Active temperature control assembly

Abstract

The utility model provides an active temperature control assembly, and relates to the technical field of temperature control. The active temperature control assembly comprises a heating element, a heater driving circuit, a main temperature control circuit, a backup temperature control circuit, a temperature measuring element and an upper computer, and a heater interface of the heater driving circuit is connected with an interface of the heating element so as to drive the heating element to heat a product to be tested; the temperature measuring element is connected with temperature measuring interfaces of the main temperature control circuit and the backup temperature control circuit through plug connectors, communication interfaces of the main temperature control circuit and the backup temperature control circuit are connected with a communication interface of the heater driving circuit, and a communication interface of the upper computer is connected with communication interfaces of the main temperature control circuit and the backup temperature control circuit. And the upper computer drives the backup temperature control circuit to operate through a fault signal of the main temperature control circuit. When the main temperature control circuit breaks down, the upper computer can drive the backup temperature control circuit to operate in time, and the backup temperature control circuit replaces the main temperature control circuit to operate.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature control, in particular to an active temperature control component. Background Art

[0002] The main function of an active temperature control component is to control the temperature of a product to meet relevant indicators by relying on external power. It mainly consists of a temperature controller, a heating element, and a temperature sensor.

[0003] The temperature controller relies on an external power supply to collect the resistance values ​​of temperature sensors (platinum resistors) at different locations on a product. This resistance value is converted into temperature data through A / D conversion, and the temperature data for each location is uploaded to the onboard equipment via the CAN bus. Simultaneously, it provides an active heating path for the product's heater, ensuring that the product maintains an appropriate temperature during operation, guaranteeing the product's proper operation and lifespan. However, if a circuit failure occurs in the temperature controller, the controller cannot execute the signal instructions sent by the host computer, nor can it provide temperature feedback to the host computer, resulting in an inability to effectively control the temperature, thus affecting the use of the active temperature control component. Utility Model Content

[0004] The problem solved by the utility model is: how to ensure the effective operation of the active temperature control component.

[0005] In order to solve the above problems, the utility model provides an active temperature control component, including a heating element, a heater driving circuit, a main temperature control circuit, a backup temperature control circuit, a temperature measuring element and a host computer. The heater interface of the heater driving circuit is connected to the interface of the heating element to drive the heating element to heat the product to be tested. The temperature measuring element is respectively connected to the temperature measuring interfaces of the main temperature control circuit and the backup temperature control circuit through a plug-in connector. The communication interfaces of the main temperature control circuit and the backup temperature control circuit are both connected to the communication interface of the heater driving circuit. The communication interface of the host computer is respectively connected to the communication interfaces of the main temperature control circuit and the backup temperature control circuit. The host computer drives the backup temperature control circuit to operate through the fault signal of the main temperature control circuit.

[0006] Optionally, the main temperature control circuit is communicatively connected to the backup temperature control circuit.

[0007] Optionally, the main temperature control circuit includes a main MCU chip and a main transistor, the first communication pin of the main MCU chip is connected to the base of the main transistor, the collector of the main transistor is connected to the +3.3V signal, and is connected to the communication interface of the backup temperature control circuit, and the emitter of the main transistor is grounded.

[0008] Optionally, the main temperature control circuit further includes a main inverter, one end of the main inverter is connected to the collector of the main transistor, and the other end is connected to the communication interface of the backup temperature control circuit.

[0009] Optionally, the backup temperature control circuit includes a backup MCU chip and a backup transistor, the second communication pin of the backup MCU chip is connected to the main inverter, the first communication pin of the backup MCU chip is connected to the base of the backup transistor, the collector of the backup transistor is connected to the +3.3V signal and is connected to the second communication pin of the main MCU chip, and the emitter of the backup transistor is grounded.

[0010] Optionally, the backup temperature control circuit further includes a backup inverter, one end of the backup inverter is connected to the collector of the backup transistor, and the other end of the backup inverter is connected to the second communication pin of the main MCU chip.

[0011] Optionally, the temperature measuring element is made of a platinum resistor.

[0012] Optionally, the heating element is a polyimide film heater.

[0013] Optionally, the active temperature control component further includes a power supply circuit, which is connected to the power supply interfaces of the main temperature control circuit and the backup temperature control circuit respectively.

[0014] Optionally, the temperature measuring element is embedded in the heating element.

[0015] Compared with the prior art, the active temperature control component of the present invention utilizes the heater interface of the heater driving circuit to be connected with the interface of the heating element. The heater driving circuit can drive the heating element to perform heating operations to heat the product to be tested, and utilizes the temperature measuring element to be connected with the temperature measuring interface of the main temperature control circuit through a connector, so that the temperature of the heating element can be converted into an electrical signal through the main temperature control circuit, and with the help of the communication interface of the host computer and the communication connection with the main temperature control circuit, the temperature signal can be uploaded to the host computer and the temperature can be regulated by the host computer, and then the backup temperature control circuit is driven to operate by the fault signal of the main temperature control circuit by the host computer, and the backup temperature control circuit is connected to the communication interface of the heater driving circuit. In this way, when the main temperature control circuit fails, the host computer can drive the backup temperature control circuit to operate in time, and the backup temperature control circuit replaces the main temperature control circuit to operate, thereby ensuring the stable operation of the active temperature control component to ensure the effective operation of the active temperature control component. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Description of reference numerals:

[0017] 1- Main MCU chip; 2- Main transistor; 4- Main inverter; 5- Backup MCU chip; 6- Backup transistor; 7- Backup inverter; 8- First resistor; 9- Second resistor; 10- Third resistor; 11- Fourth resistor.

[0018] Figure 1 This is a structural block diagram of the active temperature control component in an embodiment of the present utility model;

[0019] Figure 2 This is a circuit diagram of the active temperature control component in the embodiment of the present utility model;

[0020] Figure 3 2 is a circuit diagram of a power supply circuit in an embodiment of the present utility model. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0022] It should be noted that the terms "first," "second," and the like in the specification and claims of the present invention and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present invention described herein can be implemented in an order other than that illustrated or described herein.

[0023] Combine Figure 1 As shown, the utility model provides an active temperature control component, including a heating element, a heater driving circuit, a main temperature control circuit, a backup temperature control circuit, a temperature measuring element and a host computer. The heater interface of the heater driving circuit is connected to the interface of the heating element to drive the heating element to heat the product to be tested. The temperature measuring element is respectively connected to the temperature measuring interfaces of the main temperature control circuit and the backup temperature control circuit through a plug-in connector. The communication interfaces of the main temperature control circuit and the backup temperature control circuit are both connected to the communication interface of the heater driving circuit. The communication interface of the host computer is respectively connected to the communication interfaces of the main temperature control circuit and the backup temperature control circuit. The host computer drives the backup temperature control circuit to operate through a fault signal of the main temperature control circuit.

[0024] It should be noted that the communication connection between the circuits in this specification can be achieved through existing technologies and is not a mandatory requirement.

[0025] Specifically, the main and backup temperature control circuits have identical circuitry. The main temperature control circuit performs temperature measurement. Specifically, the host computer issues a control signal to drive the main temperature control circuit. Based on the received control signal, the main temperature control circuit then drives the heater drive circuit. The heater drive circuit, connected to the power distribution circuit, powers up and drives the heating element to heat the product. During the heating process, a temperature measuring element (which can be understood as a temperature sensor) provides feedback on the heating element's temperature, converts it into an electrical signal, and feeds it back to the main temperature control circuit. The main temperature control circuit then feeds back to the host computer, which then adjusts the heating temperature based on the feedback from the main temperature control circuit. When the main temperature control circuit fails, the host computer establishes a communication channel with the backup temperature control circuit, and the backup temperature control circuit replaces the main temperature control circuit to perform temperature control. For example, the main temperature control circuit and the host computer communicate through a pulse signal. If the host computer does not receive the pulse signal from the main temperature control circuit within a unit time (which can be 1s, 3s or 5s), and the main temperature control circuit does not respond to the control signal sent by the host computer, it means that the main temperature control circuit has failed. At this time, the host computer sends a control signal to drive the backup temperature control circuit to operate, and the backup temperature control circuit replaces the main temperature control circuit to perform temperature regulation.

[0026] Therefore, in this embodiment, the heater interface of the heater driving circuit is connected to the interface of the heating element, and the heater driving circuit can drive the heating element to perform heating operation to heat the product to be tested, and the temperature measuring element is connected to the temperature measuring interface of the main temperature control circuit through a connector, so that the temperature of the heating element can be converted into an electrical signal through the main temperature control circuit, and with the help of the communication interface of the host computer and the communication connection with the main temperature control circuit, the temperature signal can be uploaded to the host computer and the temperature can be regulated by the host computer, and then the host computer uses the fault signal of the main temperature control circuit to drive the backup temperature control circuit to operate, and the backup temperature control circuit is connected to the communication interface of the heater driving circuit. In this way, when the main temperature control circuit fails, the host computer can drive the backup temperature control circuit to operate in time, and the backup temperature control circuit replaces the main temperature control circuit to operate, thereby ensuring the stable operation of the active temperature control component and ensuring the effective operation of the active temperature control component.

[0027] In addition, since the main temperature control circuit and the backup temperature control circuit have the same circuit composition, the two can serve as backups for each other. In other words, in actual applications, the one performing temperature control is called the main temperature control circuit, and the other is the backup temperature control circuit.

[0028] Optionally, combined Figure 1 As shown, the main temperature control circuit is communicatively connected with the backup temperature control circuit.

[0029] Specifically, the main temperature control circuit is communicated with both the host computer and the backup temperature control circuit. When the main temperature control circuit operates normally, it will send a pulse signal to the backup temperature control circuit. When the main temperature control circuit fails, the backup temperature control circuit cannot receive the pulse signal from the main temperature control circuit, thereby realizing supervision between the main temperature control circuit and the backup temperature control circuit. This can be combined with the host computer mentioned above to improve the response efficiency of the backup temperature control circuit.

[0030] Optionally, combined Figure 2 As shown, the main temperature control circuit includes a main MCU chip 1 and a main transistor 2. The first communication pin of the main MCU chip 1 is connected to the base of the main transistor 2. The collector of the main transistor 2 is connected to the +3.3V signal and is connected to the communication interface of the backup temperature control circuit. The emitter of the main transistor 2 is grounded.

[0031] It should be noted that the following are for convenience of distinction. Figure 2 B3.3V represents the +3.3V signal in the main temperature control circuit, and A3.3V represents the +3.3V signal in the backup temperature control circuit.

[0032] Specifically, the first communication pin of the master MCU chip 1 is connected to the base of the master transistor 2 via a first resistor 8. The collector of the master transistor 2 is connected to a +3.3V signal via a second resistor 9. Simultaneously, the collector of the master transistor 2 is connected to the communication interface of the backup temperature control circuit via a third resistor 10. The emitter of the master transistor 2 is grounded, and a fourth resistor 11 is connected in parallel between the emitter and base of the master transistor 2. In this way, the master transistor 2 forms an amplifier circuit between the master MCU chip 1 and the backup temperature control circuit, thereby amplifying the signal emitted by the master MCU chip 1 and facilitating its reception by the backup temperature control circuit.

[0033] Optionally, combined Figure 2 As shown, the main temperature control circuit further includes a main inverter 4, one end of the main inverter 4 is connected to the collector of the main transistor 2, and the other end is connected to the communication interface of the backup temperature control circuit.

[0034] Specifically, the main inverter 4 and the main transistor 2 form an inverting amplifier circuit between the main MCU chip 1 and the backup temperature control circuit to convert the fault signal output by the main temperature control circuit into a receiving signal of the backup temperature control circuit, so as to facilitate the communication connection between the main temperature control circuit and the backup temperature control circuit.

[0035] Optionally, combined Figure 2As shown, the backup temperature control circuit includes a backup MCU chip 5 and a backup transistor 6. The second communication pin of the backup MCU chip 5 is connected to the main inverter 4, the first communication pin of the backup MCU chip 5 is connected to the base of the backup transistor 6, the collector of the backup transistor 6 is connected to the +3.3V signal, and is connected to the second communication pin of the main MCU chip 1, and the emitter of the backup transistor 6 is grounded.

[0036] Specifically, backup transistor 6 performs the same function as primary transistor 2. It forms an amplifier circuit between the second communication pin of the primary MCU chip 1 and the second communication pin of the backup MCU. If the backup temperature control circuit fails, the fault signal from the backup temperature control circuit is fed back to the primary temperature control circuit through the transistor amplifier circuit, thereby improving the stability of signal transmission between the backup and primary temperature control circuits.

[0037] Optionally, combined Figure 2 As shown, the backup temperature control circuit also includes a backup inverter 7, one end of the backup inverter 7 is connected to the collector of the backup transistor 6, and the other end of the backup inverter 7 is connected to the second communication pin of the main MCU chip 1.

[0038] Specifically, the backup inverter 7 and the backup transistor 6 form an inverting amplifier circuit between the backup MCU chip 5 and the main temperature control circuit to convert the fault signal output by the backup temperature control circuit into a receiving signal of the main temperature control circuit, so as to realize the communication connection between the main temperature control circuit and the backup temperature control circuit.

[0039] It should be noted that the main MCU chip 1 and the backup MCU chip 5 in this embodiment can be completely identical, and can adopt the temperature controller chip in the prior art.

[0040] Optionally, the temperature measuring element is made of a platinum resistor. Thus, as the temperature rises, the resistance of the temperature measuring element increases at a uniform rate, thereby improving the temperature measurement accuracy of the temperature measuring element.

[0041] Optionally, the heating element is a polyimide film heater. In this way, the polyimide film heater can expand the temperature adaptability range of the heating element, thereby improving the flexibility of use of the heating element.

[0042] Optionally, combined Figure 3 As shown, the active temperature control component also includes a power supply circuit, which is connected to the power supply interfaces of the main temperature control circuit and the backup temperature control circuit respectively.

[0043] Specifically, the power distribution circuit may include an input fuse, an input filter circuit, a PFV circuit, an auxiliary source circuit, an overvoltage / overcurrent protection circuit, a +12V power conversion circuit, and a -12V power conversion circuit. During power supply, the input fuse is connected in series with the AC115V input busbar to protect it. The AC115V voltage then passes through the input filter circuit to power the subsequent PFC circuit. A PFC circuit boosts the input voltage to approximately DC260V, which is then supplied to two ±12V power conversion circuits to generate ±12V DC output voltages (+12V current 1.5A, -12V current 0.5A). The auxiliary source circuit also generates the isolated auxiliary power required by various functional circuits. The ±12V DC output voltages are each equipped with overvoltage / overcurrent protection circuits. After passing through the output filter circuit, the ±12V DC output voltages are supplied to the load, meeting the requirements of both the primary and backup temperature control circuits.

[0044] Optionally, combined Figure 1 As shown, the temperature measuring element is embedded in the heating element.

[0045] Specifically, the temperature measuring element is embedded in the heating element through a hot pressing process, thereby improving the integration of the temperature measuring element and the heating element.

[0046] Although the disclosure of the present invention is as above, the scope of protection of the present invention is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications will fall within the scope of protection of the present invention.

Claims

1. An active temperature control component, characterized in that: It includes a heating element, a heater driving circuit, a main temperature control circuit, a backup temperature control circuit, a temperature measuring element and a host computer. The heater interface of the heater driving circuit is connected to the interface of the heating element to drive the heating element to heat the product to be tested. The temperature measuring element is connected to the temperature measuring interfaces of the main temperature control circuit and the backup temperature control circuit respectively through a plug-in connector. The communication interfaces of the main temperature control circuit and the backup temperature control circuit are both connected to the communication interface of the heater driving circuit. The communication interface of the host computer is connected to the communication interfaces of the main temperature control circuit and the backup temperature control circuit respectively. The host computer drives the backup temperature control circuit to operate through the fault signal of the main temperature control circuit.

2. The active temperature control assembly according to claim 1, characterized in that: The main temperature control circuit is communicatively connected to the backup temperature control circuit.

3. The active temperature control assembly according to claim 2, characterized in that: The main temperature control circuit includes a main MCU chip and a main transistor. The first communication pin of the main MCU chip is connected to the base of the main transistor. The collector of the main transistor is connected to the +3.3V signal and is connected to the communication interface of the backup temperature control circuit. The emitter of the main transistor is grounded.

4. The active temperature control assembly according to claim 3, characterized in that: The main temperature control circuit further includes a main inverter, one end of which is connected to the collector of the main transistor, and the other end of which is connected to the communication interface of the backup temperature control circuit.

5. The active temperature control assembly according to claim 4, characterized in that: The backup temperature control circuit includes a backup MCU chip and a backup transistor. The second communication pin of the backup MCU chip is connected to the main inverter, the first communication pin of the backup MCU chip is connected to the base of the backup transistor, the collector of the backup transistor is connected to the +3.3V signal and is connected to the second communication pin of the main MCU chip, and the emitter of the backup transistor is grounded.

6. The active temperature control assembly according to claim 5, characterized in that: The backup temperature control circuit also includes a backup inverter, one end of the backup inverter is connected to the collector of the backup transistor, and the other end of the backup inverter is connected to the second communication pin of the main MCU chip.

7. The active temperature control assembly according to claim 1, characterized in that: The temperature measuring element is made of a platinum resistor.

8. The active temperature control assembly according to claim 1, characterized in that: The heating element is a polyimide film heater.

9. The active temperature control assembly according to claim 1, characterized in that: It also includes a power supply circuit, which is connected to the power supply interfaces of the main temperature control circuit and the backup temperature control circuit respectively.

10. The active temperature control assembly according to claim 1, characterized in that: The temperature measuring element is embedded in the heating element.

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