Vacuum welding furnace for chip welding

Abstract

The utility model relates to the technical field of welding furnaces, and provides a chip welding vacuum welding furnace which comprises an upper cavity, a lower cavity, a profiling heating assembly, a plurality of upper heating pipes and a plurality of lower heating pipes. The upper cavity is arranged above the lower cavity, the upper cavity and the lower cavity form a sealed vacuum cavity, the upper heating pipe is arranged in the upper cavity, the lower heating pipe is arranged in the lower cavity, and the profiling heating assembly is arranged in the vacuum cavity. And high fitting with the workpiece is realized, and the heating uniformity is ensured. The heating device can be a plane, a curved surface or an irregular shape, and a plurality of surfaces are directly contacted for heating.

Description

Technical Field

[0001] The utility model relates to the technical field of welding furnaces, in particular to a vacuum welding furnace for chip welding. Background Art

[0002] In the prior art, vacuum welding equipment is a specialized device designed for welding workpieces. Its structure primarily includes a controller, a sealable cavity, a vacuum pump, a heating device, a heating plate, and a cooling device. The heating plate is located within the sealable cavity, and the workpiece is placed on the heating plate. The heating and cooling devices are located below the heating plate and are connected to the controller, respectively. The controller regulates the heating plate's temperature, raising or lowering the temperature. The vacuum pump is located outside the sealable cavity and evacuates the sealable cavity to ensure that the welding process is performed in an oxygen-free state, ensuring weld quality while reducing the void rate within the weld and improving weld reliability.

[0003] The vacuum welding furnace in the prior art has low heating efficiency and uneven heating. Summary of the Invention

[0004] The utility model provides a chip welding vacuum welding furnace, which is used to solve the problems of low heating efficiency and uneven heating of vacuum welding furnaces in the prior art.

[0005] A chip welding vacuum welding furnace includes an upper cavity, a lower cavity, a contoured heating component, multiple upper heating tubes and multiple lower heating tubes; the upper cavity is arranged above the lower cavity, the upper cavity and the lower cavity form a sealed vacuum cavity, the upper heating tubes are arranged in the upper cavity, the lower heating tubes are arranged in the lower cavity, and the contoured heating component is arranged in the vacuum cavity.

[0006] According to the chip welding vacuum welding furnace of the present invention, the profiling heating component includes a first heating plate and a profiling jig; the first heating plate is arranged in the vacuum chamber, the profiling jig is arranged on the first heating plate, and the profiling jig is provided with a plurality of first profiling grooves.

[0007] According to the chip welding vacuum welding furnace of the present invention, the contoured heating component includes a second heating plate and a hollow jig; the hollow jig is arranged above the second heating plate, the second heating plate is provided with a plurality of second contoured grooves, and the hollow jig is hollowed out at the positions of the second contoured grooves corresponding to the second contoured grooves.

[0008] According to the chip welding vacuum welding furnace of the present invention, it also includes an inner liner, which is arranged in the vacuum cavity, and the upper heating tube and the lower heating tube are arranged in the inner liner.

[0009] According to the chip welding vacuum welding furnace of the present invention, the lower cavity includes a lower cavity frame, a first cooling tube and a second cooling tube; the first cooling tube and the second cooling tube are arranged below the contoured heating component, and the first cooling tube and the second cooling tube are arranged in the lower cavity frame, and the first cooling tube and the second cooling tube are arranged above the lower heating tube.

[0010] According to the chip welding vacuum welding furnace of the present invention, a water cooling pipeline is provided inside the bottom of the lower cavity frame.

[0011] According to the chip welding vacuum welding furnace of the present invention, the upper cavity also includes an upper cavity frame and an observation window; the observation window is arranged in the middle of the upper cavity frame, and a water cooling pipeline is arranged inside the top of the upper cavity frame.

[0012] According to the chip welding vacuum welding furnace of the present invention, it also includes a support structure, the lower cavity is arranged above the support structure, and a plurality of rollers are arranged below the support structure.

[0013] According to the chip welding vacuum welding furnace of the present invention, a vacuum extraction interface is provided below the lower cavity.

[0014] According to the chip welding vacuum welding furnace of the present invention, the upper heating tube and the lower heating tube are vertically arranged, and the upper heating tube and the lower heating tube are infrared radiation heating sleeves.

[0015] The second heating plate and contoured fixture of this utility model feature a contoured design, with recesses for accommodating the workpiece being heated. The recesses can be designed to align with the workpiece, ensuring a precise fit and uniform heating. They can be flat, curved, or irregularly shaped, with multiple surfaces directly contacting the workpiece for heating. This close fit allows for more direct and efficient heat transfer, improving heating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of a vacuum welding furnace for chip welding;

[0018] Figure 2 It is a schematic diagram of the three-dimensional structure of the lower cavity;

[0019] Figure 3 It is a structural schematic diagram of the enlarged view of local A;

[0020] Figure 4 It is a schematic diagram of the stereoscopic structure of the profiling fixture;

[0021] Figure 5 It is a cross-sectional structural diagram of the profiling fixture;

[0022] Figure 6 It is a schematic diagram of the three-dimensional structure of the contoured heating component;

[0023] Figure 7 It is a cross-sectional structural diagram of the contoured heating component;

[0024] Figure 8 Schematic diagram of the three-dimensional structure of the upper cavity;

[0025] Figure numerals: 1. upper cavity; 2. lower cavity; 3. supporting structure; 4. roller; 5. warning light; 6. gas spring; 7. profiling jig; 11. upper cavity frame; 12. upper heating tube; 13. observation window; 21. lower cavity frame; 22. temperature sensor bracket; 23. first heating plate; 24. lower heating tube; 25. first cooling tube; 26. second cooling tube; 71. jig frame; 72. first profiling groove; 81. second heating plate; 82. hollow jig. DETAILED DESCRIPTION

[0026] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0027] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0028] In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0029] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0030] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0031] The following combination Figure 1-8 The present invention describes a vacuum welding furnace for chip welding, comprising an upper cavity 1, a lower cavity 2, a contoured heating assembly, a plurality of upper heating tubes 12, and a plurality of lower heating tubes 24; the upper cavity 1 is arranged above the lower cavity 2, and the upper cavity 1 and the lower cavity 2 form a sealed vacuum cavity, the upper heating tubes 12 are arranged in the upper cavity 1, the lower heating tubes 24 are arranged in the lower cavity 2, and the contoured heating assembly is arranged in the vacuum cavity. A temperature sensor bracket 22 is arranged above the contoured heating assembly, and the temperature sensor bracket 22 is movable and is used to place a temperature sensor. A gas spring 6 is arranged on the side of the vacuum cavity. An alarm light 5 is arranged on the side of the vacuum cavity.

[0032] In some embodiments, the contouring heating assembly includes a first heating plate 23 and a contouring jig 7. The first heating plate 23 is disposed within a vacuum chamber, and the contouring jig 7 is disposed on the first heating plate 23. The contouring jig 7 is provided with a plurality of first contouring grooves 72. The first contouring grooves 72 may be square, rectangular, circular, or irregularly shaped. This embodiment is the first embodiment of the contouring heating assembly.

[0033] In some embodiments, the contoured heating assembly includes a second heating plate 81 and a hollow fixture 82. Hollow fixture 82 is positioned above second heating plate 81. Second heating plate 81 is provided with a plurality of second contoured grooves, and hollow fixture 82 is provided with hollows corresponding to the second contoured grooves. This embodiment is a second embodiment of the contoured heating assembly, in which the heating plate has a contoured structure.

[0034] In some embodiments, an inner container is further included, which is disposed in the vacuum chamber and in which the upper heating tube 12 and the lower heating tube 24 are disposed. The inner container is preferably mirror-finished to improve heat reflection.

[0035] In some embodiments, the lower chamber 2 includes a lower chamber frame 21, a first cooling pipe 25, and a second cooling pipe 26. The first cooling pipe 25 and the second cooling pipe 26 are disposed below the contoured heating assembly. The first cooling pipe 25 and the second cooling pipe 26 are staggered, with water entering at one end of the lower chamber 2 and exiting at the other end. The first cooling pipe 25 and the second cooling pipe 26 are disposed within the lower chamber frame 21 and are disposed above the lower heating pipe 24.

[0036] In some embodiments, a water cooling pipeline is provided inside the bottom of the lower cavity frame 21 .

[0037] In some embodiments, the upper cavity 1 further includes an upper cavity frame 11 and an observation window 13 ; the observation window 13 is disposed in the middle of the upper cavity frame 11 , and a water cooling pipeline is disposed inside the top of the upper cavity frame 11 .

[0038] In some embodiments, a support structure 3 is further included, the lower cavity 2 is arranged above the support structure 3, and a plurality of rollers 4 are arranged below the support structure 3.

[0039] In some embodiments, a vacuum port is provided below the lower cavity 2 .

[0040] In some embodiments, the upper heating tube 12 and the lower heating tube 24 are vertically arranged, and the upper heating tube 12 and the lower heating tube 24 are infrared radiation heating sleeves.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A chip welding vacuum welding furnace, characterized in that, It includes an upper cavity, a lower cavity, a contoured heating component, multiple upper heating tubes and multiple lower heating tubes; the upper cavity is arranged above the lower cavity, the upper cavity and the lower cavity form a sealed vacuum cavity, the upper heating tubes are arranged in the upper cavity, the lower heating tubes are arranged in the lower cavity, and the contoured heating component is arranged in the vacuum cavity.

2. The chip bonding vacuum welding furnace according to claim 1, characterized in that: The profiling heating component includes a first heating plate and a profiling jig; the first heating plate is arranged in the vacuum chamber, the profiling jig is arranged on the first heating plate, and the profiling jig is provided with a plurality of first profiling grooves.

3. The chip bonding vacuum welding furnace according to claim 1, characterized in that: The contoured heating component includes a second heating plate and a hollow jig; the hollow jig is arranged above the second heating plate, the second heating plate is provided with a plurality of second contoured grooves, and the hollow jig is hollowed out at the positions of the second contoured grooves corresponding to the hollow jig.

4. The chip bonding vacuum welding furnace according to claim 1, characterized in that: It also includes an inner liner, which is arranged in the vacuum cavity, and the upper heating tube and the lower heating tube are arranged in the inner liner.

5. The chip bonding vacuum welding furnace according to claim 1, characterized in that: The lower cavity includes a lower cavity frame, a first cooling tube and a second cooling tube; the first cooling tube and the second cooling tube are arranged below the contoured heating assembly, the first cooling tube and the second cooling tube are arranged in the lower cavity frame, and the first cooling tube and the second cooling tube are arranged above the lower heating tube.

6. The chip bonding vacuum welding furnace according to claim 5, characterized in that: A water cooling pipeline is arranged inside the bottom of the lower cavity frame.

7. The chip bonding vacuum welding furnace according to claim 1, characterized in that: The upper cavity further comprises an upper cavity frame and an observation window; the observation window is arranged in the middle of the upper cavity frame, and a water cooling pipeline is arranged inside the top of the upper cavity frame.

8. The chip bonding vacuum welding furnace according to claim 1, characterized in that: It also includes a supporting structure, the lower cavity is arranged above the supporting structure, and a plurality of rollers are arranged below the supporting structure.

9. The chip bonding vacuum welding furnace according to claim 4, characterized in that: A vacuum extraction interface is provided below the lower cavity.

10. The chip bonding vacuum welding furnace according to claim 1, characterized in that: The upper heating tube and the lower heating tube are vertically arranged, and the upper heating tube and the lower heating tube are infrared radiation heating sleeves.

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