Chip radiator and computer

Abstract

The chip radiator comprises a heat dissipation base, a heat dissipation assembly and a connecting piece, the heat dissipation base is installed on a main board, the heat dissipation base abuts against a chip on the main board and is used for exchanging heat with the chip, and the heat dissipation assembly is arranged on the side, away from the main board in the first direction, of the heat dissipation base. The heat dissipation assembly is arranged on the heat dissipation base and used for dissipating heat of the heat dissipation base, the connecting piece is connected between the heat dissipation base and the mainboard, and according to the thickness of the chip in the first direction, the end, connected to the heat dissipation base, of the connecting piece can deform relative to the end, connected to the mainboard, of the connecting piece. The two ends, connected to the heat dissipation base and the main board through the connecting pieces, of the heat dissipation base and the main board can deform relatively, and therefore chips of different thicknesses can be contained between the heat dissipation base and the main board.

Description

Technical Field

[0001] The present application relates to the technical field of computer radiators, and in particular to a chip radiator and a computer. Background Art

[0002] The chip in a computer, the central processing unit (CPU), generates a significant amount of heat during operation, typically requiring a heat sink installed on one side of the chip to dissipate the heat. However, different chips vary in thickness, making conventional heat sinks difficult to adapt to different chip thicknesses. Furthermore, installing them with an incompatible chip can easily damage the chip. Summary of the Invention

[0003] Based on this, a chip heat sink and a computer are provided to be adaptable to chips of different thicknesses.

[0004] A chip heat sink, comprising:

[0005] A heat dissipation base is mounted on the mainboard, the heat dissipation base abuts against the chip on the mainboard and is used to exchange heat with the chip;

[0006] a heat dissipation component, disposed on a side of the heat dissipation base away from the mainboard along a first direction, and configured to dissipate heat from the heat dissipation base; and

[0007] A connecting member is connected between the heat dissipation base and the mainboard, and according to the thickness of the chip along the first direction, the connecting member is configured so that one end connected to the heat dissipation base can be deformed relative to one end connected to the mainboard.

[0008] In one embodiment, the connecting member includes a spring.

[0009] In one embodiment, the chip heat sink includes at least two connecting members.

[0010] In one embodiment, the chip heat sink includes four connecting members, and the four connecting members are arranged around the heat dissipation base at equal intervals around an axis parallel to the first direction.

[0011] In one embodiment, the chip heat sink further includes a locking member and an elastic member, wherein the locking member is used to connect the connecting member and the mainboard;

[0012] The elastic member extends along the first direction and abuts between the locking member and the connecting member to provide a pre-tightening force to the connecting member toward the main board.

[0013] In one embodiment, the locking accessory includes a bolt, and one end of the connecting member connected to the main board is provided with a first screw hole corresponding to the bolt, and the main board is provided with a second screw hole adapted to the first screw hole, and the bolt is passed through the first screw hole and the second screw hole and locked between the connecting member and the main board;

[0014] The elastic member abuts between the bolt and the connecting member.

[0015] In one embodiment, the heat dissipation base includes a heat dissipation surface facing away from the heat dissipation component, the heat dissipation surface protrudes from the side of the heat dissipation base facing away from the heat dissipation component, and the heat dissipation surface abuts against the chip.

[0016] In one embodiment, the heat dissipation assembly includes a heat pipe, a radiator and a fan. The heat pipe is arranged on the connecting member and is connected to the radiator. Condensate flows in the radiator. The fan is arranged on one side of the radiator.

[0017] In one embodiment, a plurality of accommodating grooves are provided on a side of the heat dissipation base facing away from the mainboard, and the accommodating grooves are used to accommodate the heat pipes.

[0018] According to another aspect of the present application, a computer is provided, comprising the chip heat sink described in any one of the above embodiments.

[0019] The chip heat sink of the present application is connected to the heat sink base and the mainboard at both ends through connectors and can deform relative to each other, so that chips of different thicknesses can be accommodated between the heat sink base and the mainboard, so that the chip heat sink of the present application can adapt to the installation of chips of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the overall structure of a chip heat sink according to an embodiment of the present application.

[0021] Figure 2 for Figure 1 A schematic diagram of the overall structure of the chip heat sink of the illustrated embodiment from another angle.

[0022] Figure 3 for Figure 1 The chip heat sink of the embodiment shown is a schematic diagram of the overall structure of the chip heat sink installed on the mainboard.

[0023] Figure 4 for Figure 1 An exploded view of the chip heat sink of the embodiment shown is mounted on a motherboard.

[0024] Description of reference numerals:

[0025] 10. Chip radiator;

[0026] 100, heat dissipation base; 110, heat dissipation surface; 120, receiving groove;

[0027] 200, heat dissipation component; 210, heat pipe; 220, radiator; 230, fan;

[0028] 300, connecting piece; 310, hollow portion;

[0029] 410, mainboard; 420, chip; 510, lock accessory; 520, elastic member; 600, back panel; 610, lock accessory;

[0030] F1, first direction. DETAILED DESCRIPTION

[0031] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0033] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0034] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0035] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0036] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0037] In today's increasingly publicized world of energy conservation, environmental protection, and carbon neutrality, and with the increasing demand for easier computer installation, integrated motherboards 410 featuring highly integrated, low-power, and high-performance integrated chips 420 are becoming a mainstream technology and a new favorite among home users and office workers. Integrated motherboards 410 integrate chips 420 directly onto motherboard 410, eliminating the need for separate motherboards 410 and chips 420 for installation, thus improving computer installation convenience.

[0038] The chip 420 of the integrated motherboard 410 described above often has a certain thickness, which places certain requirements on the chip heat sink 10. Due to the inconsistent thickness of the chip 420, a gap will exist between the same chip heat sink 10 and different integrated motherboards 410 after they are assembled. This prevents the heat accumulated by the integrated motherboard 410 from being dissipated, posing a risk of burning the host computer. Furthermore, the base on which the chip 420 is mounted on the integrated motherboard 410 requires a certain amount of force to secure the chip heat sink 10. Directly squeezing the chip heat sink 10 with force increases the risk of damaging the chip 420.

[0039] Based on this, the present application provides a chip heat sink 10 and a computer, so that the chip heat sink 10 can be applicable to a motherboard 410 having chips 420 of different thicknesses.

[0040] See Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, Figure 1 FIG. 1 is a schematic diagram of the overall structure of a chip heat sink 10 according to an embodiment of the present application. Figure 2 for Figure 1 The overall structure diagram of the chip heat sink 10 of the embodiment shown is from another angle. Figure 3 for Figure 1 The chip heat sink 10 of the embodiment shown is a schematic diagram of the overall structure of the chip heat sink 10 installed on the mainboard 410. Figure 4 for Figure 1 The chip heat sink 10 of the illustrated embodiment is mounted on a mainboard 410 in an exploded view.

[0041] like Figure 1 and Figure 2 As shown, the chip heat sink 10 provided in the present application includes a heat sink base 100, a heat sink assembly 200, and a connector 300. The heat sink base 100 is mounted on a mainboard 410, abuts against a chip 420 on the mainboard 410, and is used to exchange heat with the chip 420, thereby cooling and dissipating the heat of the chip 420. The heat sink assembly 200 is provided on a side of the heat sink base 100 that is away from the mainboard 410 along a first direction F1, and is used to dissipate heat from the heat sink base 100. It can be understood that the heat sink assembly 200 dissipates heat from the heat sink base 100, facilitating heat dissipation from the heat sink base 100, thereby facilitating the heat sink base 100 to abut against the chip 420 for heat conduction with the chip 420, thereby cooling the chip 420.

[0042] The connector 300 is connected between the heat sink 100 and the motherboard 410. Depending on the thickness of the chip 420 along the first direction F1, the connector 300 is configured so that its end connected to the heat sink 100 can deform relative to its end connected to the motherboard 410. In other words, the connector 300 can deform to accommodate chips 420 of varying thicknesses. The chip 420 in this application is a central processing unit (CPU).

[0043] The chip heat sink 10 of the present application is connected to the heat dissipation base 100 and the two ends of the main board 410 through the connecting piece 300 and can deform relative to each other, so that chips 420 of different thicknesses can be accommodated between the heat dissipation base 100 and the main board 410, so that the chip heat sink 10 of the present application can adapt to the installation of chips 420 of different thicknesses.

[0044] In some embodiments, see Figure 2 As shown, the connecting member 300 includes a spring sheet, which can undergo elastic deformation between the two ends along its extension direction, so that the end of the spring sheet connected to the heat dissipation base 100 can be deformed relative to the end connected to the mainboard 410, so as to be suitable for the installation of chips 420 of different thicknesses.

[0045] In some embodiments, the chip heat sink 10 includes at least two connectors 300. That is, the provision of two or more connectors 300 helps to improve the connection strength between the chip heat sink 10 and the motherboard 410, and improves the installation strength of the chip heat sink 10 on the motherboard 410.

[0046] In some embodiments, see Figure 2 As shown, the chip heat sink 10 includes four connectors 300, which are arranged at equal intervals around the heat sink base 100 around an axis parallel to the first direction F1. It can be understood that the four connectors 300 are connected to the chip heat sink 10 from four directions and installed between the chip heat sink 10 and the motherboard 410. On the one hand, this further improves the installation strength between the chip heat sink 10 and the motherboard 410. On the other hand, it also provides a relatively balanced connection force on all four sides between the chip heat sink 10 and the motherboard 410. The chip 420 located between the chip heat sink 10 and the motherboard 410 is evenly stressed, reducing the risk of damage to the chip 420 due to uneven stress.

[0047] In some embodiments, see Figure 2 As shown, a hollow portion 310 is provided on the connecting member 300 to help reduce the weight of the connecting member 300 , and the elastic range of the connecting member 300 can be adjusted according to the setting of the hollow portion 310 .

[0048] In some embodiments, the chip heat sink 10 further includes a locking member 510 and an elastic member 520. The locking member 510 is configured to connect to the connector 300 and the motherboard 410. Specifically, the side of the connector 300 closest to the motherboard 410 is connected to the motherboard 410 via the locking member 510. The elastic member 520 extends along a first direction F1 and abuts between the locking member 510 and the connector 300 to provide a preload force on the connector 300 toward the motherboard 410. It will be appreciated that the elastic deformation of the elastic member 520, combined with the deformation of the connector 300, increases the range of the distance between the chip heat sink 10 and the motherboard 410, thereby accommodating a wider range of chips 420 thicknesses. Specifically, for thicker chips 420, the elastic deformation of the elastic member 520, combined with the deformation of the connector 300, can create a greater distance between the chip heat sink 10 and the motherboard 410, making it suitable for thicker chips 420. Furthermore, the arrangement of the elastic deformation of the elastic member 520 and the deformation of the connecting member 300 helps to alleviate the snapping force of the chip heat sink 10 and the mainboard 410 on the chip 420, thereby helping to extend the life of the chip 420.

[0049] In some embodiments, as Figure 4 As shown, the locking member 510 includes a bolt, that is, the locking member 510 can be configured as a bolt. A first screw hole corresponding to the bolt is provided at one end of the connector 300 connected to the mainboard 410. A second screw hole adapted to the first screw hole is provided on the mainboard 410. The bolt is passed through the first and second screw holes and locked between the connector 300 and the mainboard 410, thereby achieving a connection between the connector 300 and the mainboard 410. Correspondingly, the elastic member 520 abuts between the bolt and the connector 300 and is compressed along the first direction F1, or along the direction from the connector 300 toward the mainboard 410. This allows the installation depth of the locking member 510 relative to the mainboard 410 to be adjusted based on the thickness of the chip 420. The elastic member 520 thus provides the connector 300 with an appropriate preload force toward the mainboard 410, thereby alleviating the snap fit between the chip heat sink 10 and the mainboard 410 and reducing the risk of compression damage to the chip 420.

[0050] In some embodiments, see Figure 4As shown, the chip heat sink 10 of the present application also includes a back plate 600 and a locking accessory 610 provided on the back plate 600. The back plate 600 is provided on the side of the mainboard 410 away from the chip heat sink 10. The locking accessory 510 passes through the mainboard 410 and is adapted and connected to the locking accessory 610 on the back plate, that is, the back plate 600 and the chip heat sink 10 are provided on opposite sides of the mainboard 410 along the first direction, and the mainboard 410 is clamped therebetween. The chip heat sink 10 is then adapted and connected to the back plate 600, thereby realizing the installation of the chip heat sink 10 relative to the mainboard 410. The setting of the back plate 600 is conducive to improving the installation strength of the chip heat sink 10 relative to the mainboard 410, reducing the damage to the mainboard 410 caused by the installation position, and improving the protection of the mainboard 410.

[0051] In some embodiments, the locking accessories 610 are configured as mortises adapted to the bolts, and the chip heat sink 10 and the back plate 600 are connected by the bolts and the mortises.

[0052] In some embodiments, see Figure 2 As shown, the heat dissipation base 100 includes a heat dissipation surface 110 on the side facing away from the heat dissipation component 200. The heat dissipation surface 110 protrudes from the side of the heat dissipation base 100 facing away from the heat dissipation component 200, and the heat dissipation surface 110 abuts against the chip 420 for heat exchange with the chip 420. The setting of the heat dissipation surface 110 is conducive to improving the cooling efficiency of the chip 420.

[0053] In some embodiments, see Figures 1-4 As shown, the heat dissipation assembly 200 includes a heat pipe 210, a radiator 220, and a fan 230. The heat pipe 210 is provided on the connector 300 and is connected to the radiator 220. Condensate flows through the radiator 220, and the fan 230 is provided on one side of the radiator 220. It is understood that the fan 230 is provided on one side of the radiator 220 to cool the condensate flowing through the radiator 220. The cooled condensate flows into the heat pipe 210. The heat pipe 210 provided on the connector 300 exchanges heat with the heat dissipation base 100, causing the heat dissipation base 100 to dissipate heat and cool down. The heat dissipation base 100 then exchanges heat with the chip 420 abutting against it to dissipate heat and cool down. In this way, the chip 420 is cooled and cooled.

[0054] In some embodiments, the fan may be mounted on the radiator by means of bolts or other structures, which is not limited here.

[0055] In some embodiments, see Figure 4As shown, a plurality of accommodating grooves 120 are provided on a side of the heat sink 100 facing away from the mainboard 410. The accommodating grooves 120 are used to accommodate the heat pipes 210. Each accommodating groove 120 extends along the second direction, and the plurality of accommodating grooves 120 are sequentially arranged along the third direction. The provision of the accommodating grooves 120, on the one hand, facilitates the accommodation and installation of the heat pipes 210, and on the other hand, helps to increase the contact area between the heat pipes 210 and the heat sink 100, thereby improving the heat exchange efficiency between the heat pipes 210 and the heat sink 100 and enhancing the cooling efficiency of the heat sink 100.

[0056] The present application also provides a computer, comprising the above-mentioned chip heat sink 10, a motherboard 410 and a chip 420. The motherboard 410, the chip 420 and the chip heat sink 10 are stacked in sequence along the first direction F1. The distance between the chip heat sink 10 and the motherboard 410 is adjustable, which is suitable for the installation of chips 420 of different thicknesses along the first direction F1.

[0057] The chip heat sink 10 and computer provided in the present application are connected to the heat dissipation base 100 and the two ends of the motherboard 410 through the connecting piece 300 and can deform relative to each other, so that chips 420 of different thicknesses can be accommodated between the heat dissipation base 100 and the motherboard 410, so that the chip heat sink 10 of the present application can adapt to the installation of chips 420 of different thicknesses.

[0058] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A chip heat sink, characterized in that: The chip heat sink comprises: A heat dissipation base is mounted on the mainboard, the heat dissipation base abuts against the chip on the mainboard and is used to exchange heat with the chip; a heat dissipation component, disposed on a side of the heat dissipation base away from the mainboard along a first direction, and configured to dissipate heat from the heat dissipation base; a connector connected between the heat sink and the mainboard, wherein the connector is configured such that an end connected to the heat sink can deform relative to an end connected to the mainboard according to the thickness of the chip along the first direction; the connector includes a spring; and A locking accessory and an elastic member, wherein the locking accessory is used to connect the connecting member and the main board; the elastic member extends along the first direction and abuts between the locking accessory and the connecting member to provide a pre-tightening force to the connecting member toward the main board.

2. The chip heat sink according to claim 1, characterized in that: The connecting piece is provided with a hollow portion.

3. The chip heat sink according to claim 1, characterized in that: The chip heat sink includes at least two connecting members.

4. The chip heat sink according to claim 1, characterized in that: The chip heat sink includes four connecting members, and the four connecting members are arranged around the heat dissipation base at equal intervals around an axis parallel to the first direction.

5. The chip heat sink according to claim 1, characterized in that: The locking accessory includes a bolt.

6. The chip heat sink according to claim 1, characterized in that The locking accessory includes a bolt, and one end of the connecting member connected to the main board is provided with a first screw hole corresponding to the bolt, and the main board is provided with a second screw hole adapted to the first screw hole, and the bolt is passed through the first screw hole and the second screw hole and locked between the connecting member and the main board; The elastic member abuts between the bolt and the connecting member.

7. The chip heat sink according to claim 1, characterized in that: The heat dissipation base includes a heat dissipation surface on a side away from the heat dissipation component. The heat dissipation surface is raised on the side of the heat dissipation base away from the heat dissipation component, and the heat dissipation surface abuts against the chip.

8. The chip heat sink according to claim 1, characterized in that: The heat dissipation assembly includes a heat pipe, a radiator and a fan. The heat pipe is arranged on the connecting member and is connected to the radiator. Condensate flows in the radiator. The fan is arranged on one side of the radiator.

9. The chip heat sink according to claim 8, characterized in that: A plurality of accommodating grooves are provided on a side of the heat dissipation base facing away from the mainboard, and the accommodating grooves are used to accommodate the heat pipes.

10. A computer, characterized in that: The invention comprises a chip heat sink as claimed in any one of claims 1 to 9.

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