Module diode, junction box, junction box assembly and photovoltaic assembly

Abstract

The utility model discloses a module diode, a junction box, a junction box assembly and a photovoltaic assembly. The module diode comprises a first conducting strip, a second conducting strip, a diode chip and an insulator. The first conducting strip and the second conducting strip are arranged in a plane spaced mode, the first conducting strip is provided with a first through hole for the bus bar to penetrate through, and the second conducting strip is provided with a second through hole for the bus bar to penetrate through. The diode chip is arranged on the second conducting strip. The insulator wraps the diode chip. The module diode comprises a first edge and a second edge, and the first through hole and the second through hole are arranged close to the first edge. According to the utility model, the positions of the first through hole and the second through hole of the module diode are optimized, so that the module junction box and the axial junction box can share the box body with the same structure, and the manufacturing cost of the junction box is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of photovoltaics, and in particular relates to a module diode, a junction box, a junction box assembly and a photovoltaic assembly. Background Art

[0002] The PV panel's junction box connects between the battery array and the charge control unit, conducting the current generated by the array. To prevent reverse current flow between the battery array and the charge control unit, diodes are installed in the junction box to limit the current flow.

[0003] Currently, the mainstream junction boxes are axial junction boxes and modular junction boxes. Axial diodes are installed in the axial junction box. The diode chip of the axial diode is independently packaged. After the diode chip is packaged, the diode chip is electrically connected to two conductive plates. Each of the two conductive plates is provided with a through-hole for the bus bar to pass through. Since the insulator that encapsulates the diode chip has a certain volume and the position of the through-hole must avoid the connection position between the diode chip and the conductive plate, the two through-holes and the insulator are generally distributed in a Y shape, that is, a triangular distribution.

[0004] The module diode is installed in the module junction box. The diode chip of the module diode is first installed on a conductive sheet, then electrically connected to the other conductive sheet through structures such as jumpers, and finally the diode chip is packaged by an insulator. Since the diode chip is directly integrated on the conductive sheet and the insulator is directly packaged on the conductive sheet, the through-holes on the conductive sheet for the busbar to pass through can be relatively centered, so the two through-holes and the insulator are generally arranged along the same straight line.

[0005] Due to the different positions of the perforations on the modular diodes and the axial diodes, the positions at which the busbars penetrate into the axial junction box and the modular junction box are also different. When the modular diodes and the axial diodes are used in the junction box, they need to adapt to the box bodies of different structures, making it difficult to achieve a unified box body structure, thereby increasing the manufacturing cost of the junction box.

[0006] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. Utility Model Content

[0007] The purpose of the utility model is to provide a modular diode, which is used to solve the problem that the box body structures of the axial junction box and the modular junction box cannot be unified.

[0008] In order to achieve the above-mentioned purpose, a specific embodiment of the present invention provides a module diode, which includes a first conductive sheet, a second conductive sheet, a diode chip and an insulator. The first conductive sheet and the second conductive sheet are arranged in a plane spaced apart, and the first conductive sheet is provided with a first through-hole for the bus bar to pass through, and the second conductive sheet is provided with a second through-hole for the bus bar to pass through. The diode chip is arranged on the second conductive sheet and is electrically connected to the first conductive sheet and the second conductive sheet. The insulator covers the diode chip and extends between the first through-hole and the second through-hole. The module diode includes a first edge and a second edge opposite to each other in a first direction, and the first through-hole and the second through-hole are arranged to satisfy L1 less than L2, and L3 less than L4, wherein L1 is the distance between the side of the first through-hole close to the first edge and the first edge, L2 is the distance between the side of the first through-hole close to the second edge and the second edge, L3 is the distance between the side of the second through-hole close to the first edge and the first edge, and L4 is the distance between the side of the second through-hole close to the second edge and the second edge.

[0009] In one or more embodiments of the present invention, the diode chip is configured to satisfy L5 greater than L6, where L5 is the distance between the side of the diode chip close to the first edge and the first edge, and L6 is the distance between the side of the diode chip close to the second edge and the second edge.

[0010] In one or more embodiments of the present invention, the first through-hole and the second through-hole are configured to satisfy L1 equal to L3.

[0011] In one or more embodiments of the present invention, the first perforation and the second perforation are configured to satisfy L2 equal to L4.

[0012] In one or more embodiments of the present invention, the first through-hole and the second through-hole are symmetrical about a reference axis, and the reference axis is parallel to the first direction.

[0013] In one or more embodiments of the present invention, the diode chip and the second through hole are staggered in a second direction, and the second direction is perpendicular to the first direction.

[0014] In one or more embodiments of the present invention, on a plane perpendicular to the second direction, there is no space between a vertical projection of the diode chip and a vertical projection of the second through-hole.

[0015] In one or more embodiments of the present invention, the first conductive sheet includes a first main body portion and a first bent portion bent from an edge of the first main body portion.

[0016] In one or more embodiments of the present invention, the second conductive sheet includes a second main body portion and a second bent portion bent from an edge of the second main body portion.

[0017] In one or more embodiments of the present invention, a first pad for connecting to a bus bar is provided on the first conductive sheet, and the first pad is located on a side of the first through-hole away from the second through-hole.

[0018] In one or more embodiments of the present invention, a second pad for connecting to a bus bar is provided on the second conductive sheet, and the second pad is located on a side of the second through-hole away from the first through-hole.

[0019] In one or more embodiments of the present invention, the first pad and the second pad are symmetrical about a reference axis, and the reference axis is parallel to the first direction.

[0020] On the other hand, the present invention also provides a junction box, which includes a box body and the above-mentioned module diode. The module diode is arranged in the box body, and the box body includes a third through-hole and a fourth through-hole for the bus bar to pass through, wherein the third through-hole faces the first through-hole, and the fourth through-hole faces the second through-hole.

[0021] In one or more embodiments of the present invention, the junction box further includes a first heat sink in surface contact with the first conductive sheet.

[0022] In one or more embodiments of the present invention, the junction box further includes a second heat sink in surface contact with the second conductive sheet.

[0023] In one or more embodiments of the present invention, the junction box further includes a first supporting portion extending from a side of the third through hole toward the first conductive sheet, and the first supporting portion is used to support the first conductive sheet.

[0024] In one or more embodiments of the present invention, the junction box further includes a second supporting portion extending from a side of the fourth through hole toward the second conductive sheet, and the second supporting portion is used to support the second conductive sheet.

[0025] In one or more embodiments of the present invention, a first positioning post and a second positioning post with different cross-sectional areas are provided in the box body, at least one of the first conductive sheet and the second conductive sheet is provided with a first positioning hole that cooperates with the first positioning post, and at least one of the first conductive sheet and the second conductive sheet is provided with a second positioning hole that cooperates with the second positioning post.

[0026] On the other hand, the present invention further provides a junction box assembly, which includes a positive junction box, a negative junction box and a plurality of intermediate junction boxes. The positive junction box, the negative junction box and the intermediate junction boxes all adopt the above-mentioned junction box.

[0027] On the other hand, the present invention further provides a photovoltaic assembly, which includes the above-mentioned junction box assembly.

[0028] Compared with the prior art, the positions of the first through-hole and the second through-hole of the module diode in the present invention are relatively close to the first edge of the module diode and relatively offset from the central axis of the module diode perpendicular to the first direction, which is basically consistent with the positions of the two through-holes on the traditional axial diode. This can unify the positions of the busbars entering the module junction box and the axial junction box, so that the module junction box and the axial junction box can share the same box body structure, thereby reducing the manufacturing cost of the junction box. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are only some of the embodiments described in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts.

[0030] Figure 1 This is a planar structural diagram of the module diode in Example 1 of the present utility model;

[0031] Figure 2 This is a planar structural diagram of the module diode in Example 1 of the present utility model without the insulator;

[0032] Figure 3 This is a side view of the module diode in the first embodiment of the present utility model;

[0033] Figure 4 This is an exploded structural diagram of the junction box in the second embodiment of the present utility model;

[0034] Figure 5 This is a planar structural diagram of the junction box in the second embodiment of the present utility model;

[0035] Figure 6 This is a planar structural diagram of the box body in Example 2 of the present utility model.

[0036] Explanation of main figure marks: 100, module diode, 110, first conductive sheet, 111, first through-hole, 112, first main body, 113, first bending portion, 114, first soldering pad, 120, second conductive sheet, 121, second through-hole, 122, second main body, 123, second bending portion, 124, second soldering pad, 130, diode chip, 140, jumper, 150, insulator, 160, first edge, 170, second edge, 180, first positioning hole, 190, second positioning hole, 200, box body, 210, third through-hole, 220, fourth through-hole, 230, first positioning column, 240, second positioning column, 300, first heat sink, 400, second heat sink. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only a portion of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of the present invention.

[0038] Example 1:

[0039] Reference Figures 1 to 3 As shown, this embodiment provides a module diode 100, which includes a first conductive sheet 110, a second conductive sheet 120, a diode chip 130, and an insulator 150. The first conductive sheet 110 and the second conductive sheet 120 are spaced apart in a plane. The first conductive sheet 110 is provided with a first through-hole 111 for a busbar to pass through, and the second conductive sheet 120 is provided with a second through-hole 121 for a busbar to pass through. The diode chip 130 is provided on the second conductive sheet 120 and is electrically connected to the first conductive sheet 110 and the second conductive sheet 120. The diode chip 130 is electrically connected to the first conductive sheet 110 via a jumper 140. The insulator 150 covers the diode chip 130 and extends between the first through-hole 111 and the second through-hole 121.

[0040] The module diode 100 includes a first edge 160 and a second edge 170 facing each other in a first direction, the first direction being perpendicular to an arrangement direction of the first conductive sheet 110 and the second conductive sheet 120 .

[0041] The first through-hole 111 and the second through-hole 121 are arranged so that L1 is smaller than L2, and L3 is smaller than L4. L1 is the distance between the side of the first through-hole 111 closest to the first edge 160 and the first edge 160, L2 is the distance between the side of the first through-hole 111 closest to the second edge 170 and the second edge 170, L3 is the distance between the side of the second through-hole 121 closest to the first edge 160 and the first edge 160, and L4 is the distance between the side of the second through-hole 121 closest to the second edge 170 and the second edge 170.

[0042] According to the above structural design, the first through-hole 111 and the second through-hole 121 of the modular diode 100 in this embodiment are positioned relatively close to the first edge 160 of the modular diode 100 and relatively offset from the central axis of the modular diode 100 perpendicular to the first direction, substantially aligning with the positions of the two through-holes in a conventional axial diode. Therefore, when the modular diode 100 in this embodiment and a conventional axial diode are used in a junction box, the busbar insertion position can be unified, thereby achieving a unified junction box structure and reducing the manufacturing cost of the junction box.

[0043] Reference Figure 1 As shown, the first through-hole 111 and the second through-hole 121 are arranged so that L1 equals L3, and the first through-hole 111 and the second through-hole 121 are arranged so that L2 equals L4. That is, the first through-hole 111 and the second through-hole 121 are equidistant from the first edge 160 on their sides and equidistant from the second edge 170 on their sides.

[0044] Furthermore, the first through-hole 111 and the second through-hole 121 are symmetrical about a reference axis, and the reference axis is parallel to the first direction, that is, the first through-hole 111 and the second through-hole 121 are arranged on a straight line perpendicular to the first direction.

[0045] It should be understood that the contours of the first edge 160 and the second edge 170 in this embodiment extend approximately along a straight line and are approximately parallel. Due to material deformation, processing errors, and assembly errors, the positions of the first through-hole 111, the second through-hole 121, the first edge 160, and the second edge 170 in the actual product may differ slightly from those in the design drawings, resulting in L1 being approximately equal to L3 and L2 being approximately equal to L4. Therefore, when the structural design of this embodiment is applied to actual products, it is not required that L1 be exactly equal to L3 and L2 be exactly equal to L4. It is sufficient that L1 be approximately equal to L3 and L2 be approximately equal to L4.

[0046] In addition, in other embodiments, the lengths of the first conductive sheet 110 and the second conductive sheet 120 in the first direction are not the same, L1 may not be equal to L3, and L2 may not be equal to L4. In this case, the first through-hole 111 and the second through-hole 121 should be symmetrical about a reference axis parallel to the first direction as much as possible.

[0047] Reference Figure 2 As shown, in this embodiment, the distance between the side of the diode chip 130 close to the first edge 160 and the first edge 160 is L5, and the distance between the side close to the second edge 170 and the second edge 170 is L6, where L5 is greater than L6, that is, the position of the diode chip 130 is relatively close to the second edge 170 and relatively far away from the first edge 160.

[0048] Furthermore, the diode chip 130 and the second through-hole 121 are offset in a second direction, wherein the second direction is perpendicular to the first direction. This offset provides sufficient heat dissipation space for the diode chip 130 in the second direction near the second through-hole 121, allowing heat from the diode chip 130 to be transferred away along the second direction.

[0049] Reference Figure 2 As shown, on a plane perpendicular to the second direction, there is no gap between the vertical projection of the diode chip 130 and the vertical projection of the second through-hole 121. That is, the diode chip 130 and the second through-hole 121 are completely misaligned in the second direction. Specifically, the distance between the side of the diode chip 130 away from the second edge 170 and the second edge 170 is L7, where L4 is greater than L7.

[0050] Reference Figure 1 and Figure 2 As shown, in this embodiment, a first solder pad 114 is provided on the first conductive sheet 110. The first solder pad 114 is located on the side of the first through-hole 111 away from the second through-hole 121. The first solder pad 114 is used to connect to a busbar. Similarly, a second solder pad 124 is provided on the second conductive sheet 120. The second solder pad 124 is located on the side of the second through-hole 121 away from the first through-hole 111. The second solder pad 124 is also used to connect to a busbar. Furthermore, the first solder pad 114 and the second solder pad 124 are symmetrical about the reference axis.

[0051] Reference Figure 3 As shown, in this embodiment, the first conductive sheet 110 includes a first main portion 112 and a first bent portion 113 bent from an edge of the first main portion 112 .

[0052] The first bending portion 113 can enhance the heat dissipation capability of the first conductive sheet 110 in a direction perpendicular to the plane where the first main body portion 112 is located, and can also form a foolproof structure.

[0053] Specifically, the side of the module diode 100 away from the bending direction of the first bending portion 113 can be set as the front side, and the opposite side of the front side can be set as the back side. In this way, when the installer installs the module diode 100 on other components, the front and back sides of the module diode 100 can be quickly identified by the bending direction of the first bending portion 113.

[0054] Similarly, in this embodiment, the second conductive sheet 120 includes a second main body portion 122 and a second bending portion 123 bent from the edge of the second main body portion 122. The bending direction of the second bending portion 123 is the same as that of the first bending portion 113, and the function of the second bending portion 123 is the same as that of the first bending portion 113.

[0055] Example 2:

[0056] Reference Figure 4 As shown, this embodiment provides a junction box, which includes a box body 200 and the module diode 100 of the first embodiment. The module diode 100 is disposed within the box body 200. The box body 200 includes a third through-hole 210 and a fourth through-hole 220 for the busbar to pass through. The third through-hole 210 faces the first through-hole 111, and the fourth through-hole 220 faces the second through-hole 121.

[0057] Reference Figure 4 and Figure 6 As shown, a first supporting portion extending toward the first conductive sheet 110 is provided beside the third through hole 210 of this embodiment. The first supporting portion is used to support the first conductive sheet 110 .

[0058] Likewise, a second supporting portion extending toward the second conductive sheet 120 is disposed beside the fourth through hole 220 . The second supporting portion is used to support the second conductive sheet 120 .

[0059] Reference Figure 4 and Figure 5 As shown, a first positioning post 230 and a second positioning post 240 having different cross-sectional areas are provided in the box body 200 of this embodiment. Two first positioning posts 230 and two second positioning posts 240 are provided, and the two first positioning posts 230 are relatively close to the first edge 160 of the module diode 100, and the two second positioning posts 240 are relatively close to the second edge 170 of the module diode 100.

[0060] The first conductive sheet 110 has a first positioning hole 180 that cooperates with the first positioning post 230 and a second positioning hole 190 that cooperates with the second positioning post 240 . The second conductive sheet 120 has a first positioning hole 180 that cooperates with the first positioning post 230 and a second positioning hole 190 that cooperates with the second positioning post 240 .

[0061] Compared with traditional positioning holes, the differentiated first positioning holes 180 and second positioning holes 190 provided in this embodiment can form a fool-proof structure. When the installer installs the module diode 100 on other components, the positions of the first positioning holes 180 and the second positioning holes 190 can be used to quickly identify the corresponding installation positions of the first conductive sheet 110 and the second conductive sheet 120 and the front and back sides of the module diode 100.

[0062] In other embodiments, the positions and numbers of the first positioning holes 180 and the second positioning holes 190 can also be adaptively adjusted. As an example, the first positioning holes 180 are only provided on the first conductive sheet 110 , and the second positioning holes 190 are only provided on the second conductive sheet 120 .

[0063] In summary, it should be ensured that at least one of the first conductive sheet 110 and the second conductive sheet 120 is provided with a first positioning hole 180 , and at least one of the first conductive sheet 110 and the second conductive sheet 120 is provided with a second positioning hole 190 .

[0064] Reference Figure 4 As shown, in order to improve the heat dissipation efficiency of the first conductive sheet 110 and the second conductive sheet 120 , the junction box in this embodiment further includes a first heat dissipation sheet 300 in contact with the surface of the first conductive sheet 110 and a second heat dissipation sheet 400 in contact with the surface of the second conductive sheet 120 .

[0065] Specifically, the first heat sink 300 is located on a side of the first conductive sheet 110 close to the first support portion, and the first heat sink 300 is inserted through the first positioning post 230 close to the first conductive sheet 110. Similarly, the second heat sink 400 is located on a side of the first conductive sheet 110 close to the first support portion, and the second heat sink 400 is inserted through the first positioning post 230 close to the second conductive sheet 120.

[0066] Example 3:

[0067] This embodiment provides a junction box assembly, which includes a positive junction box, a negative junction box, and several intermediate junction boxes. The positive junction box, the negative junction box, and the intermediate junction boxes are all the junction boxes in the second embodiment.

[0068] Example 4:

[0069] This embodiment provides a photovoltaic assembly, which includes the junction box assembly in the third embodiment.

[0070] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0071] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A module diode, characterized in that: include: A first conductive sheet and a second conductive sheet, the first conductive sheet and the second conductive sheet are spaced apart from each other in a plane, the first conductive sheet is provided with a first through-hole for a bus bar to pass through, and the second conductive sheet is provided with a second through-hole for a bus bar to pass through; a diode chip, disposed on the second conductive sheet and electrically connected to the first conductive sheet and the second conductive sheet; an insulator, covering the diode chip and extending between the first through-hole and the second through-hole; The module diode includes a first edge and a second edge opposite to each other in a first direction, and the first through-hole and the second through-hole are arranged to satisfy L1 less than L2, and L3 less than L4, where L1 is the distance between the side of the first through-hole close to the first edge and the first edge, L2 is the distance between the side of the first through-hole close to the second edge and the second edge, L3 is the distance between the side of the second through-hole close to the first edge and the first edge, and L4 is the distance between the side of the second through-hole close to the second edge and the second edge.

2. The module diode according to claim 1, characterized in that: The diode chip is configured to satisfy L5 greater than L6, wherein L5 is the distance between the side of the diode chip close to the first edge and the first edge, and L6 is the distance between the side of the diode chip close to the second edge and the second edge; and / or, The first perforation and the second perforation are configured to satisfy L1 equal to L3; and / or, The first perforation and the second perforation are configured to satisfy L2 equal to L4; and / or, The first through-hole and the second through-hole are symmetrical about a reference axis, and the reference axis is parallel to the first direction; and / or, The diode chip and the second through hole are staggered in a second direction, and the second direction is perpendicular to the first direction.

3. The module diode according to claim 2, characterized in that: On a plane perpendicular to the second direction, no space exists between a vertical projection of the diode chip and a vertical projection of the second through-hole.

4. The module diode according to claim 1, characterized in that: The first conductive sheet includes a first main body portion and a first bent portion bent from an edge of the first main body portion; and / or, The second conductive sheet includes a second main body portion and a second bent portion bent from an edge of the second main body portion; and / or, A first pad for connecting to a bus bar is provided on the first conductive sheet, and the first pad is located on a side of the first through-hole away from the second through-hole; and / or, A second pad for connecting to a bus bar is provided on the second conductive sheet. The second pad is located on a side of the second through-hole away from the first through-hole.

5. The module diode according to claim 4, characterized in that: The first pad and the second pad are symmetrical about a reference axis, and the reference axis is parallel to the first direction.

6. A junction box, characterized in that: The junction box comprises: The box body includes a third through hole and a fourth through hole for the bus bar to pass through; The module diode according to any one of claims 1 to 5, wherein the module diode is arranged in a box; The third through-hole faces the first through-hole, and the fourth through-hole faces the second through-hole.

7. The junction box according to claim 6, characterized in that: The junction box further includes a first heat sink in contact with the surface of the first conductive sheet; and / or, The junction box further includes a second heat sink in surface contact with the second conductive sheet; and / or, The junction box further includes a first supporting portion extending from a side of the third through-hole toward the first conductive sheet, the first supporting portion being used to support the first conductive sheet; and / or, The junction box further includes a second supporting portion extending from a side of the fourth through hole toward the second conductive sheet, wherein the second supporting portion is used to support the second conductive sheet.

8. The junction box according to claim 6, characterized in that: A first positioning post and a second positioning post with different cross-sectional areas are provided in the box body, at least one of the first conductive sheet and the second conductive sheet is provided with a first positioning hole that cooperates with the first positioning post, and at least one of the first conductive sheet and the second conductive sheet is provided with a second positioning hole that cooperates with the second positioning post.

9. A junction box assembly, characterized in that: The junction box assembly includes a positive junction box, a negative junction box, and several intermediate junction boxes. The positive junction box, the negative junction box, and the intermediate junction boxes are all the junction boxes according to any one of claims 6 to 8.

10. A photovoltaic module, characterized in that: The photovoltaic assembly includes the junction box assembly according to claim 9.

Images