Liquid cooling heat dissipation device

Abstract

The utility model provides a liquid cooling heat dissipation device, which comprises a substrate, a first end cover and a second end cover, the substrate is provided with a heat exchange surface, the heat exchange surface is used for abutting against a part to be cooled, the substrate comprises a first end part and a second end part which correspond to each other, and a plurality of heat dissipation channels for guiding cooling liquid are arranged in the substrate. Each heat dissipation channel penetrates from the first end part to the second end part, the first end cover is detachably connected with the first end part, the second end cover is detachably connected with the second end part, and a first cavity for communicating the two heat dissipation channels is formed between the first end cover and the first end part; and a second cavity for conducting the two heat dissipation channels is formed between the second end cover and the second end part. Through the arrangement, a plurality of heat dissipation channels in the substrate can be communicated with one another, and compared with the prior art, assembly is faster, and the substrate is not prone to damage after being used for a long time.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a liquid cooling heat dissipation device. Background Art

[0002] A servo drive is a controller used to control a servo motor. Its function is similar to that of a frequency converter on an ordinary AC motor. It is part of a servo system and is mainly used in high-precision positioning systems. It generates a lot of heat when working.

[0003] In the prior art, liquid-cooled flat radiators are used to cool servo drives. For example, Chinese utility model patent No. CN220586697 U discloses a heat sink and heat dissipation device. The heat sink comprises: a base plate having a heat exchange surface for contacting a heat dissipation device; a plurality of heat dissipation channels extending through the base plate in a first direction perpendicular to the normal of the heat exchange surface for conducting cooling medium; and a connection assembly for removably connecting to some or all of the heat dissipation channels to interconnect some or all of the heat dissipation channels. The connection assembly comprises a plurality of quick connectors and a plurality of connecting tubes. A quick connector is removably connected to one end of a heat dissipation channel, and two ends of a connecting tube are used for removably connecting two quick connectors. The connecting tube is a flexible conduit. The heat dissipation channels are spaced apart along a second direction perpendicular to the first direction. The heat dissipation channels also have a mounting surface protruding from the base plate, the mounting surface being disposed opposite the heat exchange surface. A groove is formed between any two adjacent heat dissipation channels. The base plate is also provided with a plurality of first mounting holes for securing the heat sink. The heat sink device comprises a heat exchanger and the heat sink; the heat exchanger is connected to a connection assembly and is used to supply cooling medium to the heat dissipation channel. The heat sink and heat sink device described in this utility model can be used to dissipate heat and cool a servo drive. However, both ends of the heat sink base plate are connected to pipes one by one via quick connectors, making this assembly method inefficient.

[0004] Therefore, in view of the above defects, the existing technology still needs to be improved and developed. Utility Model Content

[0005] The purpose of the present invention is to provide a liquid cooling device that is easy to assemble in order to address the defects and shortcomings of the prior art.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0007] The utility model provides a liquid-cooled heat dissipation device, including a substrate, a first end cover and a second end cover, wherein a heat exchange surface is provided on the substrate, and the heat exchange surface is used to abut against a heat dissipation component, the substrate includes a first end and a second end corresponding to each other, and a plurality of heat dissipation channels for guiding the cooling liquid are provided inside the substrate, and each of the heat dissipation channels runs from the first end to the second end. It should be noted here that the heat dissipation channels can be arranged according to product needs and the structure of the heat dissipation channels. The heat dissipation channels can be arranged parallel to each other, and the adjacent heat dissipation channels can be connected first, or the separated heat dissipation channels can be connected first. The heat dissipation channels can be straight channels or wavy channels. As long as multiple heat dissipation channels are connected, the circulation of the cooling liquid can be realized, and their connected ends are located at the first end or the second end of the substrate,

[0008] The first end cap is detachably connected to the first end portion, and the second end cap is detachably connected to the second end portion. A first cavity for conducting the two heat dissipation channels is formed between the first end cap and the first end portion, and a second cavity for conducting the two heat dissipation channels is formed between the second end cap and the second end portion. During assembly, the present invention can be assembled by aligning and securing the first end cap with the first end portion of the substrate, and aligning and securing the second end cap with the second end portion of the substrate, thereby interconnecting the multiple heat dissipation channels within the substrate. This arrangement allows for faster assembly than with existing technologies and is less susceptible to damage over extended use.

[0009] According to the above solution, the present invention further includes a heat exchanger for supplying and discharging coolant to the heat dissipation channels. Each of the heat dissipation channels includes at least one liquid inlet and at least one liquid outlet connected to the heat exchanger. With this structural arrangement, the heat exchanger can supply coolant to the heat dissipation channels and discharge the heated coolant out of the channels, thereby achieving a heat dissipation and temperature reduction effect.

[0010] According to the above solution, a first slot is formed in the first end portion of the substrate, the first slot communicating with the two heat dissipation channels. The first end cap seals the opening of the first slot, and the first slot and the first end cap combine to form the first cavity. With this structural arrangement, when the first end cap is attached to the first end portion of the substrate, a first cavity communicating with the two heat dissipation channels is formed.

[0011] According to the above solution, a second slot is formed in the second end portion of the substrate. The second slot communicates with the two heat dissipation channels. The second end cap seals the opening of the second slot. The second slot and the second end cap combine to form the second cavity. With this structural arrangement, when the second end cap is attached to the second end portion of the substrate, a second cavity communicating with the two heat dissipation channels is formed.

[0012] According to the above solution, the first end cover is detachably mounted on the first end portion of the substrate via a fixing member, and the second end cover is detachably mounted on the second end portion via the fixing member.

[0013] According to the above solution, a plurality of heat dissipation channels are connected end to end to form a coolant flow channel.

[0014] According to the above solution, the coolant flow channel includes an inlet and an outlet. The first end portion is provided with a mounting groove, and the first end cap is embedded in the mounting groove. The inlet and outlet are respectively provided on the first end portion, and are located on either side of the mounting groove. This structural arrangement facilitates quick installation of the first end cap onto the first end portion of the substrate.

[0015] According to the above solution, the abutting surface of the component to be dissipated heat is mounted on the heat exchange surface of the base plate via a fixing device. The fixing device includes a screw and a fixing hole provided on the heat exchange surface. The screw passes through the abutting surface of the component to be dissipated heat and is locked into the fixing hole. This structural arrangement ensures a tight connection between the component to be dissipated heat and the base plate, which facilitates the present invention in removing heat generated by the component to be dissipated heat during operation.

[0016] Beneficial effects of the utility model:

[0017] During assembly, the present invention aligns and fixes the first end cover with the first end portion of the substrate, and aligns and fixes the second end cover with the second end portion of the substrate, thereby enabling interconnection of multiple heat dissipation channels inside the substrate. This arrangement is faster than the prior art in assembly and is less likely to be damaged after long-term use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the external structure of the substrate of the utility model;

[0019] Figure 2 It is a schematic diagram of the basic internal structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the top structure of the first end cover of the present invention;

[0021] Figure 4This is a schematic diagram of the bottom end structure of the first end cover of the present invention;

[0022] Figure 5 This is a schematic diagram of the top structure of the second end cover of the present invention;

[0023] Figure 6 It is a schematic diagram of the bottom structure of the second end cover of the utility model.

[0024] In the figure: 1. substrate; 2. first end cover; 3. second end cover; 11. first end; 12. second end; 13. heat exchange surface; 14. heat dissipation channel A; 15. heat dissipation channel B; 16. heat dissipation channel C; 17. heat dissipation channel D; 18. heat dissipation channel E; 19. heat dissipation channel F; 21. first sealing ring; 31. second sealing ring; 111. first slot A; 112. first slot B; 113. mounting groove; 121. second slot A; 122. second slot B; 123. second slot C; 131. fixing hole; 141. liquid inlet; 191. liquid outlet. DETAILED DESCRIPTION

[0025] The technical solution of the present utility model is described below with reference to the accompanying drawings and embodiments.

[0026] Example 1

[0027] like Figure 1-6 As shown, the present invention provides a liquid cooling heat dissipation device, which can be used for heat dissipation of a servo drive, mainly comprising a base plate 1, a first end cover 2 and a second end cover 3. The base plate 1 is provided with a heat exchange surface 13, and the heat exchange surface 13 is used to abut the servo drive. The base plate 1 includes a first end 11 and a second end 12 corresponding to each other. A plurality of heat dissipation channels for guiding the cooling liquid are provided inside the base plate 1, and each of the heat dissipation channels runs from the first end 11 to the second end 12. In this embodiment, six heat dissipation channels are provided, namely, heat dissipation channel A14, heat dissipation channel B15, heat dissipation channel C16, heat dissipation channel D17, heat dissipation channel E18, and heat dissipation channel F19. The six heat dissipation channels are provided in parallel with each other inside the base plate 1.

[0028] The first end cap 2 is removably secured to the first end portion 11 by screws, and the second end cap 3 is removably secured to the second end portion 12 by screws. A first cavity A for connecting heat dissipation channel B15 and heat dissipation channel C16, as well as a first cavity B for connecting heat dissipation channel D17 and heat dissipation channel E18, are formed between the first end cap 2 and the first end portion 11. A second cavity A for connecting heat dissipation channel A14 and heat dissipation channel B15, a second cavity B for connecting heat dissipation channel C16 and heat dissipation channel D17, and a second cavity C for connecting heat dissipation channel E18 and heat dissipation channel F19 are formed between the second end cap 3 and the second end portion 12. These six heat dissipation channels are interconnected to form a single coolant flow channel. During assembly, the first end cap 2 is aligned and secured with the first end portion 11 of the base plate 1, and the second end cap 3 is aligned and secured with the second end portion 12 of the base plate 1. This interconnection of the multiple heat dissipation channels within the base plate 1 is achieved. This arrangement is faster than conventional assembly and is less prone to damage from prolonged use.

[0029] The present invention also includes a heat exchanger (not shown) for supplying and discharging coolant into and out of the heat dissipation channels. A liquid inlet 141 is provided at the end of the heat dissipation channel A14 remote from the second cavity A, and a liquid outlet 191 is provided at the end of the heat dissipation channel F19 remote from the second cavity C. These inlet 141 and outlet 191 are connected to the heat exchanger via pipes. This structural arrangement allows the heat exchanger to supply coolant into the coolant channels and discharge the heated coolant out of the channels, thereby achieving heat dissipation and temperature reduction.

[0030] Furthermore, the first end portion 11 is provided with a mounting groove 113, the first end cap 2 is embedded in the mounting groove 113, and the liquid inlet 141 and the liquid outlet 191 are respectively provided on the first end portion 11, and are located on both sides of the mounting groove 113. This structural arrangement facilitates the rapid installation of the first end cap 2 on the first end portion 11 of the substrate 1, and facilitates external connection of the liquid inlet 141 and the liquid outlet 191.

[0031] Further, if Figure 2As shown, a first slot A111 and a first slot B112 are formed in the first end portion 11 of the substrate 1. The first slot A111 communicates with the heat dissipation channel B15 and the heat dissipation channel C16, while the first slot B112 communicates with the heat dissipation channel D17 and the heat dissipation channel E18. The bottom end of the first end cap 2 blocks the openings of the first slot A111 and the first slot B112. The first slot A111 and the first slot B112, combined with the first end cap 2, respectively form the first cavity A and the first cavity B. With this structural arrangement, when the first end cap 2 is mounted to the first end portion 11 of the substrate 1, a first cavity connecting the two heat dissipation channels is formed. In this embodiment, a first sealing ring 21 is preferably fixed to the bottom end of the first end cap 2 to match the openings of the first slot A111 and the first slot B112.

[0032] Further, if Figure 2 As shown, a second groove A121, a second groove B122 and a second groove C123 are formed in the second end portion 12 of the substrate 1, the second groove A121 is connected to the heat dissipation channel A14 and the heat dissipation channel B15, the second groove B122 is connected to the heat dissipation channel C16 and the heat dissipation channel D17, and the second groove C123 is connected to the heat dissipation channel E18 and the heat dissipation channel F19. The second end cover 3 blocks the openings of the second groove A121, the second groove B122 and the second groove C123. The second groove A121, the second groove B122 and the second groove C123 are combined with the second end cover 3 to form the second cavity A, the second cavity B and the second cavity C, respectively. Through the arrangement of the above structure, when the second end cover 3 is installed to the second end portion 12 of the substrate 1, a second cavity connecting the two heat dissipation channels can be formed. In this embodiment, the bottom end of the second end cover 3 is preferably fixed with a second sealing ring 31 that matches the openings of the second groove A121, the second groove B122 and the second groove C123.

[0033] Furthermore, the abutting surface of the servo driver is mounted on the heat exchange surface 13 on the base plate 1 via a fixing device. The fixing device includes a screw and a fixing hole 131 provided on the heat exchange surface 13. The screw passes through the abutting surface of the servo driver and is locked into the fixing hole 131. This structural arrangement ensures that the component to be dissipated heat, namely the servo driver, is tightly connected to the base plate 1, which helps the present invention remove heat generated by the servo driver during operation.

[0034] The above description is only a preferred embodiment of the present invention. Therefore, any equivalent changes or modifications made according to the structure, features and principles described in the scope of the present invention patent application are included in the scope of the present invention patent application.

Claims

1. A liquid cooling device, comprising a substrate, wherein the substrate is provided with a heat exchange surface, the heat exchange surface being used to abut against a heat dissipation component, the substrate including a first end and a second end corresponding to each other, and a plurality of heat dissipation channels for guiding cooling liquid are provided inside the substrate, each heat dissipation channel extending from the first end to the second end. It is characterized in that It also includes a first end cover and a second end cover, the first end cover is detachably connected to the first end portion, the second end cover is detachably connected to the second end portion, a first cavity for conducting the two heat dissipation channels is formed between the first end cover and the first end portion, and a second cavity for conducting the two heat dissipation channels is formed between the second end cover and the second end portion.

2. The liquid cooling device according to claim 1, wherein: It also includes a heat exchanger, which is used to input and output coolant to the heat dissipation channels. Several of the heat dissipation channels include at least one liquid inlet connected to the heat exchanger and at least one liquid outlet connected to the heat exchanger.

3. The liquid cooling device according to claim 1, wherein: A first slot is formed in the first end portion of the substrate, the first slot is connected to the two heat dissipation channels, the first end cover blocks the opening of the first slot, and the first slot and the first end cover are combined to form the first cavity.

4. The liquid cooling device according to claim 1, wherein: A second slot is formed in the second end portion of the substrate, the second slot is connected to the two heat dissipation channels, the second end cover blocks the opening of the second slot, and the second slot and the second end cover are combined to form the second cavity.

5. The liquid cooling device according to claim 1, wherein: The first end cover is detachably mounted on the first end portion of the base plate via a fixing member, and the second end cover is detachably mounted on the second end portion via the fixing member.

6. The liquid cooling device according to claim 2, characterized in that: A plurality of heat dissipation channels are connected end to end to form a coolant flow channel.

7. The liquid cooling device according to claim 6, characterized in that: The coolant flow channel includes a liquid inlet and a liquid outlet, the first end portion is provided with a mounting groove, the first end cover is embedded in the mounting groove, the liquid inlet and the liquid outlet are respectively provided on the first end portion and are located on both sides of the mounting groove.

8. The liquid cooling device according to claim 1, wherein: The abutting surface of the component to be cooled is mounted on the heat exchange surface on the base plate through a fixing device.

9. The liquid cooling device according to claim 8, characterized in that: The fixing device includes a screw and a fixing hole provided on the heat exchange surface, and the screw passes through the abutting surface of the component to be dissipated and is locked with the fixing hole.

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