Remote monitoring and alarming device for aging box

Abstract

The utility model provides a remote monitoring and alarming device for an aging box, and the device comprises a main control module, and also comprises a voltage detection module which is configured to be connected with a first port of the main control module, and is used for transmitting collected voltage data to the main control module; the temperature detection module is configured to be connected with the second port of the main control module and is used for transmitting the collected temperature data to the main control module; the input end of the communication module is configured to be connected with the first output end of the main control module, one output end of the communication module is connected with an upper computer, and the communication module is used for receiving data sent by the main control module and transmitting the data to the upper computer; and the alarm circuit is configured to have one input end connected with the second output end of the main control module and is used for receiving an alarm signal sent by the main control circuit. Through effective connection of all the modules, real-time monitoring and data transmission are realized, an abnormal state can be responded in time, alarm information can be sent to an upper computer, and the safety and the operation efficiency of equipment are improved.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit testing, and in particular to a remote monitoring and alarm device for a burn-in box. Background Art

[0002] Chips are widely used in military, commercial, and civilian applications, making their reliability crucial. To this end, chips must undergo accelerated aging testing before installation. This process simulates long-term usage in a short period of time to verify their performance and stability. This not only ensures the proper functioning of the chip within its expected lifespan but also effectively improves the overall quality of the product. Furthermore, aging testing can identify potential flaws in chip design and manufacturing, preventing problems and reducing the risk of subsequent failures, further enhancing chip reliability.

[0003] However, existing chip burn-in chamber testing has several shortcomings. Testers must frequently visit on-site for monitoring, increasing labor and time costs and reducing testing efficiency. Furthermore, during testing, chips can be damaged due to circuit problems or human error, and the existing system lacks timely feedback on abnormalities. Consequently, problems cannot be addressed promptly, potentially leading to further damage and seriously compromising the accuracy of test results and chip safety. Utility Model Content

[0004] In view of this, the present application is dedicated to providing a remote monitoring and alarm device for a aging box, which is used to solve the problem in the existing technology that the aging box lacks remote real-time monitoring during the test process, the tester cannot obtain the voltage and temperature data of the chip in time, and cannot trigger the alarm in the first time when the chip is damaged.

[0005] In a first aspect, the present application provides a remote monitoring and alarm device for a aging box, comprising a main control module and further comprising:

[0006] a voltage detection module, configured to be connected to the first port of the main control module and used to transmit the collected voltage data to the main control module;

[0007] a temperature detection module, configured to be connected to the second port of the main control module and used to transmit the collected temperature data to the main control module;

[0008] a communication module, configured such that an input end is connected to a first output end of the main control module, and an output end of the communication module is connected to a host computer, for receiving data sent by the main control module and transmitting the data to the host computer;

[0009] The alarm circuit is configured with an input end connected to the second output end of the main control module, and is used to receive the alarm signal sent by the main control circuit.

[0010] Optionally, the device further comprises:

[0011] The power supply module is configured such that the IN pin is connected to the input power supply, the BST pin is connected to the VIN pin, and the VOUT pin is connected to the VDDA pin, VDD_1 pin, VDD_2 pin and VDD_3 pin of the main control module respectively.

[0012] Optionally, the VOUT pin is also connected to the VS+ pin, the first SDA pin and the first SCL pin of the voltage module respectively; the VOUT pin is also connected to the VDDA pin, the VDD3P3 pin and the VDDPST pin of the communication module respectively.

[0013] Optionally, the voltage detection module is further configured such that the VIN+ pin and the VBUS pin are respectively connected to the VBUS_I pin; the VIN+ pin is connected to the VBUS_O pin through a resistor R41, and the VBUS_O pin is connected to the VIN- pin of the voltage detection module.

[0014] Optionally, the temperature detection module is further configured such that the OS pin is connected to the cathode of LED3, and the anode of LED3 is connected to the BST pin of the power module through a resistor R37; the OS pin is also connected to the BST pin of the power module through a resistor R38, the second SCL pin is connected to the BST pin of the power module through a resistor R39, and the second SDA pin is connected to the BST pin of the power module through a resistor R40.

[0015] Optionally, the alarm circuit is further configured such that another input terminal is connected to a third output terminal of the main control module.

[0016] Optionally, the voltage detection module is further configured such that the first SCL pin is connected to the PB6 pin of the main control module;

[0017] The temperature detection module is further configured such that the second SCL pin is connected to the PB8 pin of the main control module;

[0018] The communication module is further configured such that the UO_TXD pin is connected to the PA10 pin of the main control module.

[0019] Optionally, the device further comprises:

[0020] a crystal oscillator circuit, configured such that one end of a first transistor is connected to the PD0 pin of the main control module, and the other end of the first transistor is connected to the PD1 pin of the main control module; one end of the first transistor is also grounded via a capacitor C51, and the other end of the first transistor is also grounded via a capacitor C54;

[0021] One end of the second transistor is connected to the PC15 pin of the main control module, and the other end of the second transistor is connected to the PC14 pin of the main control module; one end of the second transistor is also grounded through capacitor C55, and the other end of the second transistor is also grounded through capacitor C56.

[0022] Optionally, the device further comprises:

[0023] The reset circuit is configured such that one end of the resistor R32 is grounded via the capacitor C48 and the other end is connected to the VOUT pin of the power module, and the NRST pin of the main control module is connected between the capacitor C48 and the resistor R32.

[0024] Optionally, the device further comprises:

[0025] The download circuit is configured such that the SWDIO pin is connected to the PA13 pin of the main control module, and the SWCLK pin is connected to the PA14 pin of the main control module.

[0026] According to the technical solution of the present application, the voltage detection module transmits the collected voltage data to the main control module, and the temperature detection module transmits the collected temperature data to the main control module for processing. At the same time, the communication module receives the monitoring data processed by the main control module and transmits it to the host computer to realize real-time monitoring of the voltage and temperature in the chip aging box. In addition, when the system detects that the temperature or voltage exceeds the set range, the alarm circuit responds quickly, triggers the alarm signal, and promptly reminds the tester to avoid chip damage. The technical solution of the present application effectively improves the security and real-time performance of monitoring during chip testing, enables testers to achieve real-time monitoring through remote means, reduces the frequency of on-site operations, and improves work efficiency and safety.

[0027] Furthermore, the stability and scalability of the burn-in box's remote monitoring and alarm system are further enhanced through the design of a power module, crystal oscillator circuit, reset circuit, and download circuit. The power module ensures stable power supply to each functional module; the crystal oscillator circuit provides an accurate clock signal for the main control module; the reset circuit provides system self-recovery capabilities, preventing system crashes caused by abnormal operation or malfunctions; and the download circuit simplifies device program updates and debugging. The combination of these modules makes the entire remote monitoring and alarm system more reliable and easier to maintain, meeting the high stability and maintainability requirements of chip burn-in testing.

[0028] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application and to implement it in accordance with the contents of the specification, the following is a detailed description of the preferred embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 The following is a structural block diagram of a remote monitoring and alarm device for a aging box according to an embodiment of the present application;

[0030] Figure 2 shows a circuit diagram of a main control module 1 according to one embodiment of the present application;

[0031] Figure 3 shows a circuit diagram of a voltage detection module 3 according to an embodiment of the present application;

[0032] Figure 4 shows a circuit diagram of a temperature detection module 4 according to an embodiment of the present application;

[0033] Figure 5 shows a circuit diagram of a communication module 2 according to one embodiment of the present application;

[0034] Figure 6 shows a circuit diagram of an alarm circuit 5 according to one embodiment of the present application;

[0035] Figure 7 shows a circuit diagram of a power supply module according to one embodiment of the present application;

[0036] Figure 7 (a) shows a circuit diagram of a power module performing a first voltage conversion according to an embodiment of the present application;

[0037] Figure 7 (b) shows a circuit diagram of a power module performing a second voltage conversion according to an embodiment of the present application;

[0038] Figure 8 A circuit diagram of a crystal oscillator circuit according to an embodiment of the present application is shown;

[0039] Figure 9 shows a circuit diagram of a reset circuit according to one embodiment of the present application;

[0040] Figure 10 A circuit diagram of a download circuit according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0041] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It will be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some, rather than all, structures related to the present application are shown in the accompanying drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0042] As used herein, the terms "comprise," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0043] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0044] Figure 1 FIG. 1 shows a block diagram of a remote monitoring and alarm device for a aging box according to an embodiment of the present application. Figure 1 As shown, the main control module 1 is also connected to the voltage detection module 3 and the temperature detection module 4, respectively, for data transmission between the voltage detection module 3 and the temperature detection module 4. The main control module 1 is also connected to the communication module 2, and through data transmission with the communication module 2, it establishes a connection with the host computer. The main control module 1 is also connected to the alarm circuit 5, and through signal transmission with the alarm circuit 5, it can realize timely alarm prompts when the temperature or voltage exceeds the set range.

[0045] Figure 2 FIG1 shows a circuit diagram of a main control module 1 according to an embodiment of the present application. Figure 2 As shown, the main control module 1 includes a first port, a second port, a first output terminal and a second output terminal. The first port is the PB7 pin, the second port is the PB9 pin, the first output terminal is the PA9_TX pin, and the second output terminal is the PA1 pin.

[0046] Figure 3 FIG. 1 shows a circuit diagram of a voltage detection module 3 according to an embodiment of the present application. Figure 3 As shown, the voltage detection module 3 includes a first SDA pin, which is connected to the PB7 pin of the main control module 1 and is used to transmit the collected voltage data to the main control module 1. The first SDA pin of the voltage detection module 3 is connected to the PB7 pin of the main control module 1, and the I 2C communication protocol for data transmission not only standardizes communication methods and ensures data stability and reliability, but also simplifies connection and wiring complexity, reducing design complexity. Furthermore, this connection method enables the main control module 1 to monitor voltage changes in real time, respond promptly to potential issues, and improve system reliability. Furthermore, it facilitates future module expansion, simplifies the debugging process, and improves development efficiency.

[0047] In some embodiments, the main control module 1 can also transmit data to the voltage detection module 3 via the PB7 pin connected to the first SDA pin of the voltage detection module 3, thereby realizing bidirectional data transmission between the main control module 1 and the voltage detection module 3.

[0048] In some embodiments, the voltage detection module 3 further includes a first SCL pin, a VIN+ pin, a VIN- pin, and a VBUS pin. The first SCL pin is connected to the PB6 pin of the main control module 1 for providing a synchronous clock signal. 2 Data transmission on the C bus. During the communication process, the main control module 1 provides a clock pulse to the voltage detection module 3 through the first SCL pin, which determines the timing and rate of data transmission. The VIN+ pin and the VBUS pin are respectively connected to the VBUS_I pin. The VBUS_I pin is used to connect the voltage source to be measured and represents the voltage at the measurement input. In addition, the VIN+ pin is connected to the VBUS_O pin through a resistor R41, and the VBUS_O pin is also connected to the VIN- pin of the voltage detection module 3. The VBUS_O pin serves as the output channel of the detected voltage signal and is connected to the main control module 1 for further processing. The connection between the VBUS_I pin and the VBUS_O pin helps to achieve voltage distribution and balance within the voltage detection module 3. This connection method can effectively limit the current passing through the VIN+ and VIN- pins, thereby improving the detection accuracy of the circuit and avoiding measurement errors caused by voltage differences. At the same time, the presence of R41 also helps to protect the voltage signal and prevent damage to the voltage detection module 3 due to transient voltage fluctuations.

[0049] Figure 4 FIG. 4 shows a circuit diagram of a temperature detection module 4 according to an embodiment of the present application. Figure 4 As shown, the temperature detection module 4 includes a second SDA pin, which is connected to the PB9 pin of the main control module 1 and is used to transmit the collected temperature data to the main control module 1. 2 C communication protocol for data transmission.

[0050] In some embodiments, the main control module 1 can also transmit data to the voltage detection module 3 via the PB9 pin connected to the second SDA pin of the temperature detection module 4, thereby realizing bidirectional data transmission between the main control module 1 and the voltage detection module 3. 2 The bidirectional communication function of the I C bus can save pin resources and realize efficient data exchange between the temperature sensor and the main control module 1. 2 The C protocol supports multiple slave devices, so the master module 1 can easily manage and read data from multiple sensors.

[0051] In some embodiments, the temperature detection module 4 further includes a second SCL pin, which is connected to the PB8 pin of the main control module 1 and is used to provide a synchronous clock signal. 2 The synchronous communication of the C protocol ensures efficient data exchange between the main control module 1 and the temperature detection module 4. This design provides precise clock synchronization, ensures the reliability of data transmission, and supports multi-device communication, enabling the main control module 1 to manage multiple sensors.

[0052] Figure 5 FIG. 2 shows a circuit diagram of a communication module 2 according to an embodiment of the present application. Figure 5 As shown, communication module 2 includes an input terminal, namely the UO_RXD pin, which is connected to the PA9_TX pin of main control module 1. Main control module 1 transmits data to communication module 2 via the PA9_TX pin. The serial communication UART enables efficient data transmission between main control module 1 and communication module 2, ensuring stable data transmission. Furthermore, this serial communication method is simple, reliable, and easy to implement. It also supports asynchronous communication, enabling high-speed, reliable data transmission in resource-limited situations and is suitable for a variety of communication applications. Communication module 2 also includes one output terminal, namely the ANT pin, which is connected to a host computer and is used to transmit received data to the host computer. Remote data transmission is achieved via an antenna or wireless communication method, ensuring that the field data collected by main control module 1 can be transmitted to the host computer in real time for processing and monitoring. This design simplifies the complexity of wired connections, provides a larger communication range, enables remote monitoring and data management of the aging box, and improves the flexibility and scalability of the system.

[0053] In some embodiments, the communication module 2 also includes another output end, namely the UO_TXD pin, which is connected to the PA10 pin of the main control module 1 and is used to transmit data to the main control module 1, so that the main control module 1 can receive data sent from the communication module 2 in real time, thereby improving the system's data interaction capability, ensuring the rapid transmission and processing of information, and thus enhancing the overall performance and responsiveness of the system.

[0054] Figure 6 FIG. 5 shows a circuit diagram of an alarm circuit 5 according to an embodiment of the present application. Figure 6 As shown, the alarm circuit 5 includes an input terminal, namely the PA1 pin, which is connected to the PA1 pin of the main control module 1 and is used to receive the alarm signal sent by the main control circuit. The PA1 pin is connected to the transistor Q3 through the resistor R47, and the transistor Q3 is then connected to the LED4 through the resistor R45, thereby controlling the lighting of the LED4. When the main control module 1 finds that the voltage detected by the voltage detection module 3 and the temperature detected by the temperature detection module 4 are higher than the preset voltage and preset temperature, the alarm signal is transmitted to the alarm circuit 5 through the PA1 pin. After receiving the alarm signal, Q3 controls the LED4 to light up, thereby realizing the alarm indication. Such a circuit design enables the alarm system to quickly respond to the instructions of the main control module 1, improves the real-time and reliability of the alarm, and thus can quickly issue an alarm when an abnormal situation occurs, ensuring that potential problems are handled in a timely manner.

[0055] In some embodiments, the alarm circuit 5 includes another input, the PA0 pin, which is connected to the main control module 1's third output, the PA0-WKUP pin. This allows the main control module 1 to monitor or wake up the alarm circuit 5. The main control module 1 can detect specific conditions or events via the PA0 pin, triggering the alarm system or restoring the system's operating state when necessary. For example, if the device detects a module anomaly during a self-test, a signal can be transmitted to the alarm circuit 5 via the PA0 pin, illuminating the LED 5 as an alarm indication. This design enhances system flexibility, ensures timely response to potential issues, and improves overall safety and reliability.

[0056] According to the above embodiment, the voltage detection module 3 transmits the collected voltage data to the main control module 1, and the temperature detection module 4 transmits the collected temperature data to the main control module 1 for processing. At the same time, the communication module 2 receives the monitoring data processed by the main control module 1, and transmits it to the host computer, thereby realizing real-time monitoring of the voltage and temperature in the chip aging box. In addition, when the system detects that the temperature or voltage exceeds the set range, the alarm circuit 5 responds quickly, triggers an alarm signal, and promptly reminds the tester to avoid chip damage. The technical solution of the present application effectively improves the security and real-time performance of monitoring during chip testing, enables testers to achieve real-time monitoring through remote means, reduces the frequency of on-site operations, and improves work efficiency and safety.

[0057] Figure 7 FIG1 shows a circuit diagram of a power supply module according to an embodiment of the present application. Figure 7 As shown, the power module consists of two parts, Figure 7(a) shows a circuit diagram of a power module performing a first voltage conversion according to an embodiment of the present application, Figure 7 (b) shows a circuit diagram of a power module performing a second voltage conversion according to an embodiment of the present application. Figure 7 (a) and Figure 7 As shown in (b), the power module includes chip U12 and chip U13. The IN pin of chip U12 is connected to the input power supply, the BST pin of chip U12 is connected to the VIN pin of chip U13, and the VOUT pin of chip U13 is respectively connected to the VDDA pin, VDD_1 pin, VDD_2 pin, and VDD_3 pin of the main control module 1. The voltage of the input power supply is received through the IN pin, and the first voltage conversion is performed by chip U12 to obtain a +5V output voltage. The voltage is output to chip U13 through the BST pin for a second voltage conversion to obtain a 3V3 output voltage. The 3V3 voltage is output to the main control module 1 through the VOUT pin connected to the VDDA pin, VDD_1 pin, VDD_2 pin, and VDD_3 pin of the main control module 1 to power it.

[0058] In some embodiments, the VOUT pin is further connected to the VS+ pin, the first SDA pin, and the first SCL pin of the voltage module, respectively, to provide a 3V3 voltage to the voltage module. Simultaneously, the VOUT pin is further connected to the VDDA pin, the VDD3P3 pin, and the VDDPST pin of the communication module 2, respectively, to provide a 3V3 voltage to the communication module 2.

[0059] This power module design utilizes two-stage voltage conversion to effectively stabilize the input power supply voltage to the required +5V and 3.3V, ensuring a stable power supply for the main control module 1 and other modules. The series configuration of chips U12 and U13 provides the power module with greater efficiency and flexibility, enabling it to meet diverse voltage requirements, thereby improving overall system performance and reliability while also facilitating fine-grained power management.

[0060] In some embodiments, the OS pin of the temperature detection module 4 is connected to the cathode of LED 3, and the anode of LED 3 is connected to the BST pin of the power module via resistor R37. The OS pin is also connected to the BST pin of the power module via resistor R38, the second SCL pin is connected to the BST pin of the power module via resistor R39, and the second SDA pin is connected to the BST pin of the power module via resistor R40. The power module provides a +5V voltage to the temperature detection module 4 via the BST pin. The temperature detection module 4 collects temperature via a temperature sensor U17. When the detected temperature reaches the temperature threshold set by the temperature sensor U17 (i.e., too high or too low), the temperature sensor U17 outputs a signal via the OS pin, triggering the lighting of LED 3. Conversely, if the temperature is normal, the OS pin does not output a signal, and LED 3 remains off. Resistor R37 is a current-limiting resistor used to protect LED 3 from damage due to excessive current. Resistor R38 connects the OS pin to the BST pin, acting as a pull-up or current-limiting resistor to ensure the stability of the OS pin. Resistors R39 and R40 are used to connect the second SCL and second SDA pins to the BST pin respectively, and play a pull-up role to ensure that these pins remain in a high level state when no data is transmitted, stabilize the signal, and improve communication reliability.

[0061] Figure 8 FIG. 1 shows a circuit diagram of a crystal oscillator circuit according to an embodiment of the present application. Figure 8 As shown, the crystal oscillator circuit includes a first transistor X1, a second transistor X2, a capacitor C51, a capacitor C54, a capacitor C55 and a capacitor C56. One end of the first transistor is connected to the PD0 pin of the main control module 1, and the other end is connected to the PD1 pin of the main control module 1. One end of the first transistor is also grounded through capacitor C51, and the other end is also grounded through capacitor C54. One end of the second transistor is connected to the PC15 pin of the main control module 1, and the other end is connected to the PC14 pin of the main control module 1. One end of the second transistor is also grounded through capacitor C55, and the other end is also grounded through capacitor C56. By using two transistors and multiple capacitors, a stable oscillator is formed, which can provide a high-frequency clock signal to ensure the precise timing and synchronous operation of the main control module 1. The configuration of the first transistor and the second transistor and the connection with the capacitor enhance the frequency stability and anti-interference capability of the circuit, thereby improving the overall reliability and performance of the system and adapting to a variety of application requirements.

[0062] Figure 9 FIG. 1 shows a circuit diagram of a reset circuit according to an embodiment of the present application. Figure 9As shown, the reset circuit includes resistor R32 and capacitor C48. One end of resistor R32 is grounded through capacitor C48, and the other end is connected to the VOUT pin of the power module. The NRST pin of the main control module 1 is connected between capacitor C48 and resistor R32. One end of RST1 is connected between resistor R32 and capacitor C48, and the other end is grounded. This design forms an RC delay network through resistor R32 and capacitor C48, which can provide a stable reset signal to ensure that the main control module 1 obtains the appropriate reset time when powered on, thereby clearing potential error states. During operation, when the VOUT pin of the power module outputs voltage, capacitor C48 will begin to charge. Resistor R32 limits the charging rate, causing the NRST pin to remain low during the charging process. Only after capacitor C48 is charged to a sufficient voltage will the NRST pin rise to a high level, releasing the reset signal and allowing the main control module 1 to start normally. This process ensures the stability and reliability of the system during startup.

[0063] Figure 10 FIG. 1 shows a circuit diagram of a download circuit according to an embodiment of the present application. Figure 10 As shown in the figure, the download circuit includes SWDIO and SWCLK pins. The SWDIO pin is connected to PA13 of Master Control Module 1, and the SWCLK pin is connected to PA14 of Master Control Module 1. The download circuit connects to PA13 and PA14 of Master Control Module 1 via the SWDIO and SWCLK pins for programming and debugging. This design improves programming efficiency, simplifies connections, supports online debugging and status monitoring, and enhances development flexibility and convenience, thereby improving the overall reliability and maintainability of the system.

[0064] According to the above embodiment, the stability and scalability of the remote monitoring and alarm system for the burn-in box are further enhanced through the design of the power module, crystal oscillator circuit, reset circuit, and download circuit. The power module ensures stable power supply to each functional module; the crystal oscillator circuit ensures an accurate clock signal for the main control module 1; the reset circuit provides system self-recovery capabilities, preventing system crashes caused by abnormal operation or malfunctions; and the download circuit simplifies device program updates and debugging. The combination of these modules makes the entire remote monitoring and alarm system more reliable and easier to maintain, meeting the high stability and maintainability requirements of chip burn-in testing.

[0065] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A remote monitoring and alarm device for an aging box, including a main control module, characterized in that: Also includes: a voltage detection module, configured to be connected to the first port of the main control module and used to transmit the collected voltage data to the main control module; a temperature detection module, configured to be connected to the second port of the main control module and used to transmit the collected temperature data to the main control module; a communication module, configured such that an input end is connected to a first output end of the main control module, and an output end of the communication module is connected to a host computer, for receiving data sent by the main control module and transmitting the data to the host computer; The alarm circuit is configured with an input terminal connected to the second output terminal of the main control module, and is used to receive the alarm signal sent by the main control module.

2. The remote monitoring and alarm device for the aging box according to claim 1 is characterized in that: The device further comprises: The power supply module is configured such that the IN pin is connected to the input power supply, the BST pin is connected to the VIN pin, and the VOUT pin is connected to the VDDA pin, VDD_1 pin, VDD_2 pin and VDD_3 pin of the main control module respectively.

3. The remote monitoring and alarm device for the aging box according to claim 2 is characterized in that: The VOUT pin is also connected to the VS+ pin, the first SDA pin and the first SCL pin of the voltage module respectively; the VOUT pin is also connected to the VDDA pin, the VDD3P3 pin and the VDDPST pin of the communication module respectively.

4. The remote monitoring and alarm device for the aging box according to claim 1 is characterized in that: The voltage detection module is further configured such that the VIN+ pin and the VBUS pin are respectively connected to the VBUS_I pin; the VIN+ pin is connected to the VBUS_O pin via a resistor R41, and the VBUS_O pin is connected to the VIN- pin of the voltage detection module.

5. The remote monitoring and alarm device for the aging box according to claim 2 is characterized in that: The temperature detection module is also configured such that the OS pin is connected to the cathode of LED3, and the anode of LED3 is connected to the BST pin of the power module through a resistor R37; the OS pin is also connected to the BST pin of the power module through a resistor R38, the second SCL pin is connected to the BST pin of the power module through a resistor R39, and the second SDA pin is connected to the BST pin of the power module through a resistor R40.

6. The remote monitoring and alarm device for the aging box according to claim 1 is characterized in that: The alarm circuit is further configured such that another input terminal is connected to the third output terminal of the main control module.

7. The remote monitoring and alarm device for a aging tank according to claim 1, characterized in that: The voltage detection module is further configured such that a first SCL pin is connected to a PB6 pin of the main control module; The temperature detection module is further configured such that the second SCL pin is connected to the PB8 pin of the main control module; The communication module is further configured such that the UO_TXD pin is connected to the PA10 pin of the main control module.

8. The remote monitoring and alarm device for a aging tank according to claim 1, characterized in that: The device further comprises: a crystal oscillator circuit, configured such that one end of a first transistor is connected to the PD0 pin of the main control module, and the other end of the first transistor is connected to the PD1 pin of the main control module; one end of the first transistor is also grounded via a capacitor C51, and the other end of the first transistor is also grounded via a capacitor C54; One end of the second transistor is connected to the PC15 pin of the main control module, and the other end of the second transistor is connected to the PC14 pin of the main control module; one end of the second transistor is also grounded through capacitor C55, and the other end of the second transistor is also grounded through capacitor C56.

9. The remote monitoring and alarm device for a aging tank according to claim 2, characterized in that: The device further comprises: The reset circuit is configured such that one end of the resistor R32 is grounded via the capacitor C48 and the other end is connected to the VOUT pin of the power module, and the NRST pin of the main control module is connected between the capacitor C48 and the resistor R32.

10. The remote monitoring and alarm device for a aging tank according to claim 1, characterized in that: The device further comprises: The download circuit is configured such that the SWDIO pin is connected to the PA13 pin of the main control module, and the SWCLK pin is connected to the PA14 pin of the main control module.

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