Material box for storing semiconductor products

Abstract

The utility model provides a magazine for storing semiconductor products. The material box used for storing the semiconductor products comprises a material box body and a blocking card, and the material box body is provided with a containing groove array used for containing the semiconductor products; the blocking clamp is arranged on the open face of the material box body in a covering mode in the mode of sliding in the vertical direction. A through groove array is arranged on the blocking card; the shape of the through groove array is matched with that of the placing groove array; the corresponding relation between the through groove array on the blocking clamp and the containing groove array on the material box body is changed through lifting of the blocking clamp in the vertical direction, when the through groove array and the containing groove array are not staggered or correspond to each other, the material box is in an open state, and when the through groove array and the containing groove array are staggered or do not correspond to each other, the material box is in a closed state. And the material box is in a locking state. According to the material box for storing the semiconductor products, the semiconductor products can be prevented from falling off in the transportation process.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a material box for storing semiconductor products. Background Art

[0002] During the semiconductor packaging production process, when transferring products between processes, semiconductor products must be transported in specialized containers to ensure their integrity. Furthermore, to prevent the semiconductor products from falling during transfer or movement, retaining clips are installed at the front and rear ends of the container.

[0003] In current common designs, a retaining plate is typically removed before placing the cartridge on semiconductor processing equipment to facilitate material removal. During the process from removing the retaining plate to placing the cartridge on the processing equipment, the risk of semiconductor products falling out of the cartridge is significant due to the lack of the retaining plate's protection. In many real-life examples, semiconductor products have been found to have fallen during the transportation of semiconductor cartridges, resulting in significant product damage and significant financial losses. Designing a more comprehensive semiconductor cartridge to minimize transportation losses for semiconductor products has become a pressing issue. Utility Model Content

[0004] In view of this, the present application provides a material box for storing semiconductor products, so as to solve the problem that semiconductor products are prone to falling out of the semiconductor material box during transportation.

[0005] Specifically, this application is implemented through the following technical solutions:

[0006] The first aspect of the present application provides a material box for storing semiconductor products, the material box comprising a material box body and a baffle; wherein,

[0007] The magazine body is provided with an array of placement slots for placing semiconductor products;

[0008] The blocking card is slidably mounted on the open surface of the magazine body in a vertical direction; a through-slot array is provided on the blocking card; the shape of the through-slot array matches the shape of the placement slot array;

[0009] The correspondence between the through slot array on the blocking card and the placement slot array on the material box body is changed by lifting the blocking card in the vertical direction. When the through slot array and the placement slot array are not misaligned and correspond to each other, the material box is in an open state. When the through slot array and the placement slot array are misaligned and do not correspond to each other, the material box is in a locked state.

[0010] Optionally, when the blocking card is covered on the magazine body in a manner that the top plate contacts the top plate of the magazine body, the through slot array and the placement slot array are misaligned and do not correspond to each other, and the magazine is in a locked state;

[0011] A groove is provided on the bottom plate of the material box body. When the material box is on the semiconductor production equipment, the lifting component on the semiconductor production equipment is accommodated in the groove and contacts the cover plate of the baffle to lift the baffle, so that the through groove array and the placement slot array are not misaligned with each other and correspond to each other, so that the material box is converted from a locked state to an open state.

[0012] Optionally, the blocking card is a blocking card assembly, which includes a first blocking card, a second blocking card, a first connecting piece, a second connecting piece and a bottom connecting plate; a first groove matching the first connecting piece and a second groove matching the second connecting piece are provided on the bottom plate of the material box; wherein,

[0013] The first connecting member is connected to the bottom end of the cover plate of the first stopper; the second connecting member is connected to the bottom end of the cover plate of the second stopper; the bottom connecting plate is connected to the first connecting member and the second connecting member respectively;

[0014] When the blocking assembly is covered on the magazine in a manner that the top plate contacts the top plate of the magazine body, the through slot array and the placement slot array are misaligned and do not correspond to each other, and the magazine is in a locked state;

[0015] When the material box is on the semiconductor production equipment, the lifting component on the semiconductor production equipment contacts the bottom connecting plate to lift the blocking assembly, so that the first connecting member is accommodated in the first groove and the second connecting member is accommodated in the second groove, so that the through groove array and the placement groove array are not misaligned with each other and correspond to each other, and the material box is converted from a locked state to an open state.

[0016] Optionally, the material box body includes a first top plate, a first side plate, a second side plate and a bottom plate; wherein,

[0017] The first top plate, the first side plate, the second side plate and the bottom plate are arranged to form a box structure with an open opening;

[0018] The placement groove array is formed on the inner side surfaces of the first side plate and the second side plate;

[0019] The outer sides of the first side plate and the second side plate are provided with slideways, and the blocking card is arranged on the open surface of the material box body through the slideway cover.

[0020] Optionally, the first side panel and the second side panel have reinforcing ribs.

[0021] Optionally, the blocking card includes a second top plate, a third side plate, a fourth side plate and a cover plate; wherein,

[0022] The second top plate is connected to the top of the cover plate in a manner perpendicular to the cover plate;

[0023] The third side plate and the fourth side plate are respectively connected to both sides of the cover plate in a manner perpendicular to the cover plate;

[0024] The through slot array is provided on the cover plate;

[0025] The blocking card is covered on the open surface of the material box body in a manner that the third side plate and the fourth side plate are inserted into the slide channel.

[0026] Optionally, the cover plate is a hollow rectangular plate; each through slot in the through slot array is formed by a clamping slot provided on both sides of the hollow rectangular plate.

[0027] Optionally, the cover plate is a plate-shaped object, and the through-slot array is an array composed of through holes provided on the plate-shaped object.

[0028] Optionally, the material box body is made of aluminum alloy material.

[0029] Optionally, the baffle is made of stainless steel or aluminum alloy.

[0030] The material box for storing semiconductor products provided by the present application is provided with a material box body and a baffle, and the baffle is arranged to cover the open surface of the material box body in a manner of sliding in the vertical direction. In this way, the correspondence between the through-slot array on the baffle and the placement slot array on the material box body is changed by the vertical lifting of the baffle. When the through-slot array and the placement slot array are not misaligned and correspond to each other, the material box is in an open state. When the through-slot array and the placement slot array are misaligned and do not correspond to each other, the material box is in a locked state. In this way, when loading materials, the problem of needing to remove the baffle before loading is avoided. Furthermore, the action of needing to install the baffle after removing the material box from the equipment is avoided, which greatly reduces the risk of products falling out of the material box. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram of a magazine for storing semiconductor products provided in the present application in a locked state;

[0032] Figure 2 A schematic diagram of a material box for storing semiconductor products provided in the present application in an open state;

[0033] Figure 3 A schematic diagram of a magazine for storing semiconductor products according to an exemplary embodiment of the present application is shown;

[0034] Figure 4 This is a schematic diagram of a blocking card assembly according to an exemplary embodiment of the present application.

[0035] Description of reference numerals:

[0036] 1: Material box body;

[0037] 2: Block card;

[0038] 5: Semiconductor products;

[0039] 6: Lifting parts;

[0040] 11: First top plate;

[0041] 12: first side panel;

[0042] 13: Second side panel;

[0043] 14: bottom plate;

[0044] 15: slide;

[0045] 16: Place the slot array;

[0046] 17: Reinforcement ribs;

[0047] 21: Second top plate;

[0048] 22: third side panel;

[0049] 23: fourth side panel;

[0050] 24: cover plate;

[0051] 241: through slot array;

[0052] 210: First gear card;

[0053] 220: second gear card;

[0054] 230: first connecting member;

[0055] 240: second connecting member;

[0056] 250: Bottom connecting plate. DETAILED DESCRIPTION

[0057] Exemplary embodiments are described in detail herein, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numerals in different drawings represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this application.

[0058] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms "a," "the," and "the" used in this application are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0059] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0060] Specific embodiments are given below to introduce the technical solutions of the present application in detail.

[0061] Figure 1 This is a schematic diagram of a magazine for storing semiconductor products provided in this application in a locked state. Figure 2 This is a schematic diagram of the material box for storing semiconductor products provided in this application in an open state. Please also refer to Figure 1 and Figure 2 The material box for storing semiconductor products provided in this embodiment includes a material box body 1 and a baffle 2, wherein:

[0062] The magazine body 1 is provided with a placement slot array 16 for placing semiconductor products;

[0063] The blocking card 2 is slidably mounted on the open surface of the magazine body 1 in a vertical direction; a through-slot array 241 is provided on the blocking card 2; the shape of the through-slot array 241 matches the shape of the placement slot array 16;

[0064] The correspondence between the through slot array 241 on the baffle card 2 and the placement slot array 16 on the material box body 1 is changed by lifting the baffle card 2 in the vertical direction. When the through slot array 241 and the placement slot array 16 are not misaligned and correspond to each other, the material box is in an open state. When the through slot array 241 and the placement slot array 16 are misaligned and do not correspond to each other, the material box is in a locked state.

[0065] Specifically, in a possible implementation, the cartridge body 1 is made of aluminum alloy material.

[0066] The material box body 1 is a box-shaped object having one open surface, or two open surfaces; further, when the material box body 1 has one open surface, the material box for storing semiconductor products includes a baffle 2, which covers the open surface; similarly, when the material box body 1 has two open surfaces, the material box for storing semiconductor products includes two baffles 2, which cover the two open surfaces respectively.

[0067] Optionally, in a possible implementation, the material box body 1 may include a first top plate 11, a first side plate 12, a second side plate 13, and a bottom plate 14, wherein the first top plate 11, the first side plate 12, the second side plate 13, and the bottom plate 14 are arranged to form a box-shaped structure with an open opening;

[0068] The placement slot array 16 is formed on the inner side surfaces of the first side plate 12 and the second side plate 13;

[0069] Slideways 15 are formed on the outer sides of the first side plate 12 and the second side plate 13 , and the blocking card 2 is covered on the open side of the magazine body 1 through the slideways 15 .

[0070] For details, please refer to Figure 1 and Figure 2 The first top plate 11, the first side plate 12, the second side plate 13 and the bottom plate 14 are surrounded together to form a box structure with two open surfaces.

[0071] Specifically, the first top plate 11 is located at the upper part of the material box, which covers the top of the entire material box; the first side plate 12 and the second side plate 13 are respectively located on both sides of the material box, which can provide necessary lateral protection and support for the semiconductor products; the bottom plate 14 is located at the bottom of the material box, which can ensure the overall structural stability of the material box.

[0072] Furthermore, in order to more conveniently store and protect semiconductor products, a placement groove array 16 is designed on the inner side surfaces of the first side plate 12 and the second side plate 13 of the magazine body 1.

[0073] It should be noted that the placement slot array 16 is composed of a plurality of placement slots. It can be understood that each placement slot is used to accommodate a semiconductor product, and each placement slot is a slot-shaped result that runs from front to back. The number of placement slots included in the placement slot array 16 is set according to actual needs and is not limited in this embodiment. Furthermore, the spacing between two adjacent placement slots can be the same or different, and is not limited in this embodiment. In addition, the width of each placement slot ( Figure 1 The up and down directions shown in the figure are set according to the thickness of the semiconductor product to be accommodated, and are not limited in this embodiment.

[0074] It should be noted that, referring to the previous introduction, when the material box body 1 has an open surface, the material box body may also include a back plate, and the first top plate, the first side plate, the second side plate, the back plate and the bottom plate are arranged to form a box structure with an open surface.

[0075] For further information, please refer to Figure 1 and Figure 2 A slide 15 is provided on the outer side of the first side plate 12 and the second side plate 13 , and the blocking card 2 is covered on the open side of the magazine body 1 through the slide 15 .

[0076] Specifically, the slide 15 is provided on one side of the first side plate 12 and the second side plate 13 close to the open surface, and the slide 15 can be a groove-like slide that runs from top to bottom. The baffle 2 is covered on the magazine body 1 through the slide 15 and can slide up and down through the slide 15.

[0077] Optionally, in a possible implementation, the baffle 2 is made of stainless steel or aluminum alloy to ensure the stability and durability of the baffle 2 under various environmental conditions.

[0078] Optional, please continue to refer to Figure 1 and Figure 2 In a possible implementation, the blocking card 2 includes a second top plate 21, a third side plate 22, a fourth side plate 23 and a cover plate 24; wherein,

[0079] The second top plate 21 is connected to the top of the cover plate 24 in a manner perpendicular to the cover plate 24;

[0080] The third side plate 22 and the fourth side plate 23 are respectively connected to both sides of the cover plate 24 in a manner perpendicular to the cover plate 24;

[0081] The cover plate 24 is provided with the through slot array 241;

[0082] The blocking card 2 is arranged to cover the open surface of the magazine body 1 in such a manner that the third side plate 23 and the fourth side plate 24 are inserted into the slideway 15 .

[0083] Specifically, the second top plate 21 is located on top of the retaining card 2 and is vertically connected to the cover plate 24. The cover plate 24 is the main body of the retaining card 2, covering the open surface of the magazine body 1. The third side plate 22 and the fourth side plate 23 are respectively connected to either side of the cover plate 24 and are perpendicular to the cover plate 24, allowing the magazine retaining card 2 to be securely inserted into the slideway 15 of the magazine body 1.

[0084] Furthermore, a through-groove array 241 is provided on the cover plate 24 , and the shape of the through-groove array 241 matches the shape of the placement groove array 16 .

[0085] The following is a brief introduction to the working principle of the material box for storing semiconductor products provided by this application:

[0086] Please refer to Figure 1 and Figure 2 It is understandable that the blocking card 2 can be raised and lowered in the vertical direction. When the blocking card 2 is raised and lowered in the vertical direction, the corresponding relationship between the through slot array 241 on the blocking card 2 and the placement slot array 16 on the magazine body 1 changes. Figure 2 When the through slot array 241 and the placement slot array are not misaligned and correspond to each other, the material box is in an open state; further, referring to Figure 1 When the through slot array 241 and the placement slot array 16 are misaligned and do not correspond to each other, the material box is in a locked state.

[0087] Optional, please continue to refer to Figure 1 and Figure 2 In a possible implementation, when the blocking card 2 is covered on the magazine body in a manner that the top plate contacts the top plate of the magazine body 1, the through-slot array 241 and the placement slot array 16 are misaligned and do not correspond to each other, and the magazine is in a locked state;

[0088] Further, refer to Figure 2 A groove is provided on the bottom plate 14 of the material box body 1. When the material box is on the semiconductor production equipment, the lifting component 6 on the semiconductor production equipment is accommodated in the groove and contacts the cover plate of the baffle 2 to lift the baffle 2, so that the through groove array 241 and the placement slot array 16 are not misaligned with each other and correspond to each other, so that the material box is converted from a locked state to an open state.

[0089] Specifically, when the magazine is not on the semiconductor production equipment, or when the magazine is being transferred, the magazine's retaining clip 2 remains at the lowest end due to gravity. At this point, the magazine is locked, restricting the position of the semiconductor products in the magazine and protecting them from slipping out or falling out of the magazine. Furthermore, when the magazine is placed on the semiconductor production equipment, the lifting component 6 on the equipment raises the retaining clip 2 so that the through-slot array 241 on the retaining clip 2 corresponds to the position of the placement slot array 16 on the magazine body 1. At this point, the magazine is in the open state, and the equipment can take or put materials from the magazine.

[0090] Optional, Figure 3 This is a schematic diagram of a magazine for storing semiconductor products according to an exemplary embodiment of the present application. Figure 4 This is a schematic diagram of a card blocking assembly according to an exemplary embodiment of the present application. Figure 3 and Figure 4 ,exist Figure 3 and Figure 4 In the example shown, the baffle 2 is a baffle assembly, which includes a first baffle 210, a second baffle 220, a first connector 230, a second connector 240, and a bottom connecting plate 250; a first groove matching the first connector 230 and a second groove matching the second connector 240 are provided on the bottom plate of the magazine body 1; wherein,

[0091] The first connecting member 230 is connected to the bottom end of the cover plate of the first blocking card 210; the second connecting member 240 is connected to the bottom end of the cover plate of the second blocking card 220; the bottom connecting plate 250 is connected to the first connecting member 230 and the second connecting member 240 respectively;

[0092] When the blocking assembly is covered on the magazine in a manner that the top plate contacts the top plate of the magazine body 1, the through slot array 241 and the placement slot array 16 are misaligned and do not correspond to each other, and the magazine is in a locked state;

[0093] When the material box is on the semiconductor production equipment, the lifting component on the semiconductor production equipment contacts the bottom connecting plate 250 to lift the blocking assembly, so that the first connecting member 230 is accommodated in the first groove and the second connecting member 240 is accommodated in the second groove, so that the through groove array 241 and the placement groove array 16 are not misaligned with each other and correspond to each other, and the material box is converted from a locked state to an open state.

[0094] Specifically, when the magazine body 1 has two open surfaces, two retaining clips are provided, and the bottom connecting plate and retaining clips are connected by connectors to form a retaining clip assembly. In this way, when the device clamps the magazine, the retaining clip assembly can be raised to the open position, placing the magazine in the open state for taking or putting materials from the magazine.

[0095] The magazine for storing semiconductor products provided in this embodiment is provided with a retaining card, which is arranged to cover the open surface of the magazine body in a manner that can slide in the vertical direction. In this way, the correspondence between the through-slot array on the retaining card and the placement slot array on the magazine body is changed by the vertical lifting of the retaining card. When the through-slot array and the placement slot array are not misaligned and correspond to each other, the magazine is in an open state. When the through-slot array and the placement slot array are misaligned and do not correspond to each other, the magazine is in a locked state. In this way, when loading materials, the need to remove the retaining card is avoided. Furthermore, the need to install the retaining card after removing the magazine from the equipment is avoided, greatly reducing the risk of products falling out of the magazine.

[0096] Please refer to Figure 3 In a possible implementation, both the first side panel 12 and the second side panel 13 include reinforcing ribs 17 .

[0097] Specifically, by providing reinforcing ribs, the structural strength of the material box body can be increased, the structural stability of the material box body can be improved, and the deformation of the material box body can be prevented, thereby further preventing the problem of semiconductor products being damaged due to deformation of the material box body.

[0098] Optional, please continue to refer to Figures 1 to 3 In a possible implementation, the cover plate 24 is a hollow rectangular plate; each through slot in the through slot array 241 is formed by providing a card slot on both sides of the hollow rectangular plate.

[0099] Specifically, the cover plate is configured as a hollow matrix plate. On the one hand, this can provide the cover plate with a higher structural strength, and on the other hand, it can reduce the overall weight of the cover plate.

[0100] In a possible implementation, the cover plate 24 is a plate-shaped object, and the through-slot array 241 is an array composed of through holes provided on the plate-shaped object.

[0101] Specifically, the cover plate 24 may be a flat cover plate with through holes formed thereon, and the through holes constitute the through slots in the through slot array.

[0102] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A material box for storing semiconductor products, characterized in that: The material box includes a material box body and a blocking card, wherein; The magazine body is provided with an array of placement slots for placing semiconductor products; The blocking card is slidably mounted on the open surface of the magazine body in a vertical direction; the blocking card is provided with a through-slot array; the shape of the through-slot array matches the shape of the placement slot array; the magazine body is provided with a slideway extending in the vertical direction, and the blocking card is covered on the open surface of the magazine body via the slideway and is slidable in the vertical direction; The corresponding relationship between the through-slot array on the blocking card and the placement slot array on the magazine body is changed by lifting the blocking card in the vertical direction. When the through-slot array and the placement slot array are not misaligned and correspond to each other, the magazine is in an open state. When the through-slot array and the placement slot array are misaligned and do not correspond to each other, the magazine is in a locked state. When the blocking card is covered on the magazine body in a manner that the top plate contacts the top plate of the magazine body, the through slot array and the placement slot array are misaligned and do not correspond to each other, and the magazine is in a locked state; A groove is provided on the bottom plate of the material box body. When the material box is on the semiconductor production equipment, the lifting component on the semiconductor production equipment is accommodated in the groove and contacts the cover plate of the baffle to lift the baffle, so that the through groove array and the placement slot array are not misaligned with each other and correspond to each other, so that the material box is converted from a locked state to an open state.

2. The material box according to claim 1, characterized in that The material box body includes a first top plate, a first side plate, a second side plate and a bottom plate; wherein, The first top plate, the first side plate, the second side plate and the bottom plate are arranged to form a box structure with an open opening; The placement groove array is formed on the inner side surfaces of the first side plate and the second side plate; The outer sides of the first side plate and the second side plate are provided with slideways, and the blocking card is arranged on the open surface of the material box body through the slideway cover.

3. The material box according to claim 2, characterized in that: The first side panel and the second side panel have reinforcing ribs.

4. The material box according to claim 2, characterized in that: The blocking card includes a second top plate, a third side plate, a fourth side plate and a cover plate; wherein, The second top plate is connected to the top of the cover plate in a manner perpendicular to the cover plate; The third side plate and the fourth side plate are respectively connected to both sides of the cover plate in a manner perpendicular to the cover plate; The through slot array is provided on the cover plate; The blocking card is covered on the open surface of the material box body in a manner that the third side plate and the fourth side plate are inserted into the slide channel.

5. The material box according to claim 4, characterized in that: The cover plate is a hollow rectangular plate; each through slot in the through slot array is formed by clamping slots arranged on both sides of the hollow rectangular plate.

6. The material box according to claim 4, characterized in that: The cover plate is a plate-shaped object, and the through-slot array is an array composed of through holes arranged on the plate-shaped object.

7. The material box according to claim 1, characterized in that: The material box body is made of aluminum alloy material.

8. The material box according to claim 1, characterized in that: The baffle is made of stainless steel or aluminum alloy.

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