Copper bar with PI film

Abstract

The utility model relates to the technical field of copper bars, in particular to a copper bar with a PI (Polyimide) film, which comprises a copper bar body, a first insulating film and a second insulating film, the copper bar body comprises a first fixing part, a bending buffer part and a second fixing part which are sequentially connected, and the buffer effect of the copper bar body is increased by utilizing the flexibility characteristic of the bending buffer part, so that the copper bar body is prevented from being damaged. Cracking of the copper bar body caused by too large acting force is avoided, and improvement of the spatial layout of the copper bar is facilitated. The first insulating film and the second insulating film are utilized to perform insulation protection on the bent buffer part and provide electrical isolation, so that direct propagation of electromagnetic radiation can be reduced, penetration of part of electromagnetic waves can be blocked, and the performance stability of the copper bar can be improved; the bending buffer part and the receding through hole jointly form the impedance matching section, the equivalent impedance of the copper bar is changed, so that the copper bar is better matched with other parts in a circuit, and the receding through hole is also beneficial to heat dissipation of the copper bar body and improvement of impedance stability of the copper bar.

Description

Technical Field

[0001] The utility model relates to the technical field of copper busbars, in particular to a copper busbar with a PI film. Background Art

[0002] Copper busbar is an indispensable conductive material for manufacturing motor windings, high and low voltage electrical appliances, switch contacts, and wires for power supply and distribution installation. It is mostly used in new energy vehicles, transformers, base stations, servers, etc.

[0003] The main function of a base station copper busbar is to provide cable connections and signal transmission for various devices within the base station, enabling the normal operation of the base station. Specifically, the base station copper busbar has the following functions: 1. Connecting the antenna and signal source: The base station copper busbar can be used to connect the antenna and signal source. The antenna is responsible for receiving and transmitting radio signals, while the signal source provides these signals. The base station copper busbar establishes a stable and reliable connection between the antenna and signal source, ensuring smooth signal transmission. 2. Enhancing signal quality: The base station copper busbar has excellent conductivity and shielding properties, which can effectively reduce signal attenuation and interference during transmission. The copper busbar has low resistivity, high bendability, strong current transmission capacity, and stable connection, which can meet the needs of complex electrical connections within the base station. However, existing copper busbars have poor buffering effect and are prone to cracking under stress. In addition, the copper busbars in base stations lack space utilization, have poor heat dissipation, poor impedance stability, and poor impedance matching, which can easily affect the normal operation of the base station. Summary of the Invention

[0004] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to provide a copper busbar with a PI film.

[0005] The purpose of the utility model is achieved through the following technical solution: A copper busbar with PI film, comprising a copper busbar body, a first insulating film and a second insulating film, the copper busbar body comprising a first fixing portion, a bending buffer portion and a second fixing portion connected in sequence, the first insulating film being attached to one side of the bending buffer portion, and the second insulating film being attached to the other side of the bending buffer portion, the edges of the first insulating film and the edges of the second insulating film both extending out of both sides of the bending buffer portion and being bonded to each other, the bending buffer portion being provided with at least two air-avoiding through-holes, and the bending buffer portion and the air-avoiding through-holes together constituting an impedance matching section.

[0006] Preferably, the bending buffer portion includes a first bending buffer section, a side bending buffer section and a second bending buffer section, the first fixed portion, the first bending buffer section, the side bending buffer section, the second bending buffer section and the second fixed portion are connected in sequence and are an integrated structure, the first PI film is attached to one side of the first bending buffer section, the side bending buffer section and the second bending buffer section, the second PI film is attached to the other side of the first bending buffer section, the side bending buffer section and the second bending buffer section, the middle part of the first bending buffer section, the middle part of the side bending buffer section and the middle part of the second bending buffer section all have air-avoiding through holes.

[0007] Preferably, the first bending buffer section and the second bending buffer section are symmetrically connected at both ends of the side bending buffer section, and the first bending buffer section includes a first panel, a second panel, a third panel, a fourth panel and a fifth panel that are bent and transitioned in sequence, the first panel is connected to the first fixing part, and the fifth panel is connected to the side bending buffer section.

[0008] Preferably, the side-bending buffer section has a U-shaped structure, and the opening direction of the U-shaped structure is horizontally arranged.

[0009] Preferably, the first fixing portion and the second fixing portion are each provided with at least one mounting through hole.

[0010] Preferably, the mounting through hole is an elongated through hole.

[0011] Preferably, the first insulating film and the second insulating film are both PI films.

[0012] The beneficial effects of the present invention are as follows: the copper busbar with PI film of the present invention adopts a copper busbar body, a first insulating film and a second insulating film, and the copper busbar body includes a first fixing portion, a bent buffer portion and a second fixing portion connected in sequence. The flexible characteristics of the bent buffer portion are utilized to increase the buffering effect of the copper busbar body, thereby avoiding cracking of the copper busbar body due to excessive force, and facilitating improvement of the spatial layout of the copper busbar; the first insulating film and the second insulating film are utilized to insulate and protect the bent buffer portion, providing electrical isolation, which can reduce the direct propagation of electromagnetic radiation, block the penetration of some electromagnetic waves, and facilitate improvement of the performance stability of the copper busbar; the bent buffer portion and the air-avoiding through hole together constitute an impedance matching section, which changes the equivalent impedance of the copper busbar, thereby better matching it with other parts in the circuit, and the air-avoiding through hole is also beneficial to heat dissipation of the copper busbar body, thereby helping to improve the impedance stability of the copper busbar. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural diagram of the utility model;

[0014] Figure 2 This is a schematic structural diagram of the copper busbar body of the present invention;

[0015] The figures are marked as follows: 1. first insulating film; 2. second insulating film; 3. copper busbar body; 31. first fixing part; 32. bending buffer part; 321. first bending buffer section; 3211. first panel; 3212. second panel; 3213. third panel; 3214. fourth panel; 3215. fifth panel; 322. side bending buffer section; 323. second bending buffer section; 33. second fixing part; 4. air-avoiding through hole; 5. mounting through hole. DETAILED DESCRIPTION

[0016] In order to facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and drawings. The contents mentioned in the embodiments are not intended to limit the present invention.

[0017] like Figure 1-2 As shown, a copper busbar with PI film includes a copper busbar body 3, a first insulating film 1 and a second insulating film 2. The copper busbar body 3 includes a first fixing portion 31, a bending buffer portion 32 and a second fixing portion 33 connected in sequence. The first insulating film 1 is attached to one side of the bending buffer portion 32, and the second insulating film 2 is attached to the other side of the bending buffer portion 32. The edges of the first insulating film 1 and the edges of the second insulating film 2 extend out of both sides of the bending buffer portion 32 and are bonded to each other. The bending buffer portion 32 is provided with at least two air-avoiding through holes 4. The bending buffer portion 32 and the air-avoiding through holes 4 together constitute an impedance matching section.

[0018] The copper busbar with PI film comprises a copper busbar body 3, a first insulating film 1 and a second insulating film 2. The copper busbar body 3 comprises a first fixing portion 31, a bent buffer portion 32 and a second fixing portion 33 connected in sequence. The flexible characteristics of the bent buffer portion 32 enhance the buffering effect of the copper busbar body 3, thereby preventing the copper busbar body 3 from cracking due to excessive force and improving the spatial layout of the copper busbar. The first insulating film 1 and the second insulating film 2 insulate and protect the bent buffer portion 32, providing electrical isolation, which can reduce the direct propagation of electromagnetic radiation and block the penetration of some electromagnetic waves, thereby improving the performance stability of the copper busbar. The bent buffer portion 32 and the air-avoiding through-hole 4 together constitute an impedance matching section, which changes the equivalent impedance of the copper busbar, thereby better matching it with other parts in the circuit. The air-avoiding through-hole 4 also facilitates heat dissipation of the copper busbar body 3, helps improve the impedance stability of the copper busbar, and more effectively reduces signal attenuation and interference during transmission.

[0019] Furthermore, the bending buffer portion 32 includes a first bending buffer section 321, a side bending buffer section 322 and a second bending buffer section 323. The first fixed portion 31, the first bending buffer section 321, the side bending buffer section 322, the second bending buffer section 323 and the second fixed portion 33 are connected in sequence and are an integrated structure. The first PI film is attached to one side of the first bending buffer section 321, the side bending buffer section 322 and the second bending buffer section 323. The second PI film is attached to the other side of the first bending buffer section 321, the side bending buffer section 322 and the second bending buffer section 323. The middle part of the first bending buffer section 321, the middle part of the side bending buffer section 322 and the middle part of the second bending buffer section 323 all have an air-avoiding through hole 4. By utilizing the flexible characteristics of the first bending buffer section 321, the side bending buffer section 322 and the second bending buffer section 323, the buffering effect of the copper busbar body 3 is increased, and it can have a certain buffering and recovery ability when subjected to external force, thereby avoiding excessive force causing the copper busbar body 3 to crack. The special structure of the first bending buffer section 321, the side bending buffer section 322 and the second bending buffer section 323 and the air-avoiding through hole 4 together constitute an impedance matching section, which changes the equivalent impedance of the copper busbar, thereby making it better matched with other parts in the circuit. The air-avoiding through hole 4 is also beneficial to the heat dissipation of the copper busbar body 3, which helps to improve the impedance stability of the copper busbar.

[0020] Furthermore, the first bending buffer section 321 and the second bending buffer section 323 are symmetrically connected at both ends of the side bending buffer section 322, and the first bending buffer section 321 includes a first panel 3211, a second panel 3212, a third panel 3213, a fourth panel 3214 and a fifth panel 3215 that are bent and transitioned in sequence, the first panel 3211 is connected to the first fixing part 31, and the fifth panel 3215 is connected to the side bending buffer section 322.

[0021] Furthermore, the side-bend buffer section 322 has a U-shaped structure, and the opening direction of the U-shaped structure is set horizontally, which better adapts to the spatial layout inside the base station and is also conducive to optimizing electrical performance, making the magnetic field generated by the copper busbar more uniform when transmitting current, thereby reducing electromagnetic radiation and interference.

[0022] Furthermore, the first fixing portion 31 and the second fixing portion 33 are each provided with at least one mounting through hole 5 for fastening the copper busbar to the corresponding base station equipment by means of fastening members such as screws or bolts.

[0023] Furthermore, the installation through hole 5 is a long through hole so as to adapt to the installation error of the corresponding base station equipment and facilitate installation.

[0024] Furthermore, the first insulating film 1 and the second insulating film 2 are both PI films, which have good insulation, high temperature resistance and wear resistance, and are particularly suitable for this solution.

[0025] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present invention is within the scope of protection of the present invention.

Claims

1. A copper busbar with PI film, characterized by: The copper busbar comprises a copper busbar body, a first insulating film and a second insulating film. The copper busbar body comprises a first fixing portion, a bending buffer portion and a second fixing portion connected in sequence. The first insulating film is attached to one side of the bending buffer portion, and the second insulating film is attached to the other side of the bending buffer portion. The edges of the first insulating film and the second insulating film extend out of both sides of the bending buffer portion and are bonded to each other. The bending buffer portion is provided with at least two air-avoiding through-holes. The bending buffer portion and the air-avoiding through-holes together constitute an impedance matching section.

2. The copper busbar with PI film according to claim 1, characterized in that: The bending buffer portion includes a first bending buffer section, a side bending buffer section and a second bending buffer section. The first fixing portion, the first bending buffer section, the side bending buffer section, the second bending buffer section and the second fixing portion are connected in sequence and form an integrated structure. The first PI film is attached to one side of the first bending buffer section, the side bending buffer section and the second bending buffer section, and the second PI film is attached to the other side of the first bending buffer section, the side bending buffer section and the second bending buffer section. The middle part of the first bending buffer section, the middle part of the side bending buffer section and the middle part of the second bending buffer section all have air-avoiding through holes.

3. The copper busbar with PI film according to claim 2, characterized in that: The first bending buffer section and the second bending buffer section are symmetrically connected to the two ends of the side bending buffer section. The first bending buffer section includes a first panel, a second panel, a third panel, a fourth panel and a fifth panel that are bent and transitioned in sequence. The first panel is connected to the first fixing part, and the fifth panel is connected to the side bending buffer section.

4. The copper busbar with PI film according to claim 2, characterized in that: The side bending buffer section is in a U-shaped structure, and the opening direction of the U-shaped structure is arranged horizontally.

5. The copper busbar with PI film according to claim 1, characterized in that: The first fixing portion and the second fixing portion are each provided with at least one mounting through hole.

6. The copper busbar with PI film according to claim 5, characterized in that: The mounting through hole is a long through hole.

7. The copper busbar with PI film according to claim 1, characterized in that: The first insulating film and the second insulating film are both PI films.

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