Mini PC magnetic suspension heat dissipation device

Abstract

The utility model discloses a mini PC magnetic suspension heat dissipation device which comprises a magnetic suspension mechanism, the magnetic suspension mechanism is electrically connected with a positive pole assembly through a wire, negative pole assemblies are fixed to the positive pole assembly at equal intervals, a coil is arranged between every two adjacent negative pole assemblies in a sliding mode, and air guide pieces are fixed to the coils. The wind scooper is fixed outside the magnetic suspension mechanism, the two ends of the positive pole assembly are fixed to the two sides of the wind scooper, and the wire is connected with the fan wire in series. When the magnetic suspension mechanism starts to operate, the blade tips of the drooping wind guide blades leave the bottom surface of the inner cavity of the wind scooper and drift to be parallel to the fins of the heat dissipation fins under the action of wind power; and the coils with the air guide sheets always reciprocate between the two adjacent cathode assemblies along the direction of the anode assembly under the action of repulsive force, so that air blown out of the air outlet is guided to the heat dissipation fins through the magnetic suspension mechanism. The problem that the air volume is obviously reduced due to the long air channel in the strip-shaped mini pc can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of mini computer heat dissipation, in particular to a mini PC magnetic suspension heat dissipation device. Background Art

[0002] Mini PCs are designed to be placed on a desk or mounted behind a monitor, so their internal cooling system must consider both noise and airflow. The CPU, the largest heat-generating component on the circuit board, is located in the center of the board and horizontally secured to the mini PC case via holes in the board's four corners. A fan is positioned directly above the CPU, with cooling fins positioned at the fan outlet, aligned with the patterned holes in the mini PC case. This cooling layout is suitable for mini PCs with rectangular housings. However, when the mini PC case undergoes significant changes, such as to the aspect ratio of current smartphones, this existing cooling layout becomes increasingly limited. While the CPU remains in the center of the board, the fan and cooling fins are positioned on either side of the CPU, significantly lengthening the cooling duct. If the cooling duct is too long, airflow to the CPU, GPU, Wi-Fi module, and Bluetooth module will be significantly reduced. Increasing the length of the cooling fins would be necessary, but this would increase cost and weight, significantly impacting cooling performance and overall cost. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a mini PC magnetic suspension heat dissipation device, the specific solution is:

[0004] A mini PC magnetic levitation cooling device includes a magnetic levitation mechanism, wherein the magnetic levitation mechanism is electrically connected to a positive electrode component by a wire, negative electrode components are fixed equidistantly on the positive electrode component, a coil is slidably arranged between two adjacent negative electrode components, and air guide plates are fixed on the coil. The device also includes an air guide cover fixed outside the magnetic levitation mechanism, the two ends of the positive electrode component are fixed to the two sides of the air guide cover, and the wire is connected in series with the fan wire.

[0005] As a preferred solution of the present invention, the air outlet of the air guide cover is connected to a heat dissipation fin, and a plurality of air holes are designed on the bottom of the air guide cover.

[0006] As a preferred solution of the present invention, a U-shaped heat-conducting copper tube is fixed to the bottom of the air guide cover, a magnetic levitation mechanism is inserted into the U-shaped mouth of the U-shaped heat-conducting copper tube, and the two end ends of the U-shaped heat-conducting copper tube are respectively fixedly connected to the heat dissipation fins and the heat-conducting plate, and a mounting strip is fixed on the heat-conducting plate.

[0007] As a preferred solution of the present invention, the air inlet of the air guide cover is connected to the air outlet of the fan, the fan is a turbo fan with an air inlet on the top, and the arc-shaped shell of the fan is locked with the inside of the PC case.

[0008] As a preferred solution of the present invention, the air guide cover, the heat dissipation fins and the fan have the same thickness.

[0009] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0010] The technical solution of the utility model is that when the fan is not powered on, the air guide blades droop, with the blade tips contacting the bottom surface of the air guide housing cavity. When the fan is powered on and starts to rotate, the fan wires and the wires are connected in series. At this time, the magnetic levitation mechanism starts to operate. Under the action of the wind, the tips of the drooping air guide blades leave the bottom surface of the air guide housing cavity and drift up, parallel to the fins of the heat sink. Because the magnetic levitation mechanism is in operation, the coils can carry the air guide blades in a repulsive force and move back and forth continuously. Under the action of the repulsive force, several coils with air guide blades reciprocate continuously between two adjacent negative electrode components in the direction of the positive electrode component, directing the air blown out of the air outlet through the magnetic levitation mechanism (the tips of the air guide blades leave the bottom surface of the air guide housing cavity and drift up, parallel to the fins of the heat sink, so that the wind blows directly to the heat sink along the gaps in the air guide blades). This solves the problem of significantly reduced air volume due to the length of the air duct in bar-shaped mini PCs, while also avoiding the problem of increasing the length of the heat sink fins, which increases the cost and weight of the entire machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural diagram of the utility model;

[0012] Figure 2 It is the internal structure diagram of the utility model;

[0013] Figure 3 It is the structural diagram of the magnetic levitation mechanism;

[0014] In the figure: 1 heat conducting plate, 2 mounting bar, 3 U-shaped heat conducting copper tube, 4 wires, 5 fan wires, 6 air inlet, 7 air outlet, 8 cooling fins, 9 fan, 10 air guide cover, 11 air guide plate, 12 positive electrode assembly, 13 coil, 14 negative electrode assembly. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the implementation of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0016] Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meanings understood by those of ordinary skill in the art. The terms "first," "second," and similar terms used in this disclosure do not denote any order, quantity, or importance, but are simply used to distinguish different components. The terms "include," "comprising," and similar words mean that the element or object preceding the word encompasses the elements or objects listed after the word, and their equivalents, without excluding other elements or objects.

[0017] Refer to the following Figure 1-3 The mini PC magnetic levitation cooling device of the embodiment of the present application is specifically described, including a magnetic levitation mechanism, the magnetic levitation mechanism is electrically connected to the positive electrode component 12 by a wire 4, and the negative electrode component 14 is equidistantly fixed on the positive electrode component 12. A coil 13 is slidingly arranged between two adjacent negative electrode components 14, and an air guide plate 11 is fixed on the coil 13. It also includes an air guide cover 10 fixed outside the magnetic levitation mechanism, and the two ends of the positive electrode component 12 are fixed to the two sides of the air guide cover 10. The wire 4 is connected in series with the fan wire 5.

[0018] In this embodiment, the positive electrode assembly 12, the negative electrode assembly 14, and the coil 13 are all magnetic metal components, such as iron alloy or nickel alloy. Coil 13 has a negative polarity, creating a repulsive force between the negative electrode assembly 14 and coil 13, which then slides over the positive electrode assembly 12 due to the fan's wind force.

[0019] Furthermore, the air outlet of the air guide cover 10 is connected to the heat dissipation fin 8 , and a plurality of air holes are designed at the bottom of the air guide cover 10 .

[0020] In this embodiment, the air guide cover 10 is a structure with openings at both ends, and a plurality of air holes at the bottom are conducive to the exchange of air with the lower air.

[0021] Furthermore, a U-shaped heat-conducting copper tube 3 is fixed to the bottom of the air guide cover 10, and a magnetic levitation mechanism is inserted into the U-shaped mouth of the U-shaped heat-conducting copper tube 3. The two ends of the U-shaped heat-conducting copper tube 3 are respectively fixedly connected to the heat dissipation fins 8 and the heat-conducting plate 1, and a mounting strip 2 is fixed on the heat-conducting plate 1.

[0022] In this embodiment, the main heat-generating component, the central processing unit, is installed below the heat-conducting sheet 1. On the one hand, the U-shaped heat-conducting copper tube 3 can guide some heat to the heat dissipation fins 8. On the other hand, due to the long mini-computer structure, the central processing unit is placed in the middle position between the fan 9 and the heat dissipation fins 8. There is no direct connection between the air outlet 7 of the fan 9 and the heat dissipation fins 8, resulting in the weakening of the wind force during the movement of the air volume at the air outlet, which is not conducive to heat dissipation. At this time, the operation of the magnetic levitation mechanism is conducive to not weakening the wind force, and is conducive to the heat around the central processing unit to be diverted to the heat dissipation fins 8.

[0023] Furthermore, the air inlet of the air guide cover 10 is connected to the air outlet 7 of the fan 9. The fan 9 is a turbo fan with an air inlet opened on the top. The arc-shaped shell of the fan 9 is locked with the inside of the PC case.

[0024] Furthermore, the air guide cover 10, the heat dissipation fins 8 and the fan 9 have the same thickness.

[0025] In this embodiment, the same thickness of the air cover 10, the heat dissipation fins 8 and the fan 9 is advantageous in that the air volume at the fan 9 outlet is not branched and is carried to the heat dissipation fins 8 in the largest amount, thereby facilitating the maximum amount of heat removal.

[0026] Working principle: When the fan 9 is not powered on, the air guide blade 11 droops, and the tip of the air guide blade 11 contacts the bottom surface of the inner cavity of the air guide cover 10; when the fan 9 is powered on, the fan starts to rotate. Since the fan wire 5 and the wire 4 are connected in series, the magnetic suspension mechanism starts to operate. Under the action of the wind, the tip of the drooping air guide blade 11 leaves the bottom surface of the inner cavity of the air guide cover 10 and floats up, parallel to the fins of the heat dissipation fin 8; because the magnetic suspension mechanism is in operation, the repulsive force between the negative electrode assembly 14 and the coil 13 pulls the coil 13 close to the negative electrode assembly 14 along the positive electrode assembly 1 2. When coil 13 is pushed in the opposite direction, the repulsive force between the negative assembly 14 and coil 13 pushes the coil 13 near the negative assembly 14 back toward the positive assembly 12. With the help of wind, coil 13, along with air guide vanes 11, continues to reciprocate under the repulsive force. Several coils 13 with air guide vanes 11 continue to reciprocate between two adjacent negative assemblies 14 toward the positive assembly 12 under the repulsive force, directing the air from air outlet 7 to heat sink fins 8 via the magnetic levitation mechanism. This solves the problem of significantly reduced airflow due to long air ducts in bar-shaped mini PCs, while also avoiding the problems of increasing the length of the heat sink fins, which would increase the cost and overall weight.

[0027] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, and all of these should be included in the scope of the claims of the present invention.

Claims

1. Mini PC magnetic levitation cooling device, characterized by: The invention comprises a magnetic suspension mechanism, wherein the magnetic suspension mechanism is electrically connected to a positive electrode component (12) by a wire (4), a negative electrode component (14) is fixed on the positive electrode component (12) at equal intervals, a coil (13) is slidably arranged between two adjacent negative electrode components (14), an air guide plate (11) is fixed on the coil (13), and the magnetic suspension mechanism further comprises an air guide cover (10) fixed outside the magnetic suspension mechanism, two ends of the positive electrode component (12) are fixed to two sides of the air guide cover (10), and the wire (4) is connected in series with a fan wire (5).

2. The mini PC magnetic levitation cooling device according to claim 1, characterized in that: The air outlet of the air guide cover (10) is connected to a heat dissipation fin (8) correspondingly, and a plurality of air holes are designed on the bottom of the air guide cover (10).

3. The mini PC magnetic levitation cooling device according to claim 2, characterized in that: A U-shaped heat-conducting copper tube (3) is fixed to the bottom of the air guide cover (10), a magnetic suspension mechanism is inserted into the U-shaped opening of the U-shaped heat-conducting copper tube (3), two ends of the U-shaped heat-conducting copper tube (3) are fixedly connected to the heat dissipation fin (8) and the heat-conducting plate (1), respectively, and a mounting strip (2) is fixed to the heat-conducting plate (1).

4. The mini PC magnetic levitation cooling device according to claim 3, characterized in that: The air inlet of the air guide cover (10) is connected to the air outlet (7) of the fan (9). The fan (9) is a turbo fan with an air inlet opened on the top. The arc-shaped shell of the fan (9) is locked with the inside of the PC case.

5. The mini PC magnetic levitation cooling device according to claim 4, characterized in that: The air guide cover (10), the heat dissipation fins (8) and the fan (9) have the same thickness.

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