Display device

Abstract

The utility model relates to a display device. The display device includes: a panel including a display panel and a support panel supporting the display panel; a cover window covering the display panel at a side opposite to the support panel; and a resin structure disposed along a periphery of the panel at a side opposite to the cover window, with the panel between the resin structure and the cover window, in which an outer circumferential surface of the resin structure includes a recessed surface curved toward a center of the panel in a plan view.

Description

[0001] This application is a divisional application of the utility model application with the application date of December 27, 2023, application number 202323578168.4, and invention name “Display device and device for manufacturing display device”

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims priority from Korean Patent Application No. 10-2022-0191046 filed on December 30, 2022, in the Korean Intellectual Property Office, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0004] One or more embodiments relate to a display device and an apparatus for manufacturing the display device, and more particularly, to a display device and an apparatus for manufacturing the display device in which the quality of a resin structure of the display device is improved. Background Art

[0005] Recently, electronic devices have become widely used. Various electronic devices such as mobile electronic devices and stationary electronic devices are used, and such electronic devices include display devices capable of providing visual information such as images or videos to users to support various functions.

[0006] Recently, as various components for driving the display device have become miniaturized, the importance of the display device for electronic equipment has been increasing, and a structure of curved flat display device has been developed.

[0007] Furthermore, the display apparatus includes a resin structure connected to the electronic device. Utility Model Content

[0008] One or more embodiments include a display device having improved quality of a resin structure of the display device and an apparatus for manufacturing the display device.

[0009] According to one or more embodiments, an apparatus for manufacturing a display device includes: a first mold including an open surface for accommodating a display module; a second mold surrounding the first mold and accommodating the first mold; and a third mold coupled to the second mold such that the third mold covers the accommodated display module. The modulus of the first mold is lower than that of the second mold.

[0010] The first mold may include silicon, and the second mold may include metal.

[0011] The first mold may include a groove formed along a periphery of the received display module, wherein the groove is concave in a thickness direction of the first mold.

[0012] The groove can be defined by a vertical portion of the first mold, a horizontal portion of the first mold, and a protruding convex portion of the first mold, wherein the vertical portion contacts the periphery of the display module and extends in a direction perpendicular to the display surface of the display module, the horizontal portion extends from the vertical portion toward the center of the first mold in a plan view, and the protruding convex portion protrudes from the horizontal portion toward the display module.

[0013] In a plan view, a radius of an outer periphery of the groove may be smaller than a radius of an outer periphery of the display module.

[0014] The vertical portion may be chamfered at the entrance to the groove.

[0015] A portion where the vertical portion and the horizontal portion are connected to each other may be chamfered.

[0016] The apparatus may further include: an injection portion through which resin is injected into an encapsulation space formed by the groove and the display module accommodated in the first mold; and a discharge portion through which overflowed resin in the resin is discharged after the encapsulation space is completely filled with the resin, wherein, in a plan view, each of the injection portion and the discharge portion may be positioned inward from the groove in a radial direction in a plan view.

[0017] The injection portion and the discharge portion may be arranged symmetrically with respect to a center of the first mold in a plan view.

[0018] Each of the injection portion and the discharge portion may be a through hole extending in a direction perpendicular to a display surface of the display module.

[0019] The inner surfaces of the injection portion and the discharge portion may include the same material as that of the first mold.

[0020] The first mold may further include an additional groove extending from the groove toward a center of the first mold in a plan view, and each of the injection portion and the discharge portion may be connected to the additional groove.

[0021] The additional groove may include a first additional groove connected to the injection portion and a second additional groove connected to the discharge portion, and the first additional groove and the second additional groove may be symmetrically arranged with respect to a center of the first mold in a plan view.

[0022] The depth of the additional groove may be smaller than the depth of the groove.

[0023] The apparatus may further include a coupling portion coupling the second mold and the third mold. The coupling portion may include a coupling hole penetrating one of the second mold and the third mold and a portion of the other of the second mold and the third mold, and a fixing member inserted into the coupling hole.

[0024] According to one or more embodiments, a display device includes: a panel including a display panel and a support panel supporting the display panel; a cover window covering the display panel on a side opposite to the support panel and larger than the display panel in a plan view; and a resin structure provided along a periphery of the panel on a side opposite to the cover window, with the panel between the resin structure and the cover window. An outer circumferential surface of the resin structure includes a concave surface that is curved toward the center of the panel in a plan view.

[0025] The resin structure may include: a circumferential member forming a closed loop along a periphery of the panel; and a circumferential protruding portion protruding from the circumferential member toward a center of the panel in a plan view.

[0026] The thickness of the circumferential protruding portion may be smaller than the thickness of the circumferential member.

[0027] The circumferential protruding portion may include a first circumferential protruding portion and a second circumferential protruding portion.The first circumferential protruding portion and the second circumferential protruding portion may be symmetrically arranged with respect to a center of the panel in a plan view.

[0028] The resin structure may further include a cutting post protruding in a direction away from the surface of the panel, wherein the cutting post may be closer to the panel than the circumferential member in the thickness direction.

[0029] According to one or more embodiments, a method for manufacturing a display device includes: accommodating a first mold in a second mold, and accommodating a display module in the second mold, wherein the first mold includes a groove formed along a periphery of the display module; connecting a third mold to the second mold so that the third mold covers the display module; injecting resin through an injection portion and into the groove, wherein the injection portion penetrates the first mold and the second mold; curing the resin by performing a thermal curing process so that a resin structure is formed along the periphery of the display module, wherein a circumferential protrusion of the resin structure is formed at a position corresponding to the injection portion and the discharge portion; and removing the first mold, the second mold, and the third mold from the display module, and cutting residues of the resin so that a cutting column protruding from the circumferential protrusion of the resin structure is formed.

[0030] The display module may include a cover window and a panel, the vertical portion of the first mold may surround an outer periphery of the cover window of the display module, the horizontal portion may extend from the vertical portion in an inward radial direction, and the protruding boss portion may protrude from the horizontal portion toward the panel.

[0031] The second mold and the third mold may be coupled to each other through a coupling hole and a fixing member including a screw thread.

[0032] Resin may be injected into the first additional groove connected to the groove. The injected resin may completely fill the packaging space between the groove and the display module, and overflowing resin in the injected resin may be discharged through the discharge portion penetrating the first mold and the second mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a perspective view of a display device according to an embodiment.

[0034] Figure 2 According to the implementation method Figure 1 sectional view of the display panel taken along line II-II'.

[0035] Figure 3 is a bottom view of a display device according to an embodiment.

[0036] Figure 4 According to the implementation method Figure 3 1 is a cross-sectional view of the display device taken along line IV-IV'.

[0037] Figure 5 According to the implementation method Figure 3 A cross-sectional view of the display device taken along line V-V'.

[0038] Figure 6A and Figure 6B is a perspective view of an apparatus for manufacturing a display device according to an embodiment.

[0039] Figure 7 According to the implementation method Figure 6B sectional view of an apparatus for manufacturing a display apparatus taken along line VII-VII'.

[0040] Figure 8 According to the implementation method Figure 6B 1 is a cross-sectional view of an apparatus for manufacturing a display apparatus taken along line VIII-VIII'.

[0041] Figure 9 is a cross-sectional view of an apparatus for manufacturing a display apparatus according to another embodiment.

[0042] Figures 10 to 14 A method of manufacturing a display device according to an embodiment is shown. DETAILED DESCRIPTION

[0043] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals may represent like elements throughout. In this regard, the embodiments may have different forms and should not be construed as limited to the descriptions set forth herein.

[0044] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same reference numerals may be given to the same or substantially the same elements, and the description will not be repeated.

[0045] It will be understood that when a layer, region or element is referred to as being formed “on” another layer, region or element, it can be directly or indirectly formed on the other layer, region or element.

[0046] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0047] When a certain embodiment can be implemented differently, a specific process order can be performed differently from the described order. For example, two consecutively described processes can be performed substantially simultaneously, or in a reverse order to the described order.

[0048] Figure 1 is a perspective view of a display device 1 according to an embodiment.

[0049] refer to Figure 1 In an embodiment, the display apparatus 1 may display a video image or a still image and provide a screen for inputting or outputting data to or from an electronic device. Figure 1 An embodiment of a display device 1 that can be used in a smartwatch is shown. However, the display device 1 is not necessarily limited thereto, and the display device 1 can be used as a display screen that is used not only for portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, or ultra-mobile PCs (UMPCs), but also for various other products such as televisions, notebook computers, monitors, broadcast panels, or Internet of Things (IoT) devices. In addition, the display device 1 according to the embodiment can be used in electronic devices such as wearable devices including smartwatches, watch phones, glasses-type displays, or head-mounted displays (HMDs). In addition, the display device 1 according to the embodiment can be used as a display screen for various other electronic devices (such as: a central information display (CID) on a vehicle's instrument panel or a central instrument panel or instrument panel of a vehicle; a room mirror display that replaces a vehicle's side mirror; or a display provided on the rear surface of a front seat as an entertainment device for passengers in the rear seat of a vehicle).

[0050] like Figure 1As shown in , the display device 1 may have an approximately circular shape. However, embodiments of the present disclosure are not necessarily limited thereto. For example, in other embodiments, the display device 1 has a polygonal shape such as an approximately rectangular shape or an elliptical shape. For example, in an embodiment, the display device 1 generally has a rectangular planar shape having short sides extending in a first direction such as the x-direction and long sides extending in a second direction such as the y-direction. Alternatively, in an embodiment, the display device 1 has a rectangular planar shape having long sides extending in the first direction and short sides extending in the second direction, or may have a square shape having sides of equal length extending in the first and second directions. Hereinafter, for ease of description, the following will be mainly described. Figure 1 The display device 1 shown in FIG. 1 has a case in which the display device 1 has an approximately circular shape.

[0051] The display apparatus 1 includes a display module 500 and a resin structure 400 . The display module 500 includes a panel 30 and a cover window CW, and the panel 30 includes a display panel 10 and a support panel 20 .

[0052] The display panel 10 displays information processed by the display device 1. For example, the display panel 10 displays execution information of an application being executed by the display device 1 or displays user interface (UI) or graphic user interface (GUI) information based on the execution information.

[0053] The display panel 10 includes a display element. For example, the display panel 10 is an organic light-emitting display panel using organic light-emitting diodes, a micro light-emitting diode display panel using micro light-emitting diodes, a quantum dot light-emitting display panel using quantum dot light-emitting diodes including quantum dot emission layers, or an inorganic light-emitting display panel using inorganic light-emitting diodes including inorganic semiconductors. Hereinafter, the case where the display panel 10 includes an organic light-emitting display panel using organic light-emitting diodes as display elements will be mainly described in detail.

[0054] In addition, the display panel 10 includes a display area DA and a peripheral area PA. According to an embodiment, the display area DA is used to display an image and has a circular shape. However, the display area DA is not necessarily limited thereto and may have a polygonal shape such as a rectangular shape or an elliptical shape.

[0055] Pixels PX are arranged in the display area DA. The display panel 10 provides an image by using light emitted from the pixels PX. Each pixel PX emits light using a display element. According to an embodiment, each pixel PX emits one of red light, green light, and blue light. According to an embodiment, each pixel PX emits one of red light, green light, blue light, and white light.

[0056] The peripheral area PA corresponds to a non-display area that does not provide an image. The peripheral area PA at least partially surrounds the display area DA. For example, in one embodiment, the peripheral area PA completely surrounds the display area DA. Drivers that provide electrical signals to pixels PX, power lines that transmit power to pixels PX, and the like are arranged in the peripheral area PA.

[0057] According to an embodiment, the peripheral area PA includes an adjacent area AA, a bendable area BA, and a pad area PDA. The adjacent area AA is adjacent to the display area DA and surrounds the display area DA.

[0058] The pad area PDA is spaced apart from the adjacent area AA. A driver that provides a signal or voltage to the pixel PX is provided in the pad area PDA. According to an embodiment, a display circuit board is connected to the pad area PDA. The display circuit board may include a bendable flexible printed circuit board (FPCB) or a substantially rigid rigid printed circuit board (RPCB). Alternatively, in an embodiment, the display circuit board includes a composite printed circuit board including both the RPCB and the FPCB.

[0059] A driver that provides electrical signals or supplies power to the pixels PX is provided on the display circuit board.

[0060] The bendable area BA is provided between the adjacent area AA and the pad area PDA. The display panel 10 bends within the bendable area BA. For example, the display panel 10 can bend within the bendable area BA to curve in a thickness direction perpendicular to the display surface. Consequently, at least a portion of the lower surface of the display panel 10 faces each other, and the pad area PDA of the display panel 10 is arranged below the display area DA. Consequently, the area of ​​the peripheral area PA visible to the user can be reduced.

[0061] The support panel 20 is provided below the display panel 10, on a surface opposite to the display surface of the display panel 10. The support panel 20 supports the display panel 10 and protects the display panel 10 from external impact. According to an embodiment, the support panel 20 is provided on a surface opposite to the display panel 10, and then the display panel 10 is bent in the bendable area BA. Therefore, the support panel 20 is arranged between the display area DA and the pad area PDA of the display panel 10.

[0062] The cover window CW is provided on the display surface of the display panel 10 and covers the display surface of the display panel 10. The cover window CW protects the display panel 10. The cover window CW includes a transmissive material and includes glass or a polymer resin. The cover window CW includes, for example, a polymer resin such as at least one of polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, and cellulose acetate propionate.

[0063] The resin structure 400 is arranged below the display module 500, on the opposite surface of the display module 500. For example, the resin structure 400 is provided on a side opposite to the cover window CW, and the display panel 10 and the support panel 20 are interposed between the resin structure 400 and the cover window CW. According to an embodiment, the resin structure 400 has a closed loop along the periphery of the display module 500. However, according to an embodiment, the resin structure 400 is provided only on a portion of the periphery of the display module 500 and is spaced apart from the display module 500. For example, when the display module 500 has a rectangular shape, the resin structure 400 is provided on one of the four sides forming the periphery of the display module 500. Hereinafter, for the convenience of description, the case where the resin structure 400 is a closed loop along the periphery of the display module 500 will be mainly described.

[0064] Figure 2 According to the implementation method Figure 1 1 is a cross-sectional view of the display panel 10 taken along line II-II′.

[0065] refer to Figure 2 In an embodiment, the display panel 10 includes a substrate 100 , a buffer layer 111 , a pixel circuit layer PCL, a display element layer DEL, and an encapsulation layer 300 .

[0066] The substrate 100 may include glass or a polymer resin such as at least one of polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate. According to an embodiment, the substrate 100 has a multilayer structure including a base layer containing the polymer resin described above and a barrier layer. The substrate 100 including the polymer resin is flexible, rollable, or bendable.

[0067] The buffer layer 111 is provided on the substrate 100. The buffer layer 111 includes SiN x , SiON and SiO2, and may include a single layer or a multilayer including the inorganic insulating materials described above.

[0068] The pixel circuit layer PCL is disposed on the buffer layer 111. The pixel circuit layer PCL includes a thin film transistor (TFT) in the pixel circuit, an inorganic insulating layer IIL disposed below and / or above the thin film transistor (TFT) components, a first planarization layer 115, and a second planarization layer 116. The inorganic insulating layer IIL includes a first gate insulating layer 112, a second gate insulating layer 113, and an interlayer insulating layer 114.

[0069] The thin film transistor (TFT) includes a semiconductor layer A, which may include polycrystalline silicon. Alternatively, the semiconductor layer A may include at least one of amorphous silicon, an oxide semiconductor, and an organic semiconductor. The semiconductor layer A includes a channel region, and a drain region and a source region disposed on either side of the channel region. A gate electrode G overlaps the channel region.

[0070] The gate electrode G includes a low-resistance metal. The gate electrode G includes a conductive material including at least one of Mo, Al, Cu, Ti, etc., and may include a multilayer or single layer including the conductive material described above.

[0071] The first gate insulating layer 112 is interposed between the semiconductor layer A and the gate electrode G and includes an inorganic insulating material such as SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2 and ZnO x At least one of the following. ZnO x Comprises ZnO and / or ZnO2.

[0072] The second gate insulating layer 113 is provided on the first gate insulating layer 112 and covers the gate electrode G. Similar to the first gate insulating layer 112, the second gate insulating layer 113 includes an inorganic insulating material such as SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2 and ZnO x At least one of the following. ZnO x Comprises ZnO and / or ZnO2.

[0073] The upper electrode CE2 of the storage capacitor Cst is disposed above the second gate insulating layer 113. The upper electrode CE2 overlaps the gate electrode G located therebelow. The gate electrode G and the upper electrode CE2, overlapping with the second gate insulating layer 113 therebetween, form the storage capacitor Cst of the pixel circuit. For example, the gate electrode G functions as the lower electrode CE1 of the storage capacitor Cst. As described above, the storage capacitor Cst and the thin-film transistor TFT overlap. According to some embodiments, the storage capacitor Cst does not overlap the thin-film transistor TFT.

[0074] The upper electrode CE2 includes at least one of Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Ca, Mo, Ti, W, and Cu, and may include a single layer or a multilayer including the above-described materials.

[0075] The interlayer insulating layer 114 is disposed on the second gate insulating layer 113 and covers the upper electrode CE2. The interlayer insulating layer 114 includes SiO2, SiN x, SiON, Al2O3, TiO2, Ta2O5, HfO2 and ZnO x At least one of the following. ZnO x Includes ZnO and / or ZnO 2. The interlayer insulating layer 114 may include a single layer or multiple layers including the inorganic insulating material described above.

[0076] Each of the drain electrode D and the source electrode S is disposed on the interlayer insulating layer 114. The drain electrode D and the source electrode S each include a highly conductive material. For example, the highly conductive material includes at least one of Mo, Al, Cu, and Ti, and may include a multilayer or single layer containing the above materials. According to an embodiment, the drain electrode D and the source electrode S each have a multilayer structure of Ti / Al / Ti.

[0077] The first planarization layer 115 is provided on the interlayer insulating layer 114 and covers the drain electrode D and the source electrode S. The first planarization layer 115 includes an organic insulating layer. The first planarization layer 115 includes an organic insulating material, such as a general polymer (such as polymethyl methacrylate (PMMA) or polystyrene (PS)), a polymer derivative including a phenol group, an acryl polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and a blend thereof.

[0078] The connection electrode CML is disposed on the first planarization layer 115. The connection electrode CML is connected to one of the drain electrode D and the source electrode S through a contact hole in the first planarization layer 115. The connection electrode CML comprises a highly conductive material. The highly conductive material includes at least one of Mo, Al, Cu, and Ti, and may include multiple layers or a single layer containing the above conductive materials. In some embodiments, the connection electrode CML has a multilayer structure of Ti / Al / Ti.

[0079] The second planarization layer 116 is disposed on the first planarization layer 115 and covers the connection electrode CML. The second planarization layer 116 includes an organic insulating layer. The organic insulating layer includes an organic insulating material, such as a general polymer (such as PMMA or PS), a polymer derivative having a phenol group, an acryl polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and a blend thereof.

[0080] The display element layer DEL is disposed on the pixel circuit layer PCL. The display element layer DEL is disposed on the second planarization layer 116 of the pixel circuit layer PCL. The display element layer DEL includes a display element DE. The display element DE includes an organic light emitting diode (OLED). The pixel electrode 211 of the display element DE is electrically connected to the connection electrode CML through a contact hole in the second planarization layer 116.

[0081] The pixel electrode 211 includes a conductive oxide such as at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and aluminum zinc oxide (AZO). According to an embodiment, the pixel electrode 211 includes a reflective layer containing at least one of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and compounds thereof. According to an embodiment, the pixel electrode 211 further includes a layer including at least one of ITO, IZO, ZnO, and In2O3 above / below the reflective layer described above.

[0082] A pixel defining layer 118 including an opening 118OP exposing a central portion of the pixel electrode 211 is disposed on the pixel electrode 211 and the second planarization layer 116. The pixel defining layer 118 may include an organic insulating material and / or an inorganic insulating material. The opening 118OP defines an emission area EA for light emitted from the display element DE. For example, the width of the opening 118OP corresponds to the width of the emission area EA of the display element DE.

[0083] According to an embodiment, the pixel defining layer 118 includes a light-shielding material and is black. The light-shielding material includes at least one of a resin and a paste containing carbon black, carbon nanotubes, a black dye, metal particles such as one of Ni, Al, Mo, and alloys thereof, metal oxide particles such as chromium oxide, metal nitride particles such as chromium nitride, etc. When the pixel defining layer 118 includes the light-shielding material, reflection of external light caused by the metal structure below the pixel defining layer 118 can be reduced.

[0084] Spacers 119 are provided on the pixel-defining layer 118. When manufacturing the display device 1, the spacers 119 prevent cracking of the substrate 100. A mask sheet is used in the manufacturing process of the display panel 10. When the mask sheet is inserted into the opening 118OP of the pixel-defining layer 118 or adhered to the pixel-defining layer 118 to deposit a deposition material on the substrate 100, the spacers 119 prevent damage or cracking of a portion of the substrate 100 that may be caused by the mask sheet.

[0085] In an embodiment, the spacer 119 includes an organic insulating material such as polyimide. In some embodiments, the spacer 119 includes an organic insulating material such as SiN xor an inorganic insulating material of SiO2, or an organic insulating material and an inorganic insulating material.

[0086] According to an embodiment, the spacer 119 includes a different material from the pixel defining layer 118. Alternatively, according to an embodiment, the spacer 119 includes the same material as the pixel defining layer 118, and the pixel defining layer 118 and the spacer 119 are formed together by a mask process using a half-tone mask or the like.

[0087] The intermediate layer 212 of the OLED is disposed on the pixel defining layer 118 and the pixel electrode 211. The intermediate layer 212 includes an emission layer 212b disposed on the pixel electrode 211 in the opening 118OP of the pixel defining layer 118. The emission layer 212b includes a high molecular weight organic material or a low molecular weight organic material that emits light of a predetermined color.

[0088] The first functional layer 212a and the second functional layer 212c are respectively arranged below and above the emission layer 212b. The first functional layer 212a is arranged below the emission layer 212b and includes, for example, a hole transport layer (HTL) or an HTL and a hole injection layer (HIL). The second functional layer 212c is arranged above the emission layer 212b and can be selectively arranged. The second functional layer 212c includes an electron transport layer (ETL) and / or an electron injection layer (EIL). The first functional layer 212a and / or the second functional layer 212c form a common layer that completely covers the substrate 100, and the common layer also includes, for example, the relative electrode 213 to be described below.

[0089] The counter electrode 213 of the OLED is disposed on the intermediate layer 212 and includes a conductive material having a low work function. For example, the counter electrode 213 includes a (semi-)transparent layer containing at least one of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, and alloys thereof. Alternatively, in an embodiment, the counter electrode 213 further includes a layer including at least one of ITO, IZO, ZnO, and In2O3 on the (semi-)transparent layer.

[0090] According to some embodiments, a capping layer is further disposed on the opposite electrode 213. The capping layer may include an inorganic material such as LiF or / and an organic material.

[0091] The encapsulation layer 300 is disposed on the opposite electrode 213. According to an embodiment, the encapsulation layer 300 includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. Figure 2 It is shown that the encapsulation layer 300 includes a first inorganic encapsulation layer 310 , an organic encapsulation layer 320 , and a second inorganic encapsulation layer 330 , which are sequentially stacked.

[0092] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 include aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, ZnO, SiO x 、SiN x and SiON. The organic encapsulation layer 320 includes a polymer-based material. The polymer-based material includes at least one of an acryl resin, an epoxy resin, a polyimide, and a polyethylene. According to an embodiment, the organic encapsulation layer 320 includes acrylate.

[0093] Figure 3 is a bottom view of the display apparatus 1 according to the embodiment. Figure 4 According to the implementation method Figure 3 1 is a cross-sectional view of the display device 1 taken along line IV-IV′. Figure 5 According to the implementation method Figure 3 A cross-sectional view of the display device 1 taken along line VV′.

[0094] refer to Figure 3 and Figure 4 In an embodiment, a cover window CW is provided on the display surface of the panel 30. In a plan view, the cover window CW is larger than the panel 30 to cover the panel 30.

[0095] The resin structure 400 is provided on the opposite side of the display surface of the panel 30. When the display apparatus 1 is used in an electronic device, the resin structure 400 provides a connection point through which the display apparatus 1 is coupled to the electronic device.

[0096] According to an embodiment, the resin structure 400 includes a resin. As described below, the resin structure 400 is formed by injecting the resin into a mold in which the display module 500 is accommodated and curing the resin.

[0097] The resin structure 400 includes a circumferential member 410. The circumferential member 410 is a closed ring formed along the periphery of the display module 500. The circumferential member 410 covers the lower surface of the periphery of the cover window CW (such as at Figure 4 -z direction surface), and covers the lower surface of the periphery of the panel 30 (such as Figure 4 surface in the -z direction).

[0098] According to an embodiment, the circumferential member 410 includes a first surface 411, a second surface 412, and a third surface 413. The first surface 411 is in the thickness direction (such as Figure 4) in the z-direction, extending from the cover window CW. The first surface 411 forms the outer periphery of the circumferential member 410. According to an embodiment, the first surface 411 is a concave surface that is curved inwardly. For example, the first surface 411 is a curved surface that is concave in a direction from the periphery of the display module 500 toward the center of the display module 500. This may be due to the manufacturing process of the resin structure 400 as described below. The resin structure 400 is manufactured by using a mold with a low modulus (such as silicon), and the mold is pressed to be concave inwardly, and thus the circumferential member 410 is provided with a curved concave surface.

[0099] The second surface 412 is perpendicular to the thickness direction (ie, such as Figure 4 The second surface 412 extends from the first surface 411 toward the center of the display module 500 in a plan view in the y or −y direction of the circumferential member 410. The second surface 412 forms a lower boundary of the circumferential member 410.

[0100] The third surface 413 extends from the second surface 412 in an approximately thickness direction and is connected to the panel 30. According to the embodiment, the third surface 413 is connected to the panel 30 at an inclination, but is not necessarily limited thereto.

[0101] refer to Figure 3 and Figure 5 According to an embodiment, the resin structure 400 further includes a circumferential protrusion 420. The circumferential protrusion 420 extends in an inward radial direction, ie, a direction toward the center of the display module 500 (such as Figure 5 The circumferential protruding portion 420 protrudes from the third surface 413 in an inward radial direction, such as a direction toward the center of the display module 500.

[0102] According to an embodiment, the circumferential protrusion 420 includes a first circumferential protrusion 421 and a second circumferential protrusion 422. In a plan view, the first circumferential protrusion 421 and the second circumferential protrusion 422 are spaced apart from each other along the circumference of the circumferential member 410. In other words, the circumferential angle between the first circumferential protrusion 421 and the second circumferential protrusion 422 relative to the center of the display module 500 may be greater than 0 degrees and less than or equal to 180 degrees.

[0103] In an embodiment, the first circumferential protruding portion 421 and the second circumferential protruding portion 422 are arranged symmetrically in a plan view relative to the center of the display module 500. For example, the circumferential angle between the first circumferential protruding portion 421 and the second circumferential protruding portion 422 relative to the center of the display module 500 is 180 degrees. As described below, this is because the portion into which the resin is injected and the portion from which the resin is ejected to manufacture the resin structure 400 are arranged opposite to each other.

[0104] Furthermore, the thickness t1 of the first circumferential protrusion 421 is smaller than the thickness of the circumferential member 410 (i.e., the distance h from the surface of the panel 30 to the second surface 412 of the circumferential member 410). Furthermore, the thickness t2 of the second circumferential protrusion 422 is smaller than the thickness of the circumferential member 410 (i.e., the distance h from the surface of the panel 30 to the second surface 412 of the circumferential member 410). As described below, this is because the portion into which the resin is injected and the portion from which the resin is ejected to produce the resin structure 400 are located closer to the panel 30 than the second surface 412.

[0105] According to an embodiment, the resin structure 400 further includes a cutting post 430. The cutting post 430 is formed in a Figure 5 The cutting post 430 protrudes from the circumferential protrusion 420 in the -z direction, away from the surface of the panel 30. The cutting post 430 includes a first cutting post 431 protruding from the first circumferential protrusion 421 and a second cutting post 432 protruding from the second circumferential protrusion 422. The sum of the thickness t1 of the first circumferential protrusion 421 and the thickness t3 of the first cutting post 431 is less than the distance h from the surface of the panel 30 to the second surface 412 of the circumferential member 410. For example, the distance from the surface of the panel 30 to the lower surface of the first cutting post 431 is less than the distance h from the surface of the panel 30 to the second surface 412 of the circumferential member 410. For example, the first cutting post 431 is closer to the panel 30 in the thickness direction than the second surface 412 of the circumferential member 410. During the manufacturing process of the resin structure 400, the first cutting post 431 is formed by injecting resin and cutting the cured resin. The second cutting post 432 is identical or substantially identical to the first cutting post 431, and therefore, a detailed description thereof is omitted below.

[0106] Figure 6A and Figure 6B is a perspective view of an apparatus 2 for manufacturing a display device according to an embodiment. Figure 7 According to the implementation method Figure 6B sectional view of the apparatus 2 for manufacturing a display device taken along line VII-VII'. Figure 8 According to the implementation method Figure 6B sectional view of the apparatus 2 for manufacturing a display device taken along line VIII-VIII'.

[0107] refer to Figure 6A 、 Figure 6B and Figure 7 In an embodiment, the device 2 for manufacturing a display device may be a device for manufacturing a display device 1 (see Figure 1 ) of the resin structure 400 (see Figure 1) device. The device 2 can be used to manufacture the display device 1, but is not necessarily limited thereto. Hereinafter, for the convenience of description, a state in which the display module 500 is accommodated and installed in the device 2 for manufacturing the display device will be mainly described.

[0108] The apparatus 2 for manufacturing a display apparatus according to an embodiment includes a first mold 610 , a second mold 620 , and a third mold 630 .

[0109] The first mold 610 receives the display module 500. For example, the first mold 610 has an inner space and receives the display module 500 while facing the panel 30 of the display module 500. Therefore, the panel 30 of the display module 500 contacts the first mold 610, and the cover window CW of the display module 500 faces outward toward the opening.

[0110] The second mold 620 accommodates the first mold 610 by surrounding the first mold 610. The second mold 620 is arranged at the outer body of the first mold 610 and is coupled to the third mold 630. According to an embodiment, the modulus of the first mold 610 is lower than that of the second mold 620. For example, the first mold 610 includes silicon, and the second mold 620 includes metal.

[0111] The third mold 630 covers the display module 500 housed in the first mold 610 and encapsulates the first mold 610. The third mold 630 covers the display module 500 and contacts the cover window CW of the display module 500. Furthermore, the third mold 630 is combined with and fixed to the second mold 620. In some embodiments, the modulus of the third mold 630 is equal to that of the second mold 620. For example, the third mold 630 includes the same material as the second mold 620, such as metal.

[0112] Hereinafter, the shapes of the first to third molds 610 to 630 will be described in more detail. According to an embodiment, the first mold 610 includes a groove GV formed along the outer periphery of the display module 500 accommodated in the first mold 610. The groove GV forms a space that is recessed in the thickness direction of the first mold 610 along the periphery of the display module 500. According to an embodiment, the groove GV has a closed ring shape such as a ring, and the shape corresponds to the circumferential member 410 of the display module 500 described above (see FIG. Figure 4 ) shape.

[0113] The groove GV is defined by the vertical portion 611, the horizontal portion 612, and the protruding convex portion 613 of the first mold 610. For example, the vertical portion 611 forms the outer periphery of the groove GV and extends in the vertical direction (i.e., a direction perpendicular to the display surface of the display module 500). The horizontal portion 612 forms the lower surface of the groove GV and extends from the vertical portion 611 in the horizontal direction, for example, toward the center of the first mold 610 in a plan view. The protruding convex portion 613 forms the inner periphery of the groove GV, is connected to the horizontal portion 612, and protrudes in the vertical direction.

[0114] The cover window CW of the display module 500 is inserted into the outer periphery of the groove GV (i.e., the vertical portion 611). A package is formed between the vertical portion 611 and the outer periphery of the cover window CW. For example, the first mold 610 includes a low modulus material, such as silicon, and therefore, the cover window CW can be tightly inserted into the vertical portion 611 of the first mold 610. For example, according to an embodiment, the radius of the outer periphery of the groove GV is smaller than the radius of the outer periphery of the cover window CW. This allows for relatively tight packaging between the cover window CW and the first mold 610. In addition, the protruding convex portion 613 protrudes toward the display module 500 and encapsulates the display module 500.

[0115] Thus, the vertical portion 611, the horizontal portion 612, the protruding convex portion 613, and the display module 500 form a packaging space. Resin is injected into the space, and thus, the above-described circumferential member 410 is formed.

[0116] In an embodiment, the connection portion of the vertical portion 611 and the horizontal portion 612 is chamfered. This prevents incomplete filling of the resin due to the formation of bubbles at the edge between the vertical portion 611 and the horizontal portion 612 when the resin is injected into the groove GV.

[0117] Furthermore, according to an embodiment, the vertical portion 611 is chamfered at the entrance of the groove GV. For example, the groove GV has an increased outer periphery at the entrance and a gradually decreased outer periphery in the downward extending direction of the vertical portion 611. The chamfered slope allows the display module 500 to be more easily accommodated in the first mold 610.

[0118] The second mold 620 accommodates the first mold 610 by surrounding the first mold 610. The second mold 620 includes a material having greater rigidity than the first mold 610.

[0119] The third mold 630 covers the display module 500 accommodated in the first mold 610. The rigidity of the material of the third mold 630 is the same as that of the second mold 620. In addition, the third mold 630 is coupled and fixed to the second mold 620 surrounding the first mold 610 and covers the display module 500.

[0120] According to an embodiment, the apparatus 2 for manufacturing a display device further includes a coupling portion 640. The coupling portion 640 firmly couples and fixes the second mold 620 to the third mold 630. According to an embodiment, the coupling portion 640 includes a coupling hole 641 and a fixing member. In an embodiment, the coupling hole 641 penetrates the third mold 630 and penetrates a portion of the second mold 620. In an embodiment, the coupling hole 641 penetrates the second mold 620 and penetrates a portion of the third mold 630. Threads are formed in the coupling hole 641. A fixing member such as a threaded bolt is inserted into the coupling hole 641. Thus, a coupling is formed between the second mold 620 and the third mold 630. According to an embodiment, a plurality of coupling holes 641 are formed along the periphery of the second mold 620 in a plan view. For example, as Figure 6A In addition, a plurality of coupling holes 641 are formed along the periphery of the third mold 630 in a plan view. For example, as shown in FIG. Figure 6A As shown in FIG. 6 , four coupling holes 641 are formed.

[0121] As described above, according to the apparatus 2 for manufacturing a display device according to an embodiment, the mold portion into which the resin is to be injected to form the resin structure 400 includes a low-modulus material to ensure relatively strong packaging with the display module 500. In addition, the second mold 620 and the third mold 630 include a high-modulus material such as a high-rigidity material to be relatively more firmly coupled to each other.

[0122] refer to Figure 6A 、 Figure 6B and Figure 8 In an embodiment, the apparatus 2 for manufacturing a display device further includes an injection portion 660 and a discharge portion 670. The injection portion 660 provides a path for injecting resin into the packaging space formed by the first mold 610 and the display module 500. The discharge portion 670 provides a path from which the resin injected through the injection portion 660 is discharged after the groove GV is completely filled. Each of the injection portion 660 and the discharge portion 670 is formed as a through-hole penetrating the first mold 610 and the second mold 620. In addition, the inner surfaces of the injection portion 660 and the discharge portion 670 include the same material as the first mold 610.

[0123] According to an embodiment, the injection portion 660 and the discharge portion 670 are positioned inward from the groove GV in a radial direction. For example, in a plan view, the injection portion 660 and the discharge portion 670 are closer to the center of the first mold 610 than the groove GV. The injection portion 660 and the discharge portion 670 are through holes extending in a vertical direction (such as a direction perpendicular to the display surface of the display module 500). For example, the injection portion 660 and the discharge portion 670 are not connected to the groove GV, but are connected to an additional groove AGV arranged radially inward from the groove GV. For example, the first mold 610 also includes an additional groove AGV extending from the groove GV toward the center of the first mold 610 in a plan view (i.e., extending in an inward radial direction). The injection portion 660 and the discharge portion 670 are connected to the additional groove AGV. According to an embodiment, the additional groove AGV includes a first additional groove AGV1 connected to the injection portion 660 and a second additional groove AGV2 connected to the discharge portion 670. The first additional groove AGV1 is filled with resin, and therefore, the first circumferential protrusion 421 described above can be formed (see Figure 5 The second additional groove AGV2 is filled with resin, and thus, the second circumferential protrusion 422 described above can be formed (see Figure 5 ).

[0124] The injection portion 660 and the discharge portion 670 are spaced apart from each other in a plan view along the periphery of the first mold 610. For example, a circumferential angle between the injection portion 660 and the discharge portion 670 relative to the center of the first mold 610 is greater than 0 degrees and less than or equal to 180 degrees.

[0125] In an embodiment, the injection portion 660 and the discharge portion 670 are arranged symmetrically relative to the center of the first mold 610 in a plan view. For example, the circumferential angle between the injection portion 660 and the discharge portion 670 relative to the center of the first mold 610 is 180 degrees. Therefore, the entire groove GV can be substantially completely filled with resin. In addition, the first additional groove AGV1 and the second additional groove AGV2 connected to the injection portion 660 and the discharge portion 670, respectively, are arranged symmetrically relative to the center of the first mold 610 in a plan view. For example, the circumferential angle between the first additional groove AGV1 and the second additional groove AGV2 relative to the center of the first mold 610 is 180 degrees.

[0126] According to an embodiment, the additional groove AGV has a depth smaller than that of the groove GV. That is, the distance d2 from the surface of the display module 500 to the lower surface of the additional groove AGV is smaller than the distance d1 from the surface of the display module 500 to the lower surface of the groove GV. Therefore, the resin dispenser inserted into the injection portion 660 can inject the resin while being adjacent to the display module 500. In addition, the circumferential protrusion 420 (see FIG. 4 ) is formed to correspond to the additional groove AGV. Figure 5 ) is smaller than the thickness of the circumferential member 410. This allows a manufacturing process of the display apparatus in which the circumferential protruding portion 420 does not interfere when the resin structure 400 is connected to an electronic device.

[0127] Figure 9 1 is a cross-sectional view of an apparatus for manufacturing a display device according to another embodiment. Components identical to those described above are denoted by identical members, and thus repeated descriptions are omitted. In the following, only aspects different from the apparatus 2 for manufacturing a display device described above will be mainly described.

[0128] refer to Figure 9 According to an embodiment, the first mold 610 includes a 1-1st mold 610 a and a 1-2nd mold 610 b. The 1-1st mold 610 a is received in the third mold 630 , and the 1-2nd mold 610 b is received in the second mold 620 .

[0129] The display module 500 is received in the third mold 630. For example, the third mold 630 receives the display module 500 while facing the cover window CW of the display module 500. The 1-1st mold 610a is disposed at the inside of the third mold 630 and has a ring shape surrounding the display module 500 (such as the outer periphery of the cover window CW).

[0130] The second mold 620 is coupled to the third mold 630 to cover the display module 500. For example, the second mold 620 is coupled to the third mold 630 while facing the panel 30 of the display module 500. Similar to the above description, the 1-2 mold 610b includes a vertical portion 611, a horizontal portion 612, and a protruding convex portion 613, and the vertical portion 611 of the 1-2 mold 610b contacts the 1-1 mold 610a. In addition, the protruding convex portion 613 contacts the display module 500, such as the contact panel 30. Therefore, an encapsulation space can be formed between the 1-1 mold 610a, the 1-2 mold 610b, and the display module 500. Resin is injected into the encapsulation space and cured to form the resin structure 400 described above (see Figure 1 ).

[0131] In addition, according to an embodiment, the third mold 630 is divided into a plurality of components. Figure 9As shown in FIG, the third mold 630 includes a 3-1st mold 630a and a 3-2nd mold 630b. Each of the 3-1st mold 630a and the 3-2nd mold 630b receives a portion of the display module 500 and is spaced a predetermined distance apart from each other.

[0132] The distance adjustment portion 631 is provided between the 3-1st mold 630a and the 3-2nd mold 630b. The distance adjustment portion 631 can adjust the distance between the 3-1st mold 630a and the 3-2nd mold 630b. Therefore, after the display module 500 is accommodated in a state where the distance between the 3-1st mold 630a and the 3-2nd mold 630b is increased, the distance between the 3-1st mold 630a and the 3-2nd mold 630b can be reduced by using the distance adjustment portion 631. As a result, the display module 500 can be pressed more tightly against the 1-1st mold 610a, providing a relatively tighter package.

[0133] According to an embodiment, the distance adjustment portion 631 includes a clamp. For example, by tightening the clamp, the distance between the 3-1st mold 630a and the 3-2nd mold 630b can be reduced, and by loosening the clamp, the distance between the 3-1st mold 630a and the 3-2nd mold 630b can be increased. However, the distance adjustment portion 631 is not necessarily limited to the above example and can be implemented in various types.

[0134] Figures 10 to 14 A method for manufacturing a display device according to an embodiment is shown. Figure 6A 、 Figure 6B 、 Figure 7 and Figure 8 The method of manufacturing a display device is described with reference to the apparatus for manufacturing a display device shown in FIG. However, the method of manufacturing a display device is not necessarily limited thereto.

[0135] refer to Figure 10 In an embodiment, the first mold 610 is housed in the second mold 620. The display module 500 is housed in the second mold 620 (such as in the first mold 610 located inside the second mold 620). The display module 500 is housed so that a surface of the panel 30 (such as an opposite surface of the display surface) faces the first mold 610 and the second mold 620. The vertical portion 611 of the first mold 610 surrounds the outer periphery of the cover window CW of the display module 500. The horizontal portion 612 extends from the vertical portion 611 in an inward radial direction, and the protruding convex portion 613 protrudes from the horizontal portion 612 toward the panel 30. Therefore, the first mold 610 includes a groove GV formed along the periphery of the display module 500.

[0136] refer to Figure 11 In an embodiment, the third mold 630 is coupled to the second mold 620 and covers the display module 500. As described above, according to an embodiment, the second mold 620 and the third mold 630 are coupled to each other through the coupling hole and the fixing member including the screw thread.

[0137] refer to Figure 12 In an embodiment, a resin dispenser is inserted through the injection portion 660 and resin is injected into the first additional groove AGV1. Through the first additional groove AGV1, the injected resin completely fills the packaging space between the groove GV and the display module 500, and the overflowed resin is discharged through the discharge portion 670.

[0138] refer to Figure 13 In an embodiment, a thermal curing process is performed to cure the resin filling the groove GV and the additional groove AGV. Thus, the resin structure 400 is formed along the periphery of the display module 500. Furthermore, a circumferential protrusion 420 is formed at a position corresponding to the injection portion 660 and the discharge portion 670.

[0139] refer to Figure 14 In an embodiment, the device 2 for manufacturing the display device is removed. For example, the first mold 610, the second mold 620, and the third mold 630 are removed from the display module 500. In addition, the residues of the resin injected and discharged through the injection portion 660 and the discharge portion 670, respectively, are cut. Thus, the cutting posts 430 protruding from the circumferential protruding portion 420 are formed. Even when the residues of the resin are cut, the cutting posts 430 are closer to the panel 30 than the second surface 412 of the circumferential member 410 in the thickness direction. Therefore, after the residues of the resin are cut, the cutting posts 430 protrude from the circumferential protruding portion 420, and therefore, interference that may occur when the display device 1 is connected to an electronic device can be prevented.

[0140] As described above, according to one or more embodiments of the present disclosure, the quality of the resin structure of the display device is improved.

[0141] Furthermore, the resin structure of the display device can be easily formed.

[0142] Effects of the above-described one or more embodiments are not limited to those described above, and other effects that are not described may be clearly understood by those of ordinary skill in the art from the present disclosure or the claims.

[0143] It should be understood that the embodiments described herein should be considered to be descriptive only and not for purposes of limitation. The description of features or aspects within each embodiment should generally be considered to be applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made in the embodiments without departing from the spirit and scope defined by the appended claims.

Claims

1. A display device, characterized in that: include: A panel, comprising a display panel and a support panel supporting the display panel; a cover window covering the display panel at a side opposite to the support panel; as well as a resin structure provided along a periphery of the panel at a side opposite to the cover window, with the panel being between the resin structure and the cover window, Here, the outer circumferential surface of the resin structure includes a concave surface that is curved toward the center of the panel in a plan view.

2. The display device according to claim 1, wherein The resin structure comprises: a circumferential member forming a closed loop along the periphery of the panel; and A circumferential protruding portion protrudes from the circumferential member toward the center of the panel in the plan view.

3. The display device according to claim 2, wherein The thickness of the circumferential protruding portion is smaller than the thickness of the circumferential member.

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