Heat dissipation module and test equipment

Abstract

The utility model provides a heat dissipation module and test equipment, and relates to the field of test equipment. The heat dissipation module comprises a fan, a heat dissipation block, a telescopic component and a fixed component; the heat dissipation block is detachably connected to the lower portion of the fan. The telescopic component comprises a screw part and a sleeve part which are in threaded assembly with each other, and the near end of the sleeve part is rotationally connected with the periphery of the heat dissipation block; the fixing component is connected to the far end of the screw rod part, and the heat dissipation module is positioned at a preset position through the fixing component. By adopting the scheme, the test requirements of different test circuit boards can be met, the working efficiency is improved, the cost is saved, and the resource waste is avoided.

Description

Technical Field

[0001] The present disclosure relates to the field of testing equipment, and in particular to a heat dissipation module and testing equipment. Background Art

[0002] In the early stages of R&D, functional testing of circuit boards with integrated circuits is generally required. During these initial stages, because heat dissipation modules are not yet completed or are in short supply, and time is tight for testing multiple circuit boards simultaneously, external fans are typically used for cooling. However, this method often provides poor cooling, resulting in the machine not functioning properly and hindering testing progress. In the middle and later stages of testing, when the entire machine is essentially assembled, the motherboard can be tested using the original heat dissipation module. However, this will render the previously used heat dissipation module obsolete, resulting in a waste of resources. Utility Model Content

[0003] The present disclosure provides a heat dissipation module and a testing device to at least solve the above technical problems existing in the prior art.

[0004] According to a first aspect of the present disclosure, a heat dissipation module is provided, comprising: a fan, a heat dissipation block, a telescopic member and a fixed member, wherein the heat dissipation block is detachably connected to the bottom of the fan; the telescopic member comprises a screw portion and a sleeve portion that are threadedly assembled with each other, and the proximal end of the sleeve portion is rotatably connected to the outer periphery of the heat dissipation block; the fixed member is connected to the distal end of the screw portion, and the heat dissipation module is positioned at a preset position by the fixed member.

[0005] In one embodiment, a hollow rotating shaft body is provided at each corner of the heat dissipation block, and one of the rotating shaft bodies is rotatably connected to one of the telescopic members.

[0006] In one embodiment, each of the rotating shaft bodies has a guide groove extending along its own radial direction, and each of the telescopic members further includes a transition portion, which is located on the side of the sleeve portion away from the screw portion, and the transition portion is inserted into the guide groove and rotatably connected to the rotating shaft body at the guide groove position.

[0007] In one embodiment, the heat dissipation module further includes a positioning member, which penetrates the fan, the rotating shaft and the adapter from top to bottom in sequence, and the positioning member provides a rotation fulcrum for the adapter to rotate relative to the rotating shaft.

[0008] In one embodiment, the fan has mounting holes around it along its height direction, the rotating shaft body is at least partially sleeved inside the mounting hole, the positioning member extends into the mounting hole, and penetrates the rotating shaft body from top to bottom until it passes through the adapter.

[0009] In one embodiment, the adapter portion includes a rotating sub-portion and a connecting sub-portion, the rotating sub-portion is inserted into the guide groove and rotatably connected to the positioning portion, and the connecting sub-portion is connected between the rotating sub-portion and the proximal end of the sleeve portion.

[0010] In one embodiment, the fixing member includes a connecting portion and a fixing portion connected to the connecting portion, the screw portion has a rotating shaft sub-portion at one end away from the sleeve portion, the connecting portion is rotatably sleeved on the outer periphery of the rotating shaft sub-portion, and the fixing portion is fixed to a preset position by a locking member.

[0011] In one embodiment, the connecting portion is arranged higher than the fixing portion.

[0012] In one embodiment, a threaded disk is protruded from the outer circumference of the screw portion along its radial direction, and the shaft sub-portion protrudes from a side of the threaded disk away from the screw portion.

[0013] According to a second aspect of the present disclosure, a testing device is provided, comprising the above-mentioned heat dissipation module and a circuit board to be tested, wherein the heat dissipation module is connected to a preset position of the circuit board to be tested via the fixing member, and the position of the screw portion relative to the sleeve portion is rotated to adjust the distance between the heat dissipation block and the fan relative to the preset position to adapt to the test position of circuit boards to be tested of different specifications.

[0014] The heat dissipation module and test equipment disclosed in the present invention detachably connect the heat dissipation block under the fan, and add a telescopic member and a fixed member in the heat dissipation module composed of the fan and the heat dissipation block. The telescopic member is provided with a screw portion and a sleeve portion that are threadably assembled with each other, wherein the sleeve portion is connected between the heat dissipation block and the screw portion, and the proximal end of the sleeve portion is rotatably connected to the outer periphery of the heat dissipation block, and the fixed member can fix the distal end of the screw portion in a preset position. In this way, the relative position between the screw portion and the sleeve portion can be lengthened or shortened by suspending the screw portion. Since the sleeve portion is rotatably connected to the outer periphery of the heat dissipation block, the relative position between the heat dissipation block and the fixed member can be rotatably adjusted, and thus, in the process of suspending the screw portion, the test position of different circuit boards to be tested can be adapted, thereby meeting the testing requirements of different test circuit boards, improving work efficiency, and avoiding waste of resources.

[0015] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings, in which several embodiments of the present disclosure are shown by way of example and not limitation, wherein:

[0017] In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.

[0018] Figure 1 A schematic diagram of the axial structure of the heat dissipation module according to an embodiment of the present disclosure is shown;

[0019] Figure 2 A schematic diagram of the axial structure of a mounting hole with a cross section in a heat dissipation module according to an embodiment of the present disclosure is shown;

[0020] Figure 3 A schematic structural diagram of the telescopic component in the heat dissipation module according to an embodiment of the present disclosure is shown.

[0021] Description of the numbers in the figure:

[0022] 001-heat dissipation module; 10-fan; 11-mounting hole; 20-heat dissipation block; 21-rotating shaft body; 211-guide groove; 30-telescopic member; 31-screw part; 311-rotating shaft sub-part; 312-threaded disk; 32-sleeve part; 33-adapter part; 331-rotating sub-part; 332-connecting sub-part; 40-fixing member; 41-connecting part; 42-fixing part; 50-positioning piece. DETAILED DESCRIPTION

[0023] To make the purposes, features, and advantages of the present disclosure more apparent and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without creative work shall fall within the scope of protection of the present disclosure.

[0024] With the widespread use of test fans in testing motherboards, different cooling modules are becoming incompatible. As a result, cooling modules used for testing are discarded after a project is completed, resulting in significant resource waste. Existing cooling modules are typically secured with tape, which is a weak fixation method. During testing, moving the motherboard can cause the fan to fall off, or even damage the motherboard, severely impacting test efficiency. By improving the existing fan and heat sink structure, this problem can be resolved, resulting in a more stable cooling module.

[0025] In order to alleviate the above problems, the embodiment of the present disclosure provides a heat dissipation module. By designing an adjustable telescopic component structure, the same heat dissipation module can be used to meet the testing requirements of different test motherboards, thereby improving work efficiency, saving costs, and avoiding waste of resources.

[0026] refer to Figure 1-Figure 3 The embodiment of the present disclosure provides a heat dissipation module 001, comprising: a fan 10 and a heat dissipation block 20, wherein the fan 10 is located above the heat dissipation block 20, and the fan 10 and the heat dissipation block 20 are installed as one body, so that the preset position of the circuit board to be tested can be timely dissipated. Specifically, considering that the integrated structure of the fan 10 and the heat dissipation block 20 can adapt to the test requirements of different models of circuit boards to be tested, that is, adapt to the test positions of circuit boards to be tested of different sizes, the heat dissipation module 001 of the embodiment of the present disclosure also includes a telescopic member 30 and a fixed member 40, one end of the telescopic member 30 is rotatably connected to the heat dissipation block 20 with the fan 10, and the other end of the telescopic member 30 is positioned at the preset position of the circuit board to be tested through the fixed member 40.

[0027] It should be noted that the telescopic member 30 has a sleeve portion 32 at one end and a screw portion 31 at the other end. The screw portion 31 and the sleeve portion 32 are threadedly assembled with each other, that is, the outer profile of the screw portion 31 has an external thread, and the inner wall of the sleeve portion 32 has an internal thread that matches the external thread of the screw portion 31. Furthermore, the proximal end of the sleeve portion 32 is rotatably connected to the outer periphery of the heat sink 20; the fixing member 40 is connected to the distal end of the screw portion 31, and the heat sink module 001 is positioned at a preset position on the circuit board to be tested by the fixing member 40. In this way, by suspending the relative position of the screw portion 31 relative to the sleeve portion 32, the distance between the heat sink 20 with the fan 10 and the preset position of the circuit board to be tested where the fixing member 40 is located can be adjusted, thereby adapting to the application of different positions to be tested on different models of circuit boards to be tested. At the same time, the heat sink module 001 of the embodiment of the present disclosure can also be positioned at the preset position of different circuit boards to be tested by the fixing member 40.

[0028] Specifically, each corner of the heat sink 20 is provided with a hollow internal rotation shaft 21, and each rotation shaft 21 is rotatably connected to a telescopic member 30. For example, the heat sink 20 has four corners, each of which is provided with a hollow internal rotation shaft 21. The heat sink 20 is rotatably connected to each telescopic member 30 via each rotation shaft 21. This allows the telescopic members 30 to be used to adjust the heat sink 20 with the fan 10 to suit different testing requirements without affecting the application of the heat sink 20.

[0029] Considering the specific rotational connection scheme between each rotating shaft 21 and the telescopic member 30, in the heat dissipation module 001 of the disclosed embodiment, each rotating shaft 21 has a guide groove 211 extending radially therethrough. Each telescopic member 30 also includes a connecting portion 33 located on the side of the sleeve 32 away from the screw portion 31. The connecting portion 33 is inserted into the guide groove 211 and rotationally connected to the rotating shaft 21 at the guide groove 211. Thus, each telescopic member 30 can rotate relative to the rotating shaft 21 via the connecting portion 33.

[0030] Furthermore, considering the stable rotational relationship between the fan 10, the heat sink 20, and the adapter 33, the heat dissipation module 001 of the disclosed embodiment further includes a positioning member 50, which sequentially penetrates the fan 10, the rotating shaft 21, and the adapter 33 from top to bottom. The positioning member 50 provides a rotation fulcrum for the adapter 33 to rotate relative to the rotating shaft 21. In this way, the adapter 33 and the rotating shaft 21 rotate with the relative rotation fulcrum. The rotation here can be understood as adjusting the hanging position of the screw portion 31 relative to the sleeve portion 32 to adapt the distance between the preset position and the position to be tested on different circuit boards to be tested. In this way, the rotation angle of the adapter 33 relative to the rotating shaft 21 can be adaptively adjusted to match the test requirements of different circuit boards to be tested.

[0031] Specifically, considering the specific installation scheme between the fan 10, the heat sink 20, the adapter 33 and the positioning member 50, in the heat dissipation module 001 of the embodiment of the present disclosure, the fan 10 has mounting holes 11 on all sides along its own height direction. For example, the mounting hole 11 is constructed as a hole-type structure that penetrates the rotating shaft body 21 and can be fitted with the rotating shaft body 21; wherein, the rotating shaft body 21 is at least partially sleeved inside the mounting hole 11. For example, at least part of the structure of the rotating shaft body 21 is sleeved in the mounting hole 11 from bottom to top, and the top of the rotating shaft body 21 is buried in the mounting hole 11. When the positioning member 50 extends into the mounting hole 11 and penetrates the rotating shaft body 21 from top to bottom until it passes through the adapter 33, the positioning member 50 does not protrude from the surface of the mounting hole 11. In this way, the installation stability between the fan 10, the heat sink 20, the adapter 33 and the positioning member 50 can be improved, and disassembly is convenient while also being beautiful and avoiding mutual interference.

[0032] Specifically, considering the specific structure of the adapter portion 33 in the telescopic member 30, the adapter portion 33 includes a rotating sub-portion 331 and a connecting sub-portion 332, wherein the rotating sub-portion 331 is inserted into each guide groove 211 along the radial direction of each rotating shaft body 21 and is rotatably connected to each positioning portion, and each connecting sub-portion 332 is connected between each rotating sub-portion 331 and the proximal end of each sleeve portion 32. Exemplarily, each rotating sub-portion 331 is constructed as a sheet-like structure that is clearance-fitted or over-fitted with the aforementioned guide grooves 211, and each connecting sub-portion 332 is used to connect each rotating sub-portion 331 with the proximal end of each sleeve portion 32. The embodiment of the present disclosure does not limit the specific structure and shape of each connecting sub-portion 332. Exemplarily, each connecting sub-portion 332 is constructed as a sheet-like structure arranged in the same plane as the rotating sub-portion 331, or each connecting sub-portion 332 is constructed as a sheet-like structure arranged at an angle to the rotating sub-portion 331. The following further describes the solution in which each connecting sub-part 332 is constructed as a sheet-like structure arranged at an angle to the rotating sub-part 331.

[0033] Exemplarily, the fixing member 40 includes a connecting portion 41 and a fixing portion 42 connected to the connecting portion 41. The screw portion 31 has a rotating shaft sub-portion 311 at one end away from the sleeve portion 32. The connecting portion 41 is rotatably sleeved on the outer periphery of the rotating shaft sub-portion 311. The fixing portion 42 is fixed to a preset position on the circuit board to be tested by a locking member. In this way, even if the relative position of the threaded portion relative to the sleeve portion 32 is suspended, the connecting portion 41 is rotatably sleeved relative to the rotating shaft sub-portion 311 of the sleeve portion 32. In this way, it can be ensured that the fixing member 40 moves in position following the suspension of the screw portion 31, and no mutual interference between the fixing member 40 and the telescopic member 30 occurs.

[0034] The connecting portion 41 is arranged higher than the fixing portion 42 , so that the height dimension spacing between the screw portion 31 and the sleeve portion 32 relative to the circuit board to be tested can be raised.

[0035] To facilitate manual manipulation of the screw portion 31 relative to the sleeve portion 32, the heat dissipation module 001 of the present embodiment has a threaded disc 312 protruding radially from the outer periphery of the screw portion 31. The rotating shaft sub-portion 311 protrudes from the side of the threaded disc 312 away from the screw portion 31. Thus, by twisting the threaded disc 312, the screw portion 31's position relative to the sleeve portion 32 can be adjusted, thereby lengthening or shortening the overall length of the telescopic member 30, further adjusting the relative position of the heat dissipation block 20 with the fan 10 relative to the fixed member 40, thereby adapting to the test requirements of different test positions on different models of circuit boards under test.

[0036] The embodiment of the present disclosure also provides a testing device, including the above-mentioned heat dissipation module 001 and a circuit board to be tested. The heat dissipation module 001 is connected to a preset position of the circuit board to be tested through a fixing component 40. The position of the screw portion 31 relative to the sleeve portion 32 is rotated to adjust the distance between the heat dissipation block 20 and the fan 10 relative to the preset position to adapt to the test position of circuit boards to be tested of different specifications.

[0037] The heat dissipation module 001 and the test equipment of the embodiment of the present disclosure are applied, and the heat dissipation block 20 is detachably connected to the bottom of the fan 10. In the heat dissipation module 001 composed of the fan 10 and the heat dissipation block 20, a telescopic member 30 and a fixed member 40 are added. The telescopic member 30 is provided with a screw portion 31 and a sleeve portion 32 that are threadedly assembled with each other. The sleeve portion 32 is connected between the heat dissipation block 20 and the screw portion 31, and the proximal end of the sleeve portion 32 is rotatably connected to the outer periphery of the heat dissipation block 20. The fixed member 40 can The distal end of the screw portion 31 is fixed at a preset position. In this way, the relative position between the screw portion 31 and the sleeve portion 32 can be lengthened or shortened by suspending the screw portion 31. Since the sleeve portion 32 is rotatably connected to the outer periphery of the heat dissipation block 20, the relative position between the heat dissipation block 20 and the fixed component 40 can be rotated to adjust the relative position. In the process of suspending the screw portion 31, the test position of different circuit boards to be tested can be adapted, thereby meeting the test requirements of different test circuit boards, improving work efficiency, and avoiding waste of resources.

[0038] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved. This is not a limitation herein.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0040] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A heat dissipation module, characterized in that: include: fan (10); a heat dissipation block (20), the heat dissipation block (20) being detachably connected to the bottom of the fan (10); a telescopic member (30), the telescopic member (30) comprising a screw portion (31) and a sleeve portion (32) threadedly assembled with each other, the proximal end of the sleeve portion (32) being rotatably connected to the outer periphery of the heat dissipation block (20); A fixing member (40) is connected to the distal end of the screw portion (31), and the heat dissipation module (001) is positioned at a preset position by the fixing member (40).

2. The heat dissipation module according to claim 1, characterized in that: A hollow rotating shaft body (21) is provided at each corner of the heat dissipation block (20), and one rotating shaft body (21) rotates one telescopic member (30).

3. The heat dissipation module according to claim 2, characterized in that: Each of the rotating shaft bodies (21) has a guide groove (211) penetrating along its own radial direction. Each of the telescopic members (30) further includes a transition portion (33). The transition portion (33) is located on a side of the sleeve portion (32) away from the screw portion (31). The transition portion (33) is inserted into the guide groove (211) and is rotatably connected to the rotating shaft body (21) at the position of the guide groove (211).

4. The heat dissipation module according to claim 3, characterized in that: The heat dissipation module (001) further includes a positioning member (50), which penetrates the fan (10), the rotating shaft (21) and the adapter (33) in sequence from top to bottom. The positioning member (50) provides a rotation fulcrum for the adapter (33) to rotate relative to the rotating shaft (21).

5. The heat dissipation module according to claim 4, characterized in that: The fan (10) has mounting holes (11) around its four sides along its height direction. The rotating shaft (21) is at least partially sleeved inside the mounting hole (11). The positioning member (50) extends into the mounting hole (11) and penetrates the rotating shaft (21) from top to bottom until it passes through the adapter (33).

6. The heat dissipation module according to claim 4, characterized in that: The adapter portion (33) includes a rotating sub-portion (331) and a connecting sub-portion (332), wherein the rotating sub-portion (331) is inserted into the guide groove (211) and is rotationally connected to the positioning portion, and the connecting sub-portion (332) is connected between the rotating sub-portion (331) and the proximal end of the sleeve portion (32).

7. The heat dissipation module according to claim 1, characterized in that: The fixing member (40) comprises a connecting portion (41) and a fixing portion (42) connected to the connecting portion (41); the screw portion (31) has a rotating shaft sub-portion (311) at one end away from the sleeve portion (32); the connecting portion (41) is rotatably sleeved on the outer periphery of the rotating shaft sub-portion (311); and the fixing portion (42) is fixed to a preset position by a locking member.

8. The heat dissipation module according to claim 7, characterized in that: The connecting portion (41) is arranged higher than the fixing portion (42).

9. The heat dissipation module according to claim 7, characterized in that: A threaded disk (312) is protruded from the outer periphery of the screw portion (31) along its own radial direction, and the rotating shaft sub-portion (311) protrudes from a side of the threaded disk (312) away from the screw portion (31).

10. A testing device, characterized in that: The invention comprises a heat dissipation module (001) as described in any one of claims 1 to 9, and also comprises a circuit board to be tested, wherein the heat dissipation module (001) is connected to a preset position of the circuit board to be tested through the fixing member (40), and the position of the screw portion (31) relative to the sleeve portion (32) is rotated to adjust the distance between the heat dissipation block (20) and the fan (10) relative to the preset position to adapt to the test position of circuit boards to be tested of different specifications.

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