Unidirectional microphone adopting plate spring design damping plate structure

Abstract

The utility model relates to the field of microphones, and relates to a unidirectional microphone adopting a plate spring design damping plate structure, the structure of the unidirectional microphone mainly breaks through the conventional design that a plastic ring, a nickel ring, a back polar plate and a damping plate are in mechanical overhard fit, and the plate spring design damping plate is adopted to replace the conventional damping plate; the damping plate of the plate spring structure is used for buffering and dispersing pressure from the high nickel ring and the PCBA plate from top to bottom, distance adjustment of a certain amplitude can be achieved, and the defect that the size is too hard to match can be effectively overcome. The damping plate of the plate spring structure is adopted, cost can be well reduced, efficiency can be well improved for manufacturers, and the product quality is more reliable; for consumers, the shelf life of the product is longer, and the bearing capacity to the external environment is high.

Description

Technical Field

[0001] The utility model relates to the field of microphones, in particular to a unidirectional microphone with a damping plate structure designed with a leaf spring. Background Art

[0002] The current industry standard is to place a nickel ring on the backplate to prevent shorting, a damping plate placed on top, and then a nickel ring, all assembled within a plastic ring. This conventional plastic ring, nickel ring, backplate, and damping plate are mechanically rigidly fitted together. During product edge sealing, the entire circuit assembly is tightly pressed against the diaphragm and gasket. Excessive pressure can even cause the backplate to tilt and the diaphragm to be squeezed by excessive pressure. Most manufacturers in the industry use circuit assembly with a rigid dimensional fit. Undersizing results in loose components, while oversizing can make assembly difficult or inefficient. Utility Model Content

[0003] The purpose of the utility model is achieved through the following technical measures: a unidirectional microphone with a leaf spring damping plate structure, characterized in that: it includes a shell, in which a back pole membrane, a gasket, a back pole plate, a short nickel ring, a leaf spring structure damping plate, a high nickel ring, a PCBA board and a plastic ring are installed in sequence, the back pole membrane and the PCBA board are respectively fixedly mounted at the two ends inside the shell, and the back pole membrane and the PCBA board are both provided with sound inlet holes, the back pole plate, the short nickel ring and the leaf spring structure damping plate are arranged in the plastic ring, the end of the high nickel ring close to the leaf spring structure damping plate is located inside the plastic ring, and the end of the high nickel ring away from the leaf spring structure damping plate is located outside the plastic ring, the leaf spring structure damping plate includes a substrate and a leaf spring, the leaf spring is fixedly mounted on the substrate, four leaf springs are provided, the four leaf springs are equidistantly fixedly connected to the edge of the substrate, and a through hole is provided at the center of the substrate.

[0004] As a preferred solution: the sound inlet hole opened on the back pole membrane 2 is a 0° sound inlet hole, the sound inlet hole opened on the PCBA board is a 180° sound inlet hole, and the thickness of the gasket is 30um.

[0005] As a preferred solution: the leaf spring structure damping plate is assembled between the short nickel ring and the high nickel ring and is assembled together with the back plate in the plastic ring to form one pole of the parallel plate capacitor; the back plate membrane serves as the other pole of the parallel plate capacitor, and the gasket is arranged between the two poles to provide space for the diaphragm to vibrate.

[0006] As a preferred solution: the leaf spring is used to buffer and disperse the pressure from the high nickel ring and the PCBA board from top to bottom, and can achieve a certain range of distance adjustment.

[0007] As a preferred solution: the base plate and the leaf spring are integrated.

[0008] As a preferred solution: the substrate and leaf spring are made of copper material, which has good elasticity and conductivity, and can transmit analog electrical signals to the chip, facilitating subsequent signal processing and output.

[0009] Due to the adoption of the above technical solution, compared with the prior art, the advantages of the present invention are:

[0010] The structure of this application mainly breaks the design of mechanically rigid fit between conventional plastic ring, nickel ring, back plate and damping plate, and adopts leaf spring design damping plate to replace the previous damping plate; the leaf spring structure damping plate is used to buffer and disperse the pressure from the high nickel ring and PCBA board from top to bottom, and can achieve a certain range of distance adjustment, which can effectively avoid the disadvantages of rigid dimensional fit.

[0011] 1. The leaf spring structure damping plate can achieve a certain range of pressure adjustment, making the sound transmission path inside the product smoother;

[0012] 2. The leaf spring structure damping plate can reduce the pressure on the back plate and back film, and the parallelism of the two poles of the parallel plate capacitor is stronger.

[0013] 3. The first-time production yield of products using this structure will be about 5% to 10% higher than that of products with conventional damping plates, effectively improving the overall yield and thus reducing production costs.

[0014] 4. The reliability test of the product using this structure has a small change range before and after the test, which is 0.5-1.0dB smaller than the change range before and after the reliability test of the current single-point product on the market.

[0015] 5. The leaf spring structure damping plate can, to a certain extent, reduce the impact of sudden external impact on product performance.

[0016] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Attachment Figure 1 It is a sectional view of the overall structure of the utility model.

[0018] Attachment Figure 2 It is a schematic diagram of the base plate and leaf spring structure of the utility model.

[0019] Attachment Figure 3 It is a schematic diagram of the working principle of the utility model. DETAILED DESCRIPTION

[0020] Example: As shown in the attached Figure 1 and attached Figure 2As shown, a unidirectional microphone with a leaf spring damping plate structure includes a housing 1, in which a back pole film 2, a gasket 3, a back pole plate 4, a short nickel ring 5, a leaf spring damping plate 6, a high nickel ring 7, a PCBA board 8 and a plastic ring 9 are sequentially installed. The back pole film 2 and the PCBA board 8 are respectively fixedly mounted at both ends of the interior of the housing 1. The back pole film 2 and the PCBA board 8 are both provided with sound inlet holes. The back pole plate 4, the short nickel ring 5 and the leaf spring damping plate 6 are arranged In the plastic ring 9, one end of the high nickel ring 7 close to the leaf spring structure damping plate 6 is located inside the plastic ring 9, and the end of the high nickel ring 7 away from the leaf spring structure damping plate 6 is located outside the plastic ring 9. The leaf spring structure damping plate 6 includes a substrate 61 and a leaf spring 62. The leaf spring 62 is fixedly installed on the substrate 61. Four leaf springs 62 are provided, and the four leaf springs 62 are equidistantly fixedly connected to the edge of the substrate 61. A through hole is opened at the center of the substrate 61, and a damping film is installed at the through hole.

[0021] The sound inlet hole opened on the back pole membrane 2 is a 0° sound inlet hole, the sound inlet hole opened on the PCBA board 8 is a 180° sound inlet hole, the thickness of the gasket 3 is 30um, and the gasket 3 is arranged in a ring shape.

[0022] The leaf spring structure damping plate 6 is assembled between the short nickel ring 5 and the high nickel ring 7 and is assembled together with the back plate 4 in the plastic ring 9 to form one pole of the parallel plate capacitor; the back plate membrane 2 serves as the other pole of the parallel plate capacitor, and the gasket 3 is arranged between the two poles to provide space for the diaphragm to vibrate.

[0023] The leaf spring 62 is used to buffer and disperse the pressure from the high nickel ring 7 and the PCBA board 8 from top to bottom, and can achieve a certain range of distance adjustment.

[0024] The base plate 61 and the leaf spring 62 are integrated.

[0025] The substrate 61 and the leaf spring 62 are made of copper material, which has good elasticity and conductivity, and can transmit analog electrical signals to the chip, facilitating subsequent signal processing and output.

[0026] As attached Figure 3 As shown, the sound source is at 180°: signal P, the first path P1 faces the 180° sound inlet, passes through the cavity, the damping mesh, the plate hole, and reaches the diaphragm. At this point, P1 is weakened by distance damping and delay. The second path P2, after a certain distance and delay, reaches the 0° sound inlet and reaches the diaphragm. The weakened P1 is almost close to the weakened P2. The diaphragm is subjected to the same sound pressure on both sides, and the sensitivity is the lowest at this time.

[0027] When the sound source is at 0°, the first path of signal P, P1, faces the 0° sound inlet, with the shortest distance affecting the diaphragm. The second path, P2, travels a certain distance and delay to reach the 180° sound inlet, then passes through the cavity, the damping mesh, and the plate holes before reaching the diaphragm. At this point, the diaphragm's movement is primarily driven by P1, as P1's energy is much greater than P2's. Therefore, 0° is the most sensitive.

[0028] The advantages of this application are:

[0029] 1. The leaf spring structure damping plate 6 can achieve a certain range of pressure adjustment, making the sound transmission path inside the product smoother;

[0030] 2. The leaf spring structure damping plate 6 can reduce the pressure on the back plate and the back film, and the parallelism of the two poles of the parallel plate capacitor is stronger.

[0031] 3. The first-time production yield of products using this structure will be about 5% to 10% higher than that of products with conventional damping plates, effectively improving the overall yield and thus reducing production costs.

[0032] 4. The reliability test of the product using this structure has a small change range before and after the test, which is 0.5-1.0dB smaller than the change range before and after the reliability test of the current single-point product on the market.

[0033] 5. The leaf spring structure damping plate can, to a certain extent, reduce the impact of sudden external impact on product performance.

[0034] The leaf spring structure damping plate 6 is used to buffer and disperse the pressure from the high nickel ring and the PCBA board from top to bottom, which can achieve a certain range of distance adjustment and effectively avoid the disadvantages of too rigid dimensional fit.

[0035] The use of the leaf spring structure damping plate 6 can greatly reduce costs and increase efficiency for manufacturers, and the product quality is more reliable; for consumers, the product shelf life is longer and the product has a stronger ability to withstand the external environment.

Claims

1. A unidirectional microphone using a leaf spring damping plate structure, characterized by: The invention comprises a shell (1), wherein a back electrode membrane (2), a gasket (3), a back electrode plate (4), a short nickel ring (5), a leaf spring structure damping plate (6), a high nickel ring (7), a PCBA board (8) and a plastic ring (9) are sequentially installed in the shell (1), wherein the back electrode membrane (2) and the PCBA board (8) are respectively fixedly installed at two ends inside the shell (1), and the back electrode membrane (2) and the PCBA board (8) are both provided with a sound inlet hole, and the back electrode plate (4), the short nickel ring (5) and the leaf spring structure damping plate (6) are arranged on the plastic ring (9). The end of the high nickel ring (7) close to the leaf spring structure damping plate (6) is located inside the plastic ring (9), and the end of the high nickel ring (7) away from the leaf spring structure damping plate (6) is located outside the plastic ring (9). The leaf spring structure damping plate (6) includes a base plate (61) and a leaf spring (62). The leaf spring (62) is fixedly mounted on the base plate (61). Four leaf springs (62) are provided. The four leaf springs (62) are fixedly connected to the edge of the base plate (61) at equal distances. A through hole is opened at the center of the base plate (61).

2. The unidirectional microphone with a leaf spring damping plate structure according to claim 1, characterized in that: The sound inlet hole opened on the back pole membrane (2) is a 0° sound inlet hole, the sound inlet hole opened on the PCBA board (8) is a 180° sound inlet hole, and the thickness of the gasket (3) is 30 μm.

3. The unidirectional microphone with a leaf spring damping plate structure according to claim 2, characterized in that: The leaf spring structure damping plate (6) is assembled between the short nickel ring (5) and the high nickel ring (7) and is assembled together with the back plate (4) in the plastic ring (9) to form one pole of the parallel plate capacitor; the back plate membrane (2) serves as the other pole of the parallel plate capacitor, and the gasket (3) is arranged between the two poles to provide space for the membrane to vibrate.

4. The unidirectional microphone with a leaf spring damping plate structure according to claim 3, characterized in that: The leaf spring (62) is used to buffer and disperse the pressure from the high nickel ring (7) and the PCBA board (8) from top to bottom, and can achieve a certain range of distance adjustment.

5. The unidirectional microphone with a leaf spring damping plate structure according to claim 3, characterized in that: The base plate (61) and the leaf spring (62) are integrally arranged.

6. A unidirectional microphone with a leaf spring damping plate structure according to any one of claims 1 to 5, characterized in that: The substrate (61) and the leaf spring (62) are made of copper material, which has good elasticity and conductivity and can transmit analog electrical signals to the chip, facilitating subsequent signal processing and output.

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