Power module and electric device

Abstract

The utility model relates to a power module and an electric device, the power module comprises a bearing piece, a first chip and a second chip, the first chip is arranged on the bearing piece, one end of the first chip is used for being connected with a first electrode, and the other end of the first chip is used for being connected with an electric component; the second chip is arranged on the bearing piece, one end of the second chip is used for being connected with the second electrode, and the other end of the second chip is used for being connected with an electric component; wherein the first chip and the second chip are arranged at intervals in the thickness direction of the bearing part, and the orthographic projection of the first chip in the thickness direction is at least partially overlapped with the orthographic projection of the second chip. The power module and the electric device provided by the embodiment of the utility model can effectively reduce the stray inductance when the power module works, reduce the electromagnetic interference of the module structure, and improve the overall safety performance.

Description

Technical Field

[0001] The utility model relates to the technical field of automobiles, in particular to a power module and an electric device. Background Art

[0002] As a switching device in the power module circuit, the chip has the characteristic of high switching frequency. The high switching frequency will cause the current to change faster. The characteristic of inductance is to hinder the change of current. The faster the current changes, the stronger the hindering effect.

[0003] In traditional designs, the upper and lower bridge arms of the power module are located on the same plane, that is, the chips that control the circuit switches are all located on the same plane. At the same time, the commutation circuit inside the power module is located in a two-dimensional plane space. The magnetic flux formed by the commutation circuit cannot be effectively offset, and the resulting stray inductance is large.

[0004] Excessive stray inductance can lead to excessively high peak voltage differences between the two surfaces of the chip, resulting in longer and more intense voltage and current tail oscillations. Excessively high peak surface voltages affect the design margins of power modules and increase the risk of overvoltage breakdown. The tail oscillations increase electromagnetic interference and affect loss calculations. Utility Model Content

[0005] The embodiments of the present utility model provide a power module and an electrical device, which can effectively reduce stray inductance when the power module is working, reduce electromagnetic interference of the module structure, and improve overall safety performance.

[0006] On the one hand, according to an embodiment of the present invention, a power module is proposed, including a carrier, a first chip, and a second chip, the first chip being arranged on the carrier, one end of the first chip being used to connect to a first electrode and the other end being used to connect to an electrical component; the second chip being arranged on the carrier, one end of the second chip being used to connect to a second electrode and the other end being used to connect to the electrical component; wherein the first chip and the second chip are spaced apart in the thickness direction of the carrier, and the orthographic projection of the first chip in the thickness direction at least partially overlaps with the orthographic projection of the second chip.

[0007] According to one aspect of the embodiment of the present invention, the carrier includes a first carrier part and a second carrier part spaced apart in the thickness direction, the first chip is arranged on the first carrier part, and the second chip is arranged on a side of the second carrier part away from the first carrier part.

[0008] According to one aspect of an embodiment of the present utility model, the power module includes a first transfer layer, which is arranged on the first carrier portion and spaced apart from the first chip. The first chip and the second chip are respectively connected to the first transfer layer and connected to the electrical components through the first transfer layer.

[0009] According to one aspect of an embodiment of the present utility model, the supporting member includes a bending portion, the first supporting portion and the second supporting portion are connected by the bending portion, one end of the bending portion is connected to the first supporting portion and the other end is connected to the second supporting portion, so that the first supporting portion and the second supporting portion are spaced apart in the thickness direction.

[0010] According to one aspect of the embodiment of the present invention, the carrier includes a polyimide film substrate, and the first carrier portion, the second carrier portion, and the bending portion are integrally formed.

[0011] According to one aspect of an embodiment of the present utility model, the power module includes a first transfer layer, which is arranged on the side of the bending portion away from the first chip and the second chip. The first chip and the second chip are respectively connected to the first transfer layer and connected to the electrical components through the first transfer layer.

[0012] According to one aspect of the embodiments of the present invention, the power module includes a welding layer, and the first chip and the second chip are welded to the carrier through the welding layer.

[0013] According to one aspect of an embodiment of the present utility model, the power module includes a second transfer layer, which is arranged on the carrier, and the first chip and the second chip are welded to the carrier through the welding layer and the second transfer layer, and the second transfer layer is located between the welding layer and the carrier.

[0014] According to one aspect of an embodiment of the present utility model, the power module includes a heat sink, which is arranged between the first chip and the second chip and connected to the carrier. The heat sink includes a heat dissipation channel, in which a cooling medium is arranged. The cooling medium can flow in the heat dissipation channel to absorb the heat generated by the first chip and the second chip.

[0015] On the other hand, according to an embodiment of the present invention, there is provided an electrical device, comprising the power module as described above.

[0016] The embodiment of the utility model provides a power module and an electrical device. By arranging a first chip and a second chip on a carrier, the two are spaced apart in the thickness direction. When current passes through during operation, the current formed in the first chip and the second chip flows in opposite directions, so that the generated stray inductance can cancel each other in the thickness direction, thereby reducing the stray inductance formed by the power module as a whole, avoiding the obstruction of the inductance to the current and the electromagnetic interference generated, and having better safety performance. The core concept of reducing stray inductance in power module design is the mutual cancellation of magnetic fields. Using this principle, the stray inductance of two stacked chips with opposite current directions in the power module design is smaller than that of parallel chips. When the current directions are opposite, the magnetic flux generated by the upper and lower currents will cancel each other out, so the stray inductance will also be smaller. The more currents with opposite directions in the commutation circuit, the more magnetic fluxes that can be canceled out, and the smaller the stray inductance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The features, advantages and technical effects of exemplary embodiments of the present invention will be described below with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic plan view of a power module according to an embodiment of the present utility model;

[0019] Figure 2 yes Figure 1 AA section view in;

[0020] Figure 3 This is a structural diagram of the preparation process of a power module according to an embodiment of the present utility model;

[0021] Figure 4 yes Figure 3 BB cross-section in;

[0022] Figure 5 It is a plan view of another power module according to an embodiment of the present utility model;

[0023] Figure 6 yes Figure 5 CC cross-section in;

[0024] Figure 7 It is a structural schematic diagram of the heat dissipation component of an embodiment of the present utility model.

[0025] Reference numerals:

[0026] 10-carrier; 20-first chip; 30-second chip; Z-thickness direction;

[0027] 11-first bearing portion; 12-second bearing portion; 13-bending portion;

[0028] 40 - first transfer layer; 50 - welding layer; 60 - second transfer layer; 70 - heat sink; 71 - heat dissipation channel.

[0029] In the drawings, like parts are given like reference numerals, but the drawings are not necessarily drawn to scale. DETAILED DESCRIPTION

[0030] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the detailed description that follows, many specific details are presented in order to provide a comprehensive understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention. In the accompanying drawings and the following description, at least some of the well-known structures and technologies are not shown in order to avoid unnecessary ambiguity in the present invention; and, for clarity, the sizes of some structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0031] The directional words that appear in the following description refer to the directions shown in the figures and do not limit the specific structure of the power module and electrical device of the present invention. In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection. For those skilled in the art, the specific meaning of the above terms in the present invention can be understood according to the specific circumstances.

[0032] In order to better understand the present invention, Figures 1 to 7 The power module and the electrical device of the embodiments of the present utility model are described in detail.

[0033] See also Figure 1 and Figure 2 According to an embodiment of the present invention, a power module is proposed, including a carrier 10, a first chip 20 and a second chip 30. The first chip 20 is arranged on the carrier 10, one end of the first chip 20 is used to connect to the first electrode and the other end is used to connect to the electrical component; the second chip 30 is arranged on the carrier 10, one end of the second chip 30 is used to connect to the second electrode and the other end is used to connect to the electrical component; wherein the first chip 20 and the second chip 30 are spaced apart in the thickness direction Z of the carrier 10, and the orthographic projection of the first chip 20 in the thickness direction Z at least partially overlaps with the orthographic projection of the second chip 30.

[0034] Optionally, the first chip 20 and the second chip 30 can be power chips that can control the on and off of the circuit, wherein the first electrode can be the positive electrode of the power supply and the second electrode can be the negative electrode, so that the first chip 20 can be used to control the positive voltage and the second chip 30 can be used to control the negative voltage.

[0035] The power supply needs to be connected to the power module in the present invention, and the power module is then connected to the electrical components, so that the direct current generated by the power supply can be converted into alternating current through the power module and output to the electrical components. The power module mainly plays the role of converting direct current into alternating current.

[0036] Specifically, only one of the first and second chips 20, 30 needs to be turned on; turning both on simultaneously will result in a short circuit. When the first chip 20 is turned on and the second chip 30 is turned off, the current from the first electrode of the power supply passes through the first chip 20 and enters the power-consuming components, and is then directed back to the second electrode of the power supply by other leads, thus forming a current loop. At this point, the second chip 30 is in an off-circuit state, and the current can be understood as flowing in the first direction.

[0037] When the first chip 20 is disconnected and the second chip 30 is turned on, current will flow back to the second electrode of the power supply through the second chip 30. The first chip 20 is in an off-circuit state, and the current flows in the second direction in the loop, which is opposite to the previous current flow in the first direction, thereby changing the direction of current flow and converting direct current into alternating current to supply electrical components. Optionally, the electrical components can be components such as alternating current coils.

[0038] In this embodiment, the first chip 20 and the second chip 30 are stacked along the thickness direction Z, so that after the first chip 20 and the second chip 30 are respectively turned on, the reverse currents formed by each are spaced in the thickness direction Z, and the magnetic fields around the currents overlap in the physical space in the thickness direction Z. The mutual cancellation of the magnetic fields is used to further optimize the stray inductance inside the power module, so that part of the stray inductance is reduced after the cancellation, which is beneficial to reduce electromagnetic interference.

[0039] Optionally, the orthographic projections of the first chip 20 and the second chip 30 in the thickness direction Z can overlap with each other, that is, the first chip 20 and the second chip 30 can be symmetrically arranged in the thickness direction Z, so that the stray inductance generated at the two can be offset to the greatest extent, thereby having a better effect of eliminating inductance. Of course, the first chip 20 and the second chip 30 can also be appropriately staggered according to actual conditions, and the present invention is not limited to this.

[0040] The present invention arranges the first chip 20 and the second chip 30 on a carrier 10 respectively. The carrier 10 can be made of a variety of materials and structural forms to ensure that the first chip 20 and the second chip 30 are spaced apart in the thickness direction Z. Optionally, the first chip 20 and the second chip 30 can be connected to the carrier 10 by welding. The present invention does not specifically limit the specific connection method.

[0041] The embodiment of the present utility model provides a power module, which is provided with a first chip 20 and a second chip 30 on a carrier 10 so that the two are spaced apart in the thickness direction Z. When current passes through during operation, the currents formed in the first chip 20 and the second chip 30 flow in opposite directions, so that the generated stray inductances can cancel each other out in the thickness direction Z, thereby reducing the stray inductance formed by the power module as a whole, avoiding the obstruction of the current by the inductance and the electromagnetic interference generated, and having better safety performance. The core concept of reducing stray inductance in power module design is the mutual cancellation of magnetic fields. Using this principle, the stray inductance of two stacked chips with opposite current directions in the power module design is smaller than that of parallel chips. When the current directions are opposite, the magnetic flux generated by the upper and lower currents will cancel each other out, so the stray inductance is also smaller. The more the number of currents with opposite directions in the commutation circuit, the more magnetic fluxes that can be canceled out, and the smaller the stray inductance.

[0042] As an alternative embodiment, see Figure 2 The carrier 10 includes a first carrier portion 11 and a second carrier portion 12 spaced apart in the thickness direction Z. The first chip 20 is disposed on the first carrier portion 11 , and the second chip 30 is disposed on a side of the second carrier portion 12 away from the first carrier portion 11 .

[0043] Optionally, the carrier 10 can be divided into a first carrier part 11 and a second carrier part 12, and the first chip 20 and the second chip 30 are respectively arranged on the first carrier part 11 and the second carrier part 12. The first carrier part 11 and the second carrier part 12 mainly play a supporting role for the chips, and insulating materials need to be used to avoid causing current short circuit.

[0044] Optionally, the first carrier part 11 and the second carrier part 12 can respectively adopt a plate-like structure, and the chips are respectively welded to the first carrier part 11 and the second carrier part 12, the first chip 20 is welded to the top surface of the first carrier part 11, and the second chip 30 is welded to the bottom surface of the second carrier part 12. The carrier parts are also connected by welding to form a module as a whole.

[0045] Alternatively, the first carrier portion 11 and the second carrier portion 12 can utilize DBC or AMB ceramic substrates, commonly found in conventional packaging. DBC or AMB ceramic substrates are not bendable, so the first chip 20 and the second chip 30 must be soldered to two separate ceramic substrates. The first step in the packaging process involves soldering the chips to the two separate ceramic substrates to achieve a connection between the chips and the ceramic substrates.

[0046] An embodiment of the present invention provides a power module, which realizes the stacking arrangement of the first chip 20 and the second chip 30 in the thickness direction Z by respectively arranging the chips on the first carrier part 11 and the second carrier part 12, simplifies the process molding steps, and is conducive to completing the molding of the module.

[0047] As an alternative embodiment, see Figure 2 The power module includes a first transfer layer 40, which is arranged on the first carrier portion 11 and spaced apart from the first chip 20. The first chip 20 and the second chip 30 are respectively connected to the first transfer layer 40 and connected to the electrical components through the first transfer layer 40.

[0048] Optionally, the first transfer layer 40 can be a conductive material such as metal copper. The first transfer layer 40 is covered on the top surface of the first carrier part 11. The purpose is to connect the first chip 20 and the second chip 30 to the first transfer layer 40 respectively, and then connect them to external electrical components through the first transfer layer 40. The first transfer layer 40 plays the role of transfer conduction.

[0049] The connection method between each other can be to use connecting wires, or to choose to weld a copper busbar as the output end, or to weld a flexible circuit board or bond copper wires. The present invention does not specifically limit the electrical connection method between components, and the connection method in the figure is only a schematic diagram.

[0050] An embodiment of the present utility model provides a power module, which realizes the connection between the chip and the external electrical components by covering the first transfer layer 40 on the surface of the first carrier part 11 and forming an electrical connection with the first chip 20 and the second chip 30, which is conducive to completing the conversion process of direct current to alternating current.

[0051] As an alternative embodiment, see Figures 3 to 6 The carrier 10 includes a bending portion 13, the first carrier portion 11 and the second carrier portion 12 are connected by the bending portion 13, one end of the bending portion 13 is connected to the first carrier portion 11 and the other end is connected to the second carrier portion 12, so that the first carrier portion 11 and the second carrier portion 12 are spaced apart in the thickness direction Z.

[0052] In order to form a stable spacing arrangement between the first carrier part 11 and the second carrier part 12 in the thickness direction Z, in this embodiment, the first carrier part 11 and the second carrier part 12 are connected by a bending part 13. The bending arrangement of the bending part 13 in the thickness direction Z realizes the connection between the first carrier part 11 and the second carrier part 12 in the thickness direction Z, further ensuring the spacing between the first chip 20 and the second chip 30 in the thickness direction Z. Optionally, the bending part 13 can adopt an arc structure.

[0053] Optionally, the carrier 10 includes a polyimide film substrate, and the first carrier portion 11 , the second carrier portion 12 and the bending portion 13 are integrally formed.

[0054] See also Figure 3 and Figure 4 Specifically, the first chip 20 and the second chip 30 are first welded at intervals on a flatly spread polyimide substrate. Since the polyimide film substrate has a bending property, the polyimide film substrate is then bent along the thickness direction Z. The bent portion forms a bending portion 13, and the first and second ends of the substrate respectively form a first bearing portion 11 and a second bearing portion 12, which are arranged opposite to each other in the thickness direction Z, thereby driving the first chip 20 and the second chip 30 to be stacked in the thickness direction Z, and then the outer shell of the module is assembled, ultimately achieving the design purpose.

[0055] In the above-mentioned packaging process, the connecting wires connected to external electrical components or the positive and negative poles of the power supply can use one or more materials such as bonding wires, copper clips, flexible circuit boards, etc. according to different needs. Different materials correspond to different processes. For example, the process corresponding to the bonding wire is ultrasonic bonding, while the copper clips and flexible circuit boards use a welding process. The complexity and diversity of the connection process requires that the connection of the connecting wires be added in different processes according to the process characteristics.

[0056] An embodiment of the present utility model provides a power module. By setting the carrier 10 as a polyimide film substrate structure, on the basis of ensuring that the carrier 10 has insulating properties, its bendable flexibility is utilized to facilitate the spatial separation and stacking of the first carrier part 11 and the second carrier part 12 in the thickness direction Z. By introducing new packaging materials, a new packaging method is designed to provide a low stray inductance power module packaging method based on stacking technology, while reducing the welding process and lowering the production cost.

[0057] As an alternative embodiment, see Figure 5 and Figure 6 The power module includes a first transfer layer 40, which is arranged on the side of the bending portion 13 away from the first chip 20 and the second chip 30. The first chip 20 and the second chip 30 are respectively connected to the first transfer layer 40 and connected to the electrical components through the first transfer layer 40.

[0058] In this embodiment, the first transfer layer 40 is also provided to realize the transfer between the first chip 20 and the second chip 30 and the electrical components. In this embodiment, the first transfer layer 40 is provided on the bending portion 13 of the carrier 10 and is located on the same surface of the carrier 10 as the first chip 20 and the second chip 30.

[0059] Optionally, the first transfer layer 40 in this embodiment can also be a conductive material such as metal copper. The first transfer layer 40 is covered on the surface of the bending portion 13. The purpose is to connect the first chip 20 and the second chip 30 to the first transfer layer 40 respectively, and then connect them to external electrical components through the first transfer layer 40. The first transfer layer 40 plays the role of transfer conduction.

[0060] The connection method between each other can be to use connecting wires, or to choose to weld a copper busbar as the output end, or to weld a flexible circuit board or bond copper wires. The present invention does not specifically limit the electrical connection method between components, and the connection method in the figure is only a schematic diagram.

[0061] During the molding process, when the first chip 20 and the second chip 30 are welded at intervals on the carrier 10 of the flat polyimide film substrate, the first transfer layer 40 is arranged between the two chips. After the carrier 10 is bent along the thickness direction Z, the first chip 20 is located at the first carrier part 11, the second chip 30 is located at the second carrier part 12 opposite in the thickness direction Z, and the first transfer layer 40 between the two is just located on the bending part 13.

[0062] An embodiment of the present invention provides a power module, which realizes the connection between the chip and external electrical components by covering the first switching layer 40 on the surface of the bending portion 13 and forming an electrical connection with the first chip 20 and the second chip 30, which is conducive to completing the conversion process of direct current to alternating current.

[0063] As an optional embodiment, the power module includes a welding layer 50 , and the first chip 20 and the second chip 30 are welded to the carrier 10 through the welding layer 50 .

[0064] When the first chip 20 and the second chip 30 are respectively soldered to the carrier 10, a connection is formed between the chip and the carrier 10 via the soldering layer 50. For example, the connection between the chip and the carrier 10 can be achieved by soldering. Alternatively, other connection methods such as silver sintering can be used to connect the layers.

[0065] The embodiment of the present invention provides a power module, which realizes welding of the chip and the carrier 10 by utilizing the welding layer 50, provides a stable connection method, realizes a fixed connection between each other, improves the stability of the overall structure, and facilitates the completion of the process molding.

[0066] As an optional embodiment, the power module includes a second transfer layer 60, which is arranged on the carrier 10. The first chip 20 and the second chip 30 are welded to the carrier 10 through the welding layer 50 and the second transfer layer 60. The second transfer layer 60 is located between the welding layer 50 and the carrier 10.

[0067] Optionally, the second transfer layer 60 can be a metal copper layer. The purpose of setting the second transfer layer 60 on the carrier 10 in this embodiment is to take into account that in the process of welding the chip to the carrier 10, the carrier 10 may not have direct weldability, such as a polyimide film substrate. Therefore, by setting the second transfer layer 60 on the carrier 10, reliable welding can be formed with the chip, providing welding points with the chip.

[0068] The second transfer layer 60 in this embodiment not only needs to meet the welding requirements with the chip, but also needs to ensure its own electrical conductivity, so that it can be connected to an external power supply using a connecting wire, which is conducive to completing the conduction of current.

[0069] After welding is completed, the carrier 10 is sequentially stacked with a second transfer layer 60 , a welding layer 50 and a chip layer, and a connection line connected to the outside can be connected to the second transfer layer 60 to form conduction.

[0070] An embodiment of the present invention provides a power module, which provides a basis for welding the chip and the carrier 10 by setting a second transfer layer 60 on the carrier 10, ensuring that the chip can form a stable connection with the carrier 10, so that the carrier 10 has better connection characteristics.

[0071] As an alternative embodiment, see Figure 6 and Figure 7 The power module includes a heat sink 70, which is arranged between the first chip 20 and the second chip 30 and connected to the carrier 10. The heat sink 70 includes a heat dissipation channel 71. A cooling medium is provided in the heat dissipation channel 71. The cooling medium can flow in the heat dissipation channel 71 to absorb the heat generated by the first chip 20 and the second chip 30.

[0072] Considering that the first chip 20 and the second chip 30 will generate a lot of heat during operation, in order to ensure the thermal environment of the entire structure, in this embodiment, a heat sink 70 is set between the first chip 20 and the second chip 30 to absorb the surrounding heat, thereby realizing the liquid cooling process.

[0073] Optionally, the heat sink 70 can be connected to the carrier 10 by welding. When the carrier 10 is bent as a whole, the heat sink 70 can be connected between the first carrier part 11 and the second carrier part 12. The heat sink 70 can also be welded to the carrier 10 through the welding layer 50 and the second transfer layer 60. At this time, the top and bottom surfaces of the carrier 10 are covered with copper layers.

[0074] In order to meet the requirements of double-sided welding, the two sides of the heat sink 70 connected to the carrier 10 need to be flat, and the heat dissipation channel 71 should be located inside the heat sink 70. Therefore, the heat sink 70 cannot be manufactured by traditional casting or subtractive manufacturing. The heat sink 70 can be manufactured by stamping technology.

[0075] Alternatively, the heat sink 70 may be formed by extrusion, welding, or a combination of these processes. The heat dissipation channel 71 of the heat sink 70 contains a cooling medium, and the water inlet and outlet therein may be integrally formed with the heat sink 70 body. Optionally, the water inlet and outlet may be subsequently welded to the heat sink 70 by methods such as friction stir welding.

[0076] Optionally, the heat sink 70 needs to be solderable, so the metal on the surface must be able to connect to the solder layer 50. Therefore, the heat sink 70 needs to be made of copper or other materials that can be connected to solder. Optionally, if the main material of the heat sink 70 is not able to connect to solder, it is necessary to add a special coating to the heat sink 70 to make it connectable to solder, such as spraying copper, electroplating, or chemically plating a metal that can connect to the solder layer 50 on the heat sink 70.

[0077] When the heat sink 70 is connected between the first chip 20 and the second chip 30, the cooling medium therein flows in the heat dissipation channel 71, thereby being able to exchange heat with the chips and take away the heat generated by the chips. After the cooling medium flows out of the heat sink 70, the heat is released, and finally a circulation of the cooling medium is formed to continuously dissipate heat between the two chips.

[0078] Optionally, after the electrical connections are made inside the power module, a housing needs to be added to the module. In the present invention, a plastic encapsulation method can be used to encapsulate the entire module using an injection molding machine. Epoxy resin potting can also be used instead of injection molding.

[0079] An embodiment of the present utility model provides a power module. By arranging a heat sink 70 on a carrier 10 between a first chip 20 and a second chip 30, synchronous heat dissipation of the chips during operation is achieved, a reliable thermal environment is provided for the current loop, failure problems caused by excessive temperature of the entire structure are avoided, and the overall safety performance of the module is improved.

[0080] According to an embodiment of the present invention, an electrical device is provided, comprising the power module described above.

[0081] The power module provided by the present invention can be applied to various fields requiring alternating current, such as automobiles, but the present invention is not limited thereto.

[0082] The embodiment of the present utility model provides a power module and an electrical device. By arranging a first chip and a second chip on a carrier so that the two are spaced apart in the thickness direction, when current passes through during operation, the currents formed in the first chip and the second chip flow in opposite directions, so that the generated stray inductances can cancel each other out in the thickness direction, thereby reducing the stray inductance formed by the power module as a whole, avoiding the obstruction of the current by the inductance and the electromagnetic interference generated, and having better safety performance. The core concept of reducing stray inductance in power module design is the mutual cancellation of magnetic fields. Using this principle, the stray inductance of two stacked chips with opposite current directions in the power module design is smaller than that of parallel chips. When the current directions are opposite, the magnetic flux generated by the upper and lower currents will cancel each other out, so the stray inductance will also be smaller. The more currents with opposite directions in the commutation circuit, the more magnetic fluxes that can be canceled out, and the smaller the stray inductance.

[0083] While the present invention has been described with reference to preferred embodiments, various modifications may be made and equivalent components may be substituted without departing from the scope of the present invention. In particular, the various technical features described in the various embodiments may be combined in any manner, provided no structural conflicts exist. The present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.

Claims

1. A power module, characterized in that: include: bearing members; A first chip is disposed on the carrier, wherein one end of the first chip is used to connect to the first electrode and the other end of the first chip is used to connect to the electrical component; a second chip disposed on the carrier, wherein one end of the second chip is used to connect to the second electrode and the other end of the second chip is used to connect to the electrical component; The first chip and the second chip are spaced apart in the thickness direction of the carrier, and the orthographic projection of the first chip in the thickness direction at least partially overlaps with the orthographic projection of the second chip.

2. The power module according to claim 1, wherein: The carrier includes a first carrier portion and a second carrier portion spaced apart in the thickness direction. The first chip is disposed on the first carrier portion, and the second chip is disposed on a side of the second carrier portion away from the first carrier portion.

3. The power module according to claim 2, wherein: The power module includes a first transfer layer, which is arranged on the first carrier and spaced apart from the first chip. The first chip and the second chip are respectively connected to the first transfer layer and connected to the electrical components through the first transfer layer.

4. The power module according to claim 2, wherein: The supporting member includes a bending portion, and the first supporting portion and the second supporting portion are connected by the bending portion. One end of the bending portion is connected to the first supporting portion and the other end is connected to the second supporting portion, so that the first supporting portion and the second supporting portion are spaced apart in the thickness direction.

5. The power module according to claim 4, characterized in that: The carrier includes a polyimide film substrate, and the first carrier portion, the second carrier portion, and the bending portion are integrally formed.

6. The power module according to claim 4, characterized in that: The power module includes a first transfer layer, which is arranged on a side of the bending portion away from the first chip and the second chip. The first chip and the second chip are respectively connected to the first transfer layer and connected to the electrical components through the first transfer layer.

7. The power module according to claim 1, wherein: The power module includes a welding layer, and the first chip and the second chip are welded to the carrier through the welding layer.

8. The power module according to claim 7, characterized in that: The power module includes a second transfer layer, which is arranged on the carrier. The first chip and the second chip are welded to the carrier through the welding layer and the second transfer layer. The second transfer layer is located between the welding layer and the carrier.

9. The power module according to claim 1, wherein: The power module includes a heat sink, which is arranged between the first chip and the second chip and connected to the carrier. The heat sink includes a heat dissipation channel, in which a cooling medium is arranged. The cooling medium can flow in the heat dissipation channel to absorb heat generated by the first chip and the second chip.

10. An electrical device, characterized in that: The method comprises the power module according to any one of claims 1 to 9.

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