Laser processing equipment

Abstract

The utility model discloses laser processing equipment which comprises a laser device and a light spot adjusting assembly, the laser device is used for emitting a laser beam, the light spot adjusting assembly is used for adjusting light spots of the laser beam into a first light spot and a second light spot, the light spot diameter of the first light spot is larger than that of the second light spot, and the light spot adjusting assembly is used for adjusting the light spots of the laser beam into the first light spot and the second light spot. Wherein the laser beam of the first light spot is used for machining a to-be-windowed area on the circuit board, and the laser beam of the second light spot is used for adjusting the bending degree of an R angle of the to-be-windowed area. According to the invention, large-area windowing is carried out on the circuit board by using the laser beams with relatively large light spots, and the bending degree of the R angle of the windowing area is adjusted by using the laser beams with relatively small light spots, so that rapid windowing is realized, and the problem that the R angle of the windowing area is too large can be solved.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing device. Background Art

[0002] Circuit board windowing refers to the removal of the coating layer covering the wires in specific areas of the printed circuit board, exposing the wires to facilitate welding or connection with other components.

[0003] With the development of laser technology in recent years, laser processing technology is gradually replacing some traditional processing methods due to its advantages of high processing efficiency and small thermal impact on the substrate. For example, the traditional circuit board window opening method can be achieved by using chemical solutions, while the current related technology can be achieved by processing the circuit board through laser.

[0004] However, there are also some problems in opening windows on circuit boards using lasers. For example, if a laser with a larger spot size is used to open windows on the circuit board, there is a problem that the R angle (R angle is the inner and outer arc angles of an arc, used to describe the degree of curvature of the arc) of the window opening area is too large. If a laser with a smaller spot size is used to open windows on the circuit board, there is a problem of low processing efficiency. Utility Model Content

[0005] In order to overcome the problems existing in the above-mentioned prior art, the main purpose of this application is to provide a laser processing equipment that can improve processing efficiency and solve the problem of excessively large R angle in the window area.

[0006] In order to achieve the above objectives, this application specifically adopts the following technical solutions:

[0007] The present application provides a laser processing device for processing a circuit board, the laser processing device comprising:

[0008] a laser, wherein the laser is used to emit a laser beam;

[0009] a light spot adjustment component, the light spot adjustment component being used to adjust the light spot of the laser beam into a first light spot and a second light spot, wherein the light spot diameter of the first light spot is larger than the light spot diameter of the second light spot;

[0010] The laser beam of the first light spot is used to process the area to be windowed on the circuit board, and the laser beam of the second light spot is used to adjust the curvature of the R angle of the area to be windowed.

[0011] In some embodiments, the spot diameter of the first light spot is 160um to 200um, and the spot diameter of the second light spot is 30um to 60um.

[0012] In some embodiments, the spot adjustment component includes a beam splitter and a spot diameter adjustment element, the beam splitter is used to split the laser beam into a first laser beam and a second laser beam, the spot diameter adjustment element is used to adjust the spot of the first laser beam to the first spot, and to adjust the spot of the second laser beam to the second spot.

[0013] In some embodiments, the spot diameter adjustment element includes a first spot diameter adjustment element and a second spot diameter adjustment element, the first spot diameter adjustment element is used to adjust the first laser beam to the first spot, and the second spot diameter adjustment element is used to adjust the second laser beam to the second spot.

[0014] In some embodiments, the spot adjustment component includes two spot diameter adjustment elements, which are switchably arranged on the output light path of the laser beam, one of the spot diameter adjustment elements is used to adjust the spot of the laser beam to the first spot, and the other spot diameter adjustment element is used to adjust the spot of the laser beam to the second spot.

[0015] In some embodiments, the spot diameter adjusting element is configured as a mask.

[0016] In some embodiments, the laser processing equipment further includes a galvanometer and a reflector assembly, wherein the reflector assembly is used to change the transmission direction of the laser beam, and the galvanometer is used to scan the circuit board with the laser beams of the first light spot and the second light spot respectively.

[0017] In some embodiments, the circuit board is configured as a flexible circuit board, and the laser processing equipment further includes a coiling and uncoiling mechanism for winding and uncoiling the flexible circuit board.

[0018] In some embodiments, the material rewinding and unwinding mechanism includes a unwinding roller, a winding roller and a support roller, the unwinding roller and the winding roller are arranged at intervals, one end of the flexible circuit board is wound on the unwinding roller, and the other end of the flexible circuit board is wound on the winding roller, and the support roller is arranged between the unwinding roller and the winding roller for supporting the flexible circuit board.

[0019] In some embodiments, the roll-reeling and rewinding mechanism further includes a driving assembly, wherein the driving assembly is connected to the supporting roller and the winding roller, respectively, and is used to drive the winding roller and the supporting roller to rotate.

[0020] Accordingly, the present application also provides another laser processing device for processing a circuit board, the laser processing device comprising:

[0021] a first laser, configured to emit a laser beam of a first light spot;

[0022] a second laser, the second laser being configured to emit a laser beam of a second light spot, wherein a spot diameter of the first light spot is larger than a spot diameter of the second light spot;

[0023] The laser beam of the first light spot is used to process the area to be windowed on the circuit board, and the laser beam of the second light spot is used to adjust the curvature of the R angle of the area to be windowed.

[0024] In some embodiments, the diameter of the first light spot is 160 um to 200 um, and the diameter of the second light spot is 30 um to 60 um.

[0025] In some embodiments, the laser processing equipment further includes a galvanometer and a reflector assembly, wherein the reflector assembly is used to change the transmission direction of the laser beam, and the galvanometer is used to scan the laser beam across the circuit board.

[0026] In some embodiments, the circuit board is configured as a flexible circuit board, and the laser processing equipment further includes a coiling and uncoiling mechanism for winding and uncoiling the flexible circuit board.

[0027] The laser processing equipment of the present application includes a laser and a spot adjustment component. The laser is used to emit a laser beam, and the spot adjustment component is used to adjust the spot of the laser beam into a first spot and a second spot, wherein the spot diameter of the first spot is larger than the spot diameter of the second spot. The laser beam of the first spot is used to process the area to be windowed on the circuit board, and the laser beam of the second spot is used to adjust the curvature of the rounded corners of the area to be windowed. Compared to the prior art, the present application uses a laser beam with a larger spot to window the circuit board, and a laser beam with a smaller spot to adjust the curvature of the rounded corners of the windowed area, achieving rapid windowing and solving the problem of excessively large rounded corners in the windowed area. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the structure of the laser processing equipment provided in an embodiment of the present application.

[0029] Figure 2 A schematic structural diagram of a laser processing device using large-spot laser processing is provided in another embodiment of the present application.

[0030] Figure 3 A schematic structural diagram of a laser processing device using small-spot laser processing is provided in another embodiment of the present application.

[0031] Figure 4A schematic structural diagram of a laser processing device using large-spot laser processing is provided as another embodiment of the present application.

[0032] Figure 5 A schematic structural diagram of a laser processing device using small-spot laser processing is provided as another embodiment of the present application.

[0033] Figure 6 This is a schematic diagram of the structure of the circuit board before processing.

[0034] Figure 7 This is a schematic diagram of the structure of a circuit board that does not use a small spot laser to modify the R angle of the window area.

[0035] Figure 8 This is a schematic diagram of the structure of a circuit board that has been modified with a small-spot laser in the R corner of the window area.

[0036] Description of reference numerals:

[0037] 1. Laser processing mechanism; 11. Laser; 111. First laser; 112. Second laser; 12. Spot adjustment component; 121. Beam splitter; 122. First spot diameter adjustment element; 123. Second spot diameter adjustment element; 13. Galvanometer; 14. Reflector assembly; 141. First reflector; 142. Second reflector; 143. Third reflector; 144. Fourth reflector; 2. Rewinding and unwinding mechanism; 21. Unwinding roller; 22. Rewinding roller; 23. Support roller; 100. Circuit board. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0039] In the description of this application, unless otherwise specified or limited, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0040] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described from the perspectives shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should be understood that when it is mentioned that an element is connected to another element "on" or "under", it can not only be directly connected to the other element "on" or "under", but also indirectly connected to the other element "on" or "under" through an intermediate element.

[0041] Reference Figure 1 As shown, an embodiment of the present application discloses a laser processing device, which includes a laser processing mechanism 1, and the laser processing mechanism 1 is used to output multiple laser beams, wherein part of the laser beam is used to process the area to be windowed on the circuit board 100, and part of the laser beam is used to adjust the curvature of the R angle of the area to be windowed, and the spot diameter of the laser beam used to adjust the curvature of the R angle of the area to be windowed is smaller than the spot diameter of the laser beam used to process the area to be windowed on the circuit board.

[0042] When performing window opening processing on a circuit board, the present application can first use a large-spot laser beam to open windows on a large area of ​​the circuit board, and then switch to a small-spot laser beam to modify the R angle of the window opening area of ​​the circuit board, thereby improving the window opening efficiency while solving the problem of excessively large R angle of the window opening area.

[0043] Continue to refer to Figure 1 As shown, the laser processing mechanism 1 includes a laser 11 and a spot adjustment component 12. The laser 11 is used to emit a laser beam. The spot adjustment component 12 is disposed in the optical path of the laser beam and is used to adjust the spot of the laser beam into a first spot and a second spot. The laser beam with the first spot is then used to process the area to be windowed on the circuit board, and the laser beam with the second spot is used to adjust the curvature of the R angle of the area to be windowed, thereby achieving windowing processing on the circuit board. The spot diameter of the first spot is larger than the spot diameter of the second spot. In this embodiment, by providing the spot adjustment component 12, the spot adjustment component 12 facilitates adjustment of the spot of the laser beam emitted by the laser 11 to have different spot diameters, namely, the first spot and the second spot, thereby improving processing efficiency.

[0044] According to some embodiments of the present application, optionally, the spot diameter of the first light spot can be 160um to 200um, and the spot diameter of the second light spot can be 30um to 60um. In this embodiment, when processing a circuit board, a laser beam with a spot diameter of 160um to 200um can be first used to open a window in the area to be opened on the circuit board to be processed, thereby improving the window opening efficiency. A laser beam with a spot diameter of 30um to 60um can then be used to adjust the curvature of the R angle of the window opening area, thereby preventing the R angle of the window opening area from being too large.

[0045] According to some embodiments of the present application, optionally, the spot adjustment component 12 includes a beam splitter 121 and a spot diameter adjustment element. The beam splitter 121 can be an acousto-optic modulator (English full name: Acousto-Optic Modulator, abbreviated as: AOM). The beam splitter 121 is arranged on the output optical path of the laser 11, and is used to split the laser beam emitted by the laser 11 into a first laser beam and a second laser beam. The spot diameter adjustment element is arranged on the optical path of the first laser beam and the second laser beam, and is used to adjust the spot of the first laser beam to a first spot and the spot of the second laser beam to a second spot. In this embodiment, by providing the beam splitter 121, the beam splitter 121 can split a laser beam into multiple laser beams, so that only one laser is required instead of multiple lasers. The structure is simple and the cost is reduced. At the same time, by providing the spot diameter adjustment element, it is convenient to adjust the laser beam after the beam splitter is split by the beam splitter to the desired spot diameter, and the spot adjustment method is simple and convenient.

[0046] According to some embodiments of the present application, optionally, the spot diameter adjustment element includes a first spot diameter adjustment element 122 and a second spot diameter adjustment element 123. The first spot diameter adjustment element 122 is used to adjust the spot of the first laser beam to a first spot, and then use the laser beam with the adjusted first spot to scan the area of ​​the circuit board 100 to be windowed, so as to achieve processing of the area of ​​the circuit board 100 to be windowed. The second spot diameter adjustment element 123 is used to adjust the spot of the second laser beam to a second spot, and then use the laser beam with the adjusted second spot to scan the R angle of the area of ​​the circuit board 100 to be windowed, so as to achieve adjustment of the degree of curvature of the R angle of the area to be windowed. In this embodiment, by providing two spot diameter adjustment elements, the spot diameter of a laser beam can be adjusted separately by the two spot diameter adjustment elements. The spot adjustment method is simple and convenient, and the processing efficiency is improved.

[0047] Of course, in some embodiments, only one spot diameter adjustment element may be provided, and the laser beam may be adjusted into two laser beams with different spot diameters by using the one spot diameter adjustment element.

[0048] According to some embodiments of the present application, each spot diameter adjustment element can optionally be configured as a mask. This embodiment uses a mask to adjust the spot diameter of the laser beam. Since the mask is a highly precise and low-cost device, the reliability of the laser processing window is improved and the cost is low.

[0049] According to some embodiments of the present application, the laser processing mechanism 1 optionally further includes a galvanometer and a reflector assembly 14, and the reflector assembly 14 can be used to change the transmission direction of the laser beam emitted by the laser 11. The galvanometer 13 can be used to scan the laser beams of the first light spot and the second light spot on the circuit board respectively. For example, the galvanometer 13 can first scan the laser beam of the first light spot on the area to be windowed on the circuit board, and then scan the laser beam of the second light spot on the R angle of the area to be windowed. In this embodiment, by providing the reflector assembly 14, the transmission direction of the laser beam emitted by the laser 11 and the transmission direction of the laser beam emitted by the light spot adjustment assembly can be changed by the reflector assembly 14, thereby making the setting position of the laser and the light spot adjustment assembly unrestricted, making the distribution of various components in the entire laser processing equipment more compact and reasonable, and reducing the space occupied; at the same time, by providing the galvanometer, it is convenient for the laser beam to scan the circuit board according to the preset pattern, thereby improving the scanning accuracy.

[0050] According to some embodiments of the present application, optionally, the reflector assembly 14 may include a first reflector 141, a second reflector 142, a third reflector 143 and a fourth reflector 144. The beam splitter 121 is arranged on the outgoing optical path of the laser 11, and is used to split the laser beam emitted by the laser 11 into a first laser beam and a second laser beam. The first reflector 141, the first spot diameter adjustment element 122 and the second reflector 142 are sequentially arranged on the optical path of the first laser beam, so that the first laser beam is emitted to the first spot diameter adjustment element 122 through the first reflector 141, and the spot diameter of the first laser beam is adjusted to 160um~200um by the first spot diameter adjustment element 122 and then emitted to the second reflector 142, and then the first laser beam with adjusted spot diameter is emitted into the galvanometer 13 through the second reflector 142, and the galvanometer 13 then scans the first laser beam with adjusted spot diameter toward the circuit board 100, so as to realize the processing of the area to be windowed of the circuit board 100 using the laser beam of the first spot, refer to Figure 6 and Figure 7 As shown, in Figure 6 In the process, the circuit board is not processed; Figure 7In the embodiment, the laser beam with the first spot has been used to process the area to be windowed on the circuit board, but the laser beam with the second spot has not been used to adjust the curvature of the R angle of the area to be windowed. The third reflector 143, the second spot diameter adjustment element 123 and the fourth reflector 144 are sequentially arranged on the optical path of the second laser beam, so that the second laser beam is emitted to the second spot diameter adjustment element 123 through the third reflector 143, and the spot diameter of the second laser beam is adjusted to 30um~60um by the second spot diameter adjustment element 123 and then emitted to the fourth reflector 144. The second laser beam with the adjusted spot diameter is then emitted to the galvanometer 13 through the fourth reflector 144, and the galvanometer 13 then scans the second laser beam with the adjusted spot diameter toward the circuit board 100, so as to adjust the curvature of the R angle of the area to be windowed on the circuit board 100 by using the laser beam with the second spot, with reference to FIG. Figure 8 As shown, in Figure 8 In the example, a laser beam with a first spot is used to process the area to be windowed on the circuit board, and a laser beam with a second spot is used to adjust the curvature of the R angle of the area to be windowed. The laser beam emitted from the first spot diameter adjustment element 122 is reflected by the second reflector 142 and then combined with the laser beam emitted from the second spot diameter adjustment element 123 by the fourth reflector 144. This allows both laser beams, one large spot and one small spot, to enter the galvanometer mirror 13 at the same location, allowing the same galvanometer mirror 13 to be used for laser processing.

[0051] Continue to refer to Figure 1 As shown, the laser processing equipment further includes a coiling and unwinding mechanism 2 for winding and unwinding a circuit board 100, which may be a flexible circuit board. This embodiment utilizes coiling and unwinding mechanism 2 to allow the circuit board to be wound up. During laser processing of the circuit board, the material can be rewound while processing, or after processing a portion, the material can be rewound before processing the next portion. Compared to a method of waiting until all portions of the circuit board are processed before rewinding, this embodiment improves processing efficiency.

[0052] According to some embodiments of the present application, the roll-up and unwinding mechanism 2 optionally includes a roll-up roller 21, a roll-up roller 22, and a support roller 23. The roll-up roller 21 and the roll-up roller 22 are spaced apart, one end of the circuit board 100 is wound around the roll-up roller 21, and the other end of the flexible circuit board is wound around the roll-up roller 22. The support roller 23 is disposed between the roll-up roller 21 and the roll-up roller 22 to support the flexible circuit board. For example, the roll-up mechanism 2 may stop while laser windowing is being performed on the circuit board 100, and resume after the windowing process is complete. Alternatively, the roll-up mechanism 2 may be performed while laser windowing is being performed on the circuit board 100, that is, each roller performs laser processing while rolling. For this laser processing method, the processing speed of the galvanometer 13 may be set to a fixed value, and the rolling speed may be pre-planned based on the windowing pattern to ensure the accuracy of the processing position. In this embodiment, the circuit board is unwound and rolled up by the unwinding roller 21 and the winding roller 22, thereby improving processing efficiency. At the same time, the flexible circuit board is supported by the supporting roller 23, so that the circuit board is kept in a flat state, thereby improving processing accuracy.

[0053] According to some embodiments of the present application, the coiling mechanism 2 optionally further includes a drive assembly, which is connected to the support roller 23 and the winding roller 22, respectively, for driving the winding roller 22 and the support roller 23 to rotate to achieve the unwinding of the coiled material. The drive assembly may include a servo motor or a direct drive motor (DD motor). This embodiment, by providing a drive assembly for driving the support roller 23 and the winding roller 22 to rotate, can further improve processing efficiency, achieve a high degree of automation, and save time and effort.

[0054] In some embodiments, the scanning processing range of the galvanometer mirror 13 can cover the width of the roller, thereby eliminating the need to move the galvanometer mirror 13 and improving processing efficiency.

[0055] Based on the above embodiment, the present application also discloses another specific implementation method. The main difference between this embodiment and the above embodiment is that this embodiment does not have a beam splitter. Instead, two switchable spot diameter adjustment elements are used to adjust the laser beam spot to obtain a first spot laser beam and a second spot laser beam. Specifically, in this embodiment, the spot adjustment component 12 includes two spot diameter adjustment elements, which are switchably arranged on the output light path of the laser 11. One of the spot diameter adjustment elements is used to adjust the spot of the laser beam to a first spot and inject it into the galvanometer 13. The galvanometer 13 then scans the laser beam with the adjusted first spot across the circuit board 100 to achieve processing of the area to be windowed on the circuit board 100; the other spot diameter adjustment element is used to adjust the spot of the laser beam to a second spot and inject it into the galvanometer 13. The galvanometer 13 then scans the laser beam with the adjusted second spot across the circuit board 100 to achieve adjustment of the curvature of the R angle of the area to be windowed.

[0056] For example, referring to Figure 2 and Figure 3 As shown, the reflector assembly 14 includes a first reflector 141 and a second reflector 142, each of which is disposed on the optical path of the laser beam. Two spot diameter adjustment elements, namely a first spot diameter adjustment element 122 and a second spot diameter adjustment element 123, are switchably disposed on the optical path of the laser beam. When processing is required on the area to be windowed on the circuit board 100, the first spot diameter adjustment element 122 is disposed on the optical path of the laser beam. The laser beam emitted by the laser 11 passes through the first reflector 141 and is directed to the first spot diameter adjustment element 122. The laser beam is then adjusted to a spot diameter of 160 μm to 200 μm by the first spot diameter adjustment element 122 and then directed to the galvanometer 13 via the second reflector 142. The galvanometer 13 then scans the laser beam with the adjusted spot diameter toward the circuit board 100 to process the area to be windowed on the circuit board 100. When it is necessary to adjust the degree of curvature of the R angle of the area to be windowed on the circuit board 100, the second spot diameter adjustment element 123 is arranged on the optical path of the laser beam, so that the laser beam emitted by the laser 11 is directed toward the second spot diameter adjustment element 123 through the first reflector 141. The spot diameter of the laser beam is adjusted to 30um~60um by the second spot diameter adjustment element 123 and then directed toward the galvanometer 13 through the second reflector 142. The galvanometer 13 then scans the circuit board 100 with the laser beam after adjusting the spot diameter, so as to adjust the degree of curvature of the R angle of the area to be windowed on the circuit board 100.

[0057] This embodiment can be provided with only one laser, and no beam splitter is required. Instead, the laser beam emitted by the laser is switchably adjusted by two spot diameter adjustment elements to obtain laser beams of the first spot and the second spot. Fewer components are used and the cost is lower.

[0058] Based on the above embodiments, the present application also discloses another specific implementation method. The main difference between this embodiment and the above embodiments is that the present application is provided with two lasers, and two laser beams with different light spots can be emitted by the two lasers. Specifically, in this embodiment, the laser processing mechanism 1 includes a first laser 111 and a second laser 112. The first laser 111 is used to emit a laser beam of a first light spot, and the second laser 112 is used to emit a laser beam of a second light spot, and the spot diameter of the first light spot is larger than the spot diameter of the second light spot. When performing window processing on a circuit board, the laser beam of the first light spot can be first used to process the area of ​​the circuit board to be windowed, thereby realizing the processing of the area of ​​the circuit board to be windowed; and then the laser beam of the second light spot is used to process the R corner of the circuit board, thereby realizing the adjustment of the curvature of the R corner of the circuit board.

[0059] When performing window opening processing on a circuit board, the present application can first use a laser beam with a first light spot with a larger spot diameter to open windows on a large area of ​​the circuit board, and then switch to a laser beam with a second light spot with a smaller spot diameter to modify the R angle of the window area of ​​the circuit board, thereby improving the window opening efficiency while solving the problem of excessively large R angle of the window opening area.

[0060] According to some embodiments of the present application, optionally, the spot diameter of the first light spot can be 160um to 200um, and the spot diameter of the second light spot can be 30um to 60um. In this embodiment, when processing a circuit board, a laser beam with a spot diameter of 160um to 200um can be first used to open a window in the area to be opened on the circuit board to be processed, thereby improving the window opening efficiency. A laser beam with a spot diameter of 30um to 60um can then be used to adjust the curvature of the R angle of the window opening area, thereby preventing the R angle of the window opening area from being too large.

[0061] According to some embodiments of the present application, the laser processing mechanism 1 optionally further includes a reflector assembly 14 and a galvanometer 13. The reflector assembly 14 is arranged on the optical path of the laser beam and is used to change the transmission direction of the laser beam. The galvanometer 13 is used to scan the laser beams of the first light spot and the second light spot on the circuit board 100 to achieve window processing on the circuit board 100. In this embodiment, by providing the reflector assembly 14, the transmission direction of the laser beam emitted by the laser 11 and the transmission direction of the laser beam emitted by the light spot adjustment assembly can be changed through the reflector assembly 14, thereby making the setting position of the laser and the light spot adjustment assembly unrestricted, making the distribution of various components in the entire laser processing equipment more compact and reasonable, and reducing space occupancy; at the same time, by providing the galvanometer, it is convenient for the laser beam to scan the circuit board according to the preset pattern, thereby improving the accuracy of the scanning.

[0062] In some embodiments, two lasers may be equipped with one reflector assembly, or two lasers may be equipped with two reflector assemblies. For example, referring to Figure 4 As shown, the reflector assembly 14 includes a first reflector 141, a second reflector 142 and a third reflector 143. The third reflector 143 has a first reflective surface and a second reflective surface. The first laser 111 is used to emit a first laser beam, and the second laser 112 is used to emit a second laser beam. When it is necessary to process the area to be windowed on the circuit board 100, the first reflective surface of the third reflector 143 is set on the optical path of the first laser beam, so that the first laser beam emitted by the first laser 111 passes through the first reflective surfaces of the first reflector 141 and the third reflector 143 in sequence and is emitted to the galvanometer 13, and then the first laser beam is scanned to the circuit board 100 by the galvanometer 13 to realize the processing of the area to be windowed on the circuit board 100. When it is necessary to adjust the curvature of the R angle of the area to be windowed on the circuit board, refer to Figure 5 As shown, the second reflecting surface of the third reflecting mirror 143 is set on the optical path of the second laser beam, so that the second laser beam emitted by the second laser 112 passes through the second reflecting surfaces of the second reflecting mirror 142 and the third reflecting mirror 143 in sequence and is emitted to the galvanometer 13, and then the second laser beam is scanned on the circuit board 100 by the galvanometer 13 to adjust the curvature of the R angle of the area to be windowed on the circuit board 100, wherein the spot diameter of the first laser beam can be 160um~200um, and the spot diameter of the second laser beam can be 30um~60um.

[0063] In order to improve processing efficiency, multiple laser processing mechanisms 1 can be provided. Multiple laser processing mechanisms 1 can be used to process the same area to be opened on the circuit board 100, thereby doubling the processing range and improving processing efficiency. Alternatively, multiple laser processing mechanisms 1 can be used to process different areas to be opened on the circuit board 100 to improve processing efficiency.

[0064] In some embodiments, a laser can be controlled to emit a laser beam, and then the laser beam emitted by the laser can be divided into a first laser beam and a second laser beam by a beam splitter. Then, the spot of the first laser beam is adjusted to the first spot by a beam spot diameter adjustment element, and the spot of the second laser beam is adjusted to the second spot by a beam spot diameter adjustment element. Then, the laser beam of the first spot is scanned by a galvanometer at the area to be windowed on the circuit board to achieve windowing of the circuit board, and the laser beam of the second spot is scanned by a galvanometer at the R angle of the area to be windowed on the circuit board to achieve adjustment of the degree of curvature of the R angle of the area to be windowed. Among them, one or more beam spot diameter adjustment elements can be provided. In this embodiment, by providing an optical splitter, a beam of laser can be divided into multiple beams of laser by the beam splitter, so that only one laser is required instead of multiple lasers. The structure is simple and the cost is reduced. At the same time, by providing a beam spot diameter adjustment element, it is convenient to adjust the laser beam after the beam splitter is split by the beam splitter to the desired spot diameter, and the beam spot adjustment method is simple and convenient.

[0065] In other embodiments, a beam splitter may not be provided. Instead, two switchable spot diameter adjustment elements are used to adjust the laser beam spot to obtain a first spot laser beam and a second spot laser beam. The first spot laser beam and the second spot laser beam are then used to perform window processing on the circuit board. This embodiment can be provided with only one laser and does not require a beam splitter. Instead, the laser beam emitted by the laser is switchably adjusted using two spot diameter adjustment elements to obtain the first spot laser beam and the second spot laser beam. This embodiment uses fewer components and is less expensive.

[0066] In other embodiments, two lasers may be provided, wherein one laser emits a laser beam of a first light spot and the other laser emits a laser beam of a second light spot, and the circuit board is then windowed by the laser beam of the first light spot and the laser beam of the second light spot, respectively.

[0067] In some embodiments, when processing a circuit board, the circuit board to be processed can be first wound on a reeling and winding mechanism. In a specific processing process, the circuit board 100 can be reeled up by the reeling and winding mechanism 2 after the window opening process of the circuit board to be processed is completed; or the circuit board to be processed can be reeled up by the reeling and winding mechanism 2 during the process of laser windowing of the circuit board 100, that is, the circuit board can be laser processed while the roller is driven to roll. For example, the scanning direction of the galvanometer 13 and the reeling and winding speed of the reeling and winding mechanism 2 can be controlled based on the pattern of the window opening area of ​​the circuit board 100. In this embodiment, during the process of laser processing of the circuit board, the material can be reeled up while processing, or the material can be reeled up directly after processing a part and then the next part can be processed. Compared with the method of reeling up the material after all parts of the circuit board are processed, this embodiment improves the processing efficiency.

[0068] The above description is merely a preferred embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A laser processing device for processing circuit boards, characterized in that: include: a laser, wherein the laser is used to emit a laser beam; a light spot adjustment component, the light spot adjustment component being used to adjust the light spot of the laser beam into a first light spot and a second light spot, wherein the light spot diameter of the first light spot is larger than the light spot diameter of the second light spot; The laser beam of the first light spot is used to process the area to be windowed on the circuit board, and the laser beam of the second light spot is used to adjust the curvature of the R angle of the area to be windowed.

2. The laser processing equipment according to claim 1, characterized in that The spot diameter of the first light spot is 160um to 200um, and the spot diameter of the second light spot is 30um to 60um.

3. The laser processing equipment according to claim 1, characterized in that The spot adjustment component includes a beam splitter and a spot diameter adjustment element. The beam splitter is used to split the laser beam into a first laser beam and a second laser beam. The spot diameter adjustment element is used to adjust the spot of the first laser beam to the first spot and to adjust the spot of the second laser beam to the second spot.

4. The laser processing equipment according to claim 3, characterized in that The spot diameter adjusting element includes a first spot diameter adjusting element and a second spot diameter adjusting element. The first spot diameter adjusting element is used to adjust the first laser beam into the first spot. The second spot diameter adjusting element is used to adjust the second laser beam into the second spot.

5. The laser processing equipment according to claim 1, characterized in that The spot adjustment component includes two spot diameter adjustment elements, which are switchably arranged on the output light path of the laser beam. One of the spot diameter adjustment elements is used to adjust the spot of the laser beam to the first spot, and the other spot diameter adjustment element is used to adjust the spot of the laser beam to the second spot.

6. The laser processing equipment according to any one of claims 3 to 5, characterized in that: The light spot diameter adjusting element is configured as a mask.

7. The laser processing equipment according to claim 1, characterized in that The laser processing equipment further includes a galvanometer and a reflector assembly, wherein the reflector assembly is used to change the transmission direction of the laser beam, and the galvanometer is used to scan the circuit board with the laser beams of the first light spot and the second light spot respectively.

8. The laser processing equipment according to claim 1, characterized in that The circuit board is configured as a flexible circuit board, and the laser processing equipment further includes a coiling and uncoiling mechanism for winding and uncoiling the flexible circuit board.

9. The laser processing equipment according to claim 8, characterized in that The material rewinding and unwinding mechanism includes a unwinding roller, a winding roller and a support roller. The unwinding roller and the winding roller are arranged at intervals. One end of the flexible circuit board is wound on the unwinding roller, and the other end of the flexible circuit board is wound on the winding roller. The support roller is arranged between the unwinding roller and the winding roller for supporting the flexible circuit board.

10. The laser processing equipment according to claim 9, characterized in that The coiling and unwinding mechanism further includes a driving assembly, which is connected to the supporting roller and the winding roller respectively and is used to drive the winding roller and the supporting roller to rotate.

11. A laser processing device for processing circuit boards, characterized in that: include: a first laser, configured to emit a laser beam of a first light spot; a second laser, the second laser being configured to emit a laser beam of a second light spot, wherein a spot diameter of the first light spot is larger than a spot diameter of the second light spot; The laser beam of the first light spot is used to process the area to be windowed on the circuit board, and the laser beam of the second light spot is used to adjust the curvature of the R angle of the area to be windowed.

12. The laser processing equipment according to claim 11, characterized in that The spot diameter of the first light spot is 160um to 200um, and the spot diameter of the second light spot is 30um to 60um.

13. The laser processing equipment according to claim 11, characterized in that The laser processing equipment further includes a galvanometer and a reflector assembly, wherein the reflector assembly is used to change the transmission direction of the laser beam, and the galvanometer is used to scan the laser beam across the circuit board.

14. The laser processing equipment according to any one of claims 11 to 13, characterized in that: The circuit board is configured as a flexible circuit board, and the laser processing equipment further includes a coiling and uncoiling mechanism for winding and uncoiling the flexible circuit board.

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