The loading plate 21 includes a lifting plate (not shown). The lifting plate raises and lowers the plurality of wafers W placed in the cassette C on the loading plate 21 together, moves within the cassette loading platform 20, and enables transfer of the wafers W to and from the first conveying mechanism 40, described later. The lifting plate is raised and lowered, for example, between a first position on the upper side and a second position on the lower side using a lifting mechanism (not shown). The first position is where the wafers W on the lifting plate are located within the cassette C, and the second position is where the wafers W are transferred between the lifting plate and the first conveying mechanism 40.

[0058] In addition, depending on the diameter of the wafer W, the wafer W may be transferred between the cassette C and the first transport mechanism 40 via the above-mentioned lifting plate. This is determined by the specifications.

[0059] The cassette module 10 also includes a delivery module 30. The delivery module 30 is composed of a stack of delivery units 31 for delivering wafers W. In the cassette module 10, the delivery module 30 is located on the side of the processing module 11 in the width direction (the positive side in the Y direction in the figure) and is used for delivery with the processing module 11. Specifically, the delivery module 30 is provided in a portion of the cassette module 10 adjacent to the second conveying space K2 of the processing module 11, which will be described later, in the width direction (the Y direction in the figure).

[0060] The cassette module 10 also includes a first transport mechanism 40 for transporting wafers W between the cassette stage 20 and the delivery module 30. The first transport mechanism 40 includes a fork 41 as a support portion for supporting the wafer W. The fork 41 is configured to be movable in the vertical direction (Z direction in the figure), the direction around the vertical axis, the depth direction (X direction in the figure), and the width direction (Y direction in the figure).

[0061] And, in Figure 1 As shown by the thick black arrow in FIG. 8 , the first transport mechanism 40 is configured to allow the wafer W supported by the fork 41 to pass through the delivery module 30 in the depth direction (X direction in the figure) in a plan view.

[0062] Furthermore, as will be described later, the box module 10 includes a storage portion 50. Furthermore, as will be described later, a first air supply unit 60 (see FIG. 1 ) is provided with respect to the box module 10. Figure 4 ).

[0063] The detailed structure of the cartridge module 10 will be described later.

[0064] The process module 11 includes a plurality of various process units that perform predetermined processes such as development, and is provided adjacent to the cartridge module 10 in the width direction (Y direction in the figure).

[0065] Furthermore, the processing module 11 further includes a second transport mechanism 70 .

[0066] The second conveying mechanism 70 conveys wafers W between the interface module 30 and the processing units within the processing module 11. The second conveying mechanism 70 can also convey wafers W between the processing units within the processing module 11. In this example, the second conveying mechanism 70 also conveys wafers W between the processing units within the processing module 11 and the interface module 110 (described later) of the interface module 12.

[0067] The second transport mechanism 70 transfers the wafer W to and from the transfer module 30 in the width direction (the Y direction in the figure).

[0068] For example, in the processing module 11, as Figure 3As shown, the submodules BL, each equipped with a second conveying mechanism 70, are stacked vertically. In the example shown in the figure, two submodules BL are stacked vertically. Hereinafter, the upper submodule BL may be referred to as upper submodule BL1, and the lower submodule BL may be referred to as lower submodule BL2.

[0069] A second conveying space K2 in which the second conveying mechanism 70 is provided is formed at the center of each submodule BL in the depth direction (X direction in the drawing) so as to extend in the width direction (Y direction in the drawing) in a plan view.

[0070] In addition, in each sub-module BL, multiple processing units are provided in the space near the front side (negative side of the X direction in the figure) and the space on the inside side (positive side of the X direction in the figure) of the second conveying space K2, respectively, along the vertical direction (Z direction in the figure) and the width direction (Y direction in the figure).

[0071] The front side (the negative side in the X direction in the figure) of the second conveying space K2 in the upper submodule BL1 is divided into an upper layer BL11 and a lower layer BL12. Figure 2 As shown, a plurality of (two in the example of the drawing) developing units DEV are provided in each of the layers BL11 and BL12 along the width direction (Y direction in the drawing).

[0072] The developing unit DEV performs a developing process on the exposed wafer W to develop the resist film on the wafer W and form a resist pattern. Each developing unit DEV includes: a rotating holding disk 81 that holds the wafer W and rotates it; and a cup 82 that surrounds the wafer W on the rotating holding disk 81 and recovers the processing liquid that has scattered from the wafer W. In addition, as Figure 1 As shown, nozzles 83 are provided for ejecting a developing liquid as a processing liquid toward wafers W held on a rotating holding plate 81. For example, one nozzle 83 is provided for each of layers BL11 and BL12, and is shared by developing units DEV on the same layer.

[0073] like Figure 2 As shown, the front side of the second conveying space K2 in the lower submodule BL2 is also divided into an upper layer BL21 and a lower layer BL22, similar to the upper submodule BL1. However, in the lower submodule BL2, multiple (two in the example shown) resist film forming units COT are provided in each layer BL21 and BL22 along the width direction (Y direction in the figure).

[0074] The resist film forming unit COT performs a resist film forming process on the wafer W, forming a resist film on the wafer W. Each resist film forming unit COT, like the developing unit DEV, includes a rotating holding disk 81 and a cup 82. Furthermore, a nozzle 83 is provided that is shared between the resist film forming units COT for the same layer. Furthermore, a resist liquid for forming a resist film is ejected from the nozzle 83 for each resist film forming unit COT as a processing liquid.

[0075] like Figure 1 and Figure 3 As shown, in the upper part of the inner side (positive side in the X direction in the figure) of the second conveying space K2 in each submodule BL, the heat treatment unit HT is provided with multiple (in the vertical direction (Z direction in the figure) Figure 3 In the example, there are four (four), and there are also multiple (in the width direction (Y direction in the figure) Figure 1 In the example, there are three thermal treatment units HT. Each thermal treatment unit HT performs a heating process on the wafer W. Each thermal treatment unit HT may perform both a heating process and a cooling process on the wafer W.

[0076] Furthermore, a storage section 90 is provided at the back lower portion of the second transport space K2 in each submodule BL. The storage section 90 stores electrical equipment for the heat treatment unit HT (eg, a driver for controlling the heat treatment unit HT).

[0077] Furthermore, a utility unit U is provided below the lower submodule BL2 in the process module 11. The utility unit U functions as a storage unit for storing components (resist liquid storage bottles, etc.) related to supplying resist liquid to the resist film forming unit COT.

[0078] Furthermore, in the processing module 11 , the filter 102 of the second air supply unit 100 is provided for each submodule BL.

[0079] The second air supply unit 100 supplies clean air to the second transport space K2 from above. The second air supply unit 100 includes a fan unit 101 (see FIG. Figure 6 ).

[0080] The fan unit 101 transports gas toward the filter 102. Specifically, for example, the fan unit 101 draws gas into the fan unit 101 and transports the drawn gas toward the filter 102 via a duct (not shown). The fan unit 101 is shared between the submodules BL. The fan unit 101 may also be positioned on the interface module 12. In other words, the fan unit 101 may be stacked on the interface module 12.

[0081] The filter 102 purifies the gas conveyed from the fan unit 101 , that is, filters out particles in the gas, and blows the purified gas (clean gas) toward the second conveying space K2 below.

[0082] The filter 102 is provided above the corresponding second conveying space K2 .

[0083] In this manner, a portion of the second air supply unit 100 (specifically, the fan unit 101 ) overlaps the interface module 12 .

[0084] The interface module 12 is provided between the processing module 11 and an exposure device (not shown) to transfer the wafer W therebetween.

[0085] like Figure 1 and Figure 2 As shown, the interface module 12 includes a handover module 110. The handover module 110 is composed of a stack of handover units 111 for handing over wafers W. In the interface module 12, the handover module 110 is located on the side of the processing module 11 in the width direction (the negative side in the Y direction in the figure) and is used to hand over wafers W to and from the processing module 11. Specifically, the handover module 110 is located in the interface module 12 adjacent to the second conveying space K2 of the processing module 11 in the width direction (the Y direction in the figure).

[0086] The interface module 12 also includes a third transport mechanism 120 for transporting wafers W between the delivery module 110 and the exposure apparatus. The third transport mechanism 120 includes a fork 121 for supporting the wafer W. The fork 121 is configured to be movable in the vertical direction (Z direction in the figure), the direction around the vertical axis, the depth direction (X direction in the figure), and the width direction (Y direction in the figure).

[0087] Furthermore, as will be described later, a third air blowing unit 130 is provided with respect to the interface module 12 .

[0088] The detailed structure of the interface module 12 will be described later.

[0089] The coating and developing apparatus 1 also includes a control unit 200 that controls the components of the coating and developing apparatus 1, including the first to third conveying mechanisms 40, 70, and 120. The control unit 200 is, for example, a computer equipped with a processor such as a CPU and memory, and includes a program storage unit (not shown). The program storage unit stores a program including instructions for controlling the processes of the coating and developing apparatus 1. Alternatively, the program may be recorded on a computer-readable storage medium H and loaded from the storage medium H into the control unit 200. The storage medium H may be either temporary or non-temporary.

[0090] The control unit 200 may be housed in a housing portion 51 or a housing portion 52 of the cartridge module 10 , which will be described later.

[0091] <Box module 10>

[0092] Next, refer to Figure 1 and Figure 2 and use Figure 4 and Figure 5 The structure of the cartridge module 10 will be described in more detail. Figure 4 It is an explanatory diagram of the structure of the process module 11 side in the cartridge module 10 . Figure 5 It is an explanatory diagram of the dimensions of the cartridge module 10 .

[0093] As described above, the cartridge module 10 includes the first transport mechanism 40 .

[0094] like Figure 4 As shown, the first transport mechanism 40 includes a first guide portion 42 and a second guide portion 43 in addition to the fork 41 .

[0095] The first guide 42 guides the fork 41 in the vertical direction (Z direction in the figure). Specifically, the first guide 42 moves, for example, a lifter 44 along the first guide 42. The fork 41 is supported on the lifter 44 via a rotating body 45. The rotating body 45 rotates on the lifter 44. The fork 41 moves forward and backward horizontally relative to the rotating body 45.

[0096] The second guide portion 43 guides the movement of the first guide portion 42 in the depth direction (X direction in the figure). Specifically, the second guide portion 43 guides the movement of the first guide portion 42 as follows. Figure 1 and Figure 2 As shown, the second guide portion 43 guides the first guide portion 42 to move in the depth direction in a region adjacent to the cassette mounting table 20 in the width direction (Y direction in the figure) in a plan view in the first conveying space K1 where the first conveying mechanism 40 is provided.

[0097] In the cartridge module 10 , the following condition (A) is satisfied with respect to the width direction (Y direction in the drawing).

[0098] (A) If Figure 5 As shown, the size (width) W1 of the gap h1 between the cassette mounting table 20 and the delivery module 30 is larger than the length (width) W2 of the first guide portion 42 and smaller than the length (width) of the fork 41 .

[0099] In addition, the "length of the fork 41" in the condition (A) refers to the size of the fork 41 in the width direction (Y direction in the figure) when moving in the depth direction (X direction in the figure).

[0100] As described above, in the cassette module 10, the first conveyance mechanism 40 is configured to allow the wafer W supported by the fork 41 to pass through the delivery module 30 in the depth direction (X direction in the figure) when viewed from above. During this passage, since the cassette module 10 satisfies the above-mentioned condition (A), the first guide portion 42 can pass through the above-mentioned gap h1.

[0101] When the condition (A) is satisfied, when the fork 41 moves in the depth direction (X direction in the figure), the first guide 42 can pass through the gap h1 , but the wafer W supported by the fork 41 cannot pass through the gap h1 .

[0102] Furthermore, the first transport mechanism 40 transfers the wafer W to and from the cassette stage 20 from the process module 11 side in the width direction (Y direction in the drawing).

[0103] On the other hand, the first conveying mechanism 40 only transfers the wafer W to the transfer module 30 in the depth direction (the X direction in the figure) (i.e., the wafer W is transported relative to the transfer module 30), and not in the width direction (the Y direction in the figure). Figure 1 As shown by the hollow dotted arrow, the first conveying mechanism 40 only transfers the wafer W to the transfer module 30 from the back side (positive side in the X direction in the figure), but not from the width direction (Y direction in the figure) and the front side (negative side in the X direction in the figure).

[0104] Furthermore, in the cassette module 10 , a delivery module 30 is provided in the first conveyance space K1 .

[0105] In the first conveying space K1, the delivery module 30 is configured to be able to deliver the wafer W to the second delivery mechanism 70 of all submodules BL included in the processing module 11. Specifically, for example, Figure 2 As shown, the delivery module 30 is provided to be continuous in the vertical direction (X direction in the figure) and overlaps with both the upper submodule BL1 and the lower submodule BL2 when viewed in the width direction (Y direction in the figure).

[0106] The height of the upper end of the delivery module 30 is substantially equal to the height of the top surface of the housing 10a of the cassette module 10 that defines the first transport space K1. That is, the delivery module 30 is provided with almost no gap between it and the top surface of the housing 10a.

[0107] The lower end of the delivery module 30 is at a height that allows wafers W to be delivered between the second transport mechanism 70 of the lower submodule BL2 and the delivery module 30 , and is, for example, substantially the same as the lower end of the layer BL21 .

[0108] like Figure 4As shown, the portion of the first conveying space K1 divided by the housing 10a that is closer to the front side (negative side in the X direction in the figure) than the delivery module 30 is filled with a storage portion 50 for storing various electrical appliances. Figure 1 and Figure 4 As shown, the portion of the first conveying space K1 that is closer to the front side than the delivery module 30 and on the processing module 11 side (positive side in the Y direction in the figure) and above is filled with the storage section 50. The storage section 50 is located in approximately the same range as the delivery module 30 in the vertical direction (Z direction in the figure). In other words, the height of the upper and lower ends of the storage section 50 is approximately the same as that of the delivery module 30.

[0109] Furthermore, a first air supply unit 60 is provided with respect to the box module 10 .

[0110] The first air supply unit 60 supplies clean air from above to the first transfer space K1 . The first air supply unit 60 includes a fan unit 61 and a filter 62 .

[0111] The fan unit 61 sends the gas toward the filter 62. Specifically, for example, the fan unit 61 sucks the gas into the fan unit 61 and sends the sucked gas toward the filter 62.

[0112] The filter 62 purifies the gas conveyed from the fan unit 61 , that is, filters out particles in the gas, and blows the purified gas (clean gas) toward the first conveying space K1 below.

[0113] For example, the first air supply unit 60 supplies clean air only to a portion of the first transfer space K1 that is not filled with the storage portion 50 and is located further back than the delivery module 30 (positive side in the X direction in the drawing).

[0114] Specifically, the filter 62 is provided only above a portion of the first conveying space K1 that is further inward than the delivery module 30 .

[0115] Alternatively, exhaust from the bottom side of the cassette module 10 may be performed from both the front side and the back side (positive and negative sides in the X direction in the figure) so that the clean gas supplied from the first air supply unit 60 to the first transfer space K1 also flows below the storage section 50 through which the wafers W pass. In other words, exhaust ports (not shown) for exhausting air from the first transfer space K1 may be provided on the front side and the back side of the bottom of the cassette module 10.

[0116] Alternatively, storage sections 51 and 52 for storing various electrical appliances may be provided above the box module 10. However, the height of the top ends of the storage sections 51 and 52 should be set below the top end of the processing module 11. For example, the storage section 51 may be provided above the filter 62, while the storage section 52 may be provided so as to straddle the top of the interface module 30 and the top of the storage section 50.

[0117] Alternatively, the fan unit 61 of the first air supply unit 60 may be located higher than the first conveying space K1 and further inward (positive in the X direction in the figure) of the first conveying space K1. In this case, the lower portion of the fan unit 61 may serve as the storage section 53 for storing various electrical appliances. The storage section 53 may also extend to an area overlapping the cassette mounting table 20 when viewed from above.

[0118] Interface module 12

[0119] Next, refer to Figure 2 and use Figure 6 The detailed structure of the interface module 12 will be described. Figure 6 It is an explanatory diagram of the structure of the interface module 12.

[0120] As described above, the interface module 12 includes the third transport mechanism 120 .

[0121] The third conveying mechanism 120 is configured, for example, so that the fork 121 is only on the front side ( Figure 6 The fork 121 moves in a space (on the negative side of the X direction, etc.), and the wafer W is transferred to and from the transfer module 110 only from the near front side.

[0122] Furthermore, in the interface module 12 , a delivery module 110 is provided in the third conveyance space K3 where the third conveyance mechanism 120 is provided.

[0123] In the third conveying space K3, the delivery module 110 is configured to be able to deliver the wafer W to the second delivery mechanism 70 of all submodules BL included in the processing module 11. Specifically, for example, Figure 2 As shown, the interface module 110 is continuous in the vertical direction (Z direction in the figure) and overlaps with both the upper submodule BL1 and the lower submodule BL2 when viewed in the width direction (Y direction in the figure).

[0124] For example, Figure 6 As shown, the delivery module 110 is provided with a gap between it and the top surface of the housing 12 a of the interface module 12 that partitions the third transport space K3 .

[0125] A storage section 140 for storing various electrical appliances is provided at the back side (positive side in the X direction in the figure) and the upper end of the third conveying space K3 . The storage section 140 is provided at a distance from the delivery module 110 .

[0126] Furthermore, the depth (length in the X direction in the figure) of the housing 12a that defines the third conveying space K3 is smaller than the depth of the process module 11. Therefore, the front (negative X direction in the figure) ends of the housing 12a and the process module 11 are substantially aligned, but the rear (positive X direction in the figure) ends do not align, with the rear end of the process module 11 being located rearward.

[0127] Furthermore, a third air supply unit 130 is provided with respect to the interface module 12 .

[0128] The third air supply unit 130 supplies clean air from above to the third transport space K3 and includes a fan unit 131 and a filter 132 .

[0129] The fan unit 131 sends the gas toward the filter 132 . Specifically, for example, the fan unit 131 draws the gas into the fan unit 131 and sends the drawn gas toward the filter 132 via the duct 133 .

[0130] The filter 132 purifies the gas conveyed from the fan unit 131 , that is, filters out particles in the gas, and blows the purified gas (clean gas) toward the third conveying space K3 below.

[0131] The third air supply unit 130 supplies the clean gas to the following portion in the third transfer space K3 , for example.

[0132] The space where the wafer W passes through is closer to the front side (negative side in the X direction in the figure) than the transfer module 110

[0133] The space that overlaps with the transfer module 110 when viewed from above

[0134] The space between the transfer module 110 and the storage unit 140

[0135] Specifically, the filter 132 is provided from the front side (the negative side in the X direction in the figure) end portion of the housing 12 a to a portion between the interface module 110 and the storage portion 140 .

[0136] Alternatively, the fan unit 131 of the third air supply unit 130 may be located further inward (positive in the X direction in the figure) than the housing 12a. However, in this case, the rear end of the fan unit 131 is not located further inward than the rear end of the processing module 11.

[0137] As described above, the fan unit 101 of the second air supply unit 100 used in the process module 11 may also be superimposed on the interface module 12. Specifically, the fan unit 101 may also be superimposed on the filter 132. However, the height of the upper end of the fan unit 101 is set to be lower than the height of the upper end of the process module 11. By arranging the fan unit 101 in this manner, the overall height of the coating and developing apparatus 1 can be reduced.

[0138] Alternatively, storage sections 141 and 142 may be provided above the portion of the interface module 12 that is closer to the front side (negative side in the X direction in the figure) and above the portion that is closer to the back side (positive side in the X direction in the figure) than the fan unit 101. However, the height of the upper ends of the storage sections 141 and 142 is set to be lower than the height of the upper end of the processing module 11. For example, the storage sections 141 and 142 accommodate items that were previously mounted above the processing module 11 (e.g., electrical appliances for the resist film forming unit COT and electrical appliances for the second conveying mechanism 70). By providing the storage sections 141 and 142 in this manner, the overall height of the coating and developing device 1 can also be reduced.

[0139] <Example of Processing by Coating and Developing Device 1>

[0140] Next, an example of processing by the coating and developing apparatus 1 will be described. Note that the following steps are executed under the control of the control unit 200 based on a program stored in a program storage unit (not shown).

[0141] (Step S1)

[0142] First, the wafer W is loaded into the delivery module 30 of the coating and developing apparatus 1 .

[0143] Specifically, for example, first, on the front side of the cassette mounting table 20 ( Figure 4 When the lift plate (not shown) of the mounting plate 21 (on the negative side in the X direction, etc.) is moved to the second position, the wafer W on the lift plate is delivered to the fork 41 of the first transport mechanism 40 .

[0144] Next, the wafer W supported by the fork 41 is oriented toward the back side ( Figure 4 The X-direction positive side, etc., moves through the transfer module 30.

[0145] Specifically, the first guide 42 moves inward along the depth direction, and the wafer W supported by the fork 41 passes under the delivery module 30 and moves to a position further inward than the delivery module 30 .

[0146] In one embodiment, the height of the wafer W when it is delivered from the lifting plate of the mounting plate 21 to the fork 41 is substantially the same as that when it passes through the delivery module 30 in a plan view.

[0147] Then, the wafer W supported by the fork 41 is transferred from the back side ( Figure 4 The positive side in the X direction, etc.) is connected to the transfer module 30.

[0148] Specifically, the fork 41 enters the delivery unit 31 corresponding to the lower sub-module BL2 in the delivery module 30 from the inner side, and delivers the wafer W from the fork 41 to the delivery unit 31 .

[0149] (Step S2)

[0150] Next, a resist coating process is performed on the wafer W to form a resist film on the wafer W.

[0151] Specifically, for example, the second conveying mechanism 70 is used to convey the wafer W from the transfer unit 31 corresponding to the lower sub-module BL2 in the transfer module 30 to the anti-etching film forming unit COT of the lower sub-module BL2, and then the anti-etching liquid is rotationally coated on the surface of the wafer W to form an anti-etching film in a manner covering the surface of the wafer W.

[0152] (Step S3)

[0153] Next, the wafer W is subjected to a pre-exposure bake (PAB: Pre-Applied Bake) process.

[0154] Specifically, the second transport mechanism 70 transports the wafer W to the thermal treatment unit HT for PAB processing, and PAB processing is performed on the wafer W. Thereafter, the wafer W is transported to the delivery unit 111 corresponding to the lower submodule BL2 in the delivery module 110 of the interface module 12 .

[0155] (Step S4)

[0156] Next, the wafer W is subjected to an exposure process.

[0157] Specifically, for example, the third transport mechanism 120 transports the wafer W from the delivery unit 111 corresponding to the lower submodule BL2 in the delivery module 110 to the exposure device, where the resist film on the wafer W is exposed to a predetermined pattern. Thereafter, the third transport mechanism 120 transports the wafer W to the delivery unit 111 corresponding to the upper submodule BL1 in the delivery module 110.

[0158] (Step S5)

[0159] Next, the wafer W is subjected to a PEB (Post Exposure Bake) process.

[0160] Specifically, for example, the wafer W is transported from the delivery unit 111 corresponding to the upper submodule BL1 in the delivery module 110 to the thermal treatment unit HT for PEB treatment in the upper submodule BL1 by the second transport mechanism 70 , and the wafer W is subjected to PEB treatment.

[0161] (Step S6)

[0162] Next, the wafer W is subjected to a development process.

[0163] Specifically, for example, the wafer W is transported to the developing unit DEV by the second transport mechanism 70 , and the wafer W is subjected to a development process using a developer.

[0164] (Step S7)

[0165] Next, the wafer W is subjected to a post-bake process.

[0166] Specifically, for example, the second transport mechanism 70 transports the wafer W to the thermal treatment unit HT for post-bake processing, and the post-bake processing is performed on the wafer W. Thereafter, the second transport mechanism 70 transports the wafer W to the delivery unit 31 corresponding to the upper submodule BL1 in the delivery module 30 of the cassette module 10.

[0167] (Step S8)

[0168] Then, the wafer W is carried out from the coating and developing apparatus 1 .

[0169] Specifically, the wafer W is returned to the front side (ie, the front side) of the cassette mounting table 20 located at the second position in the reverse order of step S1. Figure 4 On the lifting plate (not shown) of the placing plate 21 on the negative side of the X direction (e.g., the X direction).

[0170] At this point, the process of the coating and developing device 1 is completed.

[0171] <Main Effects of the Present Embodiment>

[0172] As described above, in the coating and developing apparatus 1, the cassette module 10 includes the delivery module 30 formed by stacking the delivery units 31 for delivering the wafers W between the cassette module 10 and the process module 11. Therefore, compared to a case where the process module 11 includes the delivery module 30, the number of process units that can be mounted on the process module 11 can be increased without changing the floor space of the process module 11, thereby improving productivity.

[0173] Furthermore, in the coating and developing apparatus 1, the cassette module 10 includes a first conveying mechanism 40 for conveying the wafer W between the cassette mounting table 20 and the delivery module 30. The first conveying mechanism 40 includes a fork 41 and is configured to allow the wafer W supported by the fork 41 to be conveyed in the depth direction ( Figure 4 The wafer W supported by the fork 41 passes through the delivery module 30 in the X direction (e.g., the X direction). Therefore, compared to a situation where this is not possible, that is, compared to a situation where the wafer W supported by the fork 41 passes through an area that does not overlap with the delivery module 30 when viewed from above while moving in the depth direction, the following effects are achieved. Specifically, the increase in the footprint of the cassette module 10 caused by providing the delivery module 30 in the cassette module 10 can be suppressed.

[0174] Therefore, according to this embodiment, it is possible to suppress the increase in size of the device due to increased productivity. In other words, according to this embodiment, the number of processing units mounted can be increased without significantly increasing the size of the device, thereby achieving improved productivity.

[0175] In addition, in this embodiment, the first conveying mechanism 40 only conveys Figure 4 The wafer W is transferred to and from the transfer module 30 in the X direction, rather than in the width direction ( Figure 4 Therefore, in the width direction, the portion that does not overlap with the cassette stage 20 when viewed from above can be minimized. Specifically, in the width direction, the gap h1 between the cassette stage 20 and the delivery module 30 can be minimized. Therefore, according to this embodiment, the device can be prevented from becoming larger.

[0176] Furthermore, in this embodiment, the first conveying mechanism 40 only conveys Figure 4 The wafer W is transferred to and from the transfer module 30 (on the positive side in the X direction, etc.), rather than from the width direction ( Figure 4 Y direction) and near front side ( Figure 4 In addition, the first air supply unit 60 supplies clean air only to the portion of the first conveying space K1 that is not filled with the storage section 50 and is further inward from the transfer module 30. This reduces the size of the first air supply unit 60 and prevents gas from stagnating within the first conveying space K1.

[0177] Furthermore, in this embodiment, the fan unit 101 of the second air supply unit 100 for the process module 11 is provided on the interface module 12, the upper end of which is lower than the upper end of the process module 11. Therefore, compared with a case where the fan unit 101 is provided above the process module 11, the height of the coating and developing apparatus 1 can be reduced.

[0178] <Specific Examples and Modifications of the Height of the Handover Module>

[0179] Figure 7 It is an explanatory diagram of a modified example of the delivery module included in the cassette module 10 .

[0180] In the above example, the delivery modules 30 of the box module 10 are continuous in the vertical direction and are connected in the width direction ( Figure 2 That is, the transfer module 30 includes a module 32 for the upper submodule BL1 and a module 33 for the lower submodule BL2, and these modules 32 and 33 are continuous in the vertical direction.

[0181] Instead of this, it is also possible to Figure 7 As in the case of the transfer module 30A, a gap h2 is provided between the module 32A for the upper submodule BL1 and the module 33A for the lower submodule BL2. In this case, the wafer W supported by the fork 41 of the first conveying mechanism 40 passes through the gap h2 when passing through the transfer module 30 in the depth direction in a plan view.

[0182] <Specific example of liquid treatment layer in treatment module>

[0183] Figure 8 This diagram illustrates a specific example of the upper layer BL11 of the upper submodule BL1 of the processing module 11. The lower layer BL12 of the upper submodule BL1 and the upper and lower layers BL21 and BL22 of the lower submodule BL2 have the same structure as the upper layer BL11 of the upper submodule BL1.

[0184] like Figure 8 As shown, the upper layer BL11 has an air flow creation unit 300. The air flow creation unit 300 generates an air flow from above to below the cup 82 in the processing space K11 where the rotary holding disk 81 and the cup 82 are provided.

[0185] The air flow creation unit 300 includes a fan filter unit (FFU) 301 as a fourth air supply unit that supplies clean air from above to the processing space K11 .

[0186] The air flow shaping unit 300 includes a straightening plate 302 in addition to the FFU 301 .

[0187] The rectifying plate 302 is provided between the cup 82 and the FFU 301 , and forms a downward airflow by the gas blown out from the FFU 301 .

[0188] The rectifying plate 302 has an opening 303 for each rotating holding disk 81 , that is, for each cup 82 . Each opening 303 is provided at a position facing the corresponding rotating holding disk 81 and forms an airflow toward the wafer W held on the corresponding rotating holding disk 81 .

[0189] Furthermore, the rectifying plate 302 generates a stronger airflow in the region R1 surrounding the outer periphery of each opening 303 in a plan view than in the outer region R2.

[0190] The rectifier plate 302 includes ejection holes (not shown) that allow the gas from the FFU 301 to pass through and be ejected downward. A plurality of ejection holes are formed in both the area of ​​the rectifier plate 302 opposite to the strong airflow forming area R1 and the area opposite to the weak airflow forming area R2. The proportion of the ejection holes in the area of ​​the rectifier plate 302 opposite to the strong airflow forming area R1, i.e., the first opening ratio, is lower than the proportion of the ejection holes in the area opposite to the weak airflow forming area R2, i.e., the second opening ratio. As a result, the flow rate of the airflow formed by the gas ejected from the ejection holes in the area opposite to the strong airflow forming area R1 is faster than the flow rate of the airflow formed by the gas ejected from the ejection holes in the area opposite to the weak airflow forming area R2. That is, a stronger airflow can be formed in the strong airflow forming area R1 than in the weak airflow forming area R2.

[0191] The strong airflow formed in strong airflow region R1 functions as an air curtain. Therefore, the influence of disturbance factors present in weak airflow region R2 can be suppressed from reaching the area above cup 82, which is inside strong airflow region R1. Specifically, particles in weak airflow region R2 can be suppressed from being included in the airflow flowing downward from opening 303, that is, the airflow flowing toward wafer W.

[0192] like Figure 9 As shown, an opening 311 may be provided in the sidewall 310 of the upper layer BL11, which covers the side of the processing space K11. The opening 311 connects the space adjacent to the processing space K11 (e.g., the first transport space K1 or the third transport space K3) with the processing space K11. By providing such an opening 311, gas in the processing space K11 can be discharged to the adjacent space.

[0193] The opening 311 is provided, for example, at the lower portion of the side wall 310, specifically, at a position on the side wall 310 below the upper end of the cup 82. This prevents particles contained in the gas in the adjacent space from entering the cup 82 when the gas returns to the processing space K11 through the opening 311.

[0194] Alternatively, the opening 311 may be provided in the upper portion of the side wall 310. Specifically, the opening 311 may be provided at a position above the upper end of the cup 82 on the side wall 310. Thus, if the pressure in the processing space K11 suddenly rises or the airflow in the processing space K11 suddenly becomes stronger, the gas in the processing space K11 can be discharged to the adjacent space through the opening 311.

[0195] like Figure 10As shown, a partition wall 320 may be provided in the width direction (Y direction in the figure) to separate the cups 82. This can suppress the following mutual influence between the portion of the processing space K11 where one cup 82 is provided and the portion of the processing space K11 where another cup 82 is provided.

[0196] The airflow formed by the airflow forming unit 300 is a downflow

[0197] · Exhaust from the outside of cup 82

[0198] The height range of the partition wall 320 is, for example, equal to the height range of the processing space K11 (the height range from the bottom wall 330 of the layer BL11 to the rectifying plate 302 when the rectifying plate 302 is provided). In this case, the partition wall 320 is formed with an opening 321 through which the nozzle 83 and the like pass when the nozzle 83 moves in the width direction (the Y direction in the figure).

[0199] like Figure 11 As shown, a flow regulating member 340 may be provided between the cup 82 and the side wall 310A. The flow regulating member 340 guides the gas from the FFU 301 toward the exhaust port 331 provided at the lower portion of the processing space K11 and outside the cup 82 .

[0200] The exhaust port 331 is provided for each cup 82, for example, between the corresponding cup 82 and the sidewall 310. Alternatively, at least the lower end of the flow regulating member 340 may be located between the cup 82 and the exhaust port 331, and the rest of the flow regulating member 340 may be located between the exhaust port 331 and the sidewall 310.

[0201] Furthermore, the height of the upper end of the partition wall 320A separating the cups 82 may be lower than the height of the upper end of the cup 82. In this case, an exhaust port 332 for exhausting the processing space K11 from the outside of the cup 82 may be provided between the partition wall 320A and the cup 82 for each cup 82. This makes it easy to independently control the pressure and airflow between a portion of the processing space K11 where one cup 82 is located and a portion of the processing space K11 where another cup 82 is located.

[0202] In the example shown in the drawings, the exhaust ports 331 and 332 are provided in the bottom wall 330. However, the exhaust ports 331 and 332 may be provided outside the cup 82 and at a portion other than the bottom wall 330 that is lower than the upper end of the cup 82.

[0203] <Variation 1 of Processing Module>

[0204] Figure 12 It is an explanatory diagram showing a schematic configuration of a first modification of the processing module. Figure 13 Yes Figure 12An illustration of the schematic structure of the front side of the processing module. Figure 14 It is an explanatory diagram schematically showing the general structure of a split module described later. Figure 15 This is an explanatory diagram of the structure of the intermediate module described later.

[0205] Figure 12 and Figure 13 The coating and developing device 1A and Figure 1 The coating and developing apparatus 1 shown in FIG. 1A and FIG. 2A is different in the structure of the process module. Specifically, the process module 11A of the coating and developing apparatus 1A is divided into a plurality of divided modules DBL along the width direction (Y direction in the figure). Figure 12 In the example shown in FIG. 1 , the processing module 11A is divided into two divided modules DBL, with an intermediate module CBL provided between the two adjacent divided modules DBL. Hereinafter, the divided module DBL on the negative side in the width direction (the left side in the figure) is sometimes referred to as the left divided module DBL1, and the divided module DBL on the positive side in the width direction (the right side in the figure) is sometimes referred to as the right divided module DBL2.

[0206] The split module DBL is used separately Figure 1 The processing module 11 described above is configured in the same manner.

[0207] Hereinafter, the division module DBL and the intermediate module CBL will be described. Regarding the division module DBL, the description will focus on the differences from the processing module 11 .

[0208] like Figure 14 As shown, in the left dividing module DBL1 among the dividing modules DBL, an upper submodule BL1A and a lower submodule BL2 are stacked in this order from the top, and a reciprocating layer BL3 is provided between the upper submodule BL1A and the lower submodule BL2.

[0209] Similar to the upper submodule BL1 of the processing module 11 described above, the upper submodule BL1A and the lower submodule BL2 of the left partition module DBL1 are each provided with a second conveying mechanism 70. However, the second conveying mechanism 70 provided in the left partition module DBL1 not only conveys wafers W between the interface module 30 and the processing units within the left partition module DBL1, and between the processing units within the left partition module DBL1, but also conveys wafers W between the processing units within the left partition module DBL1 and the interface module 170 of the intermediate module CBL, described later.

[0210] Furthermore, in the left partition module DBL1, unlike the aforementioned processing module 11, the front side (the negative side in the X direction in the figure) of the second conveying space K2 in the upper submodule BL1A is divided into an upper layer BL21 and a lower layer BL22, each of which is provided with the resist film forming unit COT, similarly to the lower submodule BL2. In other words, the left partition module DBL1 has four stacked layers each of which is provided with the resist film forming unit COT.

[0211] The other structures of the upper submodule BL1A and the lower submodule BL2 of the left division module DBL1 are respectively the same as those of the upper submodule BL1 and the lower submodule BL2 of the processing module 11 described above.

[0212] A shuttle transport mechanism 150 is provided on the shuttle layer BL3. The shuttle transport mechanism 150 linearly transports wafers W only in the width direction (the Y direction in the figure). In this example, the shuttle transport mechanism 150 linearly transports wafers W in the width direction (the Y direction in the figure) between the interface module 30 of the cassette module 10 and the interface module 170 of the intermediate module BLC. In other words, the shuttle transport mechanism 150 linearly transports wafers W in the width direction between the interface modules. Therefore, the shuttle transport mechanism 150 does not transport wafers W to the processing units within the processing module 11.

[0213] The linear wafer W transport path of the reciprocating transport mechanism 150 does not overlap with the processing units in the left dividing module DBL1 in a plan view, but overlaps with the second transport space K2 where the second transport mechanism 70 is provided.

[0214] On the other hand, Figure 13 As shown, in the right split module DBL2, the upper submodule BL1 and the lower submodule BL2A ​​are stacked in this order from the top. Furthermore, although not shown, in the right split module DBL2, similar to the left split module DBL1, a reciprocating layer BL3 is provided between the upper submodule BL1 and the lower submodule BL2A.

[0215] The upper submodule BL1 and the lower submodule BL2A ​​of the right dividing module DBL2 are each provided with a conveying mechanism 160 (see Figure 12 ). Similar to the second conveying mechanism 70 provided in the left partition module DBL1, the conveying mechanism 160 conveys wafers W to the processing units in the right partition module DBL2. Specifically, the conveying mechanism 160 conveys wafers W between the handover module 170 of the intermediate module CBL and the processing units in the right partition module DBL2, between the processing units in the right partition module DBL2, and between the processing units in the right partition module DBL2 and the handover module 110 of the interface module 12A described later.

[0216] Furthermore, in the right partition module DBL2, unlike the aforementioned processing module 11, the front side (the negative side in the X direction in the figure) of the second conveying space K2 in the lower submodule BL2A ​​is divided into an upper layer BL11, where the developing unit DEV is located, and a lower layer BL12, similarly to the upper submodule BL1. In other words, the right partition module DBL2 has four stacked layers each containing the developing unit DEV.

[0217] The other structures of the upper submodule BL1 and the lower submodule BL2A ​​of the right division module DBL2 are respectively the same as those of the upper submodule BL1 and the lower submodule BL2 of the processing module 11 described above.

[0218] The shuttle level BL3 of the right dividing module DBL2 is also provided with a shuttle transport mechanism 150. However, the shuttle transport mechanism 150 of the right dividing module DBL2 transports the wafer W linearly along the width direction (Y direction in the figure) between the delivery module 170 of the intermediate module BLC and the delivery module 110 of the interface module 12A.

[0219] In the reciprocating layer BL3 of the right dividing module DBL2 , the reciprocating transport mechanism 150 transports the wafer W linearly so that the wafer W does not pass through the area overlapping with the processing units in the right dividing module DBL2 in a plan view, but passes through the transport space K4 where the transport mechanism 160 is provided.

[0220] like Figure 12 As shown, the intermediate module CBL is disposed between two dividing modules DBL arranged along the width direction, and relays the wafer W between them.

[0221] like Figure 15 As shown, the intermediate module CBL includes a transfer module 170. The transfer module 170 is composed of a stack of transfer units 171 for transferring wafers W. In the intermediate module CBL, the transfer module 170 is located between the second transfer space K2 of the left partition module DBL1 and the transfer space K4 of the right partition module DBL2.

[0222] The handover units 171 included in the handover module 170 and the handover units 171 to which the shuttle conveyor mechanism 150 is attached can be provided separately for the shuttle conveyor mechanism 150 of the left-side dividing module DBL1 and the shuttle conveyor mechanism 150 of the right-side dividing module DBL2. Thus, the transport of one shuttle conveyor mechanism 150 will not be hindered by the transport of the other shuttle conveyor mechanism 150.

[0223] like Figure 12As shown, when independently arranged in this manner, the interface unit 171a for the reciprocating conveying mechanism 150 of the left segmentation module DBL1 and the interface unit 171b for the reciprocating conveying mechanism 150 of the right segmentation module DBL2 can also be arranged on the same layer in the width direction (Y direction in the figure). This allows the reciprocating layer BL3 to be set to the same height in the left segmentation module DBL1 and the right segmentation module DBL2, thereby reducing the height of the device when the reciprocating layer BL3 is installed.

[0224] In addition, similarly, in the handover module 170, for layers other than the layer where the handover unit 171 for the reciprocating conveying mechanism 150 is provided, the handover unit 171 can also be independently provided for the left dividing module DBL1 and the right dividing module DBL2, and arranged along the width direction (Y direction in the figure).

[0225] Furthermore, the intermediate module CBL includes a transport mechanism 180 for transporting wafers W between the transfer unit 171 for the reciprocating transport mechanism 150 of the transfer module 170 and other transfer units 171. The transport mechanism 180 includes a fork 181 for supporting the wafer W. The fork 181 is configured to be movable in the vertical direction (Z direction in the figure), the direction around the vertical axis, the depth direction (X direction in the figure), and the width direction (Y direction in the figure).

[0226] In the intermediate module CBL, the above-mentioned delivery module 170 is provided in the conveying space K5 provided with the conveying mechanism 180. The delivery module 170 is provided with a gap between it and the top surface of the housing CBLa of the intermediate module CBL1 that partitions the conveying space K5.

[0227] A chemical unit CHE is provided on the front side (negative side in the X direction in the figure) of the conveying space K5. The chemical unit CHE houses a bottle storing a coating liquid (specifically, resist liquid) used in the resist film forming unit COT, a pump for pressurizing and conveying the coating liquid to the resist film forming unit COT, and the like.

[0228] Furthermore, the depth (length in the X direction in the figure) of the housing CBLa that defines the conveying space K5 is smaller than the depth of the partition module DBL. Therefore, the front (negative X direction) ends of the housing CBLa and the partition module DBL are roughly aligned, but their rear (positive X direction) ends are not aligned, with the rear end of the partition module DBL being located inward.

[0229] Furthermore, an air supply unit 190 is provided with respect to the intermediate module CBL.

[0230] The air supply unit 190 supplies clean air from above to the conveying space K5 . The air supply unit 190 includes a fan unit 191 and a filter 192 .

[0231] The fan unit 191 delivers the gas to the filter 192. Specifically, for example, the fan unit 191 draws the gas into the fan unit 191 and delivers the drawn gas to the filter 192 via the pipe 193.

[0232] The filter 192 purifies the gas conveyed from the fan unit 191 , that is, filters out particles in the gas, and blows the purified gas (clean gas) toward the conveying space K5 below.

[0233] The air supply unit 190 supplies the clean gas to the following portion in the transfer space K5 , for example.

[0234] The space that the wafer W passes through, which is further inward than the transfer module 170 (positive side in the X direction in the figure)

[0235] The space that overlaps with the handover module 170 when viewed from above

[0236] Alternatively, the fan unit 191 of the air supply unit 190 may be located further inward (on the positive side in the X direction in the figure) than the housing CBLa. However, in this case, the inner end of the fan unit 191 is not located further inward than the inner end of the partition module DBL.

[0237] The fan unit 101 of the second air supply unit 100 used in the left partition module DBL1 can also be stacked on top of the center module CBL. Specifically, the fan unit 101 can also be stacked on top of the filter 192. However, the height of the top end of the fan unit 101 is set to be lower than the height of the top end of the partition module DBL. By arranging the fan unit 101 in this way, the overall height of the coating and developing apparatus 1A can be reduced.

[0238] Alternatively, the aforementioned storage sections 141 and 142 may be provided above the front side (negative side in the X direction in the figure) and the back side (positive side in the X direction in the figure) of the intermediate module CBL relative to the fan unit 101. However, the height of the upper ends of the storage sections 141 and 142 is set to be lower than the height of the upper ends of the process modules 11A.

[0239] and, Figure 12 The coating and developing device 1A and Figure 1 The coating and developing apparatus 1 shown in FIG. 1A and FIG. 2A differs in the structure of the interface module. Specifically, the interface module 12A of the coating and developing apparatus 1A includes a conveying mechanism 125 that conveys wafers W between an interface unit 171 approached by the reciprocating conveying mechanism 150 and other interface units 171 in the interface module 110. The conveying mechanism 125 is, for example, located on the inner side (positive side in the X direction in the figure) of the interface module 110.

[0240] The rest of the structure of the interface module 12A is the same as that of the interface module 12 .

[0241] In the coating and developing apparatus 1A, the wafer W is supported, for example, in the following sequence, and resist coating, exposure, and the like are performed on the wafer W. Hereinafter, among the delivery units, the delivery unit to which any of the reciprocating transport mechanisms is in proximity is referred to as a reciprocating delivery unit, and the delivery unit to which no reciprocating transport mechanism is in proximity is referred to as a non-reciprocating delivery unit.

[0242] 1st conveying mechanism 40 → non-reciprocating transfer unit 31 of transfer module 30 → 2nd conveying mechanism 70 → anti-etching film forming unit COT of left dividing module DBL1 → 2nd conveying mechanism 70 → heat treatment unit HT for PAB treatment of left dividing module DBL1 → 2nd conveying mechanism 70 → non-reciprocating transfer unit 171 of intermediate module CBL → conveying mechanism 180 → transfer unit 171b of intermediate module CBL → reciprocating conveying mechanism 150 of right dividing module DBL2 → reciprocating transfer unit 111 of interface module 12A → conveying mechanism 125 → non-reciprocating transfer unit 111 of transfer module 110 → 3rd conveying mechanism 120 → exposure device.

[0243] Then, the wafer W is supported, for example, in the following procedure, and the wafer W is subjected to a PEB process, a development process, and the like.

[0244] Exposure device → 3rd conveying mechanism 120 → non-reciprocating transfer unit 111 of interface module 12A → conveying mechanism 160 → heat treatment unit HT for PEB treatment of right dividing module DBL2 → conveying mechanism 160 → developing unit DEV of right dividing module DBL2 → conveying mechanism 160 → heat treatment unit HT for post-bake treatment of right dividing module DBL2 → conveying mechanism 160 → non-reciprocating transfer unit 171 of intermediate module CBL → conveying mechanism 180 → transfer unit 171a of intermediate module CBL → reciprocating conveying mechanism 150 of left dividing module DBL1 → reciprocating transfer unit 31 of transfer module 30 → 1st conveying mechanism 40.

[0245] By using the above-described processing module 11A, the number of processing units mounted in the processing module 11A can be increased.

[0246] <Variation 2 of Processing Module>

[0247] Figure 16 It is an explanatory diagram showing the schematic structure of a second modification of the processing module. Figure 17 This is an explanatory diagram of the structure of the intermediate module CBLB.

[0248] Figure 16 The coating and developing device 1B and Figure 12 The process module 11B is divided along the width direction (Y direction in the figure) similarly to the coating and developing device 1A shown in FIG. However, in the coating and developing device 1B, unlike the coating and developing device 1A, the storage section 141 is provided above the left divided module DBL1 and the right divided module DBL2. Figure 17 As shown, no storage portions 141 and 142 are provided above the intermediate module CBLB.

[0249] Therefore, the height of the upper end of the intermediate module CBLB can be raised to the same height as the upper end of the dividing module DBL. By raising the intermediate module CBLB in this way, workers can easily access the uppermost layer of the dividing module DBL via the intermediate module CBLB to perform maintenance on the processing units on the uppermost layer of the dividing module DBL. This makes maintenance easier.

[0250] In addition, even if the height of the upper end of the intermediate module CBLB is increased as described above, since the upper end of the storage portion 141 from the upper end of the intermediate module CBLB to the split module DBL is separated, both the fan unit 191 and the filter 192 of the air supply unit 190 can be set above the intermediate module CBL.

[0251] Moreover, if the fan unit 191 is provided above the intermediate module CBLB, rather than being provided at a position further inward than the intermediate module CBLB (the shell CBLBa thereof), the inner end portion of the shell CBLBa (the positive end portion in the X direction in the figure) can be expanded to the inner end portion of the splitting module DBL. As a result, a processing unit can be provided further inward than the conveying mechanism 180 in the intermediate module CBLB. In addition, a processing unit that is smaller than, for example, the heat treatment unit HT provided in the splitting module DBL is provided at a position further inward than the conveying mechanism 180 in the intermediate module CBLB. More specifically, for example, in a case where the heat treatment unit HT has both a hot plate and a cooling plate, a heat treatment unit HTB having only a hot plate is provided at a position further inward than the conveying mechanism 180 in the intermediate module CBLB.

[0252] In addition, by increasing the height of the upper end of the intermediate module CBLB as described above, a unit (for example, an inspection camera unit) having a dimension in the depth direction (the X direction in the figure) equal to that of the chemical unit CHE can be provided in an area near the front side of the intermediate module CBLB (the negative side in the X direction in the figure) where the chemical unit CHE does not exist.

[0253] In addition, for the interface module 12A, when the storage parts 141 and 142 are not set above it, the height of the upper end of the interface module 12A can also be increased, and the fan unit 131 and the filter 132 of the third air supply unit 130 can both be set above the interface module 12A.

[0254] <Variation 3 of Processing Module>

[0255] Figure 18 It is an explanatory diagram showing the schematic structure of a third modification of the processing module. Figure 19 It is an explanatory diagram of the structure of the division module DBLC.

[0256] Figure 18 The coating and developing device 1C and Figure 12 Similar to the coating and developing apparatus 1A shown in FIG. 1 , the processing module 11C is divided into a plurality of divided modules DBLC along the width direction (the Y direction in the figure). However, unlike the coating and developing apparatus 1A, no intermediate module is provided between adjacent divided modules DBLC, and the plurality of divided modules DBLC constituting the processing module 11C are connected along the width direction (the Y direction in the figure). Figure 18 In the example shown, the processing module 11C is divided into two split modules DBLC, with no intermediate module provided between adjacent split modules DBLC. Hereinafter, the split module DBLC on the negative side in the width direction (the left side in the figure) is sometimes referred to as the left split module DBLC1, and the split module DBLC on the positive side in the width direction (the right side in the figure) is sometimes referred to as the right split module DBLC2.

[0257] like Figure 19 As shown, in the left dividing module DBLC1 among the dividing modules DBLC, the upper submodule BL1C and the lower submodule BL2C are stacked in this order from the top, and a reciprocating layer BL3C is provided in each of the upper submodule BL1C and the lower submodule BL2C.

[0258] Similar to the upper submodule BL1 of the processing module 11 described above, the upper submodule BL1C and the lower submodule BL2C of the left partition module DBLC1 are each provided with a second conveying mechanism 70. However, the second conveying mechanism 70 provided in the left partition module DBLC1 not only conveys wafers W between the transfer module 30 and the processing units within the left partition module DBLC1, and between the processing units within the left partition module DBLC1, but also conveys wafers W between the processing units within the left partition module DBLC1 and the transfer unit TRS3 described later.

[0259] In addition, in the left-side dividing module DBLC1, the front side (negative side in the X direction in the figure) of the second conveying space K2 of each of the upper sub-module BL1C and the lower sub-module BL2C is divided into an upper layer BL21 and a lower layer BL22 provided with an anti-etching film forming unit COT, similar to the above-mentioned lower sub-module BL2.

[0260] On the other hand, in the right split module DBLC2 among the split modules DBLC, although not shown in the figure, the upper submodule BL1D and the lower submodule BL2D are stacked in this order from the top, and a reciprocating layer BL3D is provided in each of the upper submodule BL1D and the lower submodule BL2D.

[0261] Similar to the upper submodule BL1 of the right dividing module DBL2, the upper submodule BL1D and the lower submodule BL2D of the right dividing module DBLC2 are provided with a conveying mechanism 160 (see FIG. Figure 18 However, unlike the conveying mechanism provided in the above-mentioned right partition module DBL2, the conveying mechanism 160 provided in the right partition module DBLC2 not only conveys wafers W between the handover module 110 of the interface module 12A and the processing units in the right partition module DBLC2, and between the processing units in the right partition module DBLC2, but also conveys wafers W between the processing units in the right partition module DBLC2 and the handover unit TRS2 described later.

[0262] In addition, in the right-side dividing module DBLC2, the front side (negative side of the X direction in the figure) of the conveying space K4 of each of the upper sub-module BL1D and the lower sub-module BL2D is divided into an upper layer BL11 and a lower layer BL12 provided with the developing unit DEV, similar to the above-mentioned upper sub-module BL1.

[0263] Returns the description of the left split module DBLC1.

[0264] In the left division module DBLC1 , a reciprocating layer BL3C is provided on the back side (positive side in the X direction in the figure) of the second conveying space K2 of each of the upper submodule BL1C and the lower submodule BL2C so as to overlap with the heat treatment unit HT.

[0265] A reciprocating conveying mechanism 150C is provided on the reciprocating layer BL3C. Hereinafter, the reciprocating conveying mechanism 150C provided on the reciprocating layer BL3C of the upper submodule BL1C may be referred to as the upper reciprocating conveying mechanism 150Ca, and the reciprocating conveying mechanism 150C provided on the reciprocating layer BL3C of the lower submodule BL2C may be referred to as the lower reciprocating conveying mechanism 150Cb.

[0266] Similar to the above-described shuttle transport mechanism 150, the shuttle transport mechanism 150C linearly transports the wafer W only in the width direction (the Y direction in the figure). In this example, the shuttle transport mechanism 150C linearly transports the wafer W in the width direction (the Y direction in the figure) between the transfer unit TRS1 provided in the left dividing module DBL1 and the transfer unit TRS2 provided in the right dividing module DBL2.

[0267] Specifically, the upper reciprocating transport mechanism 150Ca transports the wafer W linearly along the width direction between the transfer unit TRS1 provided in the upper submodule BL1C of the left segmentation module DBLC1 and the transfer unit TRS2 provided in the upper submodule BL1D of the right segmentation module DBLC2. Furthermore, the lower reciprocating transport mechanism 150Cb transports the wafer W linearly along the width direction between the transfer unit TRS1 provided in the lower submodule BL2C of the left segmentation module DBLC1 and the transfer unit TRS2 provided in the lower submodule BL2D of the right segmentation module DBLC2.

[0268] Hereinafter, the transfer unit TRS1 provided in the upper submodule BL1C may be referred to as an upper transfer unit TRS1a, and the transfer unit TRS2 provided in the upper submodule BL1D may be referred to as an upper transfer unit TRS2a.

[0269] The linear wafer W transport path of the reciprocating transport mechanism 150C and the transfer units TRS1 and TRS2 are arranged so as to overlap with the processing units within the processing module 11C when viewed from above. For example, if the thermal processing unit HT includes both a hot plate and a cooling plate, the linear wafer W transport path of the reciprocating transport mechanism 150C and the transfer units TRS1 and TRS2 are arranged so as not to overlap with the hot plate of the thermal processing unit HT but only with the cooling plate when viewed from above.

[0270] The transfer unit TRS1 is provided, for example, at an end portion on the cassette module 10 side in a region of the left partition module DBLC1 that is further back than the second conveyance space K2 (positive side in the X direction in the drawing).

[0271] Furthermore, the transfer unit TRS2 is provided, for example, at an end portion on the cassette module 10 side in a region of the right partition module DBLC2 that is further back than the conveyance space K4 (positive side in the X direction in the drawing).

[0272] On the other hand, in the right dividing module DBLC2, a reciprocating layer BL3D is provided on the inner side (positive side in the X direction in the figure) of the conveying space K4 of each of the upper submodule BL1D and the lower submodule BL2D so as to be stacked with the heat treatment unit HT.

[0273] A reciprocating conveying mechanism 150D is provided on the reciprocating layer BL3D. Hereinafter, the reciprocating conveying mechanism 150D provided on the reciprocating layer BL3D of the upper submodule BL1D may be referred to as the upper reciprocating conveying mechanism 150Da, and the reciprocating conveying mechanism 150D provided on the reciprocating layer BL3D of the lower submodule BL2D may be referred to as the lower reciprocating conveying mechanism 150Db.

[0274] Similar to the above-described shuttle transport mechanism 150, the shuttle transport mechanism 150D linearly transports the wafer W only in the width direction (the Y direction in the figure). In this example, the shuttle transport mechanism 150D linearly transports the wafer W in the width direction (the Y direction in the figure) between the transfer unit TRS3 provided in the right dividing module DBLC2 and the transfer unit TRS4 provided in the left dividing module DBLC1.

[0275] Specifically, the upper reciprocating transport mechanism 150Da transports the wafer W linearly along the width direction between the transfer unit TRS3 provided in the upper submodule BL1D of the right segmentation module DBLC2 and the transfer unit TRS4 provided in the upper submodule BL1C of the left segmentation module DBLC1. Furthermore, the lower reciprocating transport mechanism 150Db transports the wafer W linearly along the width direction between the transfer unit TRS3 provided in the lower submodule BL2D of the right segmentation module DBLC2 and the transfer unit TRS4 provided in the lower submodule BL2C of the left segmentation module DBLC1.

[0276] Hereinafter, the transfer unit TRS3 provided in the upper submodule BL1D may be referred to as an upper transfer unit TRS3a, and the transfer unit TRS4 provided in the upper submodule BL1C may be referred to as an upper transfer unit TRS4a.

[0277] The linear wafer W transport path of the reciprocating transport mechanism 150D and the transfer units TRS3 and TRS4 are arranged so as to overlap with the processing units in the processing module 11C when viewed from above. For example, if the thermal processing unit HT includes both a hot plate and a cooling plate, the linear wafer W transport path of the reciprocating transport mechanism 150D and the transfer units TRS3 and TRS4 are arranged so as not to overlap with the hot plate of the thermal processing unit HT when viewed from above, but only with the cooling plate.

[0278] The transfer unit TRS3 is provided, for example, at an end portion on the interface module 12A side in a region of the right divided module DBLC2 that is further back than the conveyance space K4 (positive side in the X direction in the figure).

[0279] Furthermore, the transfer unit TRS4 is provided, for example, at an end portion on the interface module 12A side in a region of the left division module DBLC1 that is further back than the second conveyance space K2 (positive side in the X direction in the figure).

[0280] When the processing module 11C is configured as described above, the transport mechanism 125 of the interface module 12A transports the wafer W between the delivery unit TRS3 and the delivery module 110 .

[0281] Furthermore, when the process module 11C is configured as described above, the first transport mechanism 40 of the cassette module 10 is configured to be able to transport the wafer W also to the delivery unit TRS1 .

[0282] When the process module 11C is configured as described above, the wafer W is supported, for example, in the following procedure, and the wafer W is subjected to a resist coating process, an exposure process, and the like.

[0283] The first conveying mechanism 40 → the handover unit 31 of the handover module 30 → the second conveying mechanism 70 → the anti-etching film forming unit COT of the upper sub-module BL1C → the second conveying mechanism 70 → the heat treatment unit HT for PAB treatment of the upper sub-module BL1C → the second conveying mechanism 70 → the upper handover unit TRS4a → the upper reciprocating conveying mechanism 150Da → the upper handover unit TRS3a → the conveying mechanism 125 → the handover unit 111 of the interface module 12A → the third conveying mechanism 120 → the exposure device.

[0284] Then, the wafer W is supported, for example, in the following procedure, and the wafer W is subjected to a PEB process, a development process, and the like.

[0285] Exposure device → 3rd conveying mechanism 120 → handover unit 111 of interface module 12A → conveying mechanism 160 → heat treatment unit HT for PEB treatment of upper sub-module BL1D → conveying mechanism 160 → heat treatment unit HT for PEB treatment of upper sub-module BL1D → conveying mechanism 160 → developing unit DEV of upper sub-module BL1D → conveying mechanism 160 → heat treatment unit HT for post-bake treatment of upper sub-module BL1D → conveying mechanism 160 → upper handover unit TRS2a → upper reciprocating conveying mechanism 150Ca → upper handover unit TRS1a → 1st conveying mechanism 40.

[0286] By using the above-described process module 11C, the number of process units mounted on the process module 11C can be increased.

[0287] Furthermore, when the first conveying mechanism 40 conveys wafers not only relative to the handover module 30 but also relative to the handover unit TRS1, it is preferably configured as follows. That is, the first conveying mechanism 40 only delivers the wafer W to the handover module 30 from one side (specifically, the inner side) in the depth direction (the X direction in the figure), and the handover unit TRS1 is preferably located closer to the above-mentioned side (specifically, the inner side) than the handover module 30. Thus, the conveyance of the wafer W relative to the handover module 30 by the first conveying mechanism 40 and the conveyance of the wafer W relative to the handover unit TRS1 by the first conveying mechanism 40 can be continuously performed in a short period of time, thereby improving productivity.

[0288] The substrate processing apparatus of the present invention can also be applied to a processing apparatus for processing substrates other than semiconductor wafers, for example, an FPD (Flat Panel Display) substrate.

[0289] Furthermore, the processing unit included in the substrate processing apparatus may process the wafer W by acquiring an image for inspection.

[0290] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above embodiments may be omitted, replaced, or modified in various forms without departing from the appended claims and their subject matter. For example, the constituent elements of the above embodiments may be arbitrarily combined. According to such arbitrary combinations, the functions and effects of the combined constituent elements can naturally be obtained, and other functions and effects that can be clearly understood by those skilled in the art from the description of this specification can be obtained.

[0291] In addition, the effects described in this specification are merely illustrative or exemplary, and not restrictive. That is, the technology of the present utility model can achieve other effects that can be clearly understood by those skilled in the art from the description of this specification in addition to or in place of the above effects.

[0292] In addition, the following structural examples also belong to the technical scope of the present invention.

[0293] (1) A substrate processing apparatus, characterized in that:

[0294] The substrate processing apparatus comprises:

[0295] a carrying-in and carrying-out module having a container placement portion for placing a plurality of containers configured to accommodate substrates; and

[0296] a processing module, which is arranged adjacent to the carrying-in and carrying-out module along the width direction and has a plurality of processing units for processing the substrate;

[0297] The input and output module also has:

[0298] The handover module is formed by stacking handover units for handing over the substrate between the processing module and the processing module, and the handover module is provided on the processing module side.

[0299] a first conveying mechanism for conveying the substrate between the container placement unit and the delivery module;

[0300] The processing module further includes a second conveying mechanism for conveying the substrate between the handover module and the processing unit.

[0301] The first conveying mechanism includes a supporting portion for supporting the substrate.

[0302] The first conveying mechanism is configured to allow the substrate supported by the supporting portion to pass through the delivery module along a depth direction intersecting the width direction in a plan view.

[0303] (2) The substrate processing apparatus according to (1), characterized in that:

[0304] The first conveying mechanism transfers the substrate to and from the transfer module only in the depth direction.

[0305] (3) The substrate processing apparatus according to (2), characterized in that:

[0306] The substrate processing apparatus further comprises a first air supply unit for supplying clean gas from above to the first conveying space provided with the first conveying mechanism in the carrying-in / out module.

[0307] The first conveying mechanism transfers the substrate to and from the transfer module only from one side in the depth direction.

[0308] The first air supply unit is configured to supply the clean gas only to a portion of the first transport space that is closer to the one side in the depth direction than the delivery module.

[0309] A portion of the first conveying space that is closer to the other side of the delivery module in the depth direction is filled with a storage portion for storing electrical appliances.

[0310] (4) The substrate processing apparatus according to any one of (1) to (3), characterized in that:

[0311] The container placement section is provided on a side of the carry-in / out module opposite to the processing module side in the width direction.

[0312] (5) The substrate processing apparatus according to (4), characterized in that:

[0313] The first transport mechanism transfers the substrate to and from the container mounting portion from the process module side in the width direction.

[0314] (6) The substrate processing apparatus according to (4) or (5), characterized in that:

[0315] The first conveying mechanism further includes: a first guide portion that guides the vertical movement of the support portion; and a second guide portion that guides the movement of the first guide portion in the depth direction.

[0316] In the width direction, a size of a gap between the container placement portion and the delivery module is larger than a length of the first guide portion and smaller than a length of the support portion.

[0317] (7) The substrate processing apparatus according to any one of (1) to (6), characterized in that:

[0318] The second conveying mechanism transfers the substrate to and from the transfer module in the width direction.

[0319] (8) The substrate processing apparatus according to any one of (1) to (7), characterized in that:

[0320] The processing module is divided into multiple modules along the vertical direction.

[0321] The second conveying mechanism is provided in each of the plurality of modules.

[0322] The delivery module is configured to be capable of delivering the substrate to and from the second transport mechanisms of all the modules.

[0323] (9) The substrate processing apparatus according to any one of claims (1) to (8), wherein:

[0324] The substrate processing apparatus further comprises:

[0325] Another module is provided on the side of the processing module opposite to the feeding and unfeeding module in the width direction; and

[0326] a second air supply unit for supplying clean gas from above to a second conveying space in the processing module where the second conveying mechanism is provided,

[0327] The second air supply unit partially overlaps with the other modules.

[0328] (10) The substrate processing apparatus according to any one of claims (1) to (8), wherein:

[0329] The processing module is divided into a plurality of dividing modules along the width direction.

[0330] For each of the segmentation modules, there is:

[0331] a plurality of said processing units; and

[0332] A reciprocating transport mechanism transports the substrate linearly only along the width direction.

[0333] (11) The substrate processing apparatus according to (10), characterized in that:

[0334] The processing module further comprises an intermediate module between the adjacent segmentation modules.

[0335] The intermediate module has the handover module,

[0336] The reciprocating conveying mechanism conveys the substrate linearly along the width direction between the transfer modules.

[0337] (12) The substrate processing apparatus according to (10), characterized in that:

[0338] The plurality of segmentation modules are connected along the width direction,

[0339] The reciprocating conveying mechanism linearly conveys the substrate along the width direction between the delivery unit in the dividing module in which the reciprocating conveying mechanism is provided and the delivery unit in another dividing module adjacent to the dividing module.

[0340] (13) The substrate processing apparatus according to (12), characterized in that:

[0341] The linear wafer W transport path of the reciprocating transport mechanism and the delivery unit for the wafer W to be transported by the reciprocating transport mechanism overlap with the processing unit in a plan view.

[0342] (14) The substrate processing apparatus according to (12) or (13), characterized in that:

[0343] The first conveying mechanism also conveys the substrate to the delivery unit in the dividing module on the side of the carry-in / out module in the width direction, to which the reciprocating conveying mechanism conveys the substrate.

[0344] (15) The substrate processing apparatus according to (14), characterized in that:

[0345] The first conveying mechanism transfers the substrate to and from the transfer module only from one side in the depth direction.

[0346] The delivery unit for conveying the substrate by the reciprocating conveying mechanism in the dividing module on the side of the carrying-in / out module in the width direction is provided on the one side of the delivery module of the carrying-in / out module in the depth direction.

Claims

1. A substrate processing device, characterized in that: The substrate processing device comprises: a carrying-in / out module having a container placement portion for placing a plurality of containers configured to accommodate substrates; and a processing module, which is arranged adjacent to the carrying-in and carrying-out module along the width direction and has a plurality of processing units for processing the substrate; A handover module is provided at a position close to the processing module in the feeding and unloading module for handover with the processing module. The handover module is formed by stacking handover units for handing over the substrate. The carrying-in and carrying-out module further includes a first conveying mechanism for conveying the substrate between the container loading portion and the delivery module. The processing module further includes a second conveying mechanism for conveying the substrate between the handover module and the processing unit. The first conveying mechanism includes a supporting portion for supporting the substrate. The first conveying mechanism is configured to allow the substrate supported by the supporting portion to pass through the delivery module along a depth direction intersecting the width direction in a plan view.

2. The substrate processing apparatus according to claim 1, wherein: The first conveying mechanism transfers the substrate to and from the transfer module only in the depth direction.

3. The substrate processing apparatus according to claim 2, wherein: The substrate processing apparatus further comprises a first air supply unit for supplying clean gas from above to the first conveying space provided with the first conveying mechanism in the carrying-in / out module. The first conveying mechanism transfers the substrate to and from the transfer module only from one side in the depth direction. The first air supply unit is configured to supply the clean gas only to a portion of the first transport space that is closer to the one side in the depth direction than the delivery module. A portion of the first conveying space that is closer to the other side of the delivery module in the depth direction is filled with a storage portion for storing electrical appliances.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein: The container placement section is provided on a side of the carry-in / out module opposite to the processing module side in the width direction.

5. The substrate processing apparatus according to claim 4, wherein: The first transport mechanism transfers the substrate to and from the container mounting portion from the process module side in the width direction.

6. The substrate processing apparatus according to claim 4, wherein: The first conveying mechanism further includes: a first guide portion that guides the vertical movement of the support portion; and a second guide portion that guides the movement of the first guide portion in the depth direction. In the width direction, a size of a gap between the container placement portion and the delivery module is larger than a length of the first guide portion and smaller than a length of the support portion.

7. The substrate processing apparatus according to any one of claims 1 to 3, wherein: The second conveying mechanism transfers the substrate to and from the transfer module in the width direction.

8. The substrate processing apparatus according to any one of claims 1 to 3, wherein: The processing module is divided into multiple modules along the vertical direction. The second conveying mechanism is provided in each of the plurality of modules. The delivery module is configured to be capable of delivering the substrate to and from the second transport mechanisms of all the modules.

9. The substrate processing apparatus according to any one of claims 1 to 3, wherein: The substrate processing apparatus further comprises: Another module is provided on the side of the processing module opposite to the feeding and unfeeding module in the width direction; and a second air supply unit for supplying clean gas from above to a second conveying space in the processing module where the second conveying mechanism is provided, The second air supply unit partially overlaps with the other modules.

10. The substrate processing apparatus according to any one of claims 1 to 3, wherein: The processing module is divided into a plurality of dividing modules along the width direction. For each of the segmentation modules, there is: a plurality of said processing units; and A reciprocating transport mechanism transports the substrate linearly only along the width direction.

11. The substrate processing apparatus according to claim 10, wherein: The processing module further comprises an intermediate module between the adjacent segmentation modules. The intermediate module has the handover module, The reciprocating conveying mechanism conveys the substrate linearly along the width direction between the transfer modules.

12. The substrate processing apparatus according to claim 10, wherein: A plurality of the segmentation modules are connected along the width direction, The reciprocating conveying mechanism linearly conveys the substrate along the width direction between the delivery unit in the dividing module in which the reciprocating conveying mechanism is provided and the delivery unit in another dividing module adjacent to the dividing module.

13. The substrate processing apparatus according to claim 12, wherein: The linear wafer W transport path of the reciprocating transport mechanism and the delivery unit for the wafer W to be transported by the reciprocating transport mechanism overlap with the processing unit in a plan view.

14. The substrate processing apparatus according to claim 12, wherein: The first conveying mechanism also conveys the substrate to the delivery unit in the dividing module on the side of the carry-in / out module in the width direction, to which the reciprocating conveying mechanism conveys the substrate.

15. The substrate processing apparatus according to claim 14, wherein: The first conveying mechanism transfers the substrate to and from the transfer module only from one side in the depth direction. The delivery unit for conveying the substrate by the reciprocating conveying mechanism in the dividing module on the side of the carrying-in / out module in the width direction is provided on the one side of the delivery module of the carrying-in / out module in the depth direction.

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